CN101885269B - Manufacturing method for liquid ejecting head unit, and liquid ejecting apparatus - Google Patents
Manufacturing method for liquid ejecting head unit, and liquid ejecting apparatus Download PDFInfo
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- CN101885269B CN101885269B CN2010101805334A CN201010180533A CN101885269B CN 101885269 B CN101885269 B CN 101885269B CN 2010101805334 A CN2010101805334 A CN 2010101805334A CN 201010180533 A CN201010180533 A CN 201010180533A CN 101885269 B CN101885269 B CN 101885269B
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- 239000007788 liquid Substances 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 24
- 238000004873 anchoring Methods 0.000 abstract 5
- 239000000976 ink Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000005755 formation reaction Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000012467 final product Substances 0.000 description 2
- 238000009432 framing Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/145—Arrangement thereof
- B41J2/155—Arrangement thereof for line printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/19—Assembling head units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/20—Modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Ink Jet (AREA)
Abstract
The present invention relates to a manufacturing method for liquid ejecting head unit, and a liquid ejecting apparatus, which can sustain the position precision corresponding with the resolution and fix the liquid ejecting head without increasing the number of components. The liquid ejecting apparatus comprises the following components: an anchoring plate (40) which is fixed to a base plate (20) with a plurality of fixed liquid ejecting heads (10) and is used for positioning the liquid ejecting heads to preset positions relatively to the base plate; a reference mark which is used for positioning the anchoring plate relatively to the base plate and is formed on the anchoring plate, and positioning marks which are formed on the base plate. A plurality of the positioning marks are formed along the direction in which the nozzles are arranged in a row. Forming multiple positioning marks and selecting the positioning marks in accordance with a predetermined resolution makes it possible that the anchoring plate is fixed to the base plate with a mode that the relative position relationship between the reference mark and the selected positioning mark is same. Furthermore each liquid ejecting head is fixed to the base plate through the anchoring plate.
Description
Technical field
The present invention relates to the manufacturing approach and the liquid-jet device of liquid ejecting head unit.
Background technology
With the inkjet recording device of ink-jet printer and/or plotter etc. is that the liquid-jet device of representative possesses the liquid ejecting head unit that a plurality of jet head are set, this jet head can make the liquid such as China ink that store in print cartridge and/or black case etc. as drop from nozzle ejection.
Each of a plurality of jet head that constitutes liquid ejecting head unit so is fixed under the state that is positioned accurately as the precalculated position of the parent plate of shared retaining member.For example, each jet head is along the direction of nozzle rows that a plurality of nozzles of each jet head are set by row, and each nozzle is positioned accurately continuously with certain spacing and is fixed in parent plate.
For example there is following method in method as location jet head, manufacturing liquid ejecting head unit; In the align substrates that constitutes by silicon substrate (being equivalent to parent plate) and be equipped on this subelement (being equivalent to jet head); Form keyway and key respectively with photoetching process; And make keyed engagement on align substrates, subelement is positioned preposition (for example, with reference to patent documentation 1) is installed in keyway.
No. 2549762 communique of [patent documentation 1] special permission
If according to method so, then can with each jet head accurately located and fixed on parent plate., in the method that is recorded in patent documentation 1, expect under the situation of high resolution ratio in offset nozzle column direction each jet head of configuration, because must form keyway, so number of components increases corresponding to the resolution ratio of expection.Its result, the problem that exists cost to raise.
Also have, so problem not only exists in the liquid ejecting head unit of ink jet recording head unit but also the liquid beyond ejecting ink too.
Summary of the invention
The present invention has done in view of situation so, purpose be to provide number of components is increased and corresponding to resolution ratio can keep positioning accuracy well and jet head is fixed in parent plate liquid ejecting head unit manufacturing approach and adopt the liquid-jet device of this liquid ejecting head unit.
The manufacturing approach of liquid ejecting head unit of the present invention is characterized as: possess: have by row be provided with liquid droplets nozzle nozzle rows a plurality of jet head, fixing these a plurality of jet head parent plate, be fixed in this parent plate and be used for telltale mark that aforementioned jet head is positioned the fixed head in precalculated position with respect to the aforementioned substrates plate and is used to make this fixed head to be formed at the reference mark of aforementioned fixation plate and to be formed at the aforementioned substrates plate with respect to aforementioned substrates plate location; Aforementioned telltale mark forms a plurality of along the direction that aforementioned nozzle is set by row; Resolution ratio corresponding to predetermined is selected aforementioned telltale mark; Make aforementioned reference mark become and the aforementioned fixation plate is fixed in the aforementioned substrates plate identically, and utilize this fixed head that aforementioned each jet head is fixed in parent plate with this specifically labelled relative position relation of choosing.Because select telltale mark can make the different ejection head unit of resolution ratio simply corresponding to predetermined resolution ratio,, can seek cost and reduce so needn't make parts corresponding to resolution ratio through forming a plurality of telltale marks.
