CN101888770A - Flexible conducting material substrate and implementing method thereof - Google Patents
Flexible conducting material substrate and implementing method thereof Download PDFInfo
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- CN101888770A CN101888770A CN2010102235037A CN201010223503A CN101888770A CN 101888770 A CN101888770 A CN 101888770A CN 2010102235037 A CN2010102235037 A CN 2010102235037A CN 201010223503 A CN201010223503 A CN 201010223503A CN 101888770 A CN101888770 A CN 101888770A
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- conducting material
- flexible conducting
- grid
- fixing glue
- projection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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Abstract
The invention discloses a flexible conducting material substrate, which comprises a raised grid and a fixing glue grid arranged on one side of the flexible conducting material substrate. The invention also discloses a method for implementing the flexible conducting material substrate. By applying the structure and the method, the mounting firmness of the flexible conducting material can be guaranteed, and the requirement on the conducting reliability of the flexible conducting material is met.
Description
Technical field
The present invention relates to electromagnetic shielding material, relate in particular to electromagnetic shielding material substrate and its implementation of a kind of compliant conductive.
Background technology
Along with the fast development of electronic technology, electronic product emerges in an endless stream, and the requirement of Electrostatic Protection of Electronic Products and electromagnetic wave shielding function is also being improved day by day.According to the operation principle of electronic circuit as can be known, as long as there is alternating current to exist, radiation just will inevitably generate electromagnetic waves.Electromagenetic wave radiation all can work the mischief to the integrality of signal and the reliability of circuit etc., therefore, derives the method for various electromagnetic wave shieldings.
At present, the method for electromagnetic wave shielding mainly is divided into electric screen and magnetic screen; Wherein, described electric screen is to use electric conducting material that electromagnetic radiation zone is covered or parcel, forms the structure of similar Faraday cage, and the mode by electric field shielding is with electromagnetic wave shielding; Described magnetic screen is to adopt magnetic shielding material, and as ferrite etc., the mode by armoured magnetic field is with electromagnetic wave shielding.
Existing electrical shielding material comprises hardmetal good conductor and flexible conducting material, and described hardmetal good conductor can be processed to the cavity of solid shape, will need the circuit of conductively-closed to be placed in one again; Described flexible conducting material can be conductive fabric or conductive metal film etc., because flexible conducting material has plasticity and easy process and assemble, is widely used in the electronic product such as portable terminal.
In the application process of flexible conducting material, the fastness of flexible conducting material installation and the reliability of conduction there is certain requirement.Corresponding fastness of installing, existing solution is: fixing glue is coated in the one side of flexible conducting material, this one side that scribbles fixing glue is sticked on the zone that needs shielding.But, because fixing glue is not good conductor, flexible conducting material is well contacted with ground level around the conductively-closed zone, therefore,, and can't satisfy the reliability of conduction if only can only realize the fastness of installing with fixing glue.
In order to address this problem, existent method is the problem that doping metals particle or conductive fiber improve the fixing glue poorly conductive in fixing glue, but owing to also be wrapped in fixing glue around discrete metallic particles or the conductive fiber, need flexible conducting material is applied certain pressure, the conductively-closed zone is connected with flexible conducting material with guarantee fund's metal particles.But the corresponding conductive effect of different pressure size also is different, and in use the pressure size is difficult to control, therefore, is difficult to reach the requirement to flexible conducting material conduction reliability.
Summary of the invention
In view of this, main purpose of the present invention is to provide a kind of flexible conducting material substrate and its implementation, can satisfy the reliability requirement to the flexible conducting material conduction when guaranteeing that flexible conducting material is installed fastness.
For achieving the above object, technical scheme of the present invention is achieved in that
The invention provides a kind of flexible conducting material substrate, comprising: the protruding grid and the fixing glue grid that are arranged at flexible conducting material substrate one side; Wherein,
Described protruding grid comprises a plurality of projectioies of arranging in length and breadth, is connected with conductively-closed zone ground level on every side;
Described fixing glue grid is fixed on the conductively-closed zone.
Wherein, described projection is regular stereochemical structure or is irregular stereochemical structure.
Wherein, described flexible conducting material is conduction dry goods flexible conducting material or conductive metal film class flexible conducting material.
Wherein, described flexible conducting material projection grid and described fixing glue Box junction distribute.
Wherein, the distance between described adjacent protrusion is provided with according to the electromagnetic wavelength that needs conductively-closed, is directly proportional with electromagnetic wavelength.
Wherein, the thickness of described projection is identical with the thickness of fixing glue grid; Perhaps, have thickness difference between projection thickness and fixing glue grid thickness, described thickness difference is according to the retractility setting of both respective material.
The present invention also provides a kind of implementation method of flexible conducting material substrate, and this method comprises:
Protruding grid is set on the flexible conducting material substrate plane, and places fixing glue in the groove between flexible conducting material projection grid, form the fixing glue grid.
