CN101886186A - High temperature shape memory copper alloy and preparation method thereof - Google Patents
High temperature shape memory copper alloy and preparation method thereof Download PDFInfo
- Publication number
- CN101886186A CN101886186A CN 201010226595 CN201010226595A CN101886186A CN 101886186 A CN101886186 A CN 101886186A CN 201010226595 CN201010226595 CN 201010226595 CN 201010226595 A CN201010226595 A CN 201010226595A CN 101886186 A CN101886186 A CN 101886186A
- Authority
- CN
- China
- Prior art keywords
- shape memory
- alloy
- high temperature
- copper alloy
- temperature shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 239000000956 alloy Substances 0.000 claims abstract description 31
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 229910052688 Gadolinium Inorganic materials 0.000 claims abstract description 17
- 229910052692 Dysprosium Inorganic materials 0.000 claims abstract description 16
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 16
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 15
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 14
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 14
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000004615 ingredient Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 238000003723 Smelting Methods 0.000 claims description 6
- 238000000137 annealing Methods 0.000 claims description 6
- 238000005868 electrolysis reaction Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 238000005266 casting Methods 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000002923 metal particle Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000009776 industrial production Methods 0.000 abstract 1
- 230000007334 memory performance Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 33
- 150000001875 compounds Chemical class 0.000 description 16
- 239000011572 manganese Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 13
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 11
- 229910052733 gallium Inorganic materials 0.000 description 11
- 229910052761 rare earth metal Inorganic materials 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229910000896 Manganin Inorganic materials 0.000 description 6
- -1 copper-zinc-aluminum Chemical compound 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 229910000734 martensite Inorganic materials 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 238000007669 thermal treatment Methods 0.000 description 4
- 230000009466 transformation Effects 0.000 description 4
- 230000002929 anti-fatigue Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000006025 fining agent Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 150000002910 rare earth metals Chemical class 0.000 description 3
- 238000007670 refining Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910000943 NiAl Inorganic materials 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- 229910000611 Zinc aluminium Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
The invention provides a high temperature shape memory copper alloy. The alloy comprises the following components in percentage by weight: 6 to 8 percent of Ni, 7 to 11 percent of Al, 0.5 to 0.9 percent of Sb, 2 to 5 percent of Mn, 0.03 to 0.09 percent of Gd, 0.05 to 0.5 percent of Dy, 0.005 to 0.02 percent of Y and the balance of Cu. The invention also provides a preparation method for the high temperature shape memory copper alloy. The high temperature shape memory copper alloy and the preparation method thereof have the advantages that: 1, due to the selection of proper components and content thereof, the produced alloy material has high performance and better high temperature shape memory performance under the combined action of the components; and 2, the alloy has simple and convenient preparation process and low production cost and is suitable for industrial production.
Description
Technical field
The present invention relates to a kind of high temperature shape memory copper alloy and preparation method thereof, belong to metal material field.
Background technology
In the metal current material field, the shape-memory properties of copper alloy has been subjected to increasing attention.
