CN101901662B - A kind of solenoid - Google Patents
A kind of solenoid Download PDFInfo
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- CN101901662B CN101901662B CN201010257480.1A CN201010257480A CN101901662B CN 101901662 B CN101901662 B CN 101901662B CN 201010257480 A CN201010257480 A CN 201010257480A CN 101901662 B CN101901662 B CN 101901662B
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- solenoid
- encapsulated layer
- wire winding
- enamelled wire
- accommodation section
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Abstract
Solenoid of the present invention is a kind of electromagnetic coil for solenoid valve for refrigerating system, comprising coil component and be enclosed within magnetic conductor outside coil component, coil component comprises skeleton, the enamelled wire winding be wound on skeleton, being coated on skeleton and the encapsulated layer outside enamelled wire winding and the accommodation section for holding the circuit board be connected with winding.The present invention is by being provided with lack part between the encapsulated layer of coil component outside winding and the accommodation section of containment circuit board, effective heating in winding cutting off coil is on the impact of circuit board, add the area of dissipation of solenoid when the work of energising simultaneously, reduce coil temperature rise, extend the useful life of solenoid, shorten the shaping cooling time of solenoid, improve the production efficiency of solenoid.
Description
Technical field
The present invention relates to refrigeration control technical field, specifically a kind of solenoid controlling the electromagnetically operated valve of refrigerant break-make, usually use under the environment of the high temperature of freeze cycle, high humidity.
Background technology
At present, widely use various electromagnetically operated valve in refrigeration systems as Automatic Control Component, solenoid and valve body are cooperatively used for controlling the break-make of refrigerant in refrigerating system.
The structure of existing scheme as shown in Figure 1, a kind of in refrigerating system fluid control electromagnetic coil for solenoid valve, it comprises skeleton and is wound on the enamelled wire winding on skeleton; Skeleton comprises around core and a pair flange-like portion be parallel to each other be arranged on around core two ends, thus between this is to flange-like portion, form the wound portion of winding.Enamelled wire is wound in the wound portion of core, and has welded contact pin, is then encapsulated by the skeleton encapsulating material being wound with enamelled wire, and circuit board is arranged on the coil after encapsulating, carries out envelope fill with epoxy resin to circuit board.The solenoid of existing scheme is that the heat conduction of generation when preventing coil windings from working is on circuit board, cause circuit board temperature too high, cause electric components on circuit board to burn, when adopting thicker encapsulated layer to stop work between coil windings and circuit board, winding heat conduction is on circuit board.Although the program effectively prevent coil windings and circuit board heat transfer between the two, but because encapsulated layer thickness L as shown in Figure 1 between the two has the thickness of 8mm at least, affect the uniformity of encapsulated layer because Material shrinkage local easily produces bubble formation shrinkage cavity when causing coil encapsulation shaping, add the shaping cooling time of coil in shaping cooling procedure, the molding cycle of coil is relatively long simultaneously; And solenoid is when the work of energising, and the amount of heat that winding produces is not easy to distribute, and causes coil temperature rise too high, affects the useful life of coil.
Summary of the invention
The technical assignment of the technical problem to be solved in the present invention and proposition solves the too high problem of solenoid temperature rise, improves the radiating effect of solenoid encapsulated layer.The present invention adopts following technical scheme for this reason:
Solenoid of the present invention, comprise skeleton, the enamelled wire winding be wound on described skeleton, be coated on encapsulated layer around described enamelled wire winding, skeleton, described solenoid be also included in the side of described enamelled wire winding for holding and the described circuit board of enamelled wire winding switching or the accommodation section of connector, be provided with lack part between the encapsulated layer outside the enamelled wire winding of accommodation section and this side.
As improving further and supplementing technique scheme, to adopt various structures form in the specific implementation, the present invention also comprises following technical characteristic:
Particularly, described accommodation section is the some of described encapsulated layer, and the encapsulated layer outside described accommodation section and described enamelled wire winding is integrally formed.
Particularly, described accommodation section comprises and holding and the container cavity of the circuit board of described enamelled wire winding switching or connector, the accommodation section wall portion forming described container cavity, is also provided with connecting portion between the encapsulated layer outside described accommodation section and described enamelled wire winding.
Particularly, described solenoid also comprises the contact pin connecting described enamelled wire winding and described circuit board or connector, and described contact pin runs through described connecting portion, and one end of described contact pin is positioned at described container cavity, the other end is fixed on described skeleton, middle by described connecting portion close.