Wherein, described flexible conducting material is conduction dry goods flexible conducting material or conductive metal film class flexible conducting material; Accordingly, the described method that flexible conducting material projection grid is set is specially:
Produce the protruding grid of flexible conducting material by the mode of braiding stamp; Perhaps,
Rely on metal material self good ductility to stamp out protruding grid by machining.
Wherein, described formation fixing glue grid is:
Utilize the mode of specific mould or use machining, produce fixing glue grid with flexible conducting material projection Box junction coupling.
In the such scheme, the projection of the protruding grid of described formation is regular stereochemical structure or is irregular stereochemical structure.
Flexible conducting material substrate provided by the invention and its implementation are provided with protruding grid on the flexible conducting material substrate plane; Place fixing glue in the groove between flexible conducting material projection grid, form the fixing glue grid.The flexible conducting material projection grid and the flexible conducting material substrate of setting of the present invention are one, has excellent conducting performance each other, when flexible conducting material of the present invention is fixed on the conductively-closed zone, dense protruding grid well contacts with conductively-closed zone ground level on every side, can realize the flexible conducting material good electrical conductivity.
In addition, the present invention is filled in fixing glue in the groove between the described flexible conducting material projection grid, and the fixing glue grid of formation mates with protruding Box junction, and, projection grid all raised surface glue that can not be fixed covers, and therefore can avoid the flexible conducting material glue that is fixed to isolate; Simultaneously, the fixing glue grid also can firmly be fixed on flexible conducting material on the conductively-closed zone, guarantees the installation fastness of flexible conducting material.
Description of drawings
Fig. 1 is the perspective view of flexible conducting material substrate of the present invention;
Fig. 2 is the implementation method schematic flow sheet of flexible conducting material substrate of the present invention.
Embodiment
Basic thought of the present invention is: protruding grid is set on the flexible conducting material substrate plane; Place fixing glue in the groove between flexible conducting material projection grid, form the fixing glue grid.
Wherein, described flexible conducting material projection grid and flexible conducting material substrate are one; Described flexible conducting material projection grid and described fixing glue Box junction distribute, that is: fixing glue is distributing around each projection of flexible conducting material projection grid; Distance between described flexible conducting material adjacent protrusion is provided with according to the electromagnetic wavelength that needs conductively-closed.
The projection of flexible conducting material of the present invention can be set to regular structures such as cylinder, cube, perhaps also can be set to other irregular structure.Projection with flexible conducting material is that cube structure is an example below, and the structure of flexible conducting material of the present invention is described.
Fig. 1 as shown in Figure 1, comprising: the protruding grid and the fixing glue grid that are arranged at flexible conducting material substrate one side for the perspective view of flexible conducting material substrate of the present invention; Wherein,
Described protruding grid is made up of several projectioies of arranging in length and breadth, is connected with conductively-closed zone ground level on every side, realizes the conductivity of flexible conducting material; Ground level around the described conductively-closed zone is positioned on the plane, protruding grid place shown in Fig. 1, and be close to protruding grid, here, for the structure of clear protruding grid of expression and fixing glue grid, in Fig. 1, do not provide the structure of conductively-closed zone ground level on every side.
Described fixing glue grid is fixed on the conductively-closed zone, realizes the installation fastness of flexible conducting material.
11 is flexible conducting material substrate shown in Fig. 1; 12 is a projection of flexible conducting material substrate, is cube structure; 13 is the fixing glue grid.Wherein, described flexible conducting material projection 12 repeats, and some projectioies of arranging in length and breadth constitute flexible conducting material projection grid, and do not have fixing glue on the surface of described flexible conducting material projection 12; Described flexible conducting material substrate 11 and flexible conducting material projection grid are one, have excellent conducting performance each other.
Fixing glue of the present invention is filled in the groove between the described flexible conducting material projection grid, form fixing glue grid 13, and there is not fixing glue on the surface of described flexible conducting material projection 12, fixing glue grid 13 is different from the fixing glue that existing full wafer covers, therefore can avoid the flexible conducting material glue that is fixed to isolate, can not influence the conductivity of flexible conducting material.
In actual application, by described fixing glue grid 13 flexible conducting material is pasted and fixed on the conductively-closed zone, install firmly; Simultaneously, flexible conducting material projection grid well contacts with conductively-closed zone ground level on every side, realizes the flexible conducting material good electrical conductivity.
S shown in Fig. 1 is the distance between the flexible conducting material adjacent protrusion, and this is apart from being provided with according to the electromagnetic wavelength that needs conductively-closed, and concrete, the electromagnetic wavelength of establishing conductively-closed is λ, so, can S be set and λ is proportional; λ is long more, and the S of setting is also big more, and proportionality coefficient between the two can be provided with arbitrarily; Certainly, concerning same λ, S is more little, and shield effectiveness is good more.
