CN101885164A - Tin solidified diamond abrasive polishing pad with bionic structure and manufacturing method - Google Patents
Tin solidified diamond abrasive polishing pad with bionic structure and manufacturing method Download PDFInfo
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- CN101885164A CN101885164A CN2010101938035A CN201010193803A CN101885164A CN 101885164 A CN101885164 A CN 101885164A CN 2010101938035 A CN2010101938035 A CN 2010101938035A CN 201010193803 A CN201010193803 A CN 201010193803A CN 101885164 A CN101885164 A CN 101885164A
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Abstract
The invention discloses a tin solidified diamond abrasive polishing pad with a bionic structure. The polishing pad comprises a plurality of tin lugs mixed with diamond micro-abrasive and a metal base pad; the plurality of tin lugs mixed with the diamond micro-abrasive are welded on the metal base pad; and the distribution of the plurality of tin lugs on the metal base pad satisfies the condition that theta is equal to 137.508 degrees n, leaf arrangement theory and 'Winkler foundation' theory. A manufacturing method for the polishing pad comprises the following steps of: scratching tin paste mixed with diamond micro-abrasive on a template by using a printing scraper, forming the plurality of piled curing-free tin lugs mixed with the diamond micro-abrasive on the upper surface of the metal base pad, then putting the metal base pad, on the surface of which the plurality of piled curing-free tin lugs mixed with the diamond micro-abrasive are distributed, into a reflux welding machine, and welding the plurality of tin lugs on the metal base pad after heating and melting through a reflux welding system respectively. The polishing pad manufactured by the method has the characteristics of uniform contact pressure distribution, uniform polishing solution and contact temperature field distribution so as to improve the polishing efficiency.
Description
Technical field
The invention belongs to the polishing and the planarization technical field of ceramic part, optical crystal part and semiconductor wafer, particularly a kind of structural design of tin solidified diamond abrasive polishing pad of biomimetic features and manufacturing technology method.
Background technology
Chemically mechanical polishing (CMP) is to make plane ceramic part, optical crystal part and semiconductor wafer surface ultra-smooth and super smooth a kind of important technology method.Usually chemically mechanical polishing is to utilize the comprehensive function of chemical attack and mechanical friction to make material obtain polishing.In the plane polishing process, how to solve the equalization problem in contact pressure field and temperature field effectively, effective queueing problem of the even flow field problem of polishing fluid and polishing refuse is the difficult problem of this technical field always, becomes the focus that domestic and international theoretical research person and industry specialists are paid close attention to.
Tin cream screen printing technique and Reflow Soldering technology are the important technologies in the BGA Package of electronic circuit board and IC.Serigraphy be by the mode of biting with pattern prefabricated on the template as for the surface that is printed thing, and reflow solder technique with the tin cream pattern of printing according to certain temperature curve heating and cooling, make the tin cream fusing fixed then.Special in the BGA Package that is IC, the spherical tin point of array arrangement can be finished the support of piling up chip chamber by this technical method and be connected with circuit.Therefore, tin cream serigraphy and Reflow Soldering technology provide technical guarantee for the manufacturing of our this polishing pad of specific implementation.
In plane polishing or integrated planarization process, the effect of polishing pad is to bring polishing fluid into polishing area, cuts and will polish the generation thing with polished surface of the work friction and take polishing area out of.For existing polishing pad, no matter be the continuous media form or have certain micropore form, because involving or shearing effect of material, and the continuity of surface macroscopic view, the footprint pressure that produces when making polishing temperature distributing disproportionation inhomogeneous, that produce is even, polishing fluid is difficult to introduce uniformly and the polishing refuse is difficult to smooth and easy eliminating, more can not balancedly effectively distribute ratio chemical and mechanism, thereby cause polished surface macroscopic view and micro-profile precise decreasing, more be difficult to realize overall planarization.
