CN101853057B - Main board - Google Patents
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- CN101853057B CN101853057B CN 200910132555 CN200910132555A CN101853057B CN 101853057 B CN101853057 B CN 101853057B CN 200910132555 CN200910132555 CN 200910132555 CN 200910132555 A CN200910132555 A CN 200910132555A CN 101853057 B CN101853057 B CN 101853057B
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Abstract
The invention relates to a main board. According to a specific embodiment of the invention, the main board comprises a board body. The board plate has a heating element bearing area, and a surface, adjacent to the heating element bearing area, of the board body is provided with a plurality of groups of fixed holes which are used for fixing a plurality of types of radiation devices. The amount of the group number of the fixed holes can be effectively maximized in limited space of the main board through the design, so compatibility of the radiation device can be improved actually.
Description
Technical field
The present invention relates to a kind of mainboard, particularly a kind of and heat abstractor has the computer main board of highly compatible.
Background technology
On the various information product, all kinds of high-effect processors (CPU) are played the part of more and more heavier role, but follow usefulness and what come is exactly the used heat that CPU produces.Therefore, heat abstractor on the market, for example the manufacturer of radiator fan is also for this problem and then research and develop the high-effect heating radiator of corresponding CPU.
In general, a known mainboard can be supported the CPU of different pin position, and the radiator fan that is applicable to these CPU can share a kind of specific fan fixed hole position.Yet along with semiconductor technology and design architecture are constantly weeded out the old and bring forth the new, also can have some change in the pin position of novel C PU, and then cause on the mainboard mounting hole site for the radiator fan of novel C PU to cooperate changing.But the fan mounting hole site of cooperation novel C PU and the fan that cooperates old type CPU also can't be compatible, allow the user of mainboard also need upgrade in the lump fan when changing novel C PU, cause extra burden.
In order to solve the above problems, prior art discloses a kind of fan retaining bracket.In general, the fixed orifice that offers the fan of corresponding a kind of model all around of known fan retaining bracket.Therefore, on mainboard normalized fan, the fan of another kind of model that the user is many is available.Yet when having the special type fan to release, old-fashioned fan retaining bracket just can not support that the user still need additionally purchase new-type fan retaining bracket inevitably with this special type fan of arranging in pairs or groups, and the user is brought inconvenience really.Even set up many group fixed orifices in the dislocation mode on the fan retaining bracket, under space limited on the present mainboard, the group quantity of above-mentioned many group fixed orifices still will be restricted.
Summary of the invention
Because above-mentioned problem, a purpose of the present invention is to provide a kind of mainboard.
According to a specific embodiment of the present invention, mainboard comprises a plate body.Have a heater element on the plate body and bear the district, and be provided with many pack heat dissipation devices fixed orifice in the surface that contiguous heater element bears the district on the plate body.This heater element bears and defines a pair of staggered datum axis in the district, and at least two pack heat dissipation device fixed orifices in wherein above-mentioned many pack heat dissipation devices fixed orifice are formed at respectively this on the datum axis progressively to extend out mode.
In another embodiment, this heater element bears and further defines a pair of staggered clinoid in the district, and this is that this rotates an angle to datum axis and gets relatively to clinoid.Except being positioned at this to the heat abstractor fixed hole position on the datum axis, at least one pack heat dissipation device fixed hole position in above-mentioned many pack heat dissipation devices fixed orifice in this to clinoid on.
By this design, under space limited on this mainboard, can be effectively with the quantity maximization of fixed orifice group number, with the compatibility of certain raising heat abstractor.
Can be further understood by the following detailed description and accompanying drawings about the advantages and spirit of the present invention.
Description of drawings
Figure 1A to Fig. 1 C is depicted as the synoptic diagram of the relative distance of the fan hole position that the CPU of three kinds of specifications cooperates.
Fig. 2 A and Fig. 2 B are depicted as the vertical view according to the mainboard of the first specific embodiment of the present invention.
Figure 3 shows that the vertical view according to the mainboard of the second specific embodiment of the present invention.
Figure 4 shows that the vertical view according to the mainboard of the 3rd specific embodiment of the present invention.