As preferred implementation of the present invention, can enumerate: aforementioned telltale mark is the hole that is formed at the aforementioned substrates plate.
At this, preferred: at least one side of aforementioned specifically labelled shape and size is inequality in each telltale mark.Through so forming, select which telltale mark because recognize the end easily, so can make ejection head unit more simply.
And preferred: aforementioned telltale mark is orthogonal to the direction ground formation multiple row that aforementioned nozzle is set by row at the aforementioned fixation plate.Through multiple row so is set, can easily carry out location with reference mark.
More preferably: at the aforementioned fixation plate alignment pin is set, this alignment pin is inserted logical inserting hole and is arranged at aforementioned jet head; Through aforementioned alignment pin is inserted to lead in aforementioned inserting hole aforementioned jet head is fixed in the aforementioned substrates plate.According to mode so, then can be through alignment pin positioning and fixing jet head simply.
Liquid-jet device of the present invention is characterized as: possess the liquid ejecting head unit through the manufacturing approach manufacturing of above-mentioned any liquid ejecting head unit.Through adopting the manufacturing approach of liquid ejecting head unit of the present invention, keep positioning accuracy ground because number of components is increased well corresponding to resolution ratio jet head is fixed in parent plate, so the hydrojet characteristic of liquid-jet device is good.
Description of drawings
Fig. 1 is the stereogram of the overview of expression ejection head unit.
Fig. 2 is the stereogram of the overview of expression shower nozzle.
Fig. 3 is the vertical view of the overview of expression ejection head unit.
Fig. 4 is the profile of the overview of the ejection head unit on the expression nozzle rows direction.
Fig. 5 is the partial enlarged drawing of parent plate.
Fig. 6 is the partial enlarged drawing of the parent plate after (b) was provided with before (a) of expression shower nozzle was provided with.
Fig. 7 sees the partial enlarged drawing under the situation of parent plate from the back side.
Fig. 8 is the partial enlarged drawing of the profile of parent plate.
Fig. 9 is the stereogram of the overview of expression liquid-jet device.
Symbol description
1 ink jet recording head unit (liquid ejecting head unit), 10 ink jet recording heads (jet head), 11 nozzles, 12 nozzle body, 13 nozzle housings; 20 parent plates, 23 alignment pins, 30 accessory plates, 40 fixed heads, 41 retaining holes; 50 datum plates, 51 inserting holes, 52 locating holes, 60 location-plates
The specific embodiment
Below at length describe the present invention is based on embodiment.
As be shown in Fig. 1～Fig. 4 ground; The ink jet recording head unit 1 of this embodiment (below; Also abbreviate ejection head unit as) possess the jet head sets 100 that constitutes by a plurality of ink jet recording heads 10 (below, also abbreviate shower nozzle as) and with the parent plate 20 of fixing these a plurality of shower nozzles 10 of state that are positioned the precalculated position.
At each shower nozzle 10, nozzle 11 is arranged on the direction by row with certain spacing, forms nozzle rows 14 thus.Through dispose a plurality of shower nozzles 10 (in this embodiment be example with shower nozzle 10a, 10b, 10c) along these nozzle rows 14 ground, constitute each jet head sets 100.The a plurality of shower nozzle 10a, 10b, 10c that constitute each jet head sets 100 are with staggered configuration.Promptly; Shower nozzle 10a and shower nozzle 10b are configured to row on the nozzle rows direction; Shower nozzle 10c is with respect to shower nozzle 10a and shower nozzle 10b by the state configuration of the deviation in driction that is orthogonal to the nozzle rows direction to do; The end of the nozzle rows 14 of the end of the nozzle rows 14 of the shower nozzle 10b side of shower nozzle 10a and the shower nozzle 10a side of shower nozzle 10b is overlapped in the end (on the direction with respect to nozzle rows 14 quadratures, becoming same position) of the nozzle rows 14 of shower nozzle 10c.Through so configuration, nozzle 11 can not be interrupted being provided with on the direction by row of nozzle rows 14.The a plurality of jet head sets 100 that so constituted (in this embodiment be example with 2 jet head sets 100a, 100b) are being set up in parallel on parent plate 20 on the direction of quadrature with nozzle rows 14 mutually.