Chinese patent CN200610161600.1 discloses a kind of copper-zinc-aluminum shape memory alloy abrasion resistance material and preparation method thereof, the preparing technical field that relates to a kind of shape memory alloy material, the preparation method is: with electrolytic copper, 0# zinc, 00# aluminium, electrolytic nickel is starting material, add the compound rare-earth fining agent by composition proportion and carry out melting, when the alloy liquid temp reaches 1230 ℃～1250 ℃, pour into ingot casting, be heated to 800 ℃～820 ℃ the insulation 24 hours after furnace cooling, remove the dezincify layer of surface 2～3mm then, forge into sheet material again, under 830～870 ℃+130～170 ℃+40～60 ℃ conditions, carry out the thermal treatment of two-stage timeliness.Copper-zinc-aluminum shape memory alloy abrasion resistance material by mass percentage, Zn24.5%～26%, Al3.7%～3.8%, the compound rare-earth fining agent of Ni0.9%～1.0%, 0.06%～0.09%, the composition of compound rare-earth fining agent is in mass percent, be La45.5%, Ce44.9%, Gd7.7%, Nd1.9%, Yu Weitong.Chinese patent CN200810019822.9 discloses a kind of method that improves composite rare earth copper-zinc-aluminum shape memory alloy double-pass memory effect.It is characterized by: the preparation composite rare earth copper-zinc-aluminum shape memory alloy, its chemical ingredients (weight percent) is Zn22%-26%, Al3%-4%, special composite rare-earth modifier 0.2%-0.6%, Yu Weitong.Pouring into diameter after the melting is
Ingot casting.Anneal is to be heated to 820 ℃ of insulations furnace cooling after 24 hours, removes the dezincify layer of surperficial 2-3mm then, forges the thick sheet material to 11mm again, is rolled into the 0.3mm thin plate at last.Thermal treatment process is set, its concrete technology is: 820 ℃-850 ℃ insulations are quenched after 20-40 minute in the room temperature oil, carry out in the 140-160 ℃ of oil in insulation 20-40 minute, the 90-100 ℃ water 20-30 minute three grades of ageing treatment of insulation in insulation 20-30 minute, the 40-50 ℃ water more successively.The prestrain amount of choosing is respectively to be 15%.Circulatory mediator is respectively 100 ℃ of oil and room temperature water.Under this processing parameter, carry out 20 constraint circuit training.More than two kinds of memorial alloys owing to all use a large amount of zinc, therefore be difficult to improve the Martensite Transformation temperature.
Chinese patent CN200710009646.6 discloses a kind of nickel manganin gallium high-temperature shape memory alloy and preparation method thereof, relates to a kind of alloy.Provide a kind of high martensitic transformation temperature that has, better nickel manganin gallium high-temperature shape memory alloy of plasticity and preparation method thereof.Its composition and be nickel 50%～57%, manganese 17%～25%, copper 1%～8%, gallium 17%～25% by the content of atomic percent.Nickel, manganese, copper and gallium are put into stove, vacuumize and charge into the argon gas melting, get the nickel manganin gallium high-temperature shape memory alloy ingot; With the thermal treatment of alloy ingot, temperature is 850～900 ℃, furnace cooling; To the nickel manganin gallium high-temperature shape memory alloy ingot be rolled into the sheet alloy material through heat treated nickel manganin gallium high-temperature shape memory alloy ingot 850～950 ℃ of hot rollings; The sheet alloy material that obtains is cut into sample with wire cutting method, and after the thermal treatment, ice water quenching promptly obtains nickel manganin gallium high-temperature shape memory alloy.The amount that adds gallium in the above-mentioned memorial alloy is very high, because the cost of gallium is very high, therefore causes production cost to strengthen.Gallium and compound thereof are poisonous in addition, and toxicity is considerably beyond mercury and arsenic.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art part, a kind of high temperature shape memory copper alloy and preparation method thereof is provided.
High temperature shape memory copper alloy of the present invention comprises following ingredients according to weight percent: Ni 6%～8%, and Al 7～11%, Sb 0.5%～0.9%, and Mn 2%～5%, and Gd 0.03%～0.09%, Dy 0.05%～0.5%, and Y 0.005%～0.02%, and all the other are Cu.
Preferably,
High temperature shape memory copper alloy of the present invention comprises following ingredients according to weight percent:
Ni 7%, and Al 9%, and Sb 0.7%, and Mn 3%, and Gd 0.06%, and Dy 0.2%, and Y 0.01%, and all the other are Cu.
The matrix densification of copper alloy, disperse is distributed with tiny compound phase on the matrix.
The selection of the content of each composition of alloy of the present invention and composition thereof is based on the following reasons:
Ni: content is 6%～8%, and Ni and Cu, Al form the matrix of shape memory alloy; Ni content is lower than 6%, does not reach effect; Ni content is higher than 8%, and Ni can too much consume Al and form the NiAl intermediate compound, reduces to reach steady periodic response rate;
Al: content is 7%～11%, and Al and Cu, Ni form the matrix of shape memory alloy; Al content is lower than 7%, does not reach effect; Al content is higher than 11%, forms too much γ 2 phases, reduces to reach steady periodic response rate;
Sb: content is 0.5%～0.9%; Sb forms chemical combination mutually with Cu, Mn.Sb content is lower than 0.5%, does not reach effect; Sb content is higher than 0.9%, and compound is mutually too much, can reduce the plasticity and the tensile strength of alloy, because Sb increases, compound forms netted on crystal boundary, reduces the toughness of material.
