CN101863062B - Processing method of high-strength E0 grade middle-high density plate - Google Patents
Processing method of high-strength E0 grade middle-high density plate Download PDFInfo
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- CN101863062B CN101863062B CN 201010162979 CN201010162979A CN101863062B CN 101863062 B CN101863062 B CN 101863062B CN 201010162979 CN201010162979 CN 201010162979 CN 201010162979 A CN201010162979 A CN 201010162979A CN 101863062 B CN101863062 B CN 101863062B
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Abstract
The invention relates to a processing method of a high-strength E0 grade middle-high density plate, comprising the following steps of: controlling the pressure and the time in the stewing and softening working procedure based on the traditional processing method; controlling the pressure of a grinding chamber in the hot rolling work procedure; mixing phenolic resin adhesive with paraffin and a liquid formaldehyde tapping agent in the sizing work procedure; and controlling the dried fiber water-containing rate, the hot-pressing temperature, hot-pressing factors, the density control and other conditions and innovating. The invention particularly provides a preparation method for improving the phenolic resin adhesive, thereby having the specific advantages that the phenolic resin adhesive is stable in the production process and is easy to control and the contents of free aldehyde and free phenol of adhesive liquid are low. The formaldehyde release quantity of a fiber board produced by using modified phenolic resin reaches the European E0 standard; various indexes reach national standard; and the invention has favorable weather resistance and can be used outdoors.
Description
Technical field
The present invention relates to artificial board processing method technical field, particularly a kind of processing method that synvaren is applied in high-strength E 0 grade outdoor version medium and high density fibre panel.
Background technology
Along with the change of social development and people life style, fiberboard is used in the fields such as furniture, interior decoration and packaging material in a large number.With respect to petrochemical industry and metal material, fiberboard has the plurality of advantages such as cost is low, and raw material are renewable.Mainly comprise the aided processes such as the master operations such as wood chip screening, washing, boiling, mill pressure, glue compounding and applying, drying, the moulding of mating formation, hot pressing and cutting edge, jack saw, cooling, stacking, health, sanding, sawing in the existing density board production method.The glue that wherein uses in the glue compounding and applying operation is the key that affects the density board quality.But the fiberboard that traditional urea-formaldehyde glue is produced is merely able to be used in the indoor environment usually.Phenolic resins can be applied to the manufacturing of indoor moisture proof plate even outdoor version sheet material because the resistance to water of itself is strong.At present, in wood processing field, phenolic resins successfully is used in the production of glued board and particieboard, but in the medium and high density fibre panel industry, phenolic resins seldom is used, and reason is: one, and the glue process is had relatively high expectations to equipment, danger coefficient is high, and reaction is violent, and is restive.Two, free phenol in the finished product phenolic resins, the control difficulty of free aldehyde is larger, and both are difficult to balance.Three, the phenolic resin curing temperature is high, and curing rate is slow, and when using phenolic resins to make medium and high density fibre panel, heat pressing process is relatively harsher, and adjustment difficulty is large.
Summary of the invention
Purpose of the present invention is exactly for the existing defective of prior art, for improving the stability in the phenolic resins manufacturing process, the content of free phenol and free aldehyde in the minimizing phenolic resins, optimize the process that phenolic resin glue is used for the processing high density plate, and the processing method of high-strength E 0 grade middle-high density plate that proposes.
In order to realize this purpose, the present invention at first provides following technical scheme from the density board integral processing method: the screening, cleaning, boiling that comprises wood chip is softening, defibrator process, glue compounding and applying, drying, mat formation moulding and hot pressing process.The boiling softening process carries out at twice, and the steam pressure in the boiling cylinder is 0.70-0.80Mpa in the digestion process for the second time, digestion time 3-5 minute; The pressure of mill chamber is lower than the pressure 0.01-0.02Mpa of boiling cylinder in the heat mill process; In the applying glue operation, adopt phenolic resin glue, consumption accounts for the amount of bone dry fiber quality 12-18% and mixes glue, solid paraffin applies according to the amount that accounts for bone dry fiber quality 0.5-1.5%, and the liquid formaldehyde agent for capturing adds according to the 6-14% ratio that accounts for solid phenol-formaldehyde resin modified quality; Dried fiber moisture 7-11%; Hot pressing temperature 200-230 ℃, carry out hot pressing under the hot pressing condition of hot pressing factor 9-18s/mm, density is controlled at 800-920g/cm
3
And just improve on this basis phenolic resin adhesive following preparation method is provided: the first step is 98～100% phenol and purity 36.5～37.5% formalins with purity, and water is squeezed into reactor successively.Wherein phenol accounts for the mass ratio 30～35% of total rubber, and formaldehyde accounts for the mass ratio 45～50% of total rubber, and water accounts for the mass ratio 3-7% of total rubber; Second step adding purity is 30～40% caustic lye of soda, accounts for the mass ratio 3-5% of total rubber.This moment, material was incited somebody to action voluntarily heat release intensification, until 70 ± 5 ℃ were reacted 1 hour; The 3rd step input purity 36.5～37.5% formalins and purity are 30～40% caustic lye of soda, the mass ratio that formalin accounts for total rubber is 5～8%, the mass ratio that sodium hydroxide solution accounts for total rubber is 3～5%, be warming up to 95 ± 2 ℃ and carry out polycondensation reaction, until viscosity reaches 18～22 seconds, be cooled to blowing below 40 ℃.
