CN101887860A - Manufacturing method of electronic elements and encapsulation structures thereof - Google Patents
Manufacturing method of electronic elements and encapsulation structures thereof Download PDFInfo
- Publication number
- CN101887860A CN101887860A CN 200910143133 CN200910143133A CN101887860A CN 101887860 A CN101887860 A CN 101887860A CN 200910143133 CN200910143133 CN 200910143133 CN 200910143133 A CN200910143133 A CN 200910143133A CN 101887860 A CN101887860 A CN 101887860A
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- electronic element
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000005538 encapsulation Methods 0.000 title abstract description 5
- 238000007789 sealing Methods 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 32
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 9
- 238000005275 alloying Methods 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 229910000906 Bronze Inorganic materials 0.000 claims 4
- 239000010974 bronze Substances 0.000 claims 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 4
- 210000004027 cell Anatomy 0.000 claims 1
- 239000000084 colloidal system Substances 0.000 abstract 5
- 238000005253 cladding Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 10
- 230000001788 irregular Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a manufacturing method of encapsulation structures of electronic elements, which comprises the following steps of: providing a substrate provided with a plurality of electronic elements; cladding sealing colloid on the electronic elements arranged on the substrate; cutting a plurality of precutting grooves on the sealing colloid to form a plurality of sealing colloid units; forming an electromagnetic shielding layer for cladding the sealing colloid units on the surfaces of the sealing colloid units and the precutting groove parts; and cutting along at least one precutting groove to form a plurality of encapsulation structures of the electronic elements. The invention additionally provides the encapsulation structures of the electronic elements produced by the manufacturing method of the electronic elements.
Description
Technical field
The present invention relates to a kind of manufacturing method of electronic elements and encapsulating structure thereof, refer to a kind of manufacturing method of electronic elements and encapsulating structure thereof that blocks the electromagnetic interference (EMI) effect that have especially.
Background technology
In circuit design, in every case lead, circuit board and various big or small electronic component all can generate electromagnetic waves, and the electromagnetic wave that these different elements produced might exert an influence to overall circuit performance, we are called electromagnetic interference (Electro Magnetic Interference this phenomenon, EMI), technology with present does not have radical solving method for electromagnetic interference, but good circuit design and wires design can drop to minimum with the problem of electromagnetic interference.
And in the middle of technique known; for the electromagnetic interference between isolated each electronic component; the method of normal use is lived the electronic component frame of desire protection for utilizing metal-back, blocks electromagnetic wave to form a conductor shade, and then reduces the harm of electromagnetic interference to circuit.
But fast development along with science and technology, electronic component fast compactization, high frequencyization and distribution density are more and more higher, the mobile communication product of present stage for example, develop towards the direction that WiFi, BT and GPS or the like wireless module is integrated in the single module, also therefore the problem of electromagnetic interference just seems more thorny.
And traditional metal cover will be applied in the minimum and irregular space, not only isolate the electromagnetic interference poor effect, and will make the electromagnetic interference that metal cover is isolated the different radio intermodule in single module, in technical its degree of difficulty be arranged also, also therefore cost seems too expensive.
Comprehensive the above, main purpose of the present invention is to provide a kind of electronic package manufacture method and encapsulating structure thereof that blocks the electromagnetic interference (EMI) effect that have, to improve the problems referred to above.
Summary of the invention
Technical problem and purpose that institute of the present invention desire solves:
Take a broad view of the above, known when being used for metal cover that isolated battery disturbs and being applied to the circuit design of miniaturization, high frequencyization, limited and usually be irregular shape because of the space that can be provided with, so manufacturing complexity comparatively not only, the effect that blocks electromagnetic interference is not good, and cost is also too expensive.
Therefore, main purpose of the present invention is to provide a kind of manufacturing method of electronic elements and encapsulating structure thereof, and this encapsulating structure has the effect of the electromagnetic interference of blocking, and manufacture method is comparatively simple.
The technological means that the present invention deals with problems:
A kind of manufacture method of electronic element packaging structure comprises following steps: the substrate with a plurality of electronic components is provided; Adhesive body is coated on the electronic component that is arranged on the substrate; Adhesive body is cut out a plurality of precutting troughs to form a plurality of sealings unit; The ELECTROMAGNETIC OBSCURANT layer that forms the described sealing of coating unit at the surface and the precutting trough place of sealing unit; And cut to form a plurality of electronic element packaging structures along at least one this precutting trough.
