CN101898283A - Low-temperature nickel-based solder for soldering - Google Patents
Low-temperature nickel-based solder for soldering Download PDFInfo
- Publication number
- CN101898283A CN101898283A CN2009101078248A CN200910107824A CN101898283A CN 101898283 A CN101898283 A CN 101898283A CN 2009101078248 A CN2009101078248 A CN 2009101078248A CN 200910107824 A CN200910107824 A CN 200910107824A CN 101898283 A CN101898283 A CN 101898283A
- Authority
- CN
- China
- Prior art keywords
- solder
- content
- soldering
- nickel
- based solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Exhaust Gas After Treatment (AREA)
Abstract
The invention discloses low-temperature nickel-based solder for soldering. The nickel-based solder based on a NiCrSiP system comprises the following components by weight percentage: 21.5%-28% of Cr, 2.0%-3.5% of Si, 7.0%-9.0% of P and 59.5%-69.5% of Ni. The solder of the invention is superior to BNi-5 solder in both high-temperature strength and corrosion resistance, and the nickel-based solder is applicable to both the vacuum-soldering method and the method for soldering in a continuous soldering furnace under the protective atmosphere (such as nitrogen and ammonia decomposition atmosphere) and particularly suitable for soldering the metal carriers (stainless steel materials) in the automobile exhaust purifiers and automobile EGR (exhaust gas recirculation) system, thus absolutely substituting the existing BNi-5 solder.
Description
Technical field
The present invention relates to a kind of nickel-based solder, particularly relate to a kind of fusing point at the nickel-based solder that is used for soldering automobile exhaust purifier metallic carrier and vehicle exhaust circulatory system EGR below 1000 ℃.
Background technology
In the prior art, automobile exhaust purifier metallic carrier (stainless steel) and vehicle exhaust circulatory system EGR (stainless steel) adopt vacuum brazing, and used solder is the BNi-5 trade mark.The solidus temperature of BNi-5 solder is 1080 ℃, 1135 ℃ of liquidus temperatures, and brazing temperature is at 1150 ℃-1205 ℃.As seen, adopt the BNi-5 solder to carry out soldering, its brazing temperature is quite high.Brazing temperature is very big to the influence of stainless steel mother metal, and for martensitic stain less steel, brazing temperature can not be above 1050 ℃; And for austenitic stainless steel, when brazing temperature was higher than 1150 ℃, crystal grain began fiercely to grow up, and in a single day the austenite stainless crystalline grain of steel grows up, and just can not the reusable heat processing method make its grain refinement, and the performance impact to mother metal is very big like this.
Adopt the BNi-5 solder to carry out soldering, also have other shortcomings: 1, the elevated temperature strength of BNi-5 solder and corrosion resistance are still waiting to strengthen; 2, the BNi-5 solder can only adopt vacuum brazing method, can not be in atmosphere protection (for example, nitrogen, ammonia dissolving atmosphere etc.) continuous braze welding furnace brazing, and soldering efficient is lower, and the scope of application is narrower; 3, because the brazing temperature height, energy consumption is bigger, and is influential to the service life of vacuum brazing furnace.
The vacuum brazing stainless steel generally adopts nickel-based solder, and nickel-based solder commonly used has NiCrSiBFe system, NiCrSi system, NiCrP system etc.NiCrSiBFe system is owing to contain the Fe element, and Cr content is generally all less than 15%, thereby its corrosion resistance is not strong, and this series solder is not suitable for the soldering of automobile exhaust purifier metallic carrier (stainless steel) and vehicle exhaust circulatory system EGR (stainless steel).The BNi-5 solder belongs to NiCrSi system, and its composition is as follows: Si content 9.7%-10.5%; Cr content 18.5%-19.6%; The Ni surplus.BNi-7 belongs to NiCrP system, and its composition is as follows: P content 9.7%-10.5%; Cr content 13.0%-15.0%; Ni surplus, its fusing point are 890 ℃.The brazing temperature of BNi-7 solder is lower, but since its P content greater than 9%, Cr content is high not enough, thereby its elevated temperature strength and corrosion resistance are less than the BNi-5 solder.
Publication number is to disclose a kind of nickel-based solder in the Chinese patent of CN1876312A, and its composition is as follows: Si content 0.1%-5.0%; Cr content 5.0%-20.0%; Fe content 0.2%-5.0%; P content 5.0%-11.0%; Cu content 2.0%-8.0%; B content 0.2%-5.0%; The Ni surplus.Because this solder contains Cu and Fe, Cr content is high not enough, and its elevated temperature strength and corrosion resistance are less than the BNi-5 solder.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of nickel-based solder, and its fusing point is lower than 1000 ℃, and brazing temperature can be controlled in 1050 ℃; Its elevated temperature strength and corrosion resistance are better than the BNi-5 solder, and this nickel-based solder not only can adopt vacuum brazing method, can also be in the furnace brazing of atmosphere protection continuous braze welding.