Advantage of the present invention: the synvaren smooth production process, be easy to control, free aldehyde and the free phenol content of glue are low.Use the fiberboard burst size of methanal of phenol-formaldehyde resin modified production to reach European E0 grade standard, indices all is up to state standards, and has good weatherability, can be in outdoor application.
Description of drawings
Accompanying drawing is a kind of complete suitability for industrialized production flow chart.
The specific embodiment
With reference to accompanying drawing, complete production process of the present invention comprises: former wooden shavings and outsourcing are chipped after the wood chip stacking screening, carry out successively chip washing, pre-boiling, defibrator process, glue and glue compounding and applying, drying, the moulding of mating formation, precompressed, slab edging, hot pressing, cutting edge, jack saw, turnover panel cooling, stacking, storage health, sanding, sawing, check and grade, put in storage.
The high-strength E 0 grade middle-high density fiberboard processing method processed of present embodiment is on aforementioned Process base, and following content is transformed innovation:
Embodiment 1: will long 40mm, and wide 15mm, the clean sheet of the log of thick 2mm is washed, and removes the impurity such as silt on wood chip surface.Wood chip after the washing is transported to pre-boiling cylinder by the wood chip pump and carries out preliminarily softened, and then delivers to boiling in the boiling cylinder by cork screw, and is further softening.Steam pressure in the boiling cylinder is 0.70Mpa, and the pressure of mill chamber is lower than the about 0.01Mpa of pressure of boiling cylinder, by the Grinding Quality of pressure reduction raising fiber, digestion time 3 minutes.The mill chamber that enters defibrator after chip steaming is abundant is separated fine, fiber applies phenol-formaldehyde resin modified according to the ratio that solid modified alkyd resin glue quality accounts for bone dry fiber quality 12%, solid paraffin applies according to the amount that accounts for bone dry fiber quality 0.5%, the amount that liquid formaldehyde agent for capturing quality accounts for solid phenol-formaldehyde resin modified quality 6% applies, fiber after the applying glue is carried out drying, make fiber moisture be controlled at 7%, the moulding of then mating formation is hot pressed into fiberboard.180 ℃ of hot pressing temperatures, hot pressing factor 9s/mm, fiberboard density is controlled at 820g/cm
3
Embodiment 2: will long 60mm, and wide 30mm, the clean sheet of the log of thick 6mm is washed, and removes the impurity such as silt on wood chip surface.Wood chip after the washing is transported to pre-boiling cylinder by the wood chip pump and carries out preliminarily softened, and then delivers to boiling in the boiling cylinder by cork screw, and is further softening.Steam pressure in the boiling cylinder is 0.80Mpa, and the pressure of mill chamber is lower than the about 0.02Mpa of pressure of boiling cylinder, by the Grinding Quality of pressure reduction raising fiber, digestion time 5 minutes.The mill chamber that enters defibrator after chip steaming is abundant is separated fine, fiber applies phenol-formaldehyde resin modified according to the ratio that solid modified alkyd resin glue quality accounts for bone dry fiber quality 18%, solid paraffin applies according to the amount that accounts for bone dry fiber quality 1.5%, the amount that liquid formaldehyde agent for capturing quality accounts for solid phenol-formaldehyde resin modified quality 14% applies, fiber after the applying glue is carried out drying, make fiber moisture be controlled at 11%, the moulding of then mating formation is hot pressed into fiberboard.220 ℃ of hot pressing temperatures, hot pressing factor 15s/mm, fiberboard density is controlled at 920g/cm
3
