CN101852668B - Preparation method of packaging structure of micro mechanical air pressure sensor chip - Google Patents
Preparation method of packaging structure of micro mechanical air pressure sensor chip Download PDFInfo
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- CN101852668B CN101852668B CN2010102042299A CN201010204229A CN101852668B CN 101852668 B CN101852668 B CN 101852668B CN 2010102042299 A CN2010102042299 A CN 2010102042299A CN 201010204229 A CN201010204229 A CN 201010204229A CN 101852668 B CN101852668 B CN 101852668B
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Abstract
The invention relates to a packaging structure of a micro mechanical air pressure sensor chip and a preparation method thereof. The packaging structure comprises a base, wherein the base contains metal pins and is provided with an open cavity for placing an air pressure sensor chip; and the open cavity is provided with a polytetrafluoroethylene microporous filtering film. The preparation method comprises the following steps: a mould of the base is prepared by arranging the metal pins and the open cavity for placing an air pressure sensor chip and air holes on the base; patch red plastics are coated in drops in the open cavity; the sensor chip is installed in the open cavity by the patch red plastics; bonding lead wires is prepared by using lead wire bonding technology so as to realize the electric connection between the input end and output end of the sensor chip and the metal pins; the metal pins are positioned in the base and extend outside the base; polytetrafluoroethylene microporous filtering film is fixed on the base step by using cohesive glue; and a packaging head cover is installed on the step at the top end of the base.
Description
Technical field
The present invention relates to encapsulating structure of a kind of micro mechanical air pressure sensor chip and preparation method thereof, relate in particular to encapsulating structure of a kind of and the MEMS condenser type air pressure sensor chip that the CMOS standard technology is compatible and preparation method thereof.
Background technology
Baroceptor is being brought into play more and more important effect at aspects such as weather forecast, climatic analysis, environment measuring, Aero-Space.Especially in recent years the frequent weather disaster that takes place makes baroceptor highlight importance aspect weather forecast and the climatic analysis.The baroceptor application demand is huge, because the MEMS development of technology, the baroceptor technological based on MEMS can improve the baroceptor performance, reduce cost, and therefore becomes one type of device of the main research and development of domestic and international research institution, colleges and universities.And the reliability of pressure transducer depends on the encapsulation of pressure transducer.
The encapsulation of MEMS device needs the variation of perception external environment on the one hand; Play the function that the protection and the realization electricity of chip are drawn on the other hand again; All it can not simply be sealed in the MEMS chip in the packaging body; Must leave the path that directly links to each other with extraneous, be used for transmitting physical messages such as light, heat, power.Therefore, there is very big difference in different MEMS devices to the requirement that encapsulates.In addition, sheathing material itself also has requirement.The existing opening of baroceptor requirement on devices shell can the perception ambient pressure, shields undesired signal again, so common plastic package, ceramic package are inapplicable, adopts Metal Packaging here.Present most baroceptor adopts silicon gel protection sensor stress film, and ambient pressure is delivered on the stress film through the silicon gel, though gel is very soft, what bring pressure error to test for it.
Summary of the invention
Technical matters: the object of the present invention is to provide encapsulating structure of little, the highly sensitive micro mechanical air pressure sensor chip of a kind of error and preparation method thereof; Relate in particular to encapsulating structure of a kind of and the MEMS condenser type air pressure sensor chip that standard CMOS process is compatible and preparation method thereof; Its technology is simple; Volume is little, and reliability is high.
Technical scheme:
A kind of encapsulating structure of micro mechanical air pressure sensor chip comprises: base, in base, comprise metal pins, and on base, be provided with the open type cavity that is used to place air pressure sensor chip, on the open type cavity, be provided with and gather the tetrafluoro miillpore filter.
The encapsulating structure of a kind of micro mechanical air pressure sensor chip of the present invention and preparation method thereof, concrete performing step:
The mold preparation of step 1) base is provided with metal pins and the open type cavity that is used to place air pressure sensor chip on base, on base, also be provided with bleeder vent;
Step 2) in the open type cavity, drips and be coated with patch red glue;
The step 3) sensor chip utilizes patch red glue to be installed in the open type cavity;
Step 4) uses Wire Bonding Technology to prepare being electrically connected between input/output terminal that bonding wire realizes sensor chip and the metal pins, and metal pins is arranged in base and extends to base exterior;
Step 5) is gathered the tetrafluoro miillpore filter and is utilized adhesive glue to be fixed on the base step;
The step 6) package cap is installed on the step of base top.