At parent plate 20, the through hole 21 that runs through its thickness direction is set respectively corresponding to each shower nozzle 10.That is to say that each shower nozzle 10 is fixed in parent plate 20 in slotting leading under the state of these each through holes 21.
Each shower nozzle 10 possesses nozzle body 12 and nozzle housing 13, and wherein nozzle body 12 has a plurality of nozzles 11 at an end face, and nozzle housing 13 is fixed in nozzle body 12 and faces nozzle 11 opposition sides.For example, in this embodiment, nozzle body 12 possesses 2 row nozzle rows 14, and this nozzle rows 14 is provided with nozzle 11 by row.And inside in nozzle body 12; But though not shown pressure generating chamber and the pressure generation unit of being provided with; Wherein pressure generating chamber constitutes the part of the stream that is communicated in nozzle 11, and the pressure generation unit makes pressure generating chamber produce the pressure variation and makes China ink from nozzle ejection.
The pressure generation unit is not particularly limited, and for example can adopt: utilize with the bubble that 2 electrodes insert and put the unit of the piezoelectric element of the piezoelectric that presents mechanoelectric conversion's function, the configuration heater element produces through the heating because of heater element in pressure generating chamber to make drop from the unit of nozzle ejection or make generation of static electricity between oscillating plate and electrode, make the oscillating plate distortion make drop from unit that nozzle 11 sprays etc. through electrostatic force.And; As piezoelectric element, can adopt: make it the piezoelectric element of diastrophic bending vibration type or make piezoelectric and electrode forms alternately lamination and stretch in the piezoelectric element of the extensional vibration type of axial direction etc. of material from pressure generating chamber side lamination bottom electrode, piezoelectric and top electrode.
And so each shower nozzle 10 is fixed in parent plate 20 through accessory plate 30.Accessory plate 30 comprises: be provided with the base portion 32 of shower nozzle inserting hole 31 and protrude in the set foot section 33 of nozzle 11 sides from this base portion 32.Accessory plate 30 is inserted to lead at shower nozzle 10 and under the state of shower nozzle inserting hole 31, is fixed in shower nozzle 10.Particularly, the base portion 32 of accessory plate 30 is fixed in flange part 17 through retaining thread spare 18, and this flange part 17 is arranged at the peripheral part of nozzle housing 13.
And, run through its thickness direction and form retaining thread spare 35 and insert logical retaining thread spare inserting hole 34 in the foot section 33 of accessory plate 30.And accessory plate 30 is fixed in parent plate 20 through this retaining thread spare 35.That is, at parent plate 20, retaining thread spare 35 carries out outside fixed head 40, that become the opposition side that forms shower nozzle 10 sides stated after fixed component inserting hole 22 that screw thread engages is arranged at.
So be fixed in each shower nozzle 10 of parent plate 20 as, locate accurately through the alignment pin 23 that is fixed in parent plate 20 on the following ground that describes through accessory plate 30.
As being shown in Fig. 3, Fig. 4 ground, a pair of alignment pin 23 for example is made up of metal material, is individually fixed in fixed head 40.The a pair of datum hole (reference mark) 24 of each fixed head 40 through being formed at parent plate 20 and locating hole (telltale mark) 52 are fixed in the precalculated position of parent plate 20 under the state that is positioned accurately.Fixed head 40 is so located with respect to parent plate 20 through locating hole 52 accurately; Alignment pin 23 is located with respect to parent plate 20 accurately thus; So the shower nozzle 10 that utilizes this alignment pin 23 to be located also can be located with respect to parent plate 20 accurately, states behind this details.Particularly, the fixed head 40 that is fixed with alignment pin 23 is fixed in the zone in two outsides of each through hole 21 of the parent plate 20 on the direction of nozzle rows 14 respectively with the state of location accurately.Also have, datum hole 24 so long as become the mark of benchmark can be any, can be with formation such as etching and/or laser, shapes etc. are not particularly limited.
This fixed head 40 has the retaining hole 41 that is arranged at vertical basically direction with respect to its surperficial break-through, and alignment pin 23 is inserted to lead in this retaining hole 41 and is held.That is to say that alignment pin 23 is guaranteed the perpendicularity of expecting with respect to fixed head 40 through remaining in this retaining hole 41.And, as after state ground, as long as can alignment pin 23 be fixed in fixed head 40 well, alignment pin 23 may not be pressed in retaining hole 41 certainly, the material of fixed head 40 does not also limit especially.Just, if the machining accuracy of retaining hole 41 etc. is considered, then preferred: as to adopt the material of metal material as fixed head 40.