Embodiment 3: will long 50mm, and wide 20mm, the clean sheet of the log of thick 5mm is washed, and removes the impurity such as silt on wood chip surface.Wood chip after the washing is transported to pre-boiling cylinder by the wood chip pump and carries out preliminarily softened, and then delivers to boiling in the boiling cylinder by cork screw, and is further softening.Steam pressure in the boiling cylinder is 0.75Mpa, and the pressure of mill chamber is lower than the about 0.015Mpa of pressure of boiling cylinder, by the Grinding Quality of pressure reduction raising fiber, digestion time 5 minutes.The mill chamber that enters defibrator after chip steaming is abundant is separated fine, fiber applies phenol-formaldehyde resin modified according to the ratio that solid modified alkyd resin glue quality accounts for bone dry fiber quality 15%, solid paraffin applies according to the amount that accounts for bone dry fiber quality 1%, the amount that liquid formaldehyde agent for capturing quality accounts for solid phenol-formaldehyde resin modified quality 10% applies, fiber after the applying glue is carried out drying, make fiber moisture be controlled at 10%, the moulding of then mating formation is hot pressed into fiberboard.200 ℃ of hot pressing temperatures, hot pressing factor 10s/mm, fiberboard density is controlled at 860g/cm
3
Glue embodiment of the method 1: the first step is 98～100% phenol and purity 36.5～37.5% formalins with purity, and water is squeezed into reactor successively.Wherein phenol accounts for the mass ratio 30～35% of total rubber, and formaldehyde accounts for the mass ratio 45～50% of total rubber, and water accounts for the mass ratio 3-7% of total rubber; Second step adding purity is 30～40% caustic lye of soda, accounts for the mass ratio 3-5% of total rubber.This moment, material was incited somebody to action voluntarily heat release intensification, until 70 ± 5 ℃ were reacted 1 hour; The 3rd step input purity 36.5～37.5% formalins and purity are 30～40% caustic lye of soda, the mass ratio that formalin accounts for total rubber is 5～8%, the mass ratio that sodium hydroxide solution accounts for total rubber is 3～5%, be warming up to 95 ± 2 ℃ and carry out polycondensation reaction, until viscosity reaches 18～22 seconds (with being coated with-4 glasss of 25 ℃ of surveys), be cooled to blowing below 40 ℃.
Glue embodiment of the method 2: the first step is 98～100% phenol and purity 36.5～37.5% formalins with purity, and water is squeezed into reactor successively.Wherein phenol accounts for the mass ratio 30～35% of total rubber, and formaldehyde accounts for the mass ratio 45～50% of total rubber, and water accounts for the mass ratio 3-7% of total rubber; Second step adding purity is 30～40% caustic lye of soda, accounts for the mass ratio 3-5% of total rubber.This moment, material was incited somebody to action voluntarily heat release intensification, until 70 ± 5 ℃ were reacted 1 hour; The 3rd step input purity 36.5～37.5% formalins and purity are 30～40% caustic lye of soda, the mass ratio that formalin accounts for total rubber is 5～8%, the mass ratio that sodium hydroxide solution accounts for total rubber is 3～5%, be warming up to 95 ± 2 ℃ and carry out polycondensation reaction, until viscosity reaches 18～22 seconds (with being coated with-4 glasss of 25 ℃ of surveys), be cooled to blowing below 40 ℃.
Glue embodiment of the method 3: the first step is 98～100% phenol and purity 36.5～37.5% formalins with purity, and water is squeezed into reactor successively.Wherein phenol accounts for the mass ratio 30～35% of total rubber, and formaldehyde accounts for the mass ratio 45～50% of total rubber, and water accounts for the mass ratio 3-7% of total rubber; Second step adding purity is 30～40% caustic lye of soda, accounts for the mass ratio 3-5% of total rubber.This moment, material was incited somebody to action voluntarily heat release intensification, until 70 ± 5 ℃ were reacted 1 hour; The 3rd step input purity 36.5～37.5% formalins and purity are 30～40% caustic lye of soda, the mass ratio that formalin accounts for total rubber is 5～8%, the mass ratio that sodium hydroxide solution accounts for total rubber is 3～5%, be warming up to 95 ± 2 ℃ and carry out polycondensation reaction, until viscosity reaches 18～22 seconds (with being coated with-4 glasss of 25 ℃ of surveys), be cooled to blowing below 40 ℃.
Phenolic resin adhesive in above-described embodiment (also claiming phenolic resin glue) can adopt the said method self-control, also can directly purchase, and cooperates the performance parameter of the medium and high density fibre panel of above-mentioned technique preparation obviously to be better than purchasing glue but use from glue.
The relevant parameter value range that provides in above-described embodiment through practice summary out, any combination collocation all is effectively in its scope bag, enumerates no longer one by one here.
