CN101896824A - Eco接触器 - Google Patents
Eco接触器 Download PDFInfo
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- CN101896824A CN101896824A CN2008801199710A CN200880119971A CN101896824A CN 101896824 A CN101896824 A CN 101896824A CN 2008801199710 A CN2008801199710 A CN 2008801199710A CN 200880119971 A CN200880119971 A CN 200880119971A CN 101896824 A CN101896824 A CN 101896824A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6592—Specific features or arrangements of connection of shield to conductive members the conductive member being a shielded cable
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Leads Or Probes (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
本发明涉及一种改进的屏蔽接触器,其具有一种绝缘材料或环氧树脂(9a,9b)来产生稳定的电接触。因此组装好的接触器四周均有导电材料,从而提供了屏蔽元素。因此本发明可以消除信号在传播过程中产生的阻抗不匹配。
Description
技术领域
本发明涉及一种测试时与某设备相连的接触器,本发明尤其涉及一种含有绝缘材料的屏蔽接触器,本发明进一步涉及那些能够产生稳定电接触的结构。
背景技术
目前市场上有大量的接触器可供我们使用,如传统的塑料接触器和/或部分屏蔽接触器。
这些屏蔽设备中有一大部分是由相对较薄的弹性金属片制成,它们使用弹簧接触器来在多个位置处产生电接触,在各种屏蔽设置中形成有效的地接。
屏蔽是建立在同轴理论上的,其中通过使框架与地针之间形成短路,可以在信号针周围形成一个模拟的地板,从而可以良好地控制阻抗,而阻抗正是决定接触器性能的主要因素。
其中一种商用的部分屏蔽的接触器由三块板组成。由导电材料制成的中间那块板比地针短,于是就形成了一块模拟的地板来屏蔽一个恒定阻抗的信号针。而由工程塑料材料制成的顶板和底板可以将那些针固定,防止它们对地短路。为了较好地控制一个部分屏蔽接触器中的阻抗,使屏蔽百分率最大化,可以在不影响接触器机械结构的前提下,尽可能地减少塑料材料板的长度。
如果能将接触点对剂,则可以达到100%的屏蔽。但是,在限制目前可用接触器的因素中,无法达到100%屏蔽的因素之一是塑料板的厚度主要是依赖于机械限制以及插座的要求。
因此就需要有一种更不容易被损坏的接触器。为了达到100%的屏蔽,其整个框架必须由导电金属制成。
为了达到这个目的,就必须采取措施和方法来防止信号针与框架之间发生短路,而这会形成不适宜的结构和有缺陷的设备。
因此,本发明的目的之一是提供一种环氧树脂密封的接触器,它能克服上述缺点,达到100%的屏蔽。因此,该接触器中***了一种绝缘材料来防止信号针对地短路。这样就可以使机械限制被压缩到部分屏蔽的接触器上。
同时环氧树树的成型特性可以形成封闭,并有效地形成一个稳定的接触器结构。
发明内容
如上文背景技术所述,本发明的目的之一是提供一种稳定的接触结构,它能达到100%的屏蔽,本发明还有一个目的是减少在信号传播的过程中产生的阻抗不匹配。
下文中图示的结构将进一步说明本发明的上述及其它目的。本发明由六个部分组成;如本发明的一个实施例所述,本发明至少包括六个结构。所述的接触器设有一个第一接触构件(上探针),第二接触构件(下探针),它们均从其顶面延伸到底面,从而均与DUT相接触;一个顶板和一个底板,它们均被一种绝缘材料密封,这种绝缘材料非限制性地包括环氧树脂。这些板均用于探针的框架,并都是由导电材料制成。
使框架与地针之间发生短路就可以形成那些虚拟的地板,于是就为信号针提供了屏蔽,并在信号路径上形成了一个对阻抗的良好且恒定的控制。在接触器内部有一种绝缘材料,非限制性地例如环氧树脂,作为一种固定物来支撑信号针,同时还能防止信号针与框架之间发生短路。
在信号传播的过程中,相邻针之间会发生干扰,从而产生一种高噪音且失真的传播信号。这些相邻针之间产生的干扰现象通常被称为串扰。
在本发明中,这些信号针被100%的屏蔽,因此形成了与传统塑料和/或部分屏蔽接触器完全相反的,最优化的串扰性能。
在屏蔽法中所获得的对阻抗的良好控制,进一步减少了在传播线上产生的阻抗不匹配问题。产生的不匹配越少,则回波损耗越好。
较之本发明,传统的塑料和部分屏蔽接触器中塑料材料的含有率更高。含有率越低,则介电损耗正切越少,于是就提高了信号针的接触***损耗性能。因此,本发明中显著减少了在传统塑料或部分屏蔽的接触器中通常由传播带来的损耗。