Further, described lack part comprises not encapsulating or the space for deadening of other insulating material between encapsulated layer outside described enamelled wire winding and described accommodation section, the both sides in described space have the second connecting portion of encapsulating material formation, and the second connecting portion is connected with the bottom wall part of the encapsulated layer outside described enamelled wire winding, described accommodation section; Preferably the thickness S of described second connecting portion is between 2mm ~ 5mm.
Particularly, between two contact pins, through-Penetration portion is provided with in described connecting portion.
Selectively, the cross sectional shape of the length direction of described space and/or described through-Penetration portion is roughly rectangle, ellipse, annular, circular arc, circle or two or more combination of shapes above-mentioned, preferably, in the intermediate location of its cross sectional shape also with knuckle.
Alternatively, described space and/or described through-Penetration portion are the combination of, more than 2 or 3.
Particularly, the thickness D of encapsulation object of the encapsulated layer thickness d of the bottom wall part of described accommodation section, four perisporiums in described space and diapire and/or the thickness (h, S1) of the encapsulated layer between described through-Penetration portion and described contact pin are not less than 2mm.
The invention has the beneficial effects as follows: by the reformed AHP of structure, compared with prior art, by being provided with lack part between the encapsulated layer of coil component outside winding and the accommodation section of containment circuit board, effective heating in winding cutting off coil is on the impact of circuit board, add the area of dissipation of solenoid when the work of energising simultaneously, reduce coil temperature rise, extend the useful life of solenoid, shorten the shaping cooling time of solenoid, improve the production efficiency of solenoid.
Accompanying drawing illustrates:
Fig. 1: be the electromagnetic coil structure schematic diagram of prior art;
Fig. 2: be the structural representation of the dissection of the first embodiment of solenoid of the present invention;
Fig. 3: for solenoid in Fig. 2 removes the left view after magnetic conductor;
Fig. 4: be the coil component structural representation of the second embodiment of solenoid of the present invention;
Fig. 5: be the coil component structural representation of the 3rd embodiment of solenoid of the present invention;
Fig. 6: be the structural representation of the dissection of the 4th embodiment of solenoid of the present invention;
Fig. 7: for the solenoid in Fig. 6 removes the left view after magnetic conductor;
Fig. 8: be the structural representation of the dissection of the 5th embodiment of solenoid of the present invention;
Fig. 9: for the solenoid in Fig. 8 removes the left view after magnetic conductor;
Figure 10: be the coil component structural representation of the 6th embodiment of solenoid of the present invention;
Symbol description in figure:
1-skeleton, 2-enamelled wire winding, 3/33-encapsulated layer, 34-connecting portion, 4-contact pin, 5-circuit board, 6-embedding layer, 7-lead-in wire, 8-magnetic conductor;
91 1 spaces, 911 1 bottom surfaces, 912 1 downsides, 913 1 upper sides, the 915 one the second connecting portions, 92-through-Penetration portion, 10 1 accommodation sections, 11 1 container cavities, 12 1 accommodation section wall portion.
Embodiment
In order to make those skilled in the art person understand this programme better, be described in further detail below in conjunction with drawings and embodiments.
Solenoid of the present invention comprises skeleton 1, the enamelled wire winding 2 be wound on described skeleton 1, be coated on encapsulated layer 3 around enamelled wire winding 2, skeleton 1, described solenoid is also included in the accommodation section 10 for holding the circuit board 5 or connector be connected with enamelled wire winding 2 of the side of enamelled wire winding 2, described accommodation section 10 is the some of described encapsulated layer, and is integrally formed with the encapsulated layer 33 outside enamelled wire winding.Accommodation section 10 comprises the container cavity 11 holding the circuit board 5 or connector be connected with enamelled wire winding 2, the accommodation section wall portion 12 forming container cavity 11, and accommodation section wall portion 12 comprises four the sidewall portions and bottom wall part that surround one week.Connecting portion 34 is also provided with between encapsulated layer 33 outside accommodation section 10 and described enamelled wire winding, enamelled wire winding 2 is connected by contact pin 4 with between circuit board 5 or connector, contact pin 4 runs through connecting portion 34, one end of contact pin 4 is positioned at container cavity 11, the other end is fixed on skeleton 1, middle by described connecting portion 34 close.Circuit board 5 is arranged in container cavity 11, and fills with by epoxy resin encapsulated layer 6 envelope, in addition, is installed with magnetic conductor 8 outside solenoid, and magnetic conductor 8 is by being arranged on the positioning boss location of encapsulated layer outer surface and closely cooperating with solenoid.Lack part is provided with between encapsulated layer 33 outside the enamelled wire winding 2 of accommodation section 10 and this side.