Also have, this fixed head 40 is not particularly limited to the fixing means of parent plate 20, though not shown, for example can fix from parent plate 20 sides with the connecting elements of screw element etc.
On the surface of this fixed head 40, engage the datum plate 50 that constitutes by silicon substrate.At this datum plate 50, form alignment pin 23 and insert logical inserting hole 51.Be that inserting hole 51 is engaged under the state of fixed head 40 at datum plate 50, be communicated in retaining hole 41.And inserting hole 51 is formed with the size of alignment pin 23 substantive ground inscribes.And become the locating hole 52 of fixed head 40 (alignment pin 23) with respect to the positioning reference of parent plate 20 at datum plate 50.
Form the reasons are as follows of locating hole 52.That is, if arrange nozzle 11 to high-density, then must be with each shower nozzle 10 of location, micron dimension very high degree of precision ground.Alignment pin 23 (fixed head 40) though the location can handle through the image that has adopted CCD camera for example etc. and carry out, if nozzle 11 as the arrangement to high-density of above-mentioned ground then must be handled with high multiplying power image.Therefore, being difficult to alignment pin 23 is inserted the bigger inserting hole 51 of logical aperture efficiency as benchmark, must be benchmark with the locating hole 52 that forms separately.
In the present invention, because, form inserting hole 51 and locating holes 52, so these inserting holes 51 are located mutually with locating hole 52 accurately at this datum plate 50 as on the surface of fixed head 40 datum plate 50 that is made up of silicon substrate is set above-mentionedly.Thereby,, can carry out the location of inserting hole 51, the location of alignment pin 23 (fixed head 40) just accurately through being benchmark with this locating hole 52.
The material of this datum plate 50 is not limited to the silicon single crystal substrate, also can be thin metallic plate is carried out the material of meticulous punch process gained and/or same thin metallic plate is carried out the material that wire electrical discharge is processed gained.Adopt so formed datum plate 50 also to play same effect.Promptly so long as can carry out the material of high-precision retrofit and get final product, needn't carry out particular determination to the material of datum plate 50.
On the other hand, the face in nozzle 11 sides of the base portion 32 of accessory plate 30 is equipped with the location-plate 60 that the leading section that is formed with alignment pin 23 is inserted logical front end inserting hole 61.This location-plate 60 is so that the mode that front end inserting hole 61 is located with respect to nozzle 11 accurately is fixed in accessory plate 30.
Location-plate 60 likewise is made up of silicon substrate with above-mentioned datum plate 50 and has the 2nd locating hole 62 of locating accurately with respect to front end inserting hole 61.That is, front end inserting hole 61 and the 2nd locating hole 62 for example carry out anisotropic etching through the silicon substrate to crystal face orientation (110) and form.And location-plate 60 is benchmark and having located accurately under the state of front end inserting hole 61, is fixed in accessory plate 30 for example handling with the 2nd locating hole 62 through image.
Also have; Material as location-plate 60; Though preferred employing can be like the silicon substrate of above-mentioned ground high accuracy formation front end inserting hole 61 and the 2nd locating hole 62,, be not particularly limited for the material of location-plate 60 as long as can form these front end inserting holes 61 and the 2nd locating hole 62 accurately.
And; In the formation of this embodiment so; When shower nozzle 10 (accessory plate 30) when being fixed in parent plate 20, is only inserted the front end inserting hole 61 that leads in predetermined through the leading section that makes the alignment pin 23 that is fixed in parent plate 20, each shower nozzle 10 is located accurately with respect to parent plate 20.Thereby the replacing operation of shower nozzle 10 becomes extremely easy.That is to say, because needn't adopt CCD camera etc. to make each shower nozzle 10 alignment, so need not take time and/or the time just can easily be carried out the aligning of shower nozzle 10.Thereby, for example, even use the scene of the liquid-jet device possess ejection head unit 1 to carry out also can changing operation with comparalive ease under the situation of replacing operation of shower nozzle 10 in reality.
In this embodiment, locating hole 52 forms a plurality of (52a～52d) at datum plate 50.Through so forming a plurality of locating holes 52, the ejection head unit 1 of this embodiment can stagger in parent plate 20 by each jet head sets 100 and the position is set fixes, and resolution ratio is improved.About this point, below also utilize Fig. 5～7 at length to describe.
As be shown in Fig. 5 ground, and insert near the long side direction end of datum plate 50 of logical inserting hole 51 being formed with alignment pin 23, form locating hole 52a～52d.Particularly, locating hole 52a～52d is formed at the both ends of the long side direction of datum plate 50 respectively along short side direction.That is, locating hole 52 forms two row, and each row is through 52 formations of 4 locating holes.