Mn: content is 2%～5%; Mn forms chemical combination mutually with Sb, Cu.Mn content is lower than 2%, does not reach effect; Mn content is higher than 5%, and compound is mutually too much, can reduce the plasticity and the tensile strength of alloy, because Mn increases, compound forms netted on crystal boundary, reduces the toughness of material.
Gd: content is 0.03%～0.09%, and Gd has the effect of rounding compound phase, and this has good antifriction function mutually, and the alloy strengthening effect is arranged simultaneously.But Gd, Dy and Y acting in conjunction be refinement complex compound particle not only, and the effect of energy refinement matrix, can reduce the tendency of copper base alloy by grain refining, thereby improve the ductility and the anti-fatigue performance of alloy, improve the stability of shape memory along the crystalline substance fracture.Gd content is lower than 0.03%, does not reach effect; Gd content is higher than 0.09%, because Gd is a rare earth element, too much uses, and not only improves material cost, also can form some excessive compounds, reduces the mechanical property of material.
Dy: content is 0.05%～0.5%; But Dy and Gd, Y acting in conjunction be refinement complex compound particle not only, and the effect of energy refinement matrix, can reduce the tendency of copper base alloy by grain refining, thereby improve the ductility and the anti-fatigue performance of alloy, improve the stability of shape memory along the crystalline substance fracture.Dy content is lower than 0.05%, does not reach effect; Dy content is higher than 0.5%, because Dy is a rare earth element, too much uses, and not only improves material cost, also can form some excessive compounds, reduces the mechanical property of material.
Y: content is 0.005%～0.02%; But Y and Gd, Dy acting in conjunction be refinement complex compound particle not only, and the effect of energy refinement matrix, can reduce the tendency of copper base alloy by grain refining, thereby improve the ductility and the anti-fatigue performance of alloy, improve the stability of shape memory along the crystalline substance fracture.Y content is lower than 0.005%, does not reach effect; Y content is higher than 0.02%, because Y is a rare earth element, too much uses, and not only improves material cost, also can form some excessive compounds, reduces the mechanical property of material.
The preparation method of high temperature shape memory copper alloy of the present invention comprises the following steps:
1) prepare the raw material of each component, Al electrolysis aluminium sheet wherein, Cu electrolysis copper rod, Ni, Mn ingot metal, Sb, Gd, Dy, Y all use pure metal particles;
2) raw material is placed process furnace carry out melting, smelting temperature is 1110-1190 ℃, obtains cast alloy; And then remelting makes its homogenizing, and smelting temperature is 1160-1190 ℃, and casting is into about the thick sheet of 4mm after the remelting;
3) with melted sheet alloy homo genizing annelaing under 830-860 ℃ condition, annealing time is 6-8h; After annealing finishes, cut into the square of 8mm-12mm, promptly obtain high temperature shape memory copper alloy.
High temperature shape memory copper alloy of the present invention and preparation method thereof has following technique effect:
1, owing to selected composition and the content thereof that is fit to for use, acting in conjunction between each composition, the alloy material performance of production is good, have better high-temperature shape-memory performance;
2, alloy preparation technology is easy, and production cost is low, is convenient to very much suitability for industrialized production.
Description of drawings
The metallographic structure of the high temperature shape memory copper alloy that Fig. 1 makes for the embodiment of the invention 1.
Embodiment
Embodiment 1
The high temperature shape memory copper alloy of present embodiment comprises following ingredients Ni 6% according to weight percent, and Al 7%, and Sb 0.5%, and Mn 2%, and Gd 0.03%, and Dy 0.05%, and Y 0.005%, and all the other are Cu.Have tiny and dispersive compound phase on this high temperature shape memory copper alloy, as shown in Figure 1.
