CN101866913B - Chip encapsulation structure with shielding cover body - Google Patents
Chip encapsulation structure with shielding cover body Download PDFInfo
- Publication number
- CN101866913B CN101866913B CN 200910133192 CN200910133192A CN101866913B CN 101866913 B CN101866913 B CN 101866913B CN 200910133192 CN200910133192 CN 200910133192 CN 200910133192 A CN200910133192 A CN 200910133192A CN 101866913 B CN101866913 B CN 101866913B
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- passive device
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- cover body
- shielding cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a chip encapsulation structure with a shielding cover body, comprising a substrate, a chip, a pair of first passive components, a pair of second passive components and a shielding cover body. The chip, the first passive components, the second passive components and the shielding cover body are all arranged on the substrate; the chip is electrically connected with the substrate; and the shielding cover body covers the chip and is provided with a plurality of pins connected to the substrate. The pins comprise a first pin and a second pin; the first pin is connected with a part of the substrate and is arranged between the first passive components, and is arrayed along a first axial line with the first passive components; and the second pin is connected with a part of the substrate and is arranged between the second passive components, and is arranged along a second axial line with the second passive components.
Description
Technical field
The present invention relates to chip-packaging structure (chip package structure), and particularly relevant for a kind of chip-packaging structure with shielding cover body.
Background technology
IC chip can electrically connect via a circuit board and a motherboard (motherboard) usually, so that electronic signal can be transmitted between IC chip and motherboard.Yet, when the clock frequency of IC chip is high more, electronic signal just receive more easily electromagnetic interference (Electro-Magnetic Interference, EMI).Stability when the problems affect IC chip of electromagnetic interference uses can be assembled to metal cap body the top of circuit board usually, is used for preventing electromagneticly leaking or avoiding external electromagnetic waves to infiltrate and cause interference.
At present, the mode that metal cap body is assembled to circuit board mainly can be divided into pin and insert that (pinthrough hole is PTH) with surface adhering technology (surface mount technology, SMT) two kinds of junctures.With regard to surface adhering technology (SMT); The juncture of existing surface adhering technology (SMT) then be with conducting resinl or paste solder printing (ink jet printing or screen painting) after circuit board, through conducting resinl or tin cream the pin end of metal cap body directly is engaged to the connection pad (pad) on the circuit board.Yet; See through in the process of baking-curing or tin cream sees through reflow and converts in the liquid process at conducting resinl; The thermal convection meeting that is produced makes metal cap body that the situation of skew dystopy take place; The metal cap body that causes being positioned on the circuit board can't accurately be positioned on the connection pad of circuit board, and then influences the assembling yield of metal cap body.
Summary of the invention
The present invention provides a kind of chip-packaging structure with shielding cover body, can promote the assembling yield of shielding cover body.
The present invention proposes a kind of chip-packaging structure with shielding cover body, and it comprises a substrate, a chip, a pair of first passive device, a pair of second passive device and a shielding cover body.Chip configuration and electrically connects with substrate on substrate.This is disposed on the substrate first passive device.This is disposed on the substrate second passive device.Shielding cover body is disposed on the substrate and cover covers chip, and wherein shielding cover body has a plurality of pins, and these pins are connected on the substrate.These pins comprise one first pin and one second pin.First pin connects the part of substrate between this is to first passive device, and with this first passive device is arranged along a first axle.Second pin connects the part of substrate between this is to second passive device, and with this second passive device is arranged along one second axis.
In one embodiment of this invention, above-mentioned this to first passive device, this sees through an electric conducting material and substrate electric connection to second passive device, first pin and second pin.
In one embodiment of this invention, aforesaid substrate is shaped as a rectangle.
In one embodiment of this invention, above-mentioned first pin and this are arranged along first axle first passive device, and second pin and this arrange along second axis second passive device, and first axle is in fact perpendicular to second axis.