In order to address the above problem, people press the field of force from the butt joint of the Elastic Contact theory of classics and calculate, understand the uneven reason of contact pressure field, promptly adopted retaining ring method, back pad method and fluid load method to solve this problem, also adopted the mode of polishing pad fluting to solve the flow field problem of polishing fluid, but still do not made all problems obtain more effective solution all sidedly.Yet " Winkler ground " theoretical and biological phyllotaxy theory provides for we address the above problem may." Winkler ground " theory is that to regard contact object as the coefficient of rigidity be zero, and contact is served as reasons and formed with the independence " earth pillar " that juxtaposition metamorphose is directly proportional with pressure one by one.Therefore, produce corresponding polishing pad according to above-mentioned theory and just can reach the purpose of dealing with problems.
Summary of the invention
The objective of the invention is in the polishing process because the problem that the refuse that the continuity of polishing pad makes that inhomogeneous, the polished central temperature of footprint pressure that produces is higher, polishing fluid is difficult to evenly to enter contact area and generation is difficult to discharge, and the tin solidified diamond abrasive polishing pad of a kind of biomimetic features of arranging by the leaves of plants order theory in the surface that provides.
Another object of the present invention has provided the manufacture method of the tin solidified diamond abrasive polishing pad of making a kind of biomimetic features.
The technical scheme that adopts is:
A kind of tin solidified diamond abrasive polishing pad of biomimetic features, comprise a plurality of tin projection and metal base wads that are mixed with the little abrasive material of diamond, a plurality of tin projections that are mixed with the little abrasive material of diamond are welded on respectively on the metal base wad, the distribution of above-mentioned a plurality of tin projections on the metal base wad satisfy θ=137.508 ° n and
The phyllotaxy theory, each self-separation of tin projection and satisfied " Winkler ground " theory, wherein n is the tin projection ordinal number, θ is a starting point for the center with the metal base wad in polar coordinate system, with n tin projection is terminal point, the angle that reference vector turned over, r is the polar coordinates radius of tin projection anchoring point, k is the phyllotaxy coefficient.
The tin projection that is mixed with the little abrasive material of diamond is mixed and made into by tin cream material and the little abrasive material of diamond, the volume of the little abrasive material of diamond account for above-mentioned tin cream material and the little abrasive mixture of diamond volume 5～50%.The tin cream material is: tin and plumbous mixture, tin, lead and silver-colored mixture, lead-free tin cream or be used for the tin cream that IC encapsulates usefulness.Tin and plumbous mixture ratio are 63: 37 tin, lead and silver-colored mixtures, and proportioning is 62: 36: 2.
The little abrasive material diameter range of diamond is 0.005～5 μ m, and the radius that is mixed with the tin projection of the little abrasive material of diamond is 0.1～2.5mm.The diameter of metal base wad is a standard with required polishing disk diameter, and thickness is 0.03～0.5mm.
A kind of manufacture method of tin solidified diamond abrasive polishing pad of biomimetic features comprises the following steps:
1. make screen printing template.Screen printing template comprises template and screen frame.Template is a rectangle serigraphy net, the distribution in the silk screen hole on the template satisfy θ=137.508 ° n and
The phyllotaxy theory.The housing of screen frame for matching with the rectangle template outward flange.
2. the metal base wad is fixed on the screen printing working table, screen printing template is fixed on the screen printing working table, be positioned at metal base wad top, guarantee the relative position of metal base wad and screen printing template.
3. the tin cream material is in this method: tin and plumbous mixture, and tin, lead and silver-colored mixture, lead-free tin cream is used for the tin cream that IC encapsulates usefulness.Tin and plumbous mixture, proportioning is 63: 37, tin, lead and silver-colored mixture, proportioning is 62: 36: 2.The little abrasive material diameter range of diamond is 0.005～5 μ m, the volume of the little abrasive material of diamond account for above-mentioned tin cream material and the little abrasive mixture of diamond volume 5～50%.Tin cream material and the little abrasive material of diamond are mixed, make the tin cream that is mixed with the little abrasive material of diamond.