100%的屏蔽可以极大地提高环电感。更短的回路和更多的互感电路可以显著改善环电感。
这样,本发明就达到了其它的目的和优点,总结起来,某些可以提供改进的对电子设备中产生的电磁和无线电干扰的屏蔽,减少干扰的影响,达到并维持有效的屏蔽接触;形成屏蔽设备中接触器的完全偏离,从而减少影响,不会产生有害的连续变形。
本发明还有一个目的是提供长期稳定的良好屏蔽接触,防止那些将会破坏有效屏蔽接触的永久变形。
本发明的另一个目的是在接触器与其四周的结构之间形成高度的局部接触,从而获得更有效的屏蔽接触。
本发明还有一个目的是提供一种被屏蔽的接触器,它不会受到来自于其它来源的不正确电子信号带来的电子干扰的影响,
附图说明
图1是传统的3-板结构探针接触器的剖视图。
图2是本发明的前剖视图。
图3是本发明的俯视图。
图4是本发明的立体图。
具体实施方式
虽然下文中具体说明了本发明的多个优选实施例的制作和使用,但是应理解为这仅是证明本发明的创造理念可以被具体化实施。这里通过图示说明的具体实施例不能限制本发明的保护范围。
在描述附图所示的本发明的优选实施例中,为了说明清楚,将采用具体的术语。但是,本发明不能被所选择的这些术语限制,而应理解为每个具体的术语包括了所有用类似方法达到类似目的的同等技术。
如图1所示,用于半导体设备检测的传统3-板结构探针接触器通常由如下部分组成:信号针(1’),支撑信号针(1’)的顶板(3’)和底板(4’),其中信号针(1’)与设有气隙(10’)的导电材料(9’)层之间相互传导。这种部分屏蔽的传统接触器由三块板组成。导电材料(9’)与地针之间短路(图中未显示),从而形成了一个模拟的地板在一个恒定阻抗时来屏蔽信号针(1’)。信号针(1’)的四周设有无材料的气隙(10’)。这种气隙(10’)不与信号针(1’)连接。顶板(3’)和底板(4’)均由工程塑料材料制成,它们作为框架用于定位那些探针,防止这些探针对地短路。为了良好地控制部分屏蔽接触器的阻抗,需要减少顶板(3’)和底板(4’)的塑料材料板,使屏蔽百分率最大化。
本发明的目的和优点,以及其它目的和优点将在图2所示的实施例中简洁地说明为一种改进的屏蔽接触器设备。图2是前视图(参照X轴(6),其中Z轴(8)在其上面,Y轴(7)在其右边)。本发明由一块内部设有气隙(5a)的顶板(3)和一块内部设有气隙(5b)的底板(4)组成,其中顶板(3)和底板(4)内含有一种导电材料或一种涂有如金、铜等金属材料的塑料材料,其中所述的导电材料可以非限制性地包括铝。
图2中所示的一种接触器,其作为探针(1)框架的板(3,4)是由一种导电材料制成,该材料纵向延伸,并在板(3,4)的相对侧面之间形成一个侧向宽度。所述的导电材料可以包括铝或一种涂有金、铜等金属材料的塑料材料。因此,组装好的接触器四周均有导电材料,从而提供了屏蔽元素。将框架短路来产成所述的模拟地板,于是为信号针(1)形成屏蔽;最后就可以用作其它信号针,在信号路径上对阻抗形成良好的恒定控制。
例如在一个优选实施例中,目标接触器用于在一个IC包和一个印刷电路板之间形成多个电连接,所述的接触器包括一块不导电的基板或一种绝缘材料,这种材料非限制性地优选环氧树脂。如本发明所述,在其顶面和底面之间延伸的多个绝缘材料(9a,9b)优选可以防止信号针(1)与框架,即顶板(3)和底板(4)之间发生短路。环氧树脂(9a,9b)的另一个作用是作为一种固定物来支撑信号针(1)以及顶板(3)和底板(4)。
图3是本发明的俯视图(参照Z轴(8)的设计,其中X轴(6)在其下面,Y轴(7)在其右边)。与上探针(1)一起形成的绝缘材料(9a)是为了用于解决在部分屏蔽的传统接触器表面上产生的某些机械问题。***到某个接触器中的绝缘材料(9a)是由导电材料制成,用于固定针(1)。
由于框架,即顶板(3)和底板(4)对地短路,因此信号针(1)就必须要用所述材料(9a,9b)来防止对地短路。因此这种设备就能形成100%的屏蔽。根据同轴原理,这时达到的百分率就可以使接触器具有最有效和最优选的RF特性。信号针(1)内部设置的气隙(5a)可以进一步的改善***损耗性能。由于空气的介电损耗正切值最低,因此可以改善***和信号传播过程中产生的损耗。
图4是本发明的立体图(图中显示了Z轴(8),X轴(6)和Y轴(7))。本图清晰地显示出绝缘材料(9a,9b)的位置,该绝缘材料(9a,9b)和框架即顶板和底板(3,4)一起在气隙(5a,5b)之间支撑信号针(1)。
图4还显示了信号针(1)的位置,它与地针(2)分开以形成100%的屏蔽,因为地板不会再受到图1(现有技术)所示的塑料和部分屏蔽的传统接触器中顶板和底板(3,4)的限制。
本发明对上述优选实施例的说明仅是为了提供具体的实例。本发明还可以在不偏离权利要求的实质原理和范围的情况下,改变各种细节的设计,结构和过程。
Claims (8)
1.一种有三块板的接触器,由信号针(1’)、顶板(3’)、底板(4’)和中间的板(9’)组成;顶板(3’)、底板(4’)纵向延伸,并且板(3’,4’)的相对侧面之间有一个侧向宽度;其特征在于所述的接触器具有一种改进的屏蔽元素,该元素包括一种导电材料。
2.ECO接触器,其特征在于所述的不导电材料包括在顶面和底面之间延伸的多个绝缘材料(9a,9b)。
3.如权利要求2所述的ECO接触器,其特征在于所述的绝缘材料是环氧树脂(9a,9b)。