T shown in Fig. 1 is the thickness of fixing glue grid, also is the thickness of flexible conducting material projection.Certainly, the thickness of described fixing glue grid and flexible conducting material projection can be slightly different, that is: both roughly at grade, thickness difference between the two is about about 10% of gross thickness; Certainly, according to the difference of material, described thickness difference also can change to some extent.Because flexible conducting material and fixing glue have certain retractility, elasticity in other words, as long as when flexible conducting material is fixed on the conductively-closed zone, both all can well contact the conductively-closed zone and get final product.In actual applications, can realize the fastness of installation and the balance between the conduction formedness by the size of adjusting T, for example: if T is smaller, conductivity is then quite a lot of, and fastness is just poorer; If T is big, fastness is then better, and conductivity is just relatively poor.
Implementation method to flexible conducting material of the present invention is described in detail below.
Fig. 2 is the implementation method schematic flow sheet of flexible conducting material substrate of the present invention, and as shown in Figure 2, the performing step of this method is as follows:
Step 201: protruding grid is set on the flexible conducting material substrate plane;
Be specially: on traditional flexible conducting material substrate plane, protruding grid is set,, can produces the protruding grid of flexible conducting material by the mode of braiding stamp for conduction dry goods flexible conducting material; For conductive metal film class flexible conducting material, can rely on metal material self good ductility to stamp out protruding grid by machining.
Wherein, the projection of described flexible conducting material can be set to regular structures such as cylinder, cube, perhaps also can be set to other irregular structure.
Step 202: the fixing glue grid is set;
Be specially: utilize the mode of specific mould or use machining, produce the fixing glue grid that mates with flexible conducting material projection Box junction, the thickness of the thickness of fixing glue grid and flexible conducting material projection grid is roughly the same.
Step 203: the fixing glue grid is assembled on the flexible conducting material substrate that is provided with protruding grid;
Be specially: the fixing glue grid is filled in the groove between the flexible conducting material projection grid, and is fixed on the flexible conducting material substrate, avoid the flexible conducting material raised surface glue that is fixed to cover during assembling by the viscosity of fixing glue self.
The above is preferred embodiment of the present invention only, is not to be used to limit protection scope of the present invention, all any modifications of being done within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a flexible conducting material substrate is characterized in that, comprising: the protruding grid and the fixing glue grid that are arranged at flexible conducting material substrate one side; Wherein,
Described protruding grid comprises a plurality of projectioies of arranging in length and breadth, is connected with conductively-closed zone ground level on every side;
Described fixing glue grid is fixed on the conductively-closed zone.
2. flexible conducting material substrate according to claim 1 is characterized in that, described projection is regular stereochemical structure or is irregular stereochemical structure.
3. flexible conducting material substrate according to claim 1 and 2 is characterized in that, described flexible conducting material is conduction dry goods flexible conducting material or conductive metal film class flexible conducting material.
4. flexible conducting material substrate according to claim 1 and 2 is characterized in that, described flexible conducting material projection grid and described fixing glue Box junction distribute.
5. flexible conducting material substrate according to claim 1 and 2 is characterized in that, the distance between described adjacent protrusion is provided with according to the electromagnetic wavelength that needs conductively-closed, is directly proportional with electromagnetic wavelength.
6. flexible conducting material substrate according to claim 1 and 2 is characterized in that, the thickness of described projection is identical with the thickness of fixing glue grid; Perhaps, have thickness difference between projection thickness and fixing glue grid thickness, described thickness difference is according to the retractility setting of both respective material.
7. the implementation method of a flexible conducting material substrate is characterized in that, this method comprises:
Protruding grid is set on the flexible conducting material substrate plane, and places fixing glue in the groove between flexible conducting material projection grid, form the fixing glue grid.
8. the implementation method of flexible conducting material substrate according to claim 7 is characterized in that, described flexible conducting material is conduction dry goods flexible conducting material or conductive metal film class flexible conducting material; Accordingly, the described method that flexible conducting material projection grid is set is specially:
Produce the protruding grid of flexible conducting material by the mode of braiding stamp; Perhaps,
Rely on metal material self good ductility to stamp out protruding grid by machining.
9. according to the implementation method of claim 7 or 8 described flexible conducting material substrates, it is characterized in that described formation fixing glue grid is:
Utilize the mode of specific mould or use machining, produce fixing glue grid with flexible conducting material projection Box junction coupling.
