CN101861051B - 软性电路板 - Google Patents

软性电路板 Download PDF

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Publication number
CN101861051B
CN101861051B CN200910301507XA CN200910301507A CN101861051B CN 101861051 B CN101861051 B CN 101861051B CN 200910301507X A CN200910301507X A CN 200910301507XA CN 200910301507 A CN200910301507 A CN 200910301507A CN 101861051 B CN101861051 B CN 101861051B
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circuit board
flexible circuit
transmission lines
ground plane
differential pair
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Expired - Fee Related
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CN200910301507XA
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CN101861051A (zh
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许寿国
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200910301507XA priority Critical patent/CN101861051B/zh
Priority to US12/430,134 priority patent/US8008580B2/en
Publication of CN101861051A publication Critical patent/CN101861051A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种软性电路板，包括至少一信号层，所述信号层的上方和下方分别设有一接地层，所述信号层与相邻的接地层之间分别设有一绝缘介质层，所述信号层上布设一差分对，所述差分对包括两条差分传输线，所述两绝缘介质层的相对介电常数不同，每一接地层上与所述差分对垂直相对的部分为一挖空区域，所述两接地层上挖空区域的两边缘分别与其相邻的差分传输线间具有一第一水平间距及一第二水平间距，且所述第一水平间距与所述第二水平间距不相等。所述软性电路板无需增加额外成本，只需调整现有布线方式即可实现。

Description

软性电路板
技术领域
本发明涉及一种软性电路板，特别涉及一种可传输高速差分信号的软性电路板。
背景技术
软性电路板是用柔性的绝缘基材制成的印刷电路板，具有许多硬性印刷电路板不具备的优点。例如软性电路板厚度较薄，可以自由弯曲、卷绕、折叠，可依照空间布局要求任意安排，并在三维空间任意移动和伸缩，从而达到元器件装配和导线连接的一体化。利用软性电路板可大大缩小电子产品的体积，适用电子产品向高密度、小型化、高可靠性方向发展的需要。因此，软性电路板在航天、军事、移动通讯、手提电脑、计算机外设、PDA、数码相机等领域或产品上得到了广泛的应用。
因为软性电路板厚度极薄，软性电路板上的传输线的阻抗偏低，因为传输高速信号要求较高的传输线阻抗，在软性电路板上，即使一般制程可达到的最细传输线宽度，例如4密尔(1密尔＝0.0254毫米)，也难以达到高速信号传输线阻抗的要求。
参考图1，现有技术提高传输线阻抗的方法，是将软性电路板50的接地层参考铜箔切割成网格状。但如果在信号层上传输差分对51时，会因为差分传输线52和差分传输线54对应的接地层铜箔网格排布不同，导致共模噪音的产生，这也是一般软性电路板无法传输高速差分信号的原因。
发明内容
鉴于上述内容，有必要提供一种可传输高速差分信号的软性电路板。
一种软性电路板，包括至少一信号层，所述信号层的上方和下方分别设有一接地层，所述信号层与相邻的接地层之间分别设有一绝缘介质层，所述信号层上布设一差分对，所述差分对包括两条差分传输线，两所述绝缘介质层的相对介电常数不同，每一接地层上与所述差分对垂直相对的部分为一挖空区域，一个所述接地层上挖空区域的两个边缘分别与相邻的差分传输线间都具有第一水平间距，另一所述接地层上挖空区域的两个边缘分别与相邻的差分传输线间都具有第二水平间距，且所述第一水平间距与所述第二水平间距不相等。
所述软性电路板是在所述接地层上，将与所述差分对垂直对应的两相邻接地层部分挖空，避免差分对与相邻接地层的间距太近所导致的传输线阻抗偏低问题的产生。本发明软性电路板可传输高速信号，并消除现有技术中网格化接地层所衍生的共模噪音问题。本发明软性电路板无需增加额外成本，只需调整现有布线方式即可实现。
附图说明
下面参照附图结合具体实施方式对本发明作进一步的描述。
图1为现有技术软性电路板的结构示意图。
图2为本发明软性电路板较佳实施方式的结构示意图。
具体实施方式
请参照图2，本发明软性电路板的较佳实施方式包括一信号层10及分别位于所述信号层10上、下的两接地层30，在信号层10及每一接地层30之间设有一绝缘介质层20。其中，所述两绝缘介质层20的相对介电系数不同，即由两种不同性质的绝缘介质构成，所述两绝缘介质层20的厚度可以相同也可以不同。
一差分对11包括两条差分传输线12及14，并布线于所述信号层10上。每一接地层30上，与所述差分传输线12及14所垂直相对的部分作挖空处理，以避免差分对11与相邻接地层30之间的垂直距离太近所导致的传输线阻抗偏低问题的产生，上层接地层30未挖空的部分与其相邻差分传输线12或14具有一第一水平间距d1，下层接地层30未挖空的部分与其相邻差分传输线12或14具有一第二水平间距d2，所述第一水平间距d1与所述第二水平间距d2不相等，图2中每一接地层30上覆盖的材料为铜箔，其中央的矩形挖空区域32即是将接地层30上的铜箔挖空所形成的。在所述信号层10上，所述差分对11的两侧平行设置有与差分对11长度相等的接地导电材料，本较佳实施方式中所述接地导电材料为铜箔16，每一接地铜箔16与其对应相邻的传输线12及14具有一第三水平间距d。所述第一、第二及第三水平间距d1、d2及d根据差分对11传输的信号不同而不同，所述第一、第二及第三水平间距d1、d2及d可根据差分对11传输不同信号时的阻抗要求，考虑软性电路板上每条差分传输线12及14的线宽、所述两条差分传输线12及14的间距、所述信号层10上接地铜箔16的宽度、所述两绝缘介质层20的厚度、所述两绝缘介质层20的相对介电常数等参数经由仿真软件仿真后确定。其他实施方式中，也可不在所述信号层10上布设接地铜箔，仅通过调整所述第一及第二水平间距d1及d2来调整所述差分传输线12及14的阻抗，以实现高速差分信号的传输。
所述软性电路板是在布有差分对11的信号层10的上下两相邻的接地层30上，将与差分对11的两传输线12、14垂直对应的部分挖空，避免差分对11与相邻接地层30的间距太近所导致的传输线阻抗偏低问题的产生，并选择性地在差分对11的两侧平行设置接地铜箔16，通过仿真软体仿真后设定每一接地层30未挖空的部分与其相邻差分传输线12或14的第一及第二水平间距d1及d2，以及所述接地铜箔16与传输线12、14的第三水平间距d。本发明软性电路板可传输高速信号，并消除现有技术中网格化接地层所衍生的共模噪音问题。本发明软性电路板无需增加额外成本，只需调整现有布线方式即可实现。