Fig. 2 is the structural representation of the dissection of solenoid first embodiment of the present invention, and Fig. 3 is the left view after solenoid in Fig. 2 removes magnetic conductor.As shown in Figure 2 and Figure 3, lack part in the present embodiment is the space 91 for deadening of encapsulated layer 33 outside enamelled wire winding 2 and not encapsulating of arranging between accommodation section 10 or other insulating material, the both sides in the longitudinal direction in space 91 are provided with the second connecting portion 915, second connecting portion 915 formed by encapsulating material and are connected with the bottom wall part of the encapsulated layer 33 outside enamelled wire winding 2, accommodation section.In order to ensure the bonding strength of the second connecting portion 915, the thickness S of the second connecting portion 915 is not less than 2mm, and consider and save encapsulating material and radiating effect, the thickness S of the second connecting portion 915 is less than 5mm.In addition, space 91, and to parallel with the outer surface of enamelled wire winding 2 for plane and arc surface is arranged in downside 912 at the upper side 913 of Width, and the R shown in figure is the external diameter of enamelled wire winding.In order to ensure the dielectric strength of solenoid, the encapsulated layer thickness D of the downside 912 in encapsulated layer thickness (namely the encapsulated layer thickness of the upper side 913 in the space 91) d of the bottom wall part of accommodation section 10, encapsulated layer thickness D between the bottom surface 911 in space 91 and contact pin 4, space 91 is not less than 2mm.
As can be seen from Figure 2 after solenoid is provided with space 91, effective heating in winding cutting off coil is on the impact of circuit board, add the area of dissipation of solenoid when the work of energising simultaneously, thus reach the object reducing coil temperature rise, the useful life of extension coil; The shaping cooling time of solenoid can be shortened simultaneously, reduce the consumption of encapsulating material, thus, improve the production efficiency of solenoid, reduce the production cost of solenoid.
Fig. 4 is the coil component structural representation of the second embodiment of solenoid of the present invention, section shape as shown in the figure can be arranged in described space 91, particularly, the cross sectional shape in the space 91 in the present embodiment is set to rectangle, four sides in space 91 are all plane, be connected by arc surface transition between face with face, be that the shape of the downside in space 91 is different from the main distinction of a upper embodiment, the downside of the present embodiment is the plane paralleled with upper side, the design features such as the encapsulated layer thickness of other four perisporium are same as the previously described embodiments, here repeat no more.
Fig. 5 is the coil component structural representation of the 3rd embodiment of solenoid of the present invention.Similarly, described space 91 also can be other shapes such as annular as shown in Figure 5, can reach the radiating effect of encapsulated layer equally.Four sides in the space 91 in the present embodiment are arc surface, wherein the arc surface of upper and lower two sides in the direction of the width parallels with the outer surface of enamelled wire winding, the minimum encapsulated layer thickness of space 91 4 perisporium is all not less than 2mm, other design feature is same as the previously described embodiments, repeats no more here.
Fig. 6 is the structural representation of the dissection of the 4th embodiment of solenoid of the present invention, Fig. 7 be solenoid in Fig. 6 remove after magnetic conductor left view, the lack part in the present embodiment is set to through-Penetration portion 92.Through-Penetration portion 92 is as shown in Figure 6 arranged between two contact pins, through-Penetration portion 92 runs through the side 31 away from contact pin 4 and the side near contact pin 4 of encapsulated layer 33, the cross sectional shape of the through-Penetration portion 92 in the present embodiment is rectangle, through-Penetration portion 92 left side in the longitudinal direction, right flank respectively with a left side, encapsulated layer thickness S1 between right contact pin is at more than 2mm, similarly, encapsulated layer thickness h between the downside 922 in the direction of the width of through-Penetration portion 92 and contact pin 4, encapsulated layer thickness (namely the encapsulated layer thickness of the bottom wall part of the accommodation section 10) d of the upper side in the direction of the width of through-Penetration portion 92 is not less than 2mm, ensure the insulation property of coil.The solenoid of this structure has equally effectively cut off the impact of heating in winding on circuit board of coil, the heat that winding is produced not only is distributed by the surrounding side of through-Penetration portion, and circulated up and down by through-Penetration portion and distribute, the radiating effect of encapsulated layer is significantly improved, coil temperature rise is obviously declined, also can reach object of the present invention.
In addition, also can be other shape, as annular, ellipse, polygon etc., object of the present invention can be reached.But guarantee that encapsulated layer thickness S1 between the encapsulated layer thickness d of the upper side of the encapsulated layer thickness h between the downside of through-Penetration portion and contact pin, through-Penetration portion, through-Penetration portion two sides in the longitudinal direction and contact pin is at more than 2mm, ensures the insulation property of coil.