The present invention's effect against existing technologies:
Compared to known metal cover, disclosed in this invention a kind ofly have the manufacturing method of electronic elements that blocks the electromagnetic interference (EMI) effect and have lower complexity, and can be applied to have lower-cost advantage simultaneously in the high circuit design of miniaturization, complexity easily.
Specific embodiment of the present invention will be further described by following embodiment and accompanying drawing.
Description of drawings
For above-mentioned and other purposes of the present invention, feature, advantage and embodiment can be become apparent, appended accompanying drawing is described in detail as follows:
Fig. 1 is the substrate schematic diagram with a plurality of electronic components to be packaged;
Fig. 2 is arranged on the schematic diagram of the electronic component on the substrate for adhesive body is coated on;
Fig. 3 is for cutting out adhesive body in advance the schematic diagram of a plurality of precutting troughs;
Fig. 4 is in the sealing unit and the schematic diagram of the ELECTROMAGNETIC OBSCURANT layer of formation coating sealing unit, precutting trough place;
Fig. 5 is for to cut to form the schematic diagram of a plurality of electronic element packaging structures along at least one precutting trough;
Fig. 6 is in the second embodiment of the invention being coated on sealing surface body the schematic diagram of ELECTROMAGNETIC OBSCURANT layer;
Fig. 7 cuts to form the schematic diagram of a plurality of electronic element packaging structures along at least one precutting trough for second embodiment of the invention; And
Fig. 8 is the perspective view of the electronic element packaging structure of second embodiment of the invention.
Wherein, Reference numeral
Substrate 11 '
Earth lead 12
ELECTROMAGNETIC OBSCURANT layer 4 '
Sealing surface body 5 '
Embodiment
The present invention refers to a kind of electronic package manufacture method and encapsulating structure thereof that blocks the electromagnetic interference effect that have especially about a kind of electronic package manufacture method and encapsulating structure thereof.Below enumerate a preferred embodiment with explanation the present invention, but those skilled in the art know that all this only is one for example, and be not in order to limit invention itself.The detailed description of relevant this preferred embodiment is as follows.
The manufacture method of electronic element packaging structure of the present invention comprises following steps: the substrate 11 with a plurality of electronic components 21 (a) is provided; (b) adhesive body 3 is coated at least one electronic component 21 that is arranged on the substrate 11; (c) adhesive body 3 is cut out a plurality of precutting troughs 32 to form a plurality of sealings unit 31, make each sealing unit 31 coat at least one electronic component 21; (d) in sealing unit 31 and precutting trough 32 places form to coat the ELECTROMAGNETIC OBSCURANT layer 4 of sealing unit 31; And (e) cut to form a plurality of electronic element packaging structures along at least one precutting trough 32;
See also Fig. 1, Fig. 1 is 11 schematic diagrames of the substrate with a plurality of electronic components 21 to be packaged.Electronic component 21 utilizes many bonding wires 22 to be electrically connected at substrate 11.Wherein, substrate 11 has at least one earth lead 12, and further, substrate 11 can have at least one through hole (Ground Via), and with earth lead 12 electrically connects.
See also Fig. 2, Fig. 2 is for being coated on adhesive body 3 in the schematic diagram of the electronic component 21 that is arranged on the substrate 11.In step (b), adhesive body 3 is coated on the electronic component 21 that is arranged on the substrate 11, wherein, the material of adhesive body 3 is a kind of thermosetting resin, in the present embodiment, the preferably is an epoxy resin.
See also Fig. 3, Fig. 3 is for cutting out the schematic diagram of a plurality of precutting troughs 32 to adhesive body 3.In step (c), adhesive body 3 is cut out a plurality of precutting troughs 32 to form a plurality of sealings unit 31, make each sealing unit 31 coat at least one electronic component 21.Wherein, in step (c), utilize laser knife, resin glue saw blade or other cutting tools that this adhesive body is cut out described precutting trough in advance.Perhaps, utilize engraving method that this adhesive body is cut out described precutting trough in advance.Above-mentioned cutting mode can be applicable to rule cutting and irregular cutting, and for example laser knife and engraving method can be used for irregular cutting, and the resin glue saw blade then can be used for the rule cutting.