4. the above-mentioned tin cream that is mixed with the little abrasive material of diamond is placed on the template, use printing scraper on template, to scrape the tin cream that is mixed with the little abrasive material of diamond, the tin cream that is mixed with the little abrasive material of diamond is fallen from the silk screen hole of template, form the tin projection that is mixed with the little abrasive material of diamond that does not solidify of a plurality of heap shapes at metal base wad upper surface, the distribution of above-mentioned a plurality of tin projections satisfy θ=137.508 ° n and
Theoretical and " Winkler ground " theory of phyllotaxy.
The pressure P of printing scraper and speed V choose according to concrete needs, and above-mentioned printing process is to carry out under 25 ± 3 ℃ of temperature and relative humidity 40-70% condition.
5. above-mentioned surface distributed there is the metal base wad of a plurality of tin projections that are mixed with the little abrasive material of diamond that do not solidify to put into reflow machine, by being welded on respectively on the metal base wad after the tin cream heat fused that are mixed with the little abrasive material of diamond of Reflow Soldering heat-generating system with a plurality of not curing.
Above-mentioned welding process will add gentle temperature lowering curve control according to Reflow Soldering, and the humidity province is divided into A, B, C, D, E and F district in the welding process.
A) A is the preheating zone: temperature is about 0～125 ℃, and the time was about about 60 seconds.
B) B is for soaking Ru Qu: temperature is about 125～170 ℃, and the time was about about 120 seconds.
C) C is the reflow district: temperature is about 190～240 ℃, and the time was about about 60 seconds.
D) D is the cooling zone: about 190～120 ℃ of temperature, the time was about about 60 seconds.
E) E is the B-C transition region: temperature is about 170～190 ℃, and the time was about about 30 seconds.
F) F is the C-D transition region: temperature is about 190～210 ℃, and the time was about about 30 seconds.
Its advantage is: project organization of the present invention is to weld a plurality of tin projections that are mixed with the little abrasive material of diamond on the metal base wad respectively, the phyllotaxy theory is satisfied in the distribution of these a plurality of tin projections, and has a feature of " Winkler ground ", the polishing pad that designs and manufacture according to above-mentioned theory just has footprint pressure to be evenly distributed, polishing fluid uniform with the effect of effective eliminating that contacts uniform distribution of temperature field and polishing refuse. for solving the plane optical element, the ceramic engineering part, the integrated planarization process of IC and MEMS is significant, enhance productivity, improve product quality, the development that promotes ic manufacturing technology is had realistic meaning.
Description of drawings
Fig. 1 is the little abrasive polishing pad structure chart of a kind of tin solidified diamond of biomimetic features.
Fig. 2 is the little abrasive polishing pad cross section structure of a kind of tin solidified diamond of biomimetic features figure.
Fig. 3 is a screen printing template.
Fig. 4 is the tin cream serigraphy figure that is mixed with the little abrasive material of diamond.
Fig. 5 is the schematic diagram of hot air reflux weldering.
Fig. 6 by the polishing pad figure of the little abrasive material of tin solidified diamond of a kind of biomimetic features of acquisition.
Fig. 7 is a reflow process temperature curve exemplary plot.
The specific embodiment
A kind of tin solidified diamond abrasive polishing pad of biomimetic features, comprise a plurality of tin projection 1 and metal base wads 2 that are mixed with the little abrasive material of diamond, a plurality of tin projections 1 that are mixed with the little abrasive material of diamond are welded on respectively on the metal base wad 2, the above-mentioned a plurality of distributions of tin projection 1 on metal base wad 2 that are mixed with the little abrasive material of diamond satisfy θ=137.508 ° n and
The phyllotaxy theory, each self-separation of tin projection and satisfy " Winkler ground " theory, wherein n is the tin projection ordinal number; θ is terminal point for the center with the metal base wad in polar coordinate system is a starting point with n tin projection, the angle that reference vector turned over, and r is the polar coordinates radius of tin projection anchoring point; K is the phyllotaxy coefficient.