The technical scheme that the present invention solves the problems of the technologies described above is, adopts a kind of low-temperature nickel-based solder that is used for soldering, and it is nickel-based solder that this solder adopts NiCrSiP, and by weight percentage, this solder comprises: Cr content 21.5%-28%; Si content 2.0%-3.5%; P content 7.0%-9.0%; Ni content 59.5%-69.5%.
The concrete weight proportion of above-mentioned each component of solder is:
Embodiment one, Cr content 21.5%; Si content 2.0%; P content 8.0%; The Ni surplus.
Embodiment two, Cr content 25.7%; Si content 3.1%; P content 7.0%; The Ni surplus.
Embodiment three, Cr content 27.0%; Si content 2.0%; P content 8.0%; The Ni surplus.
Embodiment four, Cr content 27.7%; Si content 2.7%; P content 7.5%; The Ni surplus.
That above-mentioned solder can be is Powdered, noncrystal membrane shape or paste.
Compare with prior art, the low-temperature nickel-based solder that is used for soldering of the present invention has following advantage: all in 1000 ℃, its elevated temperature strength and corrosion resistance all are better than the BNi-5 solder to its fusing point, have reduced the influence to mother metal greatly; And this nickel-based solder not only can adopt vacuum brazing method, can also improve the efficient of soldering in atmosphere protection (for example, nitrogen, ammonia dissolving atmosphere etc.) continuous braze welding furnace brazing, can replace the BNi-5 solder fully.
The specific embodiment
The present invention is further illustrated below in conjunction with embodiment.
It is nickel-based solder that the low-temperature nickel-based solder that is used for soldering of the present invention adopts a kind of NiCrSiP, and by weight percentage (down together), this solder comprises: Cr content 21.5%-28%; Si content 2.0%-3.5%; P content 7.0%-9.0%; Ni content 59.5%-69.5%.Certainly, except above composition, nickel-based solder of the present invention can also comprise other composition of 0%-5%, and is common as Co, B, Fe, Cu etc.Above-mentioned nickel-based solder is a matrix with Ni, adds Cr, Si, and P reduces the solder fusing point, improves the wetability and the gap filling performance power of solder simultaneously.Cr content being controlled at 21.5%-28%, making Cr remain on a higher content, mainly is elevated temperature strength and corrosion resistance in order to improve solder; The content of P is controlled at below 9%, and the content of Si is controlled at below 3.5%, and main purpose is when reducing the solder fusing point, and the intensity of solder is too much reduced.
Nickel-based solder of the present invention can adopt following examples:
Embodiment one, Cr content 21.5%; Si content 2.0%; P content 8.0%; The Ni surplus.
Embodiment two, Cr content 25.7%; Si content 3.1%; P content 7.0%; The Ni surplus.
Embodiment three, Cr content 27.0%; Si content 2.0%; P content 8.0%; The Ni surplus.
Embodiment four, Cr content 27.7%; Si content 2.7%; P content 7.5%; The Ni surplus.
Nickel-based solder of the present invention can be made Powdered, noncrystal membrane shape and paste.
Powdered solder: prepare burden by composition; Vacuum melting; Refining purifies; Inert gas is pulverized molten metal bath stream and is become drop; Drop under protective atmosphere, solidify be cooled to Powdered; The powder size classification; Application of vacuum.
Noncrystal membrane shape solder: prepare burden by composition; Vacuum melting; Refining purifies; Molten metal liquid is flowed on the metal roller of the rotation that sputters at its cooling effect continuously, make molten metal liquid stream rapid condensation form the noncrystalline membrane solder.
Paste solder: the lotion solder is formed through the special process allotment by nickel-based brazing powder, trace active component, solvent, macromolecule carrier and other auxiliary agent of-150 order granularities.
After tested; nickel-based solder of the present invention; its fusing point is all in 1000 ℃; its elevated temperature strength and corrosion resistance all are better than the BNi-5 solder; and this nickel-based solder not only can adopt vacuum brazing method, can also be at atmosphere protection (for example, nitrogen; ammonia dissolving atmosphere etc.) continuous braze welding furnace brazing can replace the BNi-5 solder fully.
Claims (6)
1. a low-temperature nickel-based solder that is used for soldering is characterized in that, it is nickel-based solder that this solder adopts NiCrSiP, and by weight percentage, this solder comprises: Cr content 21.5%-28%; Si content 2.0%-3.5%; P content 7.0%-9.0%; Ni content 59.5%-69.5%.
2. the low-temperature nickel-based solder that is used for soldering according to claim 1 is characterized in that, the weight proportion of this each component of solder is: Cr content 21.5%; Si content 2.0%; P content 8.0%; The Ni surplus.