See also Fig. 4, Fig. 4 is in sealing unit 31 and the schematic diagram of the ELECTROMAGNETIC OBSCURANT layer 4 of formation coating sealing unit, precutting trough 32 places 31.In step (d), in sealing unit 31 and precutting trough 32 places form to coat the ELECTROMAGNETIC OBSCURANT layer 4 of sealing unit 31, to block electromagnetic interference.Wherein, ELECTROMAGNETIC OBSCURANT layer 4 is a kind of conductive shell, and this conductive shell can be made of conductive material such as copper, nickel, gold, aluminium or other alloying metals, and can utilize inlay, juncture such as adhesion is fixed in sealing unit 31 with conductive shell.Perhaps, ELECTROMAGNETIC OBSCURANT layer 4 is a kind of conductive coating, this conductive coating can be made of conductive material such as copper, nickel, gold, aluminium or other alloying metals, and this conductive coating can utilize smear, pressing, plating, sputter, vapour deposition or other surperficial generation types form.
See also Fig. 5, Fig. 5 is for to cut to form the schematic diagram of a plurality of electronic element packaging structures along at least one precutting trough 32.In step (e), cut to form a plurality of electronic element packaging structures along at least one precutting trough 32.
See also Fig. 6, Fig. 6 is in the second embodiment of the invention being coated on sealing surface body 5 schematic diagram of ELECTROMAGNETIC OBSCURANT layer 4.Different with first embodiment is that the second embodiment of the present invention has more a step (d1) afterwards in step (d), and sealing surface body 5 is coated on ELECTROMAGNETIC OBSCURANT layer 4.
Please continue to consult Fig. 7, Fig. 7 cuts to form the schematic diagram of a plurality of electronic element packaging structures along at least one precutting trough 32 for second embodiment of the invention.Continuity above-mentioned steps (d1) is cut to form a plurality of electronic element packaging structures along at least one precutting trough 32 in step (e).
The present invention further provides the electronic element packaging structure that utilizes above-mentioned electronic package manufacture method to manufacture.See also Fig. 5, electronic element packaging structure comprises substrate 11 ', at least one electronic component 21, at least one sealing unit 31 and ELECTROMAGNETIC OBSCURANT layer 4 '.Wherein, substrate 11 ' is laid at least one access area.Wherein, the access area is at least one earth lead 12.Further, substrate 11 ' can have at least one through hole, and with earth lead 12 electrically connects.
ELECTROMAGNETIC OBSCURANT layer 4 ' is coated on the exposed surface of sealing unit 31, and is electrically connected at the access area, to block electromagnetic interference.Wherein, ELECTROMAGNETIC OBSCURANT layer 4 ' is a conductive shell, and this conductive shell can be made of conductive material such as copper, nickel, gold, aluminium or other alloying metals, and can utilize inlay, juncture such as adhesion is fixed in sealing unit 31 with conductive shell.Perhaps, ELECTROMAGNETIC OBSCURANT layer 4 ' is a kind of conductive coating, this conductive coating can be made of conductive material such as copper, nickel, gold, aluminium or other alloying metals, and this conductive coating can utilize smear, pressing, plating, sputter, vapour deposition or other surperficial generation types form.
See also Fig. 7, the electronic element packaging structure of second embodiment of the invention and the first embodiment difference are that the electronic element packaging structure of second embodiment more comprises the exposed surface that sealing surface body 5 ' is coated on ELECTROMAGNETIC OBSCURANT layer 4 '.
Please continue to consult Fig. 8 and consult Fig. 7 simultaneously, Fig. 8 is the perspective view of the electronic element packaging structure of second embodiment of the invention.The electronic element packaging structure section of Fig. 7 is along the profile of AA tangent plane among Fig. 8.As shown in the figure, a plurality of electronic components 21 of ELECTROMAGNETIC OBSCURANT layer 4 ' in can the single module of complete coating also can be separated out a plurality of zones and to hold different electronic component 21 are set in single module.
Describe in detail by above example, when knowing that the electronic element packaging structure that utilizes above-mentioned electronic package manufacture method to manufacture of the present invention has the effect of the electromagnetic interference of blocking, and utilize different cutting tools and method can implement irregular cutting and rule cutting, to be applied in the high circuit design of miniaturization, complexity, thus not only can the single module of complete coating, also can in single module, be separated out a plurality of zones and different electronic components is set, avoid the electromagnetic interference between the different electronic components of single inside modules to hold.
In addition, electronic package of the present invention is manufactured in the effect that can make electronic element packaging structure have the electromagnetic interference of blocking in the encapsulation process, utilizes the metal cover frame to live the electronic component of desire protection compared to technique known, and its cost is also comparatively cheap.