Embodiment
Fundamental purpose of the present invention is to provide a kind of mainboard, considers simultaneously the configuration of the fixed hole position of the heat abstractor that the CPU of all size arranges in pairs or groups in design.Especially, because the present invention utilizes the notional change of design (for example Layout mode) of printed circuit board (PCB), reach the purpose that the device of the plurality of specifications that cooperates different pin bit CPUs can share, therefore do not need to assist with any extra element, example is fan retaining bracket as is known.
For proving absolutely conception of the present invention, narrate in detail for several embodiment with the following radiator fan of being contained with heat abstractor.At first, see also Figure 1A to Fig. 1 C.Figure 1A to Fig. 1 C is depicted as the synoptic diagram of the relative distance of the fan hole position that the CPU of three kinds of specifications cooperates, and wherein P1~P3 represents the CPU runners.The present invention illustrates the effect that disclosed mainboard has take the CPU of three kinds of different sizes as example.
Shown in Figure 1A, the fan that the CPU of the first specification cooperates, the relative distance of the adjacent fan hole position on mainboard is that 2835mil (annotates: the 1000mil=1 inch).As shown in Figure 1B, the fan that the CPU of the second specification cooperates, the relative distance of the adjacent fan hole position on mainboard is 2952mil.Shown in Fig. 1 C, the fan that the CPU of the 3rd specification cooperates, the relative distance of the adjacent fan hole position on mainboard is 3150mil.
In addition, for avoiding being stopped by the electronic component on the mainboard in the process of fan on being attached to mainboard, large-scale capacitor for example, general on mainboard the fan for a certain specification all can define a height-limit area.For instance, the height-limit area R1 that the zone that bold line among Figure 1A is surrounded defines for the fan that cooperates for the first specification, and the zone that the bold line among Fig. 1 C is surrounded is the height-limit area R2 that fan that the CPU for the 3rd specification cooperates defines.
See also Fig. 2 A.Fig. 2 A is depicted as the vertical view according to the mainboard 1 of the first specific embodiment of the present invention.Shown in Fig. 2 A, have a heater element on the plate body 10 of mainboard 1 and bear district 12.In this embodiment, heater element can be a CPU, and heater element bears the CPU runners that district 12 is cooperation, and wherein label 120 represents pin.With Fig. 2, heater element bears the CPU that district 12 can bear the first specification and the 3rd specification.
Shown in Fig. 2 A, be provided with to fix one first group of fixed orifice 14 of one first radiator fan in the surface that contiguous heater element bears district 12 on the plate body 10 and in order to fix one second group of fixed orifice 16 of one second radiator fan.Be noted that the arrange in pairs or groups CPU of the first specification of the first radiator fan, the CPU of the 3rd specification and the second radiator fan is arranged in pairs or groups.
For the first radiator fan is fixed on the plate body 10, need be provided with to fix first group of fixed orifice 14 of the first radiator fan on the plate body 10.Relative distance between the adjacent fixed orifice in first group of fixed orifice 14 can be default traditionally 2835mil.Similarly, for the second radiator fan is fixed on the plate body 10, need be provided with to fix second group of fixed orifice 16 of the second radiator fan on the plate body 10.Relative distance between the adjacent fixed orifice in second group of fixed orifice 16 can be default traditionally 3150mil.
Upper to distribute, first group of fixed orifice 14 is positioned at by heater element and bears on a pair of staggered datum axis L at center in district 12, and but this is upper be positioned at outside first group of fixed orifice 14 to datum axis L and second group of fixed orifice 16 also is positioned at.Thus, no matter heater element bears the CPU that district 12 bears the first specification or the 3rd specification, all corresponding radiator fan can be fixed on the mainboard 1 of the present invention.
In addition, see also Fig. 2 B.Stopped by the electronic component on the mainboard in the process on being attached to mainboard for fear of the first radiator fan or the second radiator fan, first group of fixed orifice 14 and second group of fixed orifice 16 can be positioned at one of the first radiator fan and the second radiator fan and share height-limit area Rc, the zone that surrounds such as dotted line.Be noted that this shared height-limit area Rc is the connection Ji Qu of the height-limit area R2 that originally had of the height-limit area R1 that originally had of the first radiator fan and the second radiator fan.Take Fig. 2 B as example, the scope of this shared height-limit area Rc is equal to the zone that the bold line among Fig. 1 C is surrounded, it is the height-limit area R2 that the fan that cooperates for the CPU of the 3rd specification defines, and comprises the height-limit area R1 that fan that the CPU for the first specification cooperates defines.