Traditional pressure transducer all adopts the silicon gel that device is encapsulated, and among this structure, the silicon gel is used to protect the sense film and the bonding wire of chip on the one hand, is used for atmospheric transmission on the other hand.But, because the elastically-deformable influence of himself can not zero-decremently pass to film with the external atmosphere pressure signal.Therefore the performances such as sensitivity and accuracy of device have been influenced.The invention has the advantages that use gathers tetrafluoro miillpore filter (PTFE) and replaces the silicon gel that the sense film and the bonding wire of chip are protected; These characteristics of gathering tetrafluoro miillpore filter (PTFE) are in zero-decrement transmission atmospheric pressure signal, to stop steam; Guaranteed that sensor has high sensitivity and accuracy on the one hand; Simultaneously chip is realized protection, improved the reliability of device.
Description of drawings
Fig. 1 is a CMOS baroceptor encapsulation base plate synoptic diagram.
Fig. 2 is coated with and attaches patch red glue synoptic diagram in the CMOS baroceptor encapsulation center of bowing.
Fig. 3 is a setting pressure sensor synoptic diagram on patch red glue.
Fig. 4 is the bonding synoptic diagram that goes between between pressure transducer output pin and the base pin.
Fig. 5 installs the filter membrane synoptic diagram on the encapsulation base plate boss.
Fig. 6 is the package cap scheme of installation.
Embodiment
A kind of encapsulating structure of micro mechanical air pressure sensor chip; Comprise: base 1; In base 1, comprise metal pins 2, on base 1, be provided with the open type cavity 3 that is used to place air pressure sensor chip, on open type cavity 3, be provided with and gather tetrafluoro miillpore filter 4; On base 1, be provided with package cap 5 and saidly gather 4 packed top cover 5 cappings of tetrafluoro miillpore filter thereunder; Be provided with gap 6 gathering between tetrafluoro miillpore filter 4 and the package cap 5, an end that on base 1, also is provided with bleeder vent 7 and bleeder vent 7 is communicated with above-mentioned gap 6, the other end of bleeder vent 7 and extraneous atmosphere to be measured.
Above-mentioned gather that tetrafluoro miillpore filter (PTFE) can adopt that Beijing engineering company limited of Hua Henggao section produces gather tetrafluoro miillpore filter (PTFE); This filter membrane can effectively be realized atmospheric transmission; Meanwhile can stop the steam intrusion again; Filter membrane utilizes adhesive glue to be fixed on the step in the Can, and the superiors prevent effectively that with the protection of Metal Packaging top cover support sensor chip, filter membrane from damaging because of receiving the external force extrusion and collision.Being used for sensor chip at metab step outside preparation bleeder vent communicates with ambient atmosphere.
Further specify embodiments of the invention below in conjunction with description of drawings:
Embodiment 1
The encapsulating structure of a kind of micro mechanical air pressure sensor chip provided by the present invention is shown in Fig. 1～6:
The mold preparation of step 1) base 1 is provided with metal pins 2 and the open type cavity 3 that is used to place air pressure sensor chip on base 1, on base 1, also be provided with bleeder vent 7, sees Fig. 1;
Step 2) in open type cavity 3, drips and be coated with patch red glue 8, see Fig. 2;
Step 3) sensor chip 9 utilizes patch red glue to be installed in open type cavity 3, sees Fig. 3;
Step 4) uses Wire Bonding Technology to prepare being electrically connected between input/output terminal that bonding wire 10 realizes sensor chips 9 and the metal pins 2, and metal pins 2 is arranged in base 1 and extends to base 1 outside, sees Fig. 4;
Step 5) is gathered tetrafluoro miillpore filter 4 and is utilized adhesive glue to be fixed on base 1 step 11, sees Fig. 5;
Step 6) package cap 5 is installed on the base 1 top step 12, accomplishes the encapsulation of sensor chip, sees Fig. 6.