The tin projection 1 that is mixed with the little abrasive material of diamond is mixed and made into by tin cream material and the little abrasive material 10 of diamond, the volume of the little abrasive material of diamond account for above-mentioned tin cream material and the little abrasive mixture of diamond volume 5～50%.The tin cream material is: tin and plumbous mixture, tin, lead and silver-colored mixture, lead-free tin cream or be used for the tin cream that IC encapsulates usefulness.Tin and plumbous mixture, proportioning is 63: 37, tin, lead and silver-colored mixture, proportioning is 62: 36: 2.
The radius that is mixed with the tin projection 1 of the little abrasive material of diamond is 1mm.The diameter of metal base wad 2 is a standard with required polishing disk diameter, is made by copper or stainless steel foil plate, and thickness is 0.3mm.
A kind of manufacture method of tin solidified diamond abrasive polishing pad of biomimetic features comprises the following steps:
1. make screen printing template.Screen printing template comprises template 4 and screen frame 5.Template 4 is a rectangle serigraphy net, the distribution in the silk screen hole on the template 4 satisfy θ=137.508 ° n and
Phyllotaxy theory, but electrotyping forming, laser cutting moulding or sensitization corrosion moulding.The housing of screen frame 5 for matching with the rectangle template outward flange adopts aluminium or steel to make.
2. metal base wad 2 is fixed on the screen printing working table 8, screen printing template is fixed on the screen printing working table 8, be positioned at metal base wad 2 tops, guarantee the relative position of metal base wad 2 and screen printing template.
3. the tin cream material is in this method: tin and plumbous mixture, tin, lead and silver-colored mixture, lead-free tin cream or for being used for the tin cream that IC encapsulates usefulness.Tin and plumbous proportioning are that 63: 37 tin, lead and silver-colored proportionings are 62: 36: 2, and little abrasive material 10 diameters of diamond are 3 μ m, the volume of the little abrasive material of diamond account for above-mentioned tin cream material and the little abrasive mixture of diamond volume 50%.Tin cream material and the little abrasive material of diamond are mixed, make the tin cream 7 that is mixed with the little abrasive material of diamond.
4. the above-mentioned tin cream that is mixed with the little abrasive material of diamond is placed on the template 4, use printing scraper 6 on template 4, to scrape the tin cream 7 that is mixed with the little abrasive material of diamond, the tin cream 7 that is mixed with the little abrasive material of diamond is fallen from the silk screen hole of template, form the tin projection that is mixed with the little abrasive material of diamond 3 that does not solidify of a plurality of heap shapes at metal base wad 2 upper surfaces, the distribution of above-mentioned a plurality of tin projections satisfy θ=137.508 ° n and
Theoretical and " Winkler ground " theory of phyllotaxy.
The pressure P of printing scraper 6 and speed V can choose according to concrete needs, and above-mentioned printing process is to carry out under 25 ± 3 ℃ of temperature and relative humidity 40-70% condition.
5. above-mentioned surface distributed there is the metal base wad 2 of a plurality of tin projections that are mixed with the little abrasive material of diamond 5 that do not solidify to put into reflow machine, by being welded on respectively on the metal base wad 2 after the tin cream that is mixed with the little abrasive material of diamond 3 heat fused of Reflow Soldering heat-generating system 9 with a plurality of not curing.
Above-mentioned welding process will add gentle temperature lowering curve control according to Reflow Soldering, and the humidity province is divided into A, B, C, D, E and F district in the welding process.
A) A is the preheating zone: temperature is about 0～125 ℃, and the time was about about 60 seconds.
B) B is for soaking Ru Qu: temperature is about 125～170 ℃, and the time was about about 120 seconds.
C) C is the reflow district: temperature is about 190～240 ℃, and the time was about about 60 seconds.
D) D is the cooling zone: about 190～120 ℃ of temperature, the time was about about 60 seconds.
E) E is the B-C transition region: temperature is about 170～190 ℃, and the time was about about 30 seconds.
F) F is the C-D transition region: temperature is about 190～210 ℃, and the time was about about 30 seconds.