In one embodiment of this invention, above-mentioned substrate also comprises a pair of the 3rd passive device and a pair of the 4th passive device, and these pins also comprise one the 3rd pin and one the 4th pin.This lays respectively at two online relative corners of a diagonal angle of substrate to the 3rd passive device and this to first passive device.This lays respectively at two online relative corners of another diagonal angle of substrate to the 4th passive device and this to second passive device.The 3rd pin connects the part of substrate between this is to the 3rd passive device, and with this to the 3rd passive device along one be parallel to first axle in fact axis arrange.The 4th pin connects the part of substrate between this is to the 4th passive device, and with this to the 4th passive device along one be parallel to second axis in fact axis arrange.
In one embodiment of this invention, above-mentioned this to first passive device, this to second passive device, this to the 3rd passive device, this sees through an electric conducting material and substrate electric connection to the 4th passive device, first pin, second pin, the 3rd pin and the 4th pin.
In one embodiment of this invention, above-mentioned substrate also comprises a pair of the 3rd passive device and a pair of the 4th passive device, and these pins also comprise one the 3rd pin and one the 4th pin.This lays respectively at the relative both sides of the center of gravity of substrate to the 3rd passive device and this to first passive device.This lays respectively at the relative both sides of the center of gravity of substrate to the 4th passive device and this to second passive device.The 3rd pin connects the part of substrate between this is to the 3rd passive device, and with this to the 3rd passive device along one be parallel to first axle in fact axis arrange.The 4th pin connects the part of substrate between this is to the 4th passive device, and with this to the 4th passive device along one be parallel to second axis in fact axis arrange.
In one embodiment of this invention, above-mentioned shielding cover body comprises that a roof and vertically is connected in the sidewall of roof periphery.
In one embodiment of this invention, each above-mentioned pin comprises a bar portion and a base portion.One end of bar portion connects the edge of roof.One end of base portion is connected with the other end of bar portion.One surface of base portion is connected to the part of substrate.The bearing of trend of base portion is parallel to the bearing of trend of roof in fact.
Based on above-mentioned; Chip-packaging structure with shielding cover body of the present invention; The part that these pins of its shielding cover body connect substrates lays respectively at these between the passive device, and in other words, the spacing between the every pair of passive device can limit the scope of activities of each pin of shielding cover body.Therefore, compared to existing technologies, see through in the process of heating at electric conducting material, the present invention can prevent that thermal convection from blowing the phenomenon of moving off normal with shielding cover body, and then can promote the assembling yield of shielding cover body.
For let above and other objects of the present invention, feature and advantage can be more obviously understandable, hereinafter is special lifts embodiment, and cooperates appended graphic elaborating as follows.
Description of drawings
Fig. 1 is a kind of schematic perspective view with chip-packaging structure of shielding cover body of one embodiment of the invention;
Fig. 2 is the perspective exploded view of chip-packaging structure of the shielding cover body of Fig. 1;
Fig. 3 is the cutaway view of the chip-packaging structure with shielding cover body of Fig. 1 along the I-I line.
[main element symbol description]
100: chip-packaging structure
110: substrate
112: connection pad
120: chip
130: the first passive devices
132: electrode
140: the second passive devices
150: the three passive devices
160: the four passive devices
170: shielding cover body
170a: roof
170b: sidewall
172: the first pins
172a, 174a: bar portion
172b, 174b: base portion
174: the second pins
176: the three pins
178: the four pins
180: electric conducting material
190: electric capacity
R1: first axle
R2: second axis
R3: the 3rd axis
R4: four axistyle
Embodiment
Fig. 1 is a kind of schematic perspective view with chip-packaging structure of shielding cover body of one embodiment of the invention; Fig. 2 is the perspective exploded view of chip-packaging structure of the shielding cover body of Fig. 1, and Fig. 3 is the chip-packaging structure with shielding cover body of Fig. 1 cutaway view along the I-I line.Please be earlier simultaneously with reference to figure 1 and Fig. 2, in the present embodiment, chip-packaging structure 100 comprises a substrate 110, a chip 120, a pair of first passive device 130, a pair of second passive device 140 and a shielding cover body 170.In the present embodiment, substrate 110 for example be a printed circuit board (PCB) (printed circuit board, PCB), a module board (module board) or a base plate for packaging (package substrate).