The architectural feature that the encapsulating structure of this micro mechanical air pressure sensor chip has is following:
In the encapsulating structure of described micro mechanical air pressure sensor chip; Be that use gathers tetrafluoro miillpore filter (PTFE) and replaces the silicon gel that the sense film and the bonding wire of chip are protected; These characteristics of gathering tetrafluoro miillpore filter (PTFE) are in zero-decrement transmission atmospheric pressure signal, to stop steam; Guaranteed that sensor has high sensitivity and accuracy on the one hand, simultaneously chip has been realized protection, improved the reliability of device.
Claims (1)
1. the preparation method of the encapsulating structure of a micro mechanical air pressure sensor chip; Described encapsulating structure comprises: base (1) comprises metal pins (2) in base (1); On base (1), be provided with the open type cavity (3) that is used to place air pressure sensor chip; On open type cavity (3), be provided with and gather tetrafluoro miillpore filter (4), it is characterized in that step is following:
The preparation of the mold of step 1) base (1) is provided with metal pins (2) and is used to place the open type cavity (3) of air pressure sensor chip on base (1), on base (1), also be provided with bleeder vent (7);
Step 2) in open type cavity (3), drips and be coated with patch red glue (8);
Step 3) sensor chip (9) utilizes patch red glue to be installed in the open type cavity (3);
Step 4) uses Wire Bonding Technology to prepare being electrically connected between input/output terminal that bonding wire (10) realizes sensor chip (9) and the metal pins (2), and metal pins (2) is arranged in base (1) and extends to base (1) outside;
Step 5) is gathered tetrafluoro miillpore filter (4) and is utilized adhesive glue to be fixed on base (1) step (11);
Step 6) package cap (5) is installed on base (1) the top step (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102042299A CN101852668B (en) | 2010-06-21 | 2010-06-21 | Preparation method of packaging structure of micro mechanical air pressure sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102042299A CN101852668B (en) | 2010-06-21 | 2010-06-21 | Preparation method of packaging structure of micro mechanical air pressure sensor chip |
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| Publication Number | Publication Date |
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| CN101852668A CN101852668A (en) | 2010-10-06 |
| CN101852668B true CN101852668B (en) | 2012-01-04 |
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| CN2010102042299A Expired - Fee Related CN101852668B (en) | 2010-06-21 | 2010-06-21 | Preparation method of packaging structure of micro mechanical air pressure sensor chip |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104101456B (en) * | 2013-04-11 | 2016-07-13 | 苏州敏芯微电子技术股份有限公司 | Pressure transducer medium insulation package structure |
| CN104101459B (en) * | 2014-07-30 | 2016-04-06 | 东南大学 | A kind of baroceptor encapsulating structure of Wind-Pressure Resistance |
| CN105181231A (en) * | 2015-08-12 | 2015-12-23 | 中国电子科技集团公司第三十八研究所 | Pressure sensor of packaging structure and preparation method thereof |
| WO2018191860A1 (en) * | 2017-04-18 | 2018-10-25 | 深圳大学 | Method and device for manufacturing optical fiber end face thin film air pressure sensor |
| CN112378574B (en) * | 2020-10-19 | 2022-07-12 | 广东电网有限责任公司广州供电局 | High-voltage switch cabinet SF6Barometer state recording device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS62194431A (en) * | 1986-02-21 | 1987-08-26 | Citizen Watch Co Ltd | Pressure sensor unit |
| JPH07146195A (en) * | 1993-11-19 | 1995-06-06 | Shindengen Electric Mfg Co Ltd | Manufacture of pressure sensor |
| CN2886532Y (en) * | 2005-06-16 | 2007-04-04 | 天水华天微电子有限公司 | Micro-pressure anti-corrosion pressure transducer |
| CN201251495Y (en) * | 2008-08-17 | 2009-06-03 | 蚌埠市立群电子有限公司 | Base seat for pressure sensor |
| CN201740623U (en) * | 2010-06-21 | 2011-02-09 | 东南大学 | Micromechanical air pressure sensor chip encapsulating structure |
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