CN101820731B - Method for processing blind hole with ultraviolet laser - Google Patents
Method for processing blind hole with ultraviolet laser Download PDFInfo
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- CN101820731B CN101820731B CN 200910214609 CN200910214609A CN101820731B CN 101820731 B CN101820731 B CN 101820731B CN 200910214609 CN200910214609 CN 200910214609 CN 200910214609 A CN200910214609 A CN 200910214609A CN 101820731 B CN101820731 B CN 101820731B
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Abstract
The invention discloses a method for processing a blind hole with ultraviolet laser, which comprises the steps of first processing a central positioning blind hole at a set position with fixed point pulse and then performing hole expansion on the central positioning blind hole by a concentric scanning method. Particularly, the step of processing the central positioning blind hole with the fixed point pulse is performed by first selecting the diameter of the light spot and then selecting the pulse quantity, namely the drilling delay time. In the fixed point drilling process, the diameter of the used light spot is 0.01 to 0.05mm; and the used pulse quantity is determined by the drilling delay mode and the drilling duration is 1,000 to 10,000 microseconds. After the processing of the central positioning blind hole is finished, the remaining region outside the central positioning blind hole to be expanded is processed with ultraviolet laser beams at fixed intervals by the concentric scanning method; and finally the residue is transversely or longitudinally removed with low energy light wave. Compared with the prior art, the method ensures little high molecular residue in the blind hole and smooth inner surface of the blind hole; and the removal rate of polymer on a copper-coated surface and the evaporation and volatilization rate of the molten material are high.
Description
Technical field
The present invention relates to a kind of Ultra-Violet Laser method for processing of utilizing, be meant a kind of method of utilizing processing blind hole with ultraviolet laser especially.
Background technology
At present in the process of processing circuit board PCB, carry out 30 μ m～100 μ m blind holes and add man-hour, what generally adopt is the helical scanning method, promptly adds the man-hour laser beam from the center of circle, outwards scans with spiral of Archimedes, and sweep span d can establish, and is as shown in Figure 1.Compare with traditional concentric circular scans method, the track of spiral method processing micropore is a complete curve, has only one group of terminal, and the working depth of having avoided laser switch and hot spot registration to cause is inconsistent.Yet this method also has an inevitable shortcoming, and in order to guarantee out of roundness, nearly cylindrical sweep span reduces gradually, and the difference of hot spot degree of coupling can cause the deviation of working depth like this.So in the machining software of independent development,, solve the terminal problem that concentric circular scans is brought, so the concentric circular scans processing mode still is used widely so that the mode of laser delay value to be set.And existing concentric circular scans method is the mode that is scanned cylindrical earlier by ground in outer the reaching, and there are the staggered floor step in the residual object height of this method gained blind hole inner macromolecule, blind hole internal surface and cause smoothness low thus, influence follow-up heavy process for copper; And method of altering course with a concentric circle and spiral method also all have the darker defective of centre-drilling hole; Reason is little near the position laser action scope in the center of circle; The energy of unit are accumulation is big, and etching depth is bigger than on every side, is easy to second layer copper is carved through reaching next copper layer; And the polymer residue of accumulation is more, causes the monoblock wiring board to lose efficacy.
Summary of the invention
The objective of the invention is provides a kind of two-step processing blind hole method to existing processing blind hole with ultraviolet laser equipment, is prone to cause to overcome prior art that copper ablation and fused mass, residue are more causes the false difficult point that is electrically connected.
Designed a kind of method of processing blind hole with ultraviolet laser according to above-mentioned purpose, step is: the first, in the position that configures with fixed point pulse machining center location blind hole; The second, the concentric circular scans method is adopted in the reaming of centralized positioning blind hole; The 3rd, laterally or vertically remove residue with low-energy light wave.More specific is that the step of said use fixed point pulse machining center location blind hole is: the first, and the selective light spot diameter; The second, the strobe pulse amount is promptly selected the boring delay time.In the fixed point boring processing, used spot diameter is 0.01～0.05 millimeter; Used pulsed quantity is to confirm that through boring time-delay mode be 1000～10000 microseconds the perdurabgility of holing.
After the processing of accomplishing the centralized positioning blind hole; The said concentric circular scans method that is used for reaming is meant with the uv laser beam of determining deviation locatees the outer remaining reaming machining area of treating of blind hole with concentric circular scans method machining center, with the horizontal and vertical removing residue of low-yield parameter hot spot difference.