4.如权利要求3所述的ECO接触器,其特征在于顶板(3)和底板(4)内含有的绝缘材料(9a,9b)纵向延伸,并在板(3,4)的相对侧面之间形成一个侧向宽度。
5.如权利要求4所述的ECO接触器,其特征在于顶板和底板(3,4)是由一种如铝等导电材料(9)或一种塑料材料组成,其中所述的塑料材料上涂有金、铜等金属材料。
6.如权利要求4所述的ECO接触器,其特征在于所述的绝缘材料或环氧树脂(9a,9b)的弹性大到它能被有效地制成各种容器的形状。
7.ECO接触器,其特征在于顶板(3)的内部还设有一个气隙(5a),而底板(4)的内部还设有一个气隙(5b)。
8.如权利要求7所述的一种接触器,其特征在于所述的接触器是一种单头或双头探针。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI20072178 | 2007-12-06 | ||
MYPI20072178 MY151561A (en) | 2007-12-06 | 2007-12-06 | Eco contactor |
PCT/MY2008/000179 WO2009072864A1 (en) | 2007-12-06 | 2008-12-05 | Eco contactor |
Publications (1)
Publication Number | Publication Date |
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CN101896824A true CN101896824A (zh) | 2010-11-24 |
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ID=43836125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2008801199710A Pending CN101896824A (zh) | 2007-12-06 | 2008-12-05 | Eco接触器 |
Country Status (6)
Country | Link |
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US (1) | US8210875B2 (zh) |
JP (1) | JP2011506925A (zh) |
KR (1) | KR20100105622A (zh) |
CN (1) | CN101896824A (zh) |
MY (1) | MY151561A (zh) |
WO (1) | WO2009072864A1 (zh) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US9059545B2 (en) * | 2012-07-11 | 2015-06-16 | Tyco Electronics Corporations | Socket connectors and methods of assembling socket connectors |
US20140327462A1 (en) * | 2013-05-03 | 2014-11-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Test socket providing mechanical stabilization for pogo pin connections |
US9151778B2 (en) * | 2013-05-22 | 2015-10-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Semiconductor device test socket |
KR101954086B1 (ko) * | 2017-11-07 | 2019-03-06 | 리노공업주식회사 | 검사 프로브 조립체 및 검사 소켓 |
KR102653116B1 (ko) * | 2023-07-20 | 2024-04-02 | 주식회사 비이링크 | 전자 소자의 회로 검사용 소켓 장치 |
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US3806801A (en) * | 1972-12-26 | 1974-04-23 | Ibm | Probe contactor having buckling beam probes |
FR2538989B1 (fr) * | 1982-12-30 | 1985-10-04 | Thomson Csf | Structure d'assemblage de circuits electroniques complexes, et procede d'amelioration de la fiabilite d'un tel assemblage |