These locating hole 52 edges are left predetermined interval d (distance between centers of adjacent locating hole) with the direction of nozzle rows direction quadrature and are formed.The interval d of these locating holes 52a～52d become respectively nozzle 11 spacing (distances that nozzle is 11) 1/4th.In this embodiment, align with the datum hole that is formed at parent plate 20 24 through certain locating hole 52 among in manufacturing process, selecting to make these locating holes 52a～52d, can change the resolution ratio of ejection head unit 1.
Particularly, as be shown in Fig. 6 (a), about fixed head 40 and datum plate 50 corresponding to the shower nozzle 10a that constitutes a jet head sets 100a, with respect to a pair of datum hole 24 alignment ground adopt a pair of locating hole 52c and to datum plate 50, be that fixed head 40 is provided with.Then, about corresponding to the fixed head 40 and the datum plate 50 that constitute adjacent to the shower nozzle 10a of the jet head sets 100b of a jet head sets 100a, with respect to datum hole 24 alignment ground adopt locating hole 52a and to another datum plate 50, be that fixed head 40 is provided with.Through so being provided with, with respect to a fixed head 40, another fixed head 40 nozzle rows 14 directions stagger 2 locating holes 52 interval d amount, be that the amount of half pitch is set.Under this situation; Through forming locating hole 52 distichously; Because handle to confirm simply whether a pair of selected locating hole 52 is in same position respectively with respect to a pair of datum hole 24 and locatees on the nozzle rows direction, align so needn't in image is handled, proofread and correct (promptly changing angle) adjustment position through image.
And; If with these datum plates 50 is that benchmark adopts alignment pin 23 as each shower nozzle 10a is provided with above-mentionedly; Then as be shown in Fig. 6 (b), the shower nozzle 10a that constitutes jet head sets 100b is set to, with respect on nozzle rows 14 directions, the stagger amount of half pitch of the shower nozzle 10a that constitutes jet head sets 100a.Through so being provided with, as be shown in Fig. 7 (a), because of the shower nozzle 10a that constitutes jet head sets 100a with respect to the nozzle 11 of the shower nozzle 10a that the constitutes jet head sets 100b half pitch that staggers respectively, so on nozzle rows 14 directions, nozzle number becomes 2 times.Thus, for example the resolution ratio at a shower nozzle 10 is under the situation of 180dpi, and the resolution ratio of ejection head unit 1 becomes 360dpi.
And; For example adopting 4 groups for 1 ejection head unit 1 (under the situation of the jet head sets 100 of 100a～100d); As be shown in Fig. 7 (b); Through with the shower nozzle 10a that constitutes jet head sets 100a be benchmark, each the shower nozzle 10a that constitutes each jet head sets 100 with respect to the shower nozzle 10a that constitutes adjacent respectively jet head sets 100 respectively stagger nozzle spacing 1/4th spacing be provided with, make the resolution ratio of ejection head unit 1 become 720dpi.Under this situation; Corresponding to the datum plate 50 of the shower nozzle 10a that constitutes jet head sets 100a locating hole 52d is used for and the aliging of datum hole 24; Corresponding to the datum plate 50 of the shower nozzle 10a that constitutes jet head sets 100b locating hole 52c is used for and the aliging of datum hole 24; Corresponding to the datum plate 50 of the shower nozzle 10a that constitutes jet head sets 100c locating hole 52b is used for and the aliging of datum hole 24, locating hole 52a is used for and the aliging of datum hole 24 corresponding to the datum plate 50 of the shower nozzle 10a that constitutes jet head sets 100d.
So; In this embodiment; Because a plurality of locating holes 52 are set, can the resolution ratio decision corresponding to expection adopt which locating hole 52 ground to constitute on earth among them, change resolution ratio ground so can not increase number of components by each ejection head unit 1 ground and make.For example, under the situation that 1 locating hole 52 only is set because must be corresponding to the formation position of resolution changing locating hole, thus number of components increase to some extent, but needn't be like this in this embodiment.
And; As be shown in Fig. 7 (c); Two row nozzle rows 14 respectively stagger mutually under the situation (shower nozzle 10 is the situation of 360dpi) of half pitch in each shower nozzle 10; Also can be with respect to further stagger half pitch ground of this half pitch, promptly, with respect to the interval of the nozzle 11 of row 1/4th spacings that stagger.Particularly, can adopt locating hole 52b with respect to datum hole 24 alignment, can adopt locating hole 52a with respect to datum hole 24 alignment corresponding to the datum plate 50 of the shower nozzle 10a that constitutes jet head sets 100b corresponding to the datum plate 50 of the shower nozzle 10a that constitutes jet head sets 100a.So, even under the situation that the nozzle rows 14 of each shower nozzle 10 staggers mutually, the locating hole 52 through this embodiment also can not make number of components increase ground and form ejection head unit 1.