In practical application, first group of fixed orifice 14 internal face can have screw thread, and the first radiator fan is provided with a plurality of through holes, uses for a plurality of locking parts, and for example screw passes and is fixed in first group of fixed orifice 14 so that the first radiator fan is fixed on the plate body 10.Perhaps, the first radiator fan can have a plurality of fasteners, is clipped on the plate body 10 in order to pass first group of fixed orifice 14, thereby facility in the assembling further is provided.Second group of fixed orifice 16 and the second radiator fan can be contrasted the above design, do not repeat them here.
Should be noted that the fan fixed orifice described in the first specific embodiment is not limited with two groups.Further, this be to can arranging more groups of fixed orifices on the datum axis L, with compatible and for its installing with the fan of polytypic more.
See also Fig. 3.Figure 3 shows that the vertical view according to the mainboard 2 of the second specific embodiment of the present invention.Heater element among Fig. 3 bears the CPU that district 22 can bear the first specification and the second specification.As shown in Figure 3, be provided with to fix one first group of fixed orifice 24 of one first radiator fan in the surface that contiguous heater element bears district 22 on the plate body 20 and in order to fix one second group of fixed orifice 26 of one second radiator fan.Be noted that the arrange in pairs or groups CPU of the first specification of the first radiator fan, the CPU of the second specification and the second radiator fan is arranged in pairs or groups.
Relative distance between the adjacent fixed orifice in first group of fixed orifice 24 can be default traditionally 2835mil, and the relative distance between the adjacent fixed orifice in second group of fixed orifice 26 can be default traditionally 2952mil.
Traditionally, owing to overlap for the fan hole position for the second specification among the fan hole position of the first specification and Fig. 1 C among Figure 1A, (for example Eight characters looping pit position) causes and can't really fan be fixed on the mainboard for fear of position, common fan hole, second group of fixed orifice 26 among Fig. 3 is positioned at by heater element and bears on a pair of staggered datum axis L at 22 center, district, and first group of fixed orifice 24 is positioned at relatively this datum axis L is rotated on a pair of staggered clinoid L ' behind the angle θ.Thus, the first radiator fan can cooperate first group of fixed orifice 24 and second group of fixed orifice 26 to be fixed on the mainboard with the second radiator fan separately.Further, on the design consideration of plate body 20, first group of fixed orifice 24 and second group of fixed orifice 26 can be positioned at one and share height-limit area.
Should be noted that in the second specific embodiment, this upward reaches this to datum axis L and is limited with one group to the fan fixed orifice on the clinoid L ' is neither.Further, heater element bears the upper definable in district and goes out manyly to staggered clinoids, and this get datum axis L different rotation angle relatively separately, with compatible and supply its installing with the fan of polytypic more.
See also Fig. 4.Figure 4 shows that the vertical view according to the mainboard 3 of the 3rd specific embodiment of the present invention.Heater element among Fig. 3 bears district 32 can bear the first specification, the second specification and three kinds of CPU of the 3rd specification.As shown in Figure 4, be provided with to fix in the surface that contiguous heater element bears district 32 on the plate body 30 one first radiator fan one first group of fixed orifice 34, in order to one second group of fixed orifice 36 of fixing one second radiator fan with in order to fix one the 3rd group of fixed orifice 38 of one the 3rd radiator fan.Be noted that the arrange in pairs or groups CPU of the first specification of the first radiator fan, the arrange in pairs or groups CPU of the second specification of the second radiator fan, the CPU of the 3rd specification and the 3rd radiator fan is arranged in pairs or groups.
Relative distance between the adjacent fixed orifice in first group of fixed orifice 34 can be default traditionally 2835mil, relative distance between the adjacent fixed orifice in second group of fixed orifice 36 can be default traditionally 2952mil, and the relative distance between the adjacent fixed orifice in the 3rd group of fixed orifice 38 can be default traditionally 3150mil.