3. the low-temperature nickel-based solder that is used for soldering according to claim 1 is characterized in that, the weight proportion of this each component of solder is: Cr content 25.7%; Si content 3.1%; P content 7.0%; The Ni surplus.
4. the low-temperature nickel-based solder that is used for soldering according to claim 1 is characterized in that, the weight proportion of this each component of solder is: Cr content 27.0%; Si content 2.0%; P content 8.0%; The Ni surplus.
5. the low-temperature nickel-based solder that is used for soldering according to claim 1 is characterized in that, the weight proportion of this each component of solder is: Cr content 27.7%; Si content 2.7%; P content 7.5%; The Ni surplus.
6. according to each described low-temperature nickel-based solder that is used for soldering of claim 1 to 5, it is characterized in that: this solder is Powdered, noncrystal membrane shape or paste.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101078248A CN101898283A (en) | 2009-06-01 | 2009-06-01 | Low-temperature nickel-based solder for soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101078248A CN101898283A (en) | 2009-06-01 | 2009-06-01 | Low-temperature nickel-based solder for soldering |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101898283A true CN101898283A (en) | 2010-12-01 |
Family
ID=43224391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101078248A Pending CN101898283A (en) | 2009-06-01 | 2009-06-01 | Low-temperature nickel-based solder for soldering |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101898283A (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102699569A (en) * | 2012-06-18 | 2012-10-03 | 北京有色金属研究总院 | High temperature nickel base brazing solder paste in nuclear industry and preparing method of high temperature nickel base brazing solder paste |
CN102861962A (en) * | 2012-09-29 | 2013-01-09 | 夏琦 | Method for coating brazing materials on metal carrier |
CN102941418A (en) * | 2012-11-19 | 2013-02-27 | 湖南新光环科技发展有限公司 | Nickel-based brazing material and method for preparing alloy coating by nickel-based brazing material |
CN103492119A (en) * | 2011-03-11 | 2014-01-01 | 真空融化股份有限公司 | Nickel-based brazing foil, method for producing a brazing foil, object having a braze joint, and method for brazing |
CN104842088A (en) * | 2015-06-03 | 2015-08-19 | 浙江科技学院 | Nickel-based welding flux for braze welding on tube plate connectors and method for manufacturing nickel-based welding flux |
CN106460130A (en) * | 2014-06-26 | 2017-02-22 | 日立金属株式会社 | Nickel-based amorphous alloy ribbon for brazing, and stainless steel joined object using same |
CN106545578A (en) * | 2015-09-23 | 2017-03-29 | 天津职业技术师范大学 | A kind of TC bearings and its manufacture method |
CN107405731A (en) * | 2015-03-05 | 2017-11-28 | 日立金属株式会社 | Solder brazing alloy powder and attachment |
CN108098186A (en) * | 2017-12-18 | 2018-06-01 | 江苏锴博材料科技有限公司 | High corrosion resistance nickel-based solder foil and preparation method thereof |
CN108284219A (en) * | 2017-08-15 | 2018-07-17 | 李昕 | Stainless steel mixed-powder contains the powder stainless steel clay and the Clay Consolidation technique |
CN108286028A (en) * | 2018-01-26 | 2018-07-17 | 中国科学院金属研究所 | A kind of SiC fiber reinforcements Ni alloy-base composite materials and preparation method thereof |
CN108907492A (en) * | 2018-08-08 | 2018-11-30 | 武汉工程大学 | A kind of molybdenum/steel connector and preparation method thereof |
CN110520242A (en) * | 2017-04-25 | 2019-11-29 | 山阳特殊制钢株式会社 | Ni-Cr based alloy cored solder containing trace V |
-
2009
- 2009-06-01 CN CN2009101078248A patent/CN101898283A/en active Pending
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103492119A (en) * | 2011-03-11 | 2014-01-01 | 真空融化股份有限公司 | Nickel-based brazing foil, method for producing a brazing foil, object having a braze joint, and method for brazing |
CN102699569A (en) * | 2012-06-18 | 2012-10-03 | 北京有色金属研究总院 | High temperature nickel base brazing solder paste in nuclear industry and preparing method of high temperature nickel base brazing solder paste |
CN102861962A (en) * | 2012-09-29 | 2013-01-09 | 夏琦 | Method for coating brazing materials on metal carrier |
CN102941418A (en) * | 2012-11-19 | 2013-02-27 | 湖南新光环科技发展有限公司 | Nickel-based brazing material and method for preparing alloy coating by nickel-based brazing material |