In detail; Chip 120 is disposed on the substrate 110; And chip 120 can see through many conductive projections (conductive bump) (not illustrating) that are positioned at its below, bottom surface and be electrically connected to substrate 110, makes that two interfaces, two elements or the two-end-point between chip 120 and substrate 110 all can be reached the purpose that signal transmits via these conducting spheres.In the present embodiment, dispose a plurality of electric capacity 190 around the chip 120, wherein these electric capacity 190 are to be arranged on the substrate 110 for the needs that electrically design.
This is disposed on the substrate 110 first passive device 130, and this for example is a pair of electric capacity to first passive device 130, and it comprises pair of electrodes 132 respectively, please refer to Fig. 3.In the present embodiment, this is disposed on the substrate 110 second passive device 140, and this structure to second passive device 140 is identical in fact with this structure to first passive device 130, and in other words, this also for example is a pair of electric capacity to second passive device 140.
Hold above-mentioned; In the present embodiment; The part that first pin 172 connects substrate 110 is between this is to first passive device 130; And with this first passive device 130 is arranged along a first axle R1, in other words, this can limit the scope of activities of first pin 172 at first axle R1 to first passive device 130.Second pin 174 connects the part of substrates 110 between this is to second passive device 140, and with this to second passive device 140 along one be not parallel to first axle R1 in fact the second axis R2 arrange.Particularly; In the present embodiment; Second pin 174 with this to second passive device 140 along arranging perpendicular to the second axis R2 of first axle R1 in fact, in other words, this can limit the scope of activities of second pin 174 on the second axis R2 to second passive device 140.In brief, this can limit shielding cover body 170 moving on a plane (comprising directions X and Y direction) to first passive device 130 and this to second passive device 140.
In addition, in the present embodiment, substrate 110 also comprises a pair of the 3rd passive device 150 and a pair of the 4th passive device 160, and these pins also comprise one the 3rd pin 176 and one the 4th pin 178.Particularly; In the present embodiment; The shape of substrate 110 for example is a rectangle; And this lays respectively at two online relative corners of a diagonal angle of substrate 110 to the 3rd passive device 150 and this to first passive device 130, and this lays respectively at substrate 110 another diagonal angles online two relative corners with this to second passive device 140 to the 4th passive device 160.In other words, this to first passive device 130, this to second passive device 140, this lays respectively at four corners of substrate 110 to the 5th passive device 150 and this to the 6th passive device 160.In the present embodiment; The structure of the structure of the 3rd passive device 150 and the 4th passive device 160 structure with the structure of first passive device 130 and second passive device 140 in fact is identical; That is to say that the 3rd passive device 150 and the 4th passive device 160 for example are a pair of electric capacity respectively also.
Hold above-mentioned; The part that the 3rd pin 176 connects substrate 110 is between this is to the 3rd passive device 150; And with this to the 3rd passive device 150 along one be parallel to first axle R1 in fact one the 3rd axis R3 arrange; In other words, this can limit the scope of activities of the 3rd pin 176 on the 3rd axis R3 to the 3rd passive device 150.The part that the 4th pin 178 connects substrate 110 is between this is to the 4th passive device 160; And with this to the 4th passive device 160 along one be parallel to the second axis R2 in fact the first four axistyle R4 arrange; In other words, this can limit the scope of activities of the 4th pin 178 on four axistyle R4 to the 4th passive device 160.In the present embodiment; The structure of the structure of the 3rd pin 176 and the 4th pin 178 structure with the structure of first pin 172 and second pin 174 in fact is identical; That is to say that the 3rd pin 176 and the 4th pin 178 also have a bar portion (not illustrating) and a base portion (not illustrating) respectively.
