CN101885114B - 激光切割脆性材料基板的曲线路径切割方法 - Google Patents
激光切割脆性材料基板的曲线路径切割方法 Download PDFInfo
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- CN101885114B CN101885114B CN 201010210822 CN201010210822A CN101885114B CN 101885114 B CN101885114 B CN 101885114B CN 201010210822 CN201010210822 CN 201010210822 CN 201010210822 A CN201010210822 A CN 201010210822A CN 101885114 B CN101885114 B CN 101885114B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000003698 laser cutting Methods 0.000 title abstract description 3
- 238000005070 sampling Methods 0.000 claims abstract description 37
- 238000005336 cracking Methods 0.000 claims abstract description 14
- 238000009826 distribution Methods 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 24
- 208000037656 Respiratory Sounds Diseases 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 15
- 230000000694 effects Effects 0.000 claims description 4
- 230000001154 acute effect Effects 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 4
- 206010017076 Fracture Diseases 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 208000010392 Bone Fractures Diseases 0.000 description 1
- 208000002565 Open Fractures Diseases 0.000 description 1
- 241000227425 Pieris rapae crucivora Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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CN 201010210822 CN101885114B (zh) | 2010-06-28 | 2010-06-28 | 激光切割脆性材料基板的曲线路径切割方法 |
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CN 201010210822 CN101885114B (zh) | 2010-06-28 | 2010-06-28 | 激光切割脆性材料基板的曲线路径切割方法 |
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CN101885114A CN101885114A (zh) | 2010-11-17 |
CN101885114B true CN101885114B (zh) | 2012-11-14 |
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CN 201010210822 Expired - Fee Related CN101885114B (zh) | 2010-06-28 | 2010-06-28 | 激光切割脆性材料基板的曲线路径切割方法 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102179635B (zh) * | 2011-04-26 | 2014-07-16 | 哈尔滨工业大学 | 脆性材料微波切割的加工方法及加工装置 |
KR101355807B1 (ko) * | 2012-09-11 | 2014-02-03 | 로체 시스템즈(주) | 비금속 재료의 곡선 절단방법 |
EP3464201B1 (en) * | 2016-06-03 | 2020-04-22 | Corning Incorporated | Apparatus and method of managing mechanically induced stress on a crack tip when separating a flexible glass ribbon |
CN107907059B (zh) * | 2017-11-27 | 2019-12-06 | 京东方科技集团股份有限公司 | 一种板层剥离的检测方法和检测装置、激光检测设备 |
CN116564453B (zh) * | 2023-06-01 | 2024-02-02 | 哈尔滨工业大学 | 面向激光辐照壁材料温度分布的激光参数优化方法及*** |
CN117283638B (zh) * | 2023-11-27 | 2024-02-09 | 四川职业技术学院 | 一种用于中药的切割*** |
CN118023657B (zh) * | 2024-04-11 | 2024-06-07 | 四川显为智能装备有限公司 | 一种维修气刨机器人的控制方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007055000A (ja) * | 2005-08-23 | 2007-03-08 | Japan Steel Works Ltd:The | 非金属材料製の被加工物の切断方法及びその装置 |
CN101121220A (zh) * | 2006-08-11 | 2008-02-13 | 富士迈半导体精密工业(上海)有限公司 | 脆性材料基板切割方法 |
CN101444875A (zh) * | 2008-12-08 | 2009-06-03 | 浙江工业大学 | 一种脆性材料基板的切割方法 |
WO2009132760A1 (de) * | 2008-05-02 | 2009-11-05 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Vorrichtung zur analyse des strahlprofils eines laserstrahls |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007055000A (ja) * | 2005-08-23 | 2007-03-08 | Japan Steel Works Ltd:The | 非金属材料製の被加工物の切断方法及びその装置 |
CN101121220A (zh) * | 2006-08-11 | 2008-02-13 | 富士迈半导体精密工业(上海)有限公司 | 脆性材料基板切割方法 |
WO2009132760A1 (de) * | 2008-05-02 | 2009-11-05 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Vorrichtung zur analyse des strahlprofils eines laserstrahls |
CN101444875A (zh) * | 2008-12-08 | 2009-06-03 | 浙江工业大学 | 一种脆性材料基板的切割方法 |
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Effective date of registration: 20200731 Address after: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee after: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Address before: 310014 Hangzhou city in the lower reaches of the city of Zhejiang Wang Road, No. 18 Patentee before: ZHEJIANG University OF TECHNOLOGY Effective date of registration: 20200731 Address after: 768 Maopeng Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: SUZHOU JINSHENG CERAMIC INDUSTRY Co.,Ltd. Address before: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. |
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