The preparation of the high temperature shape memory copper alloy of present embodiment comprises the following steps:
1) prepare the raw material of each component, Al electrolysis aluminium sheet wherein, Cu electrolysis copper rod, Ni, Mn ingot metal, Sb, Gd, Dy, Y all use pure metal particles;
2) raw material is placed process furnace carry out melting, smelting temperature is 1110-1190 ℃, obtains cast alloy; And then remelting makes its homogenizing, and smelting temperature is 1160-1190 ℃, and casting is into about the thick sheet of 4mm after the remelting;
3) with melted sheet alloy homo genizing annelaing under 830-860 ℃ condition, annealing time is 6-8h; After annealing finishes, cut into the square of 8mm-12mm, promptly obtain high temperature shape memory copper alloy.
Embodiment 2
The high temperature shape memory copper alloy of present embodiment comprises following ingredients according to weight percent: Ni 8%, and Al 11%, and Sb 0.9%, and Mn 5%, and Gd 0.09%, and Dy 0.5%, Y0.02%, and all the other are Cu.Have tiny and crystal grain dispersive on this high temperature shape memory copper alloy, the preparation method is with reference to embodiment 1.
Embodiment 3
The high temperature shape memory copper alloy of present embodiment comprises following ingredients according to weight percent: Ni 7%, and Al 9%, and Sb 0.7%, and Mn 3%, and Gd 0.06%, and Dy 0.2%, and Y 0.01%, and all the other are Cu.Have tiny and dispersive compound phase on this high temperature shape memory copper alloy, the preparation method is with reference to embodiment 1.
Reference examples 1
The high temperature shape memory copper alloy of this reference examples comprises following ingredients according to weight percent: Ni 5%, and Al 6%, and Sb 0.4%, and Mn 1%, and Gd 0.02%, and Dy 0.04%, and Y 0.004%, and all the other are Cu.The preparation method is with reference to embodiment 1.
Reference examples 2
The high temperature shape memory copper alloy of this reference examples comprises following ingredients according to weight percent: Ni 9%, and Al 12%, and Sb 1.0%, and Mn 6%, and Gd 0.1%, and Dy 0.6%, Y0.03%, and all the other are Cu.The preparation method is with reference to embodiment 1.
Embodiment 4
Relatively the contrary martensitic transformation temperature of the high temperature shape memory copper alloy among background technology, reference examples and the embodiment, reach response rate and maximum elongation at break when stablizing, its result is as shown in table 1:
The contrast of table 1 alloy property:
As can be seen from the above table, the high temperature shape memory copper alloy of embodiment 1-3 reach response rate when stablizing, maximum elongation at break and contrary martensitic transformation temperature, all be better than reference examples and background technology, high temperature shape memory copper alloy of the present invention has better alloy property.
Claims (3)
1. a high temperature shape memory copper alloy is characterized in that, comprises following ingredients according to weight percent: Ni 6%～8%, and Al 7～11%, Sb 0.5%～0.9%, and Mn 2%～5%, and Gd 0.03%～0.09%, Dy 0.05%～0.5%, and Y 0.005%～0.02%, and all the other are Cu.
2. high temperature shape memory copper alloy according to claim 1 is characterized in that, comprises following ingredients according to weight percent: Ni 7%, and Al 9%, and Sb 0.7%, Mn3%, and Gd 0.06%, and Dy 0.2%, and Y 0.01%, and all the other are Cu.