10. according to the implementation method of claim 7 or 8 described flexible conducting material substrates, it is characterized in that the projection of the protruding grid of described formation is regular stereochemical structure or is irregular stereochemical structure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010223503.7A CN101888770B (en) | 2010-07-07 | 2010-07-07 | A kind of flexible conducting material substrate and its implementation |
| PCT/CN2010/077145 WO2012003664A1 (en) | 2010-07-07 | 2010-09-20 | Flexible conductive material substrate and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010223503.7A CN101888770B (en) | 2010-07-07 | 2010-07-07 | A kind of flexible conducting material substrate and its implementation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101888770A true CN101888770A (en) | 2010-11-17 |
| CN101888770B CN101888770B (en) | 2015-08-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010223503.7A Active CN101888770B (en) | 2010-07-07 | 2010-07-07 | A kind of flexible conducting material substrate and its implementation |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101888770B (en) |
| WO (1) | WO2012003664A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576692A (en) * | 2014-11-24 | 2015-04-29 | 深圳市华星光电技术有限公司 | Conductive flexible substrate, manufacturing method of conductive flexible substrate, OLED display device and manufacturing method of OLED (organic light emitting diode) display device |
| CN104853577A (en) * | 2015-05-13 | 2015-08-19 | 东莞市万丰纳米材料有限公司 | Ultrathin electromagnetic shielding membrane and production technology thereof |
| CN107690261A (en) * | 2017-07-31 | 2018-02-13 | 广东欧珀移动通信有限公司 | A kind of attaching method of graphite flake mounting structure, mobile terminal and graphite flake mounting structure |
| CN107767775A (en) * | 2017-11-30 | 2018-03-06 | 昆山国显光电有限公司 | Flexible Displays module |
| CN110831418A (en) * | 2018-08-09 | 2020-02-21 | 鸿富锦精密工业(武汉)有限公司 | Case panel and case adopting same |
Citations (4)
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| US5528001A (en) * | 1992-02-14 | 1996-06-18 | Research Organization For Circuit Knowledge | Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths |
| JPH10294586A (en) * | 1997-04-18 | 1998-11-04 | Dainippon Printing Co Ltd | Magnetism-proof card case |
| US6054647A (en) * | 1997-11-26 | 2000-04-25 | National-Standard Company | Grid material for electromagnetic shielding |
| CN1922948A (en) * | 2004-02-27 | 2007-02-28 | 三菱瓦斯化学株式会社 | Radio wave absorber and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH10294583A (en) * | 1997-04-16 | 1998-11-04 | Seiwa Electric Mfg Co Ltd | Electromagnetic wave shielding gasket |
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2010
- 2010-07-07 CN CN201010223503.7A patent/CN101888770B/en active Active
- 2010-09-20 WO PCT/CN2010/077145 patent/WO2012003664A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5528001A (en) * | 1992-02-14 | 1996-06-18 | Research Organization For Circuit Knowledge | Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths |
| JPH10294586A (en) * | 1997-04-18 | 1998-11-04 | Dainippon Printing Co Ltd | Magnetism-proof card case |
| US6054647A (en) * | 1997-11-26 | 2000-04-25 | National-Standard Company | Grid material for electromagnetic shielding |
| CN1922948A (en) * | 2004-02-27 | 2007-02-28 | 三菱瓦斯化学株式会社 | Radio wave absorber and manufacturing method thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576692A (en) * | 2014-11-24 | 2015-04-29 | 深圳市华星光电技术有限公司 | Conductive flexible substrate, manufacturing method of conductive flexible substrate, OLED display device and manufacturing method of OLED (organic light emitting diode) display device |
| CN104576692B (en) * | 2014-11-24 | 2018-01-30 | 深圳市华星光电技术有限公司 | Conductive flexible substrate and preparation method thereof and OLED display and preparation method thereof |
| CN104853577A (en) * | 2015-05-13 | 2015-08-19 | 东莞市万丰纳米材料有限公司 | Ultrathin electromagnetic shielding membrane and production technology thereof |
| CN104853577B (en) * | 2015-05-13 | 2018-06-15 | *** | Ultra-thin electromagnetic shields film production process |
| CN107690261A (en) * | 2017-07-31 | 2018-02-13 | 广东欧珀移动通信有限公司 | A kind of attaching method of graphite flake mounting structure, mobile terminal and graphite flake mounting structure |
| CN107690261B (en) * | 2017-07-31 | 2019-10-01 | Oppo广东移动通信有限公司 | A kind of attaching method of graphite flake mounting structure, mobile terminal and graphite flake mounting structure |
| CN107767775A (en) * | 2017-11-30 | 2018-03-06 | 昆山国显光电有限公司 | Flexible Displays module |
| CN107767775B (en) * | 2017-11-30 | 2020-05-19 | 广州国显科技有限公司 | Flexible display module |
| CN110831418A (en) * | 2018-08-09 | 2020-02-21 | 鸿富锦精密工业(武汉)有限公司 | Case panel and case adopting same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012003664A1 (en) | 2012-01-12 |
| CN101888770B (en) | 2015-08-12 |
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