US5521519A (en) * | 1992-07-30 | 1996-05-28 | International Business Machines Corporation | Spring probe with piloted and headed contact and method of tip formation |
US5945836A (en) * | 1996-10-29 | 1999-08-31 | Hewlett-Packard Company | Loaded-board, guided-probe test fixture |
US6404211B2 (en) * | 1999-02-11 | 2002-06-11 | International Business Machines Corporation | Metal buckling beam probe |
US6094115A (en) * | 1999-02-12 | 2000-07-25 | Raytheon Company | Control impedance RF pin for extending compressible button interconnect contact distance |
DE19983903T1 (de) * | 1999-11-17 | 2002-02-28 | Advantest Corp | IC-Sockel und IC-Testgerät |
WO2002007265A1 (en) * | 2000-07-13 | 2002-01-24 | Rika Electronics International, Inc. | Contact apparatus particularly useful with test equipment |
US6911833B2 (en) * | 2001-12-13 | 2005-06-28 | Intel Corporation | Electromagnetically shielded test contactor |
US6712621B2 (en) * | 2002-01-23 | 2004-03-30 | High Connection Density, Inc. | Thermally enhanced interposer and method |
US6902410B2 (en) * | 2002-07-15 | 2005-06-07 | Enplas Corporation | Contact unit and socket for electrical parts |
US6902416B2 (en) * | 2002-08-29 | 2005-06-07 | 3M Innovative Properties Company | High density probe device |
US7040902B2 (en) * | 2003-03-24 | 2006-05-09 | Che-Yu Li & Company, Llc | Electrical contact |
US7404718B2 (en) * | 2003-11-05 | 2008-07-29 | Tensolite Company | High frequency connector assembly |
US7946853B2 (en) * | 2005-07-02 | 2011-05-24 | Teradyne, Inc. | Compliant electro-mechanical device |
-
2007
- 2007-12-06 MY MYPI20072178 patent/MY151561A/en unknown
-
2008
- 2008-12-05 WO PCT/MY2008/000179 patent/WO2009072864A1/en active Application Filing
- 2008-12-05 CN CN2008801199710A patent/CN101896824A/zh active Pending
- 2008-12-05 US US12/746,699 patent/US8210875B2/en not_active Expired - Fee Related
- 2008-12-05 JP JP2010536866A patent/JP2011506925A/ja active Pending
- 2008-12-05 KR KR1020107013793A patent/KR20100105622A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
US8210875B2 (en) | 2012-07-03 |
MY151561A (en) | 2014-06-13 |
WO2009072864A1 (en) | 2009-06-11 |
KR20100105622A (ko) | 2010-09-29 |
US20100311274A1 (en) | 2010-12-09 |
JP2011506925A (ja) | 2011-03-03 |
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