(other embodiments)
More than, though embodiment of the present invention is illustrated, the present invention is defined in above-mentioned embodiment.Though in this embodiment, locating hole 52, is not limited thereto with the formed hole of etching for respectively, gets final product so long as become the mark of the benchmark of location.For example, also can be for place the telltale mark of fixed head 40 and parent plate 20 through source, laser apparatus.And,, be not limited thereto though locating hole 52 is 4 in above-mentioned embodiment.If for example be 8, then through locating hole 52 is selected to make resolution ratio from 180dpi to being 1440dpi to the maximum.
And though in the above-described embodiment, the shape of each locating hole 52 and/or size are identical, also can be configured inequality.Inequality through being configured, select which locating hole 52 to become easily because under the situation that locating hole 52 is selected, recognize the end, so can carry out simply aliging with the high-precision of datum hole 24.
Though in above-mentioned embodiment, fixed head 40 is made up of a member, also can be made up of a plurality of members.For example, as be shown in Fig. 8 ground and constitute the fixed head 40 under the datum plate 50 that is formed with locating hole 52, and, form peristome 85 with alignment pin 23 tablings at the guided plate 81 of topmost and the guided plate 84 of foot by a plurality of thin guided plates 81～84.And,, the open communication portion 86 that is connected with these peristomes 85 and edge part is set at the edge part than these openings in the outer part is set at the guided plate 82,83 of pars intermedia.And alignment pin 23 uprightly is arranged at the recess of parent plate 20, vertically is held through peristome 85.Peristome 85 through so constituting through guided plate 81,84 keeps, even these peristomes 85 form to such an extent that tilt, its influence is also little, maybe can ignore, so positioning accuracy is high.Promptly; Be made up of under the situation of fixed head 40 member, side's opening of inserting hole 51 and the opposing party's opening form to such an extent that overlook and stagger and cause precision to reduce sometimes, but in this embodiment; Because form peristome 85, so depart from few at thin guided plate 81,84.Its result is because can more uprightly be provided with alignment pin vertically, so positioning accuracy does not descend.Also have, though on this top datum plate 50 is set at the guided plate 81 of topmost, also can be with the guided plate 81 of datum plate 50 as topmost.And, also can locating hole 52 be set at this guided plate 81.
And, though in the above-described embodiment, 2 row nozzle rows 14 are set at each shower nozzle 10, be not defined in this especially, for example, both can 1 row nozzle rows 14 be set, and also can be provided with more than 3 row at each shower nozzle 10.And, though in above-mentioned embodiment, constitute jet head sets 100, not being defined in this especially with 3 shower nozzles 10, jet head sets 100 both can be made up of 10 in 2 shower nozzles, also can be made up of 10 in the shower nozzle more than 4.
And, though in above-mentioned embodiment 1,2 jet head sets 100 are set, not being defined in this especially at ejection head unit 1, jet head sets 100 both can be 1, also can be for more than 3.
And though in above-mentioned embodiment, shower nozzle 10 possesses accessory plate 30, is not defined in this especially, also can location-plate 60 directly be installed on nozzle housing 13, this nozzle housing 13 is positioned parent plate 20 fixes.
And though in above-mentioned embodiment, shower nozzle 10 possesses the location-plate 60 that is formed with front end inserting hole 61, and front end inserting hole 61 for example also can be formed at the member that nozzle housing 13 grades constitute shower nozzle 10.
And ejection head unit so of the present invention can be applied to: through carrying out to the so-called line ink-jet recording apparatus of the printing of recording medium thing at the recording medium thing of carrying paper used for recording etc. with respect to the direction of nozzle rows direction quadrature etc.For example, the inkjet recording device I that is shown in Fig. 9 possesses above-mentioned ejection head unit 1, apparatus main body 2, as the delivery cylinder 3 and the control part 4 that move one of unit example.
And, delivery cylinder 3 is set at apparatus main body 2.Delivery cylinder 3 will be carried in the documentary film S such as paper of apparatus main body 2 (being sprayed medium) and carry in the 1st direction, and make the China ink ejection face side of documentary film S through shower nozzle 10.At this, so-called the 1st direction is meant the direction that relatively moves of documentary film S and shower nozzle 10.In this embodiment, because ejection head unit 1 is fixed in apparatus main body 2, so carry the direction of documentary film S to become the 1st direction through delivery cylinder 3.After, the 1st direction is called throughput direction.
