CN101858503B - 固态光源组装装置及其组装方法 - Google Patents
固态光源组装装置及其组装方法 Download PDFInfo
- Publication number
- CN101858503B CN101858503B CN200910301465XA CN200910301465A CN101858503B CN 101858503 B CN101858503 B CN 101858503B CN 200910301465X A CN200910301465X A CN 200910301465XA CN 200910301465 A CN200910301465 A CN 200910301465A CN 101858503 B CN101858503 B CN 101858503B
- Authority
- CN
- China
- Prior art keywords
- state light
- solid state
- light emitter
- plane
- plane domain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000007787 solid Substances 0.000 claims description 76
- 230000033001 locomotion Effects 0.000 claims description 12
- 230000004927 fusion Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract 1
- 230000005284 excitation Effects 0.000 description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 238000005286 illumination Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910017980 Ag—Sn Inorganic materials 0.000 description 1
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 244000188472 Ilex paraguariensis Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910301465XA CN101858503B (zh) | 2009-04-10 | 2009-04-10 | 固态光源组装装置及其组装方法 |
US12/616,866 US20100258232A1 (en) | 2009-04-10 | 2009-11-12 | Apparatus and method for securing solid-state light source |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910301465XA CN101858503B (zh) | 2009-04-10 | 2009-04-10 | 固态光源组装装置及其组装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101858503A CN101858503A (zh) | 2010-10-13 |
CN101858503B true CN101858503B (zh) | 2012-06-27 |
Family
ID=42933389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910301465XA Expired - Fee Related CN101858503B (zh) | 2009-04-10 | 2009-04-10 | 固态光源组装装置及其组装方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100258232A1 (zh) |
CN (1) | CN101858503B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103985646B (zh) * | 2014-05-15 | 2017-05-03 | 中国电子科技集团公司第十三研究所 | 替代氢气炉进行芯片烧结的方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1402392A (zh) * | 2001-08-23 | 2003-03-12 | 索尼公司 | 发光元件的安装方法 |
CN101232061A (zh) * | 2007-01-22 | 2008-07-30 | 沈育浓 | 发光源封装 |
CN101373057A (zh) * | 2007-08-24 | 2009-02-25 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管光源及室外照明装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3412224B2 (ja) * | 1994-01-07 | 2003-06-03 | 住友電気工業株式会社 | レンズ実装方法と装置 |
US6858104B2 (en) * | 2002-01-28 | 2005-02-22 | Scimed Life Systems, Inc. | Apparatus and method for closed-loop control of laser welder for welding polymeric catheter components |
WO2006094305A1 (en) * | 2005-03-03 | 2006-09-08 | E.I. Dupont De Nemours And Company | Laser welding apparatus and laser welding method |
-
2009
- 2009-04-10 CN CN200910301465XA patent/CN101858503B/zh not_active Expired - Fee Related
- 2009-11-12 US US12/616,866 patent/US20100258232A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1402392A (zh) * | 2001-08-23 | 2003-03-12 | 索尼公司 | 发光元件的安装方法 |
CN101232061A (zh) * | 2007-01-22 | 2008-07-30 | 沈育浓 | 发光源封装 |
CN101373057A (zh) * | 2007-08-24 | 2009-02-25 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管光源及室外照明装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101858503A (zh) | 2010-10-13 |
US20100258232A1 (en) | 2010-10-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee after: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai City, Songjiang District Songjiang Industrial Zone West science and Technology Industrial Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Semiconductor Precision (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120627 Termination date: 20130410 |