Claims (4)
1. the tin solidified diamond abrasive polishing pad of a biomimetic features comprises a plurality of tin projection (1) and metal base wads (2) that are mixed with the little abrasive material of diamond, it is characterized in that:
A plurality of tin projections (1) that are mixed with the little abrasive material of diamond are welded on respectively on the metal base wad (2), the distribution of above-mentioned a plurality of tin projections on the metal base wad satisfy θ=137.508 ° n and
The phyllotaxy theory, each self-separation of tin projection and satisfy " Winkler ground " theory, wherein n is the tin projection ordinal number; θ is terminal point for the center with the metal base wad in polar coordinate system is a starting point with n tin projection, the angle that reference vector turned over, and r is the polar coordinates radius of tin projection anchoring point; K is the phyllotaxy coefficient;
The tin projection (1) that is mixed with the little abrasive material of diamond is mixed and made into by tin cream material and the little abrasive material of diamond (10), the volume of the little abrasive material of diamond account for above-mentioned tin cream material and the little abrasive mixture of diamond volume 5～50%; The tin cream material is: tin and plumbous mixture, tin, lead and silver-colored mixture, lead-free tin cream or be used for the tin cream that IC encapsulates usefulness; Tin and plumbous mixture, proportioning is 63: 37, tin, lead and silver-colored mixture, proportioning is 62: 36: 2, and the little abrasive material of diamond (10) diameter range is 0.005～5 μ m, and (1) radius that is mixed with the tin projection of the little abrasive material of diamond is 0.1～2.5mm;
The diameter of metal base wad (2) is a standard with required polishing disk diameter, and thickness is 0.03～0.5mm.
2. the manufacture method of the tin solidified diamond abrasive polishing pad of a biomimetic features, its feature comprises the following steps:
1. make screen printing template: screen printing template comprises template (4) and screen frame (5): template (4) is a rectangle serigraphy net, the distribution in the silk screen hole on the template (4) satisfy θ=137.508 ° n and
The phyllotaxy theory; The housing of screen frame (5) for matching with the rectangle template outward flange;
2. metal base wad (2) is fixed on the screen printing working table (8), screen printing template is fixed on the screen printing working table (8), be positioned at metal base wad (2) top, guarantee the relative position of metal base wad (2) and screen printing template;
3. the tin cream material is in this method: tin and plumbous mixture, and proportioning is 63: 37, tin, lead and silver-colored mixture, proportioning is 62: 36: 2, lead-free tin cream or be used for the tin cream that IC encapsulates usefulness; The little abrasive material of diamond (10) diameter range is 0.005～5 μ m, the volume of the little abrasive material of diamond account for above-mentioned tin cream material and the little abrasive mixture of diamond volume 5～50%, tin cream material and the little abrasive material of diamond are mixed, make the tin cream (7) that is mixed with the little abrasive material of diamond;
4. the above-mentioned tin cream (7) that is mixed with the little abrasive material of diamond is placed on the template (4), use printing scraper (6) on template (4), to scrape the tin cream (7) that is mixed with the little abrasive material of diamond, the tin cream (7) that is mixed with the little abrasive material of diamond is fallen from the silk screen hole of template (4), form the tin projection that is mixed with the little abrasive material of diamond (3) that does not solidify of a plurality of heap shapes at metal base wad (2) upper surface, theoretical and " Winkler ground " theory of phyllotaxy is satisfied in the distribution of above-mentioned a plurality of tin projections;
5. above-mentioned surface distributed there is the metal base wad (2) of a plurality of tin projections that are mixed with the little abrasive material of diamond (3) that do not solidify to put into reflow machine, by being welded on respectively on the metal base wad (2) after the tin cream that is mixed with the little abrasive material of diamond (3) heat fused of Reflow Soldering heat-generating system (9) with a plurality of not curing.
3. based on the manufacture method of the tin solidified diamond abrasive polishing pad of the described a kind of biomimetic features of claim 2, it is characterized in that: above-mentioned printing process is to carry out under 25 ± 3 ℃ of temperature and relative humidity 40-70% condition.