And, at apparatus main body 2, the China ink that stores China ink being set storing unit 5, this China ink is supplied in each shower nozzle 10 through supply pipe 6.
In inkjet recording device I so, documentary film S is transferred in throughput direction through delivery cylinder 3, and through the shower nozzle 10 ejection China inks of ejection head unit 1 image etc. is printed in documentary film S.In this case, because of possessing the ink jet type record ejection head unit of this embodiment, so inkjet recording device can not increase number of components ground corresponding to resolution ratio and make, so and also high because can locate China ink ejection characteristic accurately.
And ejection head unit of the present invention not only can be applied to be shown in the line inkjet recording device of Fig. 9, and can be applied to the inkjet recording device of other types.For example, also can be applied to the limit is displaced into and the throughput direction of the recording medium thing inkjet recording device of the direction limit of the quadrature type of printing mutually the balladeur train that is equipped with ejection head unit.
Certainly, inkjet recording device is an example of liquid-jet device only, and the present invention also can be applied to the liquid-jet device beyond the inkjet recording device.
Claims (6)
1. the manufacturing approach of a liquid ejecting head unit is characterized in that:
Possess: a plurality of jet head, these a plurality of jet head have nozzle rows, and the nozzle of liquid droplets is set by row in this nozzle rows; The parent plate of fixing these a plurality of jet head; Fixed head, this fixed head is fixed in this parent plate, is used for aforementioned jet head is positioned the precalculated position with respect to the aforementioned substrates plate; And be used to make this fixed head with respect to aforementioned substrates plate location, be formed at the reference mark of aforementioned fixation plate and be formed at the telltale mark of aforementioned substrates plate;
Form a plurality of along the direction that aforementioned nozzle is set by row aforementioned telltale mark; Resolution ratio corresponding to predetermined is selected aforementioned telltale mark; So that the mode that selecteed this telltale mark becomes identical with respect to the relative position relation of aforementioned reference mark; The aforementioned fixation plate is fixed in the aforementioned substrates plate, utilizes this fixed head that aforementioned each jet head is fixed in parent plate.
2. the manufacturing approach of liquid ejecting head unit according to claim 1 is characterized in that:
Aforementioned telltale mark is the hole that is formed at the aforementioned substrates plate.
3. the manufacturing approach of liquid ejecting head unit according to claim 1 and 2 is characterized in that:
Make that at least one side of in each telltale mark aforementioned specifically labelled shape and size is inequality.
4. the manufacturing approach of liquid ejecting head unit according to claim 1 and 2 is characterized in that:
At the aforementioned fixation plate, to form the aforementioned telltale mark of multiple row with the vertical mode of direction that aforementioned nozzle is set by row.
5. the manufacturing approach of liquid ejecting head unit according to claim 1 and 2 is characterized in that:
At the aforementioned fixation plate alignment pin is set, in aforementioned jet head this alignment pin is set and inserts logical inserting hole;
Through aforementioned alignment pin is inserted to lead in aforementioned inserting hole aforementioned jet head is fixed in the aforementioned substrates plate.
6. liquid-jet device is characterized in that:
Possesses liquid ejecting head unit through the manufacturing approach manufacturing of any one the described liquid ejecting head unit in the claim 1～5.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP119117/2009 | 2009-05-15 | ||
| JP2009119117A JP2010264700A (en) | 2009-05-15 | 2009-05-15 | Method for manufacturing liquid ejection head unit and liquid ejection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101885269A CN101885269A (en) | 2010-11-17 |
| CN101885269B true CN101885269B (en) | 2012-08-22 |
Family