3. the preparation method of a high temperature shape memory copper alloy is characterized in that, comprises the following steps:
1) prepare the raw material of each component, Al electrolysis aluminium sheet wherein, Cu electrolysis copper rod, Ni, Mn ingot metal, Sb, Gd, Dy, Y all use pure metal particles;
2) raw material is placed process furnace carry out melting, smelting temperature is 1110-1190 ℃, obtains cast alloy; And then remelting makes its homogenizing, and smelting temperature is 1160-1190 ℃, and casting is into about the thick sheet of 4mm after the remelting;
3) with melted sheet alloy homo genizing annelaing under 830-860 ℃ condition, annealing time is 6-8h; After annealing finishes, cut into the square of 8mm-12mm, promptly obtain high temperature shape memory copper alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102265954A CN101886186B (en) | 2010-07-14 | 2010-07-14 | High temperature shape memory copper alloy and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102265954A CN101886186B (en) | 2010-07-14 | 2010-07-14 | High temperature shape memory copper alloy and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101886186A true CN101886186A (en) | 2010-11-17 |
| CN101886186B CN101886186B (en) | 2011-10-12 |
Family
ID=43072276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102265954A Active CN101886186B (en) | 2010-07-14 | 2010-07-14 | High temperature shape memory copper alloy and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101886186B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102051549A (en) * | 2011-01-14 | 2011-05-11 | 南京信息工程大学 | Heat-resistant copper alloy material and preparation method thereof |
| CN102174673A (en) * | 2011-03-01 | 2011-09-07 | 广西大学 | Roasting reduction method for manganese ore |
| CN102808105A (en) * | 2012-08-24 | 2012-12-05 | 李伟 | Method for preparing shape memory copper alloy |
| CN102808106A (en) * | 2012-08-24 | 2012-12-05 | 李伟 | Shape memory alloy |
| CN103215471A (en) * | 2013-01-28 | 2013-07-24 | 厦门大学 | Copper-aluminum-iron-manganese high-temperature shape memory alloy and preparation method thereof |
| CN107287469A (en) * | 2017-06-22 | 2017-10-24 | 合肥汇之新机械科技有限公司 | A kind of copper system marmem |
| CN109185879A (en) * | 2018-08-28 | 2019-01-11 | 北京华通兴远供热节能技术有限公司 | A kind of low nitrogen gas burner of heat pipe-type |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004010997A (en) * | 2002-06-10 | 2004-01-15 | Chuo Spring Co Ltd | High damping material, spring having excellent damping property and methods of producing them |
| CN1644728A (en) * | 2005-01-13 | 2005-07-27 | 四川大学 | Production of CuALNiMn shape memory alloy thin membrane by cold rolling superthin laminated alloy |
| CN101033516A (en) * | 2006-12-29 | 2007-09-12 | 江苏大学 | Copper-zinc-aluminum shape memory alloy abrasion resistance material and manufacturing method for the same |
-
2010
- 2010-07-14 CN CN2010102265954A patent/CN101886186B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004010997A (en) * | 2002-06-10 | 2004-01-15 | Chuo Spring Co Ltd | High damping material, spring having excellent damping property and methods of producing them |
| CN1644728A (en) * | 2005-01-13 | 2005-07-27 | 四川大学 | Production of CuALNiMn shape memory alloy thin membrane by cold rolling superthin laminated alloy |
| CN101033516A (en) * | 2006-12-29 | 2007-09-12 | 江苏大学 | Copper-zinc-aluminum shape memory alloy abrasion resistance material and manufacturing method for the same |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102051549A (en) * | 2011-01-14 | 2011-05-11 | 南京信息工程大学 | Heat-resistant copper alloy material and preparation method thereof |
| CN102174673A (en) * | 2011-03-01 | 2011-09-07 | 广西大学 | Roasting reduction method for manganese ore |
| CN102808105A (en) * | 2012-08-24 | 2012-12-05 | 李伟 | Method for preparing shape memory copper alloy |
| CN102808106A (en) * | 2012-08-24 | 2012-12-05 | 李伟 | Shape memory alloy |
| CN102808105B (en) * | 2012-08-24 | 2014-11-26 | 朱育盼 | Method for preparing shape memory copper alloy |
| CN102808106B (en) * | 2012-08-24 | 2015-04-22 | 戴初发 | Shape memory alloy |
| CN103215471A (en) * | 2013-01-28 | 2013-07-24 | 厦门大学 | Copper-aluminum-iron-manganese high-temperature shape memory alloy and preparation method thereof |
| CN103215471B (en) * | 2013-01-28 | 2015-03-04 | 厦门大学 | Copper-aluminum-iron-manganese high-temperature shape memory alloy and preparation method thereof |
| CN107287469A (en) * | 2017-06-22 | 2017-10-24 | 合肥汇之新机械科技有限公司 | A kind of copper system marmem |