In addition; Please be simultaneously with reference to figure 2 and Fig. 3; In the present embodiment; This to first passive device 130, this to second passive device 140, this to the 3rd passive device 150, this sees through an electric conducting material 180 to the 4th passive device 160, first pin 172, second pin 174, the 3rd pin 176 and the 4th pin 178 and electrically connects with substrate 110, wherein electric conducting material 180 comprises conducting resinl or tin cream.In this mandatory declaration be; Since this to first passive device 130, this to second passive device 140, this to the 3rd passive device 150, this all sees through identical mode and substrate 110 electric connections to the 4th passive device 160, first pin 172, second pin 174, the 3rd pin 176 and the 4th pin 178; Therefore for the purpose of the explanation for ease, Fig. 3 only schematically illustrate with this to first passive device 130 and first pin 172 as explanation.
In detail; This to first passive device 130, this is to second passive device 140, before this is disposed on the substrate 110 to the 3rd passive device 150 and this to the 4th passive device 160, printing (screen painting or ink jet printing) electric conducting material 180 is on these connection pads 112 on the substrate 110 earlier.Then; Carry out a heating process for the first time; So that after electric conducting material 180 forms liquid forms, with this to first passive device 130, this to second passive device 140, this is disposed on these connection pads 112 of substrate 110 the 4th passive device 160 the 3rd passive device 150 and this.After electric conducting material 180 cooled and solidified of liquid form, electric conducting material after the curing 180 can with this to first passive device 130, this to second passive device 140, this is fixed on the substrate 110 the 4th passive device 160 the 3rd passive device 150 and this.In other words, this to first passive device 130, this to second passive device 140, this sees through electric conducting material 180 and is electrically connected to substrate 110 the 4th passive device 160 the 3rd passive device 150 and this.
Then, with first pin 172 of shielding cover body 170, second pin 174, the 3rd pin 176 and the 4th pin 178 embed respectively this between first passive device 130, this between second passive device 140, this is between the 3rd passive device 150 and this is between the 4th passive device 160.At last, carry out a heating process for the second time, so that shielding cover body 170 is fixed on the substrate 110.In this mandatory declaration be; When electric conducting material 180 is a conducting resinl; The mode of first heating process and second heating process all adopts the mode of baking, and when electric conducting material 180 was a tin cream, the mode of first heating process and second heating process all adopted the mode of reflow.
Since this to first passive device 130, this to second passive device 140, this can distinguish the 4th passive device 160 the 3rd passive device 150 and this and limit first pin 172, second pin 174, the 3rd pin 176, the 4th pin 178 scope of activities at first axle R1, the second axis R2, the 3rd axis R3 and four axistyle R4 in regular turn; And first axle R1 is parallel to the 3rd axis R3 in fact; The second axis R2 is parallel to four axistyle R4 in fact; First axle R1 is in fact perpendicular to the second axis R2; Therefore when carrying out heating process second time, this to first passive device 130, this to second passive device 140, this can limit mobile on a plane (comprising directions X and Y direction) of first pin 172, second pin 174, the 3rd pin 176, the 4th pin 178 to the 3rd passive device 150 and this to the 4th passive device 160.
In brief; Present embodiment through this to first passive device 130, this to second passive device 140, this limits first pin 172, second pin 174, the 3rd pin 176 of shielding cover body 170, the scope of activities of the 4th pin 178 to the 3rd passive device 150 and this to the 4th passive device 160; Therefore heat and form in the liquid process at electric conducting material 180; Can prevent that thermal convection from blowing the phenomenon of moving off normal with shielding cover body 170, and then can promote the assembling yield of shielding cover body 170.