ID=43068171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101805334A Expired - Fee Related CN101885269B (en) | 2009-05-15 | 2010-05-14 | Manufacturing method for liquid ejecting head unit, and liquid ejecting apparatus |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8262197B2 (en) |
| JP (1) | JP2010264700A (en) |
| CN (1) | CN101885269B (en) |
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| JP5293410B2 (en) * | 2009-05-29 | 2013-09-18 | コニカミノルタ株式会社 | Assembly method of line head unit |
| US8517508B2 (en) * | 2009-07-02 | 2013-08-27 | Fujifilm Dimatix, Inc. | Positioning jetting assemblies |
| JP2011183619A (en) * | 2010-03-05 | 2011-09-22 | Ricoh Co Ltd | Head array unit and image forming apparatus, and head replacing method |
| US8454128B2 (en) | 2010-06-23 | 2013-06-04 | Eastman Kodak Company | Printhead including alignment assembly |
| JP6094036B2 (en) * | 2012-02-23 | 2017-03-15 | セイコーエプソン株式会社 | Liquid ejecting head and liquid ejecting apparatus |
| JP6131527B2 (en) * | 2012-04-04 | 2017-05-24 | セイコーエプソン株式会社 | Manufacturing method of liquid jet head unit |
| WO2014096177A1 (en) * | 2012-12-19 | 2014-06-26 | Vistaprint Schweiz Gmbh | System and method for print head alignment using alignment adapter |
| US8851616B2 (en) | 2012-12-19 | 2014-10-07 | Vistaprint Schweiz Gmbh | Print head pre-alignment systems and methods |
| US20140168303A1 (en) * | 2012-12-19 | 2014-06-19 | Vistaprint Technologies Limited | Print head alignment systems and methods for increasing print resolution |
| US9259931B2 (en) * | 2012-12-19 | 2016-02-16 | Cimpress Schweiz Gmbh | System and method for print head alignment using alignment adapter |
| US9132660B2 (en) | 2012-12-19 | 2015-09-15 | Cimpress Schweiz Gmbh | System and method for offline print head alignment |
| JP6146081B2 (en) * | 2013-03-26 | 2017-06-14 | セイコーエプソン株式会社 | Liquid ejecting head, liquid ejecting head unit, liquid ejecting apparatus, and method of manufacturing liquid ejecting head unit |
| WO2016057015A1 (en) * | 2014-10-06 | 2016-04-14 | Hewlett-Packard Industrial Printing Ltd. | Printhead die assembly |
| ITUB20153883A1 (en) * | 2015-09-25 | 2017-03-25 | Jet Set S R L | PRESS SYSTEM |
| ITUB20153900A1 (en) * | 2015-09-25 | 2017-03-25 | Jet Set S R L | PRESS GROUP FOR A PRESS APPARATUS AND PRINTING SYSTEM INCLUDING THE PRINTING GROUP |
| US10391771B2 (en) | 2015-10-30 | 2019-08-27 | Hewlett-Packard Development Company, L.P. | Print bar |
| JP6790419B2 (en) * | 2016-03-31 | 2020-11-25 | ブラザー工業株式会社 | Head unit and liquid discharge device |
| CN110561913B (en) * | 2018-06-05 | 2021-05-18 | 松下知识产权经营株式会社 | Line head unit |
| JP7139870B2 (en) * | 2018-10-22 | 2022-09-21 | セイコーエプソン株式会社 | Liquid ejecting head, head holding member, liquid ejecting apparatus, and method for manufacturing liquid ejecting apparatus |
| JP7347012B2 (en) * | 2019-08-29 | 2023-09-20 | セイコーエプソン株式会社 | Liquid ejection device and support |
| JP7392332B2 (en) * | 2019-08-29 | 2023-12-06 | セイコーエプソン株式会社 | liquid discharge device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4975143A (en) | 1989-11-22 | 1990-12-04 | Xerox Corporation | Keyway alignment substrates |
| US5923348A (en) * | 1997-02-26 | 1999-07-13 | Lexmark International, Inc. | Method of printing using a printhead having multiple rows of ink emitting orifices |
| WO2004022344A1 (en) * | 2002-08-30 | 2004-03-18 | Fuji Xerox Co., Ltd, | Ink jet printer |
| US7690770B2 (en) * | 2003-07-08 | 2010-04-06 | Brother Kogyo Kabushiki Kaisha | Sheet-member stacked structure, lead frame, lead-frame stacked structure, sheet-member stacked and adhered structure, and ink jet printer head |
| JP2005224685A (en) * | 2004-02-12 | 2005-08-25 | Seiko Epson Corp | Sub-carriage loaded with multiple ink jet heads and its assembling method |
| JP4912222B2 (en) * | 2007-06-01 | 2012-04-11 | 京セラ株式会社 | Ink jet head assembly and method of manufacturing ink jet head |
| US7571970B2 (en) * | 2007-07-13 | 2009-08-11 | Xerox Corporation | Self-aligned precision datums for array die placement |
-
2009
- 2009-05-15 JP JP2009119117A patent/JP2010264700A/en active Pending
-
2010
- 2010-05-12 US US12/778,698 patent/US8262197B2/en active Active
- 2010-05-14 CN CN2010101805334A patent/CN101885269B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US8262197B2 (en) | 2012-09-11 |
| CN101885269A (en) | 2010-11-17 |
| US20100289854A1 (en) | 2010-11-18 |
| JP2010264700A (en) | 2010-11-25 |
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