Though the present invention with preferred embodiment openly as above; right its is not in order to limit the present invention; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (28)
1. the manufacture method of an electronic element packaging structure is characterized in that, its step comprises:
A, provide a substrate with a plurality of electronic components;
B, an adhesive body is coated at least one electronic component of this substrate;
C, this adhesive body is cut out a plurality of precutting troughs to form a plurality of sealings unit, wherein this each sealing unit coats at least one this electronic component;
D, in described sealing unit and described precutting trough place form an ELECTROMAGNETIC OBSCURANT layer that coats described sealing unit; And
E, cut to form a plurality of electronic element packaging structures along at least one this precutting trough.
2. the manufacture method of electronic element packaging structure according to claim 1 is characterized in that, described electronic component utilizes many bonding wires to be electrically connected at this substrate.
3. the manufacture method of electronic element packaging structure according to claim 1 is characterized in that, this substrate has at least one earth lead is arranged.
4. the manufacture method of electronic element packaging structure according to claim 3 is characterized in that, this substrate cording has at least one through hole, and with this earth lead electrically connect.
5. the manufacture method of electronic element packaging structure according to claim 1 is characterized in that, the material of this adhesive body is a thermosetting resin.
6. the manufacture method of electronic element packaging structure according to claim 5 is characterized in that, the material of this adhesive body is an epoxy resin.
7. the manufacture method of electronic element packaging structure according to claim 1 is characterized in that, utilizes laser knife, resin glue saw blade or other cutting tools that this adhesive body is cut out described precutting trough in advance in step c.
8. the manufacture method of electronic element packaging structure according to claim 1 is characterized in that, utilizes engraving method that this adhesive body is cut out described precutting trough in advance in step c.
9. the manufacture method of electronic element packaging structure according to claim 1 is characterized in that, this ELECTROMAGNETIC OBSCURANT layer is a conductive shell.
10. the manufacture method of electronic element packaging structure according to claim 9 is characterized in that, this conductive shell is made of conductive material such as a bronze medal, nickel, gold, aluminium or other alloying metals.
11. the manufacture method of electronic element packaging structure according to claim 9 is characterized in that, junctures such as this conductive shell utilization is inlayed, adhesion are fixed in described sealing unit.
12. the manufacture method of electronic element packaging structure according to claim 1 is characterized in that, this ELECTROMAGNETIC OBSCURANT layer is a conductive coating.
13. the manufacture method of electronic element packaging structure according to claim 12 is characterized in that, this conductive coating is made of conductive material such as a bronze medal, nickel, gold, aluminium or other alloying metals.
14. the manufacture method of electronic element packaging structure according to claim 12 is characterized in that, this conductive coating utilization is smeared, pressing, plating, sputter, vapour deposition or other surperficial generation types form.
15. the manufacture method of electronic element packaging structure according to claim 1 is characterized in that, has a steps d 1 after steps d, and sealing surface body is coated on this ELECTROMAGNETIC OBSCURANT layer.
16. an electronic element packaging structure is characterized in that, this encapsulating structure comprises:
One substrate has at least one access area;
At least one electronic component is arranged on this substrate;
At least one sealing unit is coated on above-mentioned at least one electronic component of this substrate;
At least one precutting trough, be formed at this sealing unit around and extend to the access area of this substrate; And
One ELECTROMAGNETIC OBSCURANT layer is coated on this sealing cell surface and this precutting trough, and with this access area conducting.
17. electronic element packaging structure according to claim 16 is characterized in that, this electronic component utilizes many bonding wires to be electrically connected at this substrate.
18. electronic element packaging structure according to claim 16 is characterized in that, this access area is at least one earth lead.
19. electronic element packaging structure according to claim 18 is characterized in that, this substrate cording has at least one through hole, and with this earth lead electrically connect.
20. electronic element packaging structure according to claim 16 is characterized in that, the material of this sealing unit is a thermosetting resin.
21. electronic element packaging structure according to claim 20 is characterized in that, the material of this sealing unit is an epoxy resin.
22. electronic element packaging structure according to claim 16 is characterized in that, this ELECTROMAGNETIC OBSCURANT layer is a conductive shell.
23. electronic element packaging structure according to claim 22 is characterized in that, this conductive shell is made of conductive material such as a bronze medal, nickel, gold, aluminium or other alloying metals.