As the 5th kind of embodiment of the present invention, Fig. 8 is the structural representation of the dissection of the 5th embodiment of solenoid of the present invention, and Fig. 9 is the left view after solenoid in Fig. 8 removes magnetic conductor.As shown in the figure, as the further improvement to above-mentioned execution mode, the lack part of the present embodiment is the combination of space 91 and through-Penetration portion 92, namely to the combination of the space 91 in above-described embodiment and through-Penetration portion 92.The solenoid of the present embodiment and the main distinction of above-described embodiment are provided with again through-Penetration portion 92 while being to be provided with space 91 in the connecting portion 34 of solenoid, due to the restriction of loop construction, the area of section of through-Penetration portion 92 is less than space 91 area of section, such execution mode is more much bigger than the area of dissipation of above-mentioned any embodiment, therefore radiating effect is further promoted, the present embodiment is the execution mode preferably used, other design feature is same as the previously described embodiments, repeats no more at place.
Figure 10 is the coil component structural representation of the 6th embodiment of solenoid of the present invention, and the lack part of solenoid of the present invention is made up of the space 91 of multiple relatively independent circle, and circular radius can be the same or different.As shown in the figure, the lack part in the present embodiment is made up of four circular spaces 91; Also wherein space 91 will can be set near two of coil edge, radius is r1's, and two that are positioned at coil middle part are set to through-Penetration portion 92, radius is r2's, in order to ensure the insulation property of coil, and in figure S and S1 shown in radius r 2, figure of the radius r 1 > through-Penetration portion in space all at more than 2mm.This two schemes can reach object of the present invention, but the area of dissipation that formed of a kind of mode combined by space and through-Penetration portion is relatively large afterwards, as the preferred embodiments in two schemes.Other design feature is same as the previously described embodiments, repeats no more at place.
Going up space or the through-Penetration portion of the circle in an embodiment in addition, equally also can be space or the through-Penetration portion of other figure, as the combination etc. of polygon or multiple figure, also can reach object of the present invention.But guarantee that the minimum thickness of the encapsulated layer of space 91 and/or through-Penetration portion 92 4 perisporium is not less than 2mm, to ensure the insulation property of coil.
Content described in this specification embodiment just enumerating inventive concept way of realization, protection scope of the present invention should not be regarded as being only limitted to the concrete form that embodiment is stated, comprises other similar form yet.
The various orientation such as left and right, upper and lower, inside and outside mentioned in this specification in addition is just quoted for convenience of description, should not be considered limitation of the present invention.
Claims (12)
1. a solenoid, comprise skeleton (1), be wound on the enamelled wire winding (2) on described skeleton (1), be coated on described enamelled wire winding (2), skeleton (1) encapsulated layer (3) around, it is characterized in that, described solenoid is also included in the accommodation section (10) for holding circuit board (5) or the connector be connected with described enamelled wire winding (2) of the side of described enamelled wire winding (2), lack part is provided with between accommodation section (10) and enamelled wire winding (2) encapsulated layer outward (33) of this side.
2. solenoid according to claim 1, is characterized in that, the some that described accommodation section (10) are described encapsulated layer, and described accommodation section (10) are integrally formed with the encapsulated layer outside described enamelled wire winding.
3. solenoid according to claim 1, it is characterized in that, described accommodation section (10) comprises the container cavity (11) holding circuit board (5) or the connector be connected with described enamelled wire winding (2), the accommodation section wall portion (12) forming described container cavity (11), is also provided with connecting portion (34) between the encapsulated layer (33) outside described accommodation section (10) and described enamelled wire winding.
4. solenoid according to claim 1, it is characterized in that, described solenoid also comprises the contact pin (4) connecting described enamelled wire winding and described circuit board or connector, described contact pin (4) runs through described connecting portion (34), one end of described contact pin is positioned at described container cavity (11), the other end is fixed on described skeleton (1), middle by described connecting portion (34) close.
5. according to claim 1-4 wherein arbitrary described solenoid, it is characterized in that, described lack part comprises not encapsulating or the space (91) for deadening of other insulating material between encapsulated layer (33) outside described enamelled wire winding and described accommodation section, the both sides in described space (91) have second connecting portion (915) of encapsulating material formation, and the second connecting portion (915) is connected with the bottom wall part of the encapsulated layer (33) outside described enamelled wire winding, described accommodation section; Preferably the thickness S of described second connecting portion (915) is between 2mm ~ 5mm.