Claims (1)
1. processing method of high-strength E 0 grade middle-high density plate, the screening, cleaning, boiling that comprises wood chip is softening, defibrator process, glue compounding and applying, drying, mat formation moulding and hot pressing process, it is characterized in that: the boiling softening process carries out at twice, the steam pressure in the boiling cylinder is 0. 70-0. 80Mpa in the digestion process for the second time, digestion time 3-5 minute; The pressure of mill chamber is lower than the pressure 0.01-0.02Mpa of boiling cylinder in the heat mill process; The solid gum that uses in the applying glue operation adopts phenolic resin glue, consumption accounts for the amount of bone dry fiber quality 12-18% and mixes glue, solid paraffin applies according to the amount that accounts for bone dry fiber quality 0.5-1.5%, and the liquid formaldehyde agent for capturing adds according to the 6-14% ratio that accounts for the solid phenolic resin quality; Dried fiber moisture 7-11%; Hot pressing temperature 200-230 ℃, carry out hot pressing under the hot pressing condition of hot pressing factor 9-18 s/mm, density is controlled at 800-920g/cm
3Described phenolic resin glue is to make by following method: the first step is 98～100% phenol and purity 36.5～37.5% formalins with purity, water is squeezed into reactor successively, wherein phenol accounts for the mass ratio 30～35% of total rubber, formaldehyde accounts for the mass ratio 45～50% of total rubber, and water accounts for the mass ratio 3-7% of total rubber; Second step adding purity is 30～40% caustic lye of soda, accounts for the mass ratio 3-5% of total rubber; This moment, voluntarily heat release intensification was incited somebody to action by thing section, until 70 ± 5 ℃ were reacted 0.8-1.2 hour; The 3rd step input purity 36.5～37. 5% formalins and purity are 30～40% caustic lye of soda, the mass ratio that formalin accounts for total rubber is 5～8%, the mass ratio that sodium hydroxide solution accounts for total rubber is 3～5%, be warming up to 95 ± 2 ℃ and carry out polycondensation reaction, until viscosity reaches 18～22 seconds, be cooled to below 40 ℃ and get final product.
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| CN 201010162979 CN101863062B (en) | 2009-10-16 | 2010-03-29 | Processing method of high-strength E0 grade middle-high density plate |
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| CN200910019444 | 2009-10-16 | ||
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| CN 201010162979 CN101863062B (en) | 2009-10-16 | 2010-03-29 | Processing method of high-strength E0 grade middle-high density plate |
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Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102120808B (en) * | 2010-12-28 | 2012-08-15 | 南星家居科技(湖州)有限公司 | Phenolic resin for E1 grade waterproof laminated floor base material and preparation method thereof |
| CN102642236A (en) * | 2012-05-14 | 2012-08-22 | 桦甸市惠邦木业有限责任公司 | Facing fiber board and production process of facing fiber board |
| CN102689337B (en) * | 2012-06-01 | 2014-10-29 | 福建农林大学 | Industrial harmless utilization method of water hyacinth |
| CN102977296B (en) * | 2012-11-29 | 2014-09-10 | 开县汇森木材加工厂 | Method for processing high-hardness phenolic resin glue used for surface of building template |
| CN103878859B (en) * | 2014-03-05 | 2016-04-20 | 东营正和木业有限公司 | The preparation method of the slim medium density fibre board (MDF) of a kind of high protection against the tide |
| CN104227819B (en) * | 2014-08-15 | 2016-05-18 | 东营正和木业有限公司 | The preparation method of reed fiber particieboard |
| CN105001802B (en) * | 2014-08-19 | 2017-11-14 | 南京林业大学 | A kind of composite heating agent of wood-based plate hot pressing, mixed glue and the quick hot-press method of wood-based plate |
| CN104875267B (en) * | 2015-05-20 | 2017-05-10 | 福建省永安林业(集团)股份有限公司 | Preparation method of medium-density fiber board for door plate of closet door |
| CN105751346B (en) * | 2016-04-29 | 2019-11-19 | 安徽农业大学 | A kind of slim burning-resistant medium density fibreboard and preparation method thereof |
| CN110091407A (en) * | 2018-01-29 | 2019-08-06 | 东营正和木业有限公司 | A kind of outdoor use furniture type fiberboard production processes |
| CN109016059A (en) * | 2018-08-17 | 2018-12-18 | 阜阳大可新材料股份有限公司 | A kind of preparation method of ultra-thin ultra-low formaldehyde burst size fiberboard |
| CN110757605B (en) * | 2019-09-29 | 2021-04-30 | 中南林业科技大学 | Method for modifying artificial forest wood by phenol-aldehyde impregnation |
| CN112356208B (en) * | 2020-11-12 | 2023-03-10 | 大亚木业(江西)有限公司 | Waterproof agent for fiber board, preparation method thereof and application of waterproof agent in preparation of waterproof fiber board |
| CN112356207A (en) * | 2020-11-12 | 2021-02-12 | 大亚人造板集团有限公司 | Manufacturing process of outdoor fiberboard |
| CN115302925A (en) * | 2022-08-25 | 2022-11-08 | 菲林格尔家居科技(江苏)有限公司 | One-step forming paint-free molding plate production process |
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