4. based on the manufacture method of the tin solidified diamond abrasive polishing pad of the described a kind of biomimetic features of claim 2, it is characterized in that: above-mentioned welding process will add gentle temperature lowering curve control according to Reflow Soldering, and the humidity province is divided into A, B, C, D, E and F district in the welding process;
A) A is the preheating zone: temperature is 0～125 ℃, and the time is 60 seconds;
B) B is for soaking Ru Qu: temperature is 125～170 ℃, and the time is 120 seconds;
C) C is the reflow district: temperature is 190～240 ℃, and the time is 60 seconds;
D) D is the cooling zone: 190～120 ℃ of temperature, and the time is 60 seconds;
E) E is the B-C transition region: temperature is 170～190 ℃, and the time is 30 seconds;
F) F is the C-D transition region: temperature is 190～210 ℃, and the time is 30 seconds.
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| CN2010101938035A CN101885164B (en) | 2010-06-08 | 2010-06-08 | Tin solidified diamond abrasive polishing pad with bionic structure and manufacturing method |
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| CN2010101938035A CN101885164B (en) | 2010-06-08 | 2010-06-08 | Tin solidified diamond abrasive polishing pad with bionic structure and manufacturing method |
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| CN102240984A (en) * | 2011-05-30 | 2011-11-16 | 沈阳理工大学 | Columnar ultra-hard abrasive grinding wheel for phyllotactic arranged abrasive and production method thereof |
| CN102814765A (en) * | 2012-08-10 | 2012-12-12 | 南京航空航天大学 | Equipment and method for distributing rotary brazing super-hard abrasive tool |
| WO2014210470A1 (en) | 2013-06-28 | 2014-12-31 | Saint-Gobain Abrasives, Inc. | Coated abrasive article based on a sunflower pattern |
| EP3613540A1 (en) * | 2011-12-31 | 2020-02-26 | Saint-Gobain Abrasives, Inc. | Abrasive article having a non-uniform distribution of openings |
| CN112677062A (en) * | 2019-10-18 | 2021-04-20 | 江苏韦尔博新材料科技有限公司 | Special abrasive grain landform for polishing steel grinding disc, diamond grinding disc and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102240984A (en) * | 2011-05-30 | 2011-11-16 | 沈阳理工大学 | Columnar ultra-hard abrasive grinding wheel for phyllotactic arranged abrasive and production method thereof |
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| EP3613540A1 (en) * | 2011-12-31 | 2020-02-26 | Saint-Gobain Abrasives, Inc. | Abrasive article having a non-uniform distribution of openings |
| US11504822B2 (en) | 2011-12-31 | 2022-11-22 | Saint-Gobain Abrasives, Inc. | Abrasive article having a non-uniform distribution of openings |
| CN102814765A (en) * | 2012-08-10 | 2012-12-12 | 南京航空航天大学 | Equipment and method for distributing rotary brazing super-hard abrasive tool |
| CN102814765B (en) * | 2012-08-10 | 2014-07-02 | 南京航空航天大学 | Equipment and method for distributing rotary brazing super-hard abrasive tool |
| WO2014210470A1 (en) | 2013-06-28 | 2014-12-31 | Saint-Gobain Abrasives, Inc. | Coated abrasive article based on a sunflower pattern |
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| JP2016523726A (en) * | 2013-06-28 | 2016-08-12 | サンーゴバン アブレイシブズ，インコーポレイティド | Coated abrasive products based on sunflower pattern |
| JP2019166634A (en) * | 2013-06-28 | 2019-10-03 | サンーゴバン アブレイシブズ，インコーポレイティド | Coated abrasive article based on sunflower pattern |
| CN112677062A (en) * | 2019-10-18 | 2021-04-20 | 江苏韦尔博新材料科技有限公司 | Special abrasive grain landform for polishing steel grinding disc, diamond grinding disc and preparation method thereof |
| CN112677062B (en) * | 2019-10-18 | 2022-12-09 | 江苏韦尔博新材料科技有限公司 | Special abrasive grain landform for polishing steel grinding disc, diamond grinding disc and preparation method thereof |
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| CN101885164B (en) | 2011-12-14 |
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