CN102941418B (en) * | 2012-11-19 | 2015-03-04 | 湖南新光环科技发展有限公司 | Nickel-based brazing material and method for preparing alloy coating by nickel-based brazing material |
CN106460130A (en) * | 2014-06-26 | 2017-02-22 | 日立金属株式会社 | Nickel-based amorphous alloy ribbon for brazing, and stainless steel joined object using same |
CN107405731A (en) * | 2015-03-05 | 2017-11-28 | 日立金属株式会社 | Solder brazing alloy powder and attachment |
CN104842088A (en) * | 2015-06-03 | 2015-08-19 | 浙江科技学院 | Nickel-based welding flux for braze welding on tube plate connectors and method for manufacturing nickel-based welding flux |
CN106545578A (en) * | 2015-09-23 | 2017-03-29 | 天津职业技术师范大学 | A kind of TC bearings and its manufacture method |
CN106545578B (en) * | 2015-09-23 | 2019-09-13 | 天津职业技术师范大学 | A kind of TC bearing and its manufacturing method |
CN110520242A (en) * | 2017-04-25 | 2019-11-29 | 山阳特殊制钢株式会社 | Ni-Cr based alloy cored solder containing trace V |
CN110520242B (en) * | 2017-04-25 | 2021-08-06 | 山阳特殊制钢株式会社 | Ni-Cr base alloy brazing material containing trace V |
CN108284219A (en) * | 2017-08-15 | 2018-07-17 | 李昕 | Stainless steel mixed-powder contains the powder stainless steel clay and the Clay Consolidation technique |
CN108284219B (en) * | 2017-08-15 | 2019-10-08 | 长沙墨科瑞网络科技有限公司 | Stainless steel mixed-powder contains the powder stainless steel clay and the Clay Consolidation technique |
CN108098186A (en) * | 2017-12-18 | 2018-06-01 | 江苏锴博材料科技有限公司 | High corrosion resistance nickel-based solder foil and preparation method thereof |
CN108286028A (en) * | 2018-01-26 | 2018-07-17 | 中国科学院金属研究所 | A kind of SiC fiber reinforcements Ni alloy-base composite materials and preparation method thereof |
CN108286028B (en) * | 2018-01-26 | 2019-09-24 | 中国科学院金属研究所 | A kind of SiC fiber reinforcement Ni alloy-base composite material and preparation method thereof |
CN108907492A (en) * | 2018-08-08 | 2018-11-30 | 武汉工程大学 | A kind of molybdenum/steel connector and preparation method thereof |
CN108907492B (en) * | 2018-08-08 | 2020-11-27 | 武汉工程大学 | Molybdenum/steel joint and preparation method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101898283A (en) | Low-temperature nickel-based solder for soldering | |
EP2272619B9 (en) | Iron-base heat- and corrosion-resistant brazing filler metals | |
JP5642061B2 (en) | Iron-chromium brazing material | |
CN100457955C (en) | Ferrum-base block non-crystalline alloy material | |
CN108161278A (en) | High entropy flux-cored wire for aluminium-steel MIG welding and preparation method thereof | |
CN103111770B (en) | A kind of Polybasic silver solder | |
CN108723637B (en) | Nickel-iron-based welding wire for 700 ℃ ultra-supercritical power station boiler | |
CN100457373C (en) | High-alloy martensite type refractory steel air-protecting flux-cored wire | |
KR20130137154A (en) | Nickel-based hydrochloric acid corrosion resistant alloy for soldering | |
CN101112739A (en) | P92 steel all position welding gas-protection flux-cored wire | |
CN103567659B (en) | For weld carbide alloy and steel without the low silver-colored intermediate temperature solder of cadmium and preparation method | |
CN102500952B (en) | Nickelbase superalloy brazing filler metal and preparation method thereof | |
CN101633085B (en) | Stainless steel welding wire and technology for welding same | |
CN105385966B (en) | A kind of Al-based Amorphous Alloys and its preparation method and application | |
CN109175781B (en) | Flux-cored wire matched with EH500 steel for ship and ocean engineering | |
CN104651657A (en) | Preparation method of enhanced type Fe-Ni-Co-based high temperature alloy through precipitation | |
CN100567542C (en) | Container and utensil that high pressure hydrogen is done with stainless steel, by this steel | |
CN110039039A (en) | A kind of 3D printing powder of stainless steel | |
CN105945449A (en) | Nickle-manganese base boron-free brazing filler metal | |
CN107214436B (en) | Welding method of low-chromium-nickel ferritic stainless steel | |
CN102373347A (en) | Joint coating copper-based alloy for silver and preparation method thereof | |
CN104674035A (en) | Preparation method of chromium-aluminum alloy | |
CN107855679B (en) | Low-silver solder for sealing vacuum electronic device and preparation method thereof | |
CN101439447A (en) | Solder | |
CN112775589A (en) | Preparation method of high-purity narrow-particle-size nickel-based brazing filler metal alloy powder |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20101201 |