24. electronic element packaging structure according to claim 23 is characterized in that, junctures such as this conductive shell utilization is inlayed, adhesion are fixed in this unit sealing unit.
25. electronic element packaging structure according to claim 17 is characterized in that, this ELECTROMAGNETIC OBSCURANT layer is a conductive coating.
26. electronic element packaging structure according to claim 25 is characterized in that, this conductive coating is made of conductive material such as a bronze medal, nickel, gold, aluminium or other alloying metals.
27. electronic element packaging structure according to claim 26 is characterized in that, this conductive coating utilization is smeared, pressing, plating, sputter, vapour deposition or other surperficial generation types form.
28. electronic element packaging structure according to claim 17 is characterized in that, this electronic element packaging structure comprises the exposed surface that sealing surface body is coated on this unit ELECTROMAGNETIC OBSCURANT layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910143133 CN101887860A (en) | 2009-05-14 | 2009-05-14 | Manufacturing method of electronic elements and encapsulation structures thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910143133 CN101887860A (en) | 2009-05-14 | 2009-05-14 | Manufacturing method of electronic elements and encapsulation structures thereof |
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| CN101887860A true CN101887860A (en) | 2010-11-17 |
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| CN 200910143133 Pending CN101887860A (en) | 2009-05-14 | 2009-05-14 | Manufacturing method of electronic elements and encapsulation structures thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102479767A (en) * | 2010-11-24 | 2012-05-30 | 宇芯（毛里求斯）控股有限公司 | Semiconductor device package with electromagnetic shielding |
| CN102683329A (en) * | 2011-03-18 | 2012-09-19 | 矽品精密工业股份有限公司 | Semiconductor package and fabrication method thereof |
| CN103018287A (en) * | 2011-09-20 | 2013-04-03 | 豪尼机械制造股份公司 | Capacitive hf strand measurement device and measurement method |
| WO2013104274A1 (en) * | 2012-01-09 | 2013-07-18 | 华为终端有限公司 | Method for manufacturing circuit board, circuit board and electronic apparatus |
| CN109449129A (en) * | 2013-03-01 | 2019-03-08 | 日月光半导体制造股份有限公司 | Semiconductor package and its manufacturing method |
| CN109712964A (en) * | 2018-10-16 | 2019-05-03 | 华为机器有限公司 | A kind of packaging part and its manufacturing method and electronic equipment |
| CN109841597A (en) * | 2017-11-24 | 2019-06-04 | 讯芯电子科技（中山）有限公司 | Subregion is electromagnetically shielded encapsulating structure and manufacturing method |
-
2009
- 2009-05-14 CN CN 200910143133 patent/CN101887860A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102479767A (en) * | 2010-11-24 | 2012-05-30 | 宇芯（毛里求斯）控股有限公司 | Semiconductor device package with electromagnetic shielding |
| CN102683329A (en) * | 2011-03-18 | 2012-09-19 | 矽品精密工业股份有限公司 | Semiconductor package and fabrication method thereof |
| CN102683329B (en) * | 2011-03-18 | 2015-05-13 | 矽品精密工业股份有限公司 | Semiconductor package and fabrication method thereof |
| CN103018287A (en) * | 2011-09-20 | 2013-04-03 | 豪尼机械制造股份公司 | Capacitive hf strand measurement device and measurement method |
| CN103018287B (en) * | 2011-09-20 | 2018-09-11 | 虹霓机械制造有限公司 | The HF measuring device and measurement method of capacitance |
| WO2013104274A1 (en) * | 2012-01-09 | 2013-07-18 | 华为终端有限公司 | Method for manufacturing circuit board, circuit board and electronic apparatus |
| US9426935B2 (en) | 2012-01-09 | 2016-08-23 | Huawei Device Co., Ltd. | Method for manufacturing circuit board, circuit board, and electronic device |
| CN109449129A (en) * | 2013-03-01 | 2019-03-08 | 日月光半导体制造股份有限公司 | Semiconductor package and its manufacturing method |
| CN109841597A (en) * | 2017-11-24 | 2019-06-04 | 讯芯电子科技（中山）有限公司 | Subregion is electromagnetically shielded encapsulating structure and manufacturing method |
| CN109712964A (en) * | 2018-10-16 | 2019-05-03 | 华为机器有限公司 | A kind of packaging part and its manufacturing method and electronic equipment |
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