6. solenoid according to claim 4, is characterized in that, is provided with through-Penetration portion (92) in described connecting portion (34) between two contact pins.
7. solenoid according to claim 5, it is characterized in that, the cross sectional shape of the length direction in described space (91) is roughly rectangle, ellipse, annular, circular arc, circle or two or more combination of shapes above-mentioned, and the intermediate location of its cross sectional shape is also with knuckle.
8. solenoid according to claim 7, is characterized in that, described space (91) are the combination of 1, more than 2 or 3.
9. solenoid according to claim 7, is characterized in that, the thickness D of the encapsulated layer thickness d of the bottom wall part of described accommodation section (10), four perisporiums of described space (91) and the encapsulation object of diapire is not less than 2mm.
10. solenoid according to claim 6, it is characterized in that, the cross sectional shape of the length direction of described through-Penetration portion (92) is roughly rectangle, ellipse, annular, circular arc, circle or two or more combination of shapes above-mentioned, and the intermediate location of its cross sectional shape is also with knuckle.
11. solenoids according to claim 10, is characterized in that, described through-Penetration portion is the combination of 1, more than 2 or 3.
12. solenoids according to claim 10, it is characterized in that, the thickness h of the encapsulated layer thickness d of the bottom wall part of described accommodation section (10), encapsulated layer between described through-Penetration portion (92) and described contact pin (4) is not less than 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010257480.1A CN101901662B (en) | 2010-08-13 | 2010-08-13 | A kind of solenoid |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010257480.1A CN101901662B (en) | 2010-08-13 | 2010-08-13 | A kind of solenoid |
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| CN101901662A CN101901662A (en) | 2010-12-01 |
| CN101901662B true CN101901662B (en) | 2016-04-13 |
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| CN201010257480.1A Active CN101901662B (en) | 2010-08-13 | 2010-08-13 | A kind of solenoid |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105202251B (en) * | 2015-10-23 | 2017-07-28 | 宁波星宇国均汽车电磁阀有限公司 | A kind of two-bit triplet switch electromagnetic valve |
| CN109869518B (en) * | 2017-12-05 | 2021-08-24 | 浙江三花制冷集团有限公司 | Electromagnetic valve and electromagnetic coil thereof |
| CN109916103B (en) * | 2017-12-12 | 2021-06-18 | 浙江三花制冷集团有限公司 | Four-way reversing valve |
| KR102587074B1 (en) * | 2018-11-30 | 2023-10-10 | 쯔지앙 산화 인텔리전트 컨트롤스 씨오., 엘티디. | Electromagnetic coils, molds, and electromagnetic coil manufacturing methods |
| CN113241871A (en) * | 2021-05-18 | 2021-08-10 | 江苏华阳智能装备股份有限公司 | Air conditioner draining pump stator assembly and encapsulating method thereof |
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| CN101038809A (en) * | 2006-03-15 | 2007-09-19 | 浙江三花制冷集团有限公司 | Electromagnetic coil |
| CN101552076A (en) * | 2008-12-22 | 2009-10-07 | 吴培生 | Unsaturated resin plastic sealed explosion-proof electromagnetic coil |
| CN101604570A (en) * | 2008-06-10 | 2009-12-16 | 浙江三花股份有限公司 | Solenoid and skeleton thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10154626A (en) * | 1996-11-25 | 1998-06-09 | Tdk Corp | Method and device for manufacturing double layer coil |
| DE10125429B4 (en) * | 2001-05-25 | 2004-06-17 | Bruker Biospin Gmbh | Superconducting high field magnetic coil with HTS coil section and manufacturing process |
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2010
- 2010-08-13 CN CN201010257480.1A patent/CN101901662B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101038809A (en) * | 2006-03-15 | 2007-09-19 | 浙江三花制冷集团有限公司 | Electromagnetic coil |
| CN101604570A (en) * | 2008-06-10 | 2009-12-16 | 浙江三花股份有限公司 | Solenoid and skeleton thereof |
| CN101552076A (en) * | 2008-12-22 | 2009-10-07 | 吴培生 | Unsaturated resin plastic sealed explosion-proof electromagnetic coil |
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Effective date of registration: 20170210 Address after: 312500 Shaoxing City, Zhejiang province Xinchang Qixing street under the Liquan Patentee after: Zhejiang three flower intelligent control Limited by Share Ltd Address before: 312500 Liquan village of Zhejiang County in Xinchang Province town under Patentee before: Sanhua Refrigeration Group Co., Ltd., Zhejang |