| CN109185879A (en) * | 2018-08-28 | 2019-01-11 | 北京华通兴远供热节能技术有限公司 | A kind of low nitrogen gas burner of heat pipe-type |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101886186B (en) | 2011-10-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102808105B (en) | Method for preparing shape memory copper alloy | |
| CN101886186B (en) | High temperature shape memory copper alloy and preparation method thereof | |
| CN109182854B (en) | 1GPa high-strength aluminum-based light medium-entropy alloy and preparation method thereof | |
| CN100467647C (en) | High-strength heat-proof compression casting magnesium alloy and preparation method thereof | |
| CN105714148B (en) | A kind of high-strength adonic of spinodal decomposition type | |
| CN103602865B (en) | Copper-containing heat-resistant magnesium-tin alloy and preparation method thereof | |
| RU2007140308A (en) | Cu-Ni-Si-Co-Cr COPPER ALLOY FOR ELECTRONICS MATERIALS AND METHOD OF ITS PRODUCTION | |
| CN102978490A (en) | High-strength, high-conductivity and heat-resisting aluminum alloy bus and production method thereof | |
| CN104561688A (en) | Heat-resistant cast aluminum alloy and gravity casting method thereof | |
| CN105177344A (en) | Cu-Fe alloy wire and preparing method thereof | |
| CN101886187B (en) | Shape memory copper alloy and preparation method thereof | |
| CN107287468A (en) | Heat-resisting Cu alloy material of a kind of high-strength highly-conductive and preparation method thereof | |
| CN105779826B (en) | A kind of preparation method of aluminium alloy rod and preparation method thereof and aluminium alloy wire | |
| CN110284018A (en) | A kind of production method of the high elastic Vulcan metal of environmental protection and its Strip | |
| CN101509091A (en) | High-strength high-ductility Al-Zn-Mg-Cu-Sr alloy and production method | |
| CN103146973B (en) | High-temperature-resistant rare earth magnesium alloy | |
| CN102828064B (en) | Lead-free free-cutting brass alloy and preparation method thereof | |
| CN107201461B (en) | High-strength high-plastic biphase cooperative precipitation type Cu alloy material of one kind and preparation method thereof | |
| CN102383012B (en) | Low-rare-earth high-strength heat-resisting magnesium alloy and preparation method thereof | |
| CN105039817A (en) | Preparation method for multi-element heat-resisting magnesium alloy and multi-element heat-resisting magnesium alloy | |
| CN106756665A (en) | Aluminium alloy, preparation method and purposes | |
| CN105316550A (en) | High-damping magnesium alloy containing long-periodic structural phase and preparation method for high-damping magnesium alloy | |
| CN105369077A (en) | Aluminum alloy conductor material and preparation method thereof | |
| CN105177395A (en) | Manufacturing technique of nickel-copper alloy | |
| CN112210703B (en) | High-recrystallization-resistance and high-toughness aluminum lithium alloy and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CHANGSHU NJNU DEVELOPMENT INSTITUTE Free format text: FORMER OWNER: NANJING UNIVERSITY OF INFORMATION SCIENCE AND TECHNOLOGY Effective date: 20120816 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 210044 NANJING, JIANGSU PROVINCE TO: 215500 SUZHOU, JIANGSU PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20120816 Address after: 215500 Changshou City South East Economic Development Zone, Jiangsu, Jin Road, No. 8 Patentee after: Changshu Nanjing Normal University Development Research Institute Co.,Ltd. Address before: Pukou District of Nanjing City, Jiangsu Province, 210044 disc City Street No. 114 Patentee before: Nanjing University of Information Science and Technology |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20201230 Address after: Building 3, No.88, Xianshi Road, high tech Zone, Changshu City, Suzhou City, Jiangsu Province Patentee after: Changshu Zijin Intellectual Property Service Co.,Ltd. Address before: 215500 8 Jindu Road, Changshou City Southeast Economic Development Zone, Jiangsu Patentee before: CHANGSHU NANJING NORMAL UNIVERSITY DEVELOPMENT RESEARCH INSTITUTE Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231228 Address after: 215500 No.72 Wenwen street, Guli Town, Changshu City, Suzhou City, Jiangsu Province Patentee after: Changshu Guli Technology Venture Service Co.,Ltd. Address before: Building 3, No.88, Xianshi Road, high tech Zone, Changshu City, Suzhou City, Jiangsu Province Patentee before: Changshu Zijin Intellectual Property Service Co.,Ltd. |
|
| TR01 | Transfer of patent right |