What one of value was carried is; In Fig. 1 and embodiment shown in Figure 2; Chip-packaging structure 100 comprise this to first passive device 130, this to second passive device 140, this is to the 3rd passive device 150 and this is to the 4th passive device 160; But in the embodiment that other does not illustrate, chip-packaging structure 100 can also only comprise this to first passive device 130 with this to second passive device 140, still can reach mobile on a plane of restriction first pin 172 and second pin 174.Therefore, the quantity of Fig. 1 and paired passive device shown in Figure 2 is merely and illustrates, and non-limiting the present invention.
In addition; In Fig. 1 and embodiment shown in Figure 2; Substrate 110 be shaped as rectangle; And first axle R1 is in fact perpendicular to the second axis R2, but in the embodiment that other does not illustrate, and substrate 110 is other polygon or circle etc. also; And first axle R1 is not parallel to the second axis R2; As long as this lays respectively at the relative both sides of the center of gravity of substrate 110 to the 3rd passive device 150 and this to first passive device 130, this lays respectively at the relative both sides of the center of gravity of substrate 110 to the 4th passive device 160 and this to second passive device 140, can limit first pin 172, second pin 174, the 3rd pin 176, the 4th pin 178 moving on a plane.Therefore, the shape of Fig. 1 and substrate shown in Figure 2 is merely and illustrates, and non-limiting the present invention.
In sum; Chip-packaging structure of the present invention; The part that first pin of its shielding cover body, second pin, the 3rd pin and the 4th pin connect substrate lay respectively at this to first passive device, this to second passive device, this is to the 3rd passive device and this is between the 4th passive device; In other words, these can limit the scope of activities of these pins of shielding cover body respectively to the spacing between the passive device.In addition; Because first axle is in fact perpendicular to second axis; Therefore see through in the process of heating and formation liquid state at electric conducting material; This to first passive device, this to second passive device, this limits first pin, second pin, the 3rd pin, the 4th pin moving on a plane (comprising directions X and Y direction) to the 3rd passive device and this to the 4th passive device; Therefore the present invention can avoid in the heating process thermal convection that shielding cover body is blown the phenomenon of moving off normal, can promote the assembling yield of shielding cover body.
Though the present invention discloses as above with embodiment; Right its is not in order to limit the present invention; Has common knowledge the knowledgeable in the technical field under any; Do not breaking away from the spirit and scope of the present invention, when doing a little change and retouching, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.
Claims (9)
1. chip-packaging structure with shielding cover body is characterized in that comprising:
One substrate;
One chip is disposed on this substrate, and electrically connects with this substrate;
A pair of first passive device is disposed on this substrate;
A pair of second passive device is disposed on this substrate; And
One shielding cover body; Be disposed on this substrate and cover and cover this chip; Wherein this shielding cover body has a plurality of pins, and it is connected on this substrate, and those pins comprise one first pin and one second pin; This first pin connects the part of this substrate between this is to first passive device; And with this first passive device is arranged along a first axle, and this second pin connects the part of this substrate between this is to second passive device, and second passive device is arranged along one second axis with this.
2. the chip-packaging structure with shielding cover body as claimed in claim 1 is characterized in that, this to first passive device, this sees through an electric conducting material and the electric connection of this substrate to second passive device, this first pin and this second pin.
3. the chip-packaging structure with shielding cover body as claimed in claim 1 is characterized in that, this substrate be shaped as a rectangle.
4. the chip-packaging structure with shielding cover body as claimed in claim 3; It is characterized in that; This first pin is arranged along this first axle first passive device with this; And this second pin is arranged along this second axis second passive device with this, and this first axle is arranged perpendicular to this second axis.
5. the chip-packaging structure with shielding cover body as claimed in claim 4; It is characterized in that; This substrate also comprises a pair of the 3rd passive device and a pair of the 4th passive device; Those pins also comprise one the 3rd pin and one the 4th pin; Should be to the 3rd passive device and two online relative corners of a diagonal angle that should lay respectively at this substrate to first passive device; Should to the 4th passive device with should lay respectively at two online relative corners of another diagonal angle of this substrate to second passive device, the 3rd pin connects the part of this substrate between this is to the 3rd passive device, and with this to the 3rd passive device along one be parallel to this first axle axis arrange; And the 4th pin connects the part of this substrate between this is to the 4th passive device, and with this to the 4th passive device along one be parallel to this second axis axis arrange.