Upper to distribute, first group of fixed orifice 34 is positioned at by heater element and bears on a pair of staggered datum axis L at center in district 32, the 3rd group of fixed orifice 38 is positioned at also that but this is upper be positioned at outside first group of fixed orifice 34 to datum axis L, and second group of fixed orifice 36 is positioned at relatively this datum axis L is rotated on a pair of staggered clinoid L ' behind the angle θ.Further, first group of fixed orifice 34, second group of fixed orifice 36 and the 3rd group of fixed orifice 38 can be positioned at a shared height-limit area.
Thus, no matter heater element bears the CPU that district 32 bears the first specification, the second specification or the 3rd specification, all corresponding radiator fan can be fixed on the mainboard 3 of the present invention.
Should be noted, more than mainboard in three specific embodiments explain mainly for the CPU of three kinds of specifications commonly used, but about the group number of fan fixed orifice and distribute then can be according to the actual requirements, for example the specification of various CPU and designing is not limited with above-described embodiment.In brief, purpose of the present invention is for many group fan fixed orifices are set in the plane space limited on mainboard, to supply its installing with the fan compatibility of Multiple Type.
Yet, the object of the present invention is to provide a kind of mainboard, so heat abstractor can be the radiator fan that collocation CPU uses, but not as limit.
By the above detailed description of preferred embodiments, hope can be known description feature of the present invention and spirit more, and is not to come protection scope of the present invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain being arranged in the appended claim limited range of the present invention of various changes and tool identity property.
Claims (3)
1. a mainboard is characterized in that, comprises:
Plate body, have heater element on it and bear the district, and be provided with many pack heat dissipation devices fixed orifice in the surface that contiguous above-mentioned heater element bears the district on the above-mentioned plate body, and above-mentioned heater element bears and defines staggered a pair of datum axis in the district, at least two pack heat dissipation device fixed hole positions in wherein above-mentioned many pack heat dissipation devices fixed orifice in above-mentioned this to datum axis on
Above-mentioned heater element bears and further defines staggered a pair of clinoid in the district, above-mentioned this be that relatively above-mentioned this rotates an angle to datum axis and get to clinoid, and at least one pack heat dissipation device fixed hole position in above-mentioned many pack heat dissipation devices fixed orifice in above-mentioned this to clinoid on.
2. mainboard according to claim 1 is characterized in that, above-mentioned at least two pack heat dissipation device fixed orifices with progressively extend out mode be formed at respectively above-mentioned this on the datum axis.
3. mainboard according to claim 1 is characterized in that, at least two pack heat dissipation device fixed hole positions are in the height-limit area that shares.
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CN 200910132555 CN101853057B (en) | 2009-04-02 | 2009-04-02 | Main board |
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CN 200910132555 CN101853057B (en) | 2009-04-02 | 2009-04-02 | Main board |
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CN101853057B true CN101853057B (en) | 2013-02-13 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1905173A (en) * | 2005-07-27 | 2007-01-31 | 富准精密工业(深圳)有限公司 | Radiator fastener |
CN1917192A (en) * | 2005-08-15 | 2007-02-21 | 嘉赫科技有限公司 | Switchable seat for radiator |
CN101005053A (en) * | 2006-01-16 | 2007-07-25 | 华硕电脑股份有限公司 | Heat radiation module |
CN201142327Y (en) * | 2007-11-29 | 2008-10-29 | 讯凯国际股份有限公司 | Rear panel structure |
-
2009
- 2009-04-02 CN CN 200910132555 patent/CN101853057B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1905173A (en) * | 2005-07-27 | 2007-01-31 | 富准精密工业(深圳)有限公司 | Radiator fastener |
CN1917192A (en) * | 2005-08-15 | 2007-02-21 | 嘉赫科技有限公司 | Switchable seat for radiator |
CN101005053A (en) * | 2006-01-16 | 2007-07-25 | 华硕电脑股份有限公司 | Heat radiation module |
CN201142327Y (en) * | 2007-11-29 | 2008-10-29 | 讯凯国际股份有限公司 | Rear panel structure |
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