Claims (5)

1.一种软性电路板，包括至少一信号层，所述信号层的上方和下方分别设有一接地层，所述信号层与相邻的接地层之间分别设有一绝缘介质层，所述信号层上布设一差分对，所述差分对包括两条差分传输线，其特征在于：两所述绝缘介质层的相对介电常数不同，每一接地层上与所述差分对垂直相对的部分为一挖空区域，一个所述接地层上挖空区域的两个边缘分别与相邻的差分传输线间都具有第一水平间距，另一所述接地层上挖空区域的两个边缘分别与相邻的差分传输线间都具有第二水平间距，且所述第一水平间距与所述第二水平间距不相等。
2.如权利要求1所述的软性电路板，其特征在于：所述信号层上，在所述差分对两侧分别平行设置有一条接地导电材料，每一条接地导电材料与其相邻的差分传输线间具有一第三水平间距。
3.如权利要求2所述的软性电路板，其特征在于：所述接地导电材料为铜箔。
4.如权利要求2所述的软性电路板，其特征在于：所述接地导电材料的长度与所述两条差分传输线的长度相等。
5.如权利要求1所述的软性电路板，其特征在于：所述接地层上的材料为铜箔。
CN200910301507XA 2009-04-13 2009-04-13 软性电路板 Expired - Fee Related CN101861051B (zh)

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US12/430,134 US8008580B2 (en) 2009-04-13 2009-04-27 Flexible printed circuit board

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TWI687136B (zh) * 2016-05-09 2020-03-01 易鼎股份有限公司 可選擇對應接地層的電路板結構
KR102616482B1 (ko) 2018-07-26 2023-12-26 삼성전자주식회사 전원 배선에서 발생된 전자기파를 상쇄하기 위한 접지 배선을 포함하는 인쇄 회로 기판 및 이를 포함하는 전자 장치
WO2021119898A1 (zh) * 2019-12-16 2021-06-24 瑞声声学科技(深圳)有限公司 传输线
WO2021119897A1 (zh) * 2019-12-16 2021-06-24 瑞声声学科技(深圳)有限公司 传输线
KR102457122B1 (ko) * 2020-12-03 2022-10-20 주식회사 기가레인 다중 신호 전송용 연성회로기판
CN113163575B (zh) * 2021-05-10 2023-09-26 西安频谱电子信息科技有限责任公司 一种多层板微波功率电路

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