6. the chip-packaging structure with shielding cover body as claimed in claim 5; It is characterized in that, this to first passive device, this to second passive device, this to the 3rd passive device, this sees through an electric conducting material and the electric connection of this substrate to the 4th passive device, this first pin, this second pin, the 3rd pin and the 4th pin.
7. the chip-packaging structure with shielding cover body as claimed in claim 1; It is characterized in that; This substrate also comprises a pair of the 3rd passive device and a pair of the 4th passive device; Those pins also comprise one the 3rd pin and one the 4th pin, and this is to the 3rd passive device and the relative both sides that should lay respectively at the center of gravity of this substrate to first passive device, and this is to the 4th passive device and the relative both sides that should lay respectively at the center of gravity of this substrate to second passive device; The 3rd pin connects the part of this substrate between this is to the 3rd passive device; And with this to the 3rd passive device along one be parallel to this first axle axis arrange, and the 4th pin connects the part of this substrate between this is to the 4th passive device, and with this to the 4th passive device along one be parallel to this second axis axis arrange.
8. the chip-packaging structure with shielding cover body as claimed in claim 1 is characterized in that, this shielding cover body comprises that a roof and vertically is connected in the sidewall of this roof periphery.
9. the chip-packaging structure with shielding cover body as claimed in claim 8; It is characterized in that; Respectively this pin comprises a bar portion and a base portion, and an end of this bar portion connects the edge of this roof, and an end of this base portion is connected with the other end of this bar portion; One surface of this base portion is connected to the part of this substrate, and the bearing of trend of this base portion is parallel to the bearing of trend of this roof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910133192 CN101866913B (en) | 2009-04-15 | 2009-04-15 | Chip encapsulation structure with shielding cover body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910133192 CN101866913B (en) | 2009-04-15 | 2009-04-15 | Chip encapsulation structure with shielding cover body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101866913A CN101866913A (en) | 2010-10-20 |
| CN101866913B true CN101866913B (en) | 2012-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910133192 Active CN101866913B (en) | 2009-04-15 | 2009-04-15 | Chip encapsulation structure with shielding cover body |
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| CN (1) | CN101866913B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108063130B (en) * | 2017-12-29 | 2020-05-15 | 江苏长电科技股份有限公司 | Electromagnetic shielding packaging structure with pin side wall tin climbing function and manufacturing process thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998027587A1 (en) * | 1996-12-19 | 1998-06-25 | Telefonaktiebolaget Lm Ericsson (Publ) | A packaging structure for integrated circuits |
| EP0605712B1 (en) * | 1992-07-17 | 1999-09-08 | Vlt Corporation | Packaging electrical components |
| CN101188230A (en) * | 2007-03-28 | 2008-05-28 | 日月光半导体制造股份有限公司 | Package structure and its making method |
| CN101188226B (en) * | 2006-11-30 | 2011-04-20 | 日月光半导体制造股份有限公司 | Chip package structure and fabricating process thereof |
-
2009
- 2009-04-15 CN CN 200910133192 patent/CN101866913B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0605712B1 (en) * | 1992-07-17 | 1999-09-08 | Vlt Corporation | Packaging electrical components |
| WO1998027587A1 (en) * | 1996-12-19 | 1998-06-25 | Telefonaktiebolaget Lm Ericsson (Publ) | A packaging structure for integrated circuits |
| CN101188226B (en) * | 2006-11-30 | 2011-04-20 | 日月光半导体制造股份有限公司 | Chip package structure and fabricating process thereof |
| CN101188230A (en) * | 2007-03-28 | 2008-05-28 | 日月光半导体制造股份有限公司 | Package structure and its making method |
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| Publication number | Publication date |
|---|---|
| CN101866913A (en) | 2010-10-20 |
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