The present invention compared with prior art, the high molecular residue in the blind hole is few, blind hole internal surface is smooth.It is high to cover copper surface aggregate thing removal degree, and fused mass vaporization volatility is high.Can know through micro-comparison; Only adopt the blind hole center working depth of concentric circular scans method processing to be difficult to control; Often exceed standard---ultra dark; Figure can see and seriously ablating to covering the copper layer from the side, and adopts among the present invention with after the processing of location drilling method, and light is smooth at the bottom of acomia black area, micropore central area, the hole.
Description of drawings
Accompanying drawing 1 is the track while scan sketch map of prior art helical scanning method; Accompanying drawing 2 is track while scan sketch mapes of prior art concentric circular scans method; Accompanying drawing 3 is basic procedure block diagrams of the present invention.
Embodiment
Among Fig. 1, the spot at center is a laser spot, and helical is the track of this laser spot; Among Fig. 2, dotted line is the track of laser spot, and solid line is concentrically ringed circle center line connecting, and d is that the distance between circle center line connecting is a sweep span.
Purport of the present invention is to reform and improve existing P CB twist drill hole method by the use operation that changes concentric circular scans method or helical scanning method, obtains the blind hole of higher crudy in the hope of utilizing Ultra-Violet Laser processing.Below in conjunction with embodiment the present invention is made further detailed description.
With reference to Fig. 3.The present invention has designed the method for a kind of Ultra-Violet Laser (being commonly called as UV laser) processing blind hole, and step adopts the concentric circular scans method to the reaming of centralized positioning blind hole again for locating blind hole in the position that configures with the fixed point pulse machining center earlier.Wherein do, use the step of fixed point pulse machining center location blind hole to be first selective light spot diameter, the strobe pulse amount is promptly selected the delay time of holing again.In fixed point boring processing, used spot diameter is 0.01～0.05 millimeter; Used pulsed quantity is to confirm that through boring time-delay mode be 1000～10000 microseconds the perdurabgility of holing.After the processing of accomplishing the centralized positioning blind hole, the concentric circular scans method that is used for reaming is meant with the uv laser beam of determining deviation locatees the outer remaining reaming machining area of treating of blind hole with concentric circular scans method machining center.Concentric circular scans method described here is that one or more tangent or crossing concentric circles scans simultaneously; And the low-yield light wave that described removing residue adopts is or/and hot spot, and power bracket is at 0.5W～2W, and frequency range is at 60KHZ～100KHZ; The transient energy scope is 10
4J/NS～10
6J/NS.
Innovative point of the present invention is processing and the processing of the reaming around blind hole branch to the blind hole center are come, and has adopted fixed point pulse boring location and concentric circular scans reaming process combined method.Wherein, the diameter that " spot diameter " adopts fixed point pulse boring to process for core, pulsed quantity can come independent the setting through " boring time-delay "." sweep span d " for after the centralized positioning blind hole bored, peripheral reaming adds concentrically ringed sweep spacing in man-hour.
Begin to add man-hour, software is provided with concrete parameter according to radius R 1 value of blind hole to be processed, comprises the radius of centralized positioning blind hole, hole delay time, concentric circular scans spacing etc.During operation, at first adopt the method for percussive drilling to process a micropore after, take the method for concentric circular scans again, the processing external diameter is the remaining area of R2.After machining like this, just accomplished the processing of whole micropore.The inventive method and prior art compare, and the high molecular residue in the pore-forming is few, and internal surface of hole is smooth, and it is high to cover copper surface aggregate thing removal degree, and fused mass vaporization volatilization is abundant.
Claims (2)
1. the method for a processing blind hole with ultraviolet laser, step is:
The first, locate blind hole in the position that configures with the fixed point pulse machining center;
The second, the concentric circular scans method is adopted in the reaming of centralized positioning blind hole;
The 3rd, with the horizontal and vertical removing polymer residue of low-yield parameter difference;
Wherein, the step of said use fixed point pulse machining center location blind hole is:
The first, the selective light spot diameter; The second, the strobe pulse amount is promptly selected the boring delay time;
Described spot diameter is 0.01～0.05 millimeter;
Described pulsed quantity is to confirm that through boring time-delay mode be 1000～10000 microseconds the perdurabgility of holing;
The said concentric circular scans method that is used for reaming is with the outer remaining reaming machining area of treating of concentric circular scans machining center location blind hole of determining deviation, with the horizontal and vertical removing residue of low-yield parameter hot spot difference; This concentric circular scans method is that one or more tangent or crossing concentric circles scans simultaneously.
2. the method for processing blind hole with ultraviolet laser according to claim 1 is characterized in that: the low-yield light wave that described removing residue adopts, and power bracket is at 0.5W～2W, and frequency range is at 60KHZ～100KHZ; The transient energy scope is 10
4J/NS～10
6J/NS.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 200910214609 CN101820731B (en) | 2009-12-31 | 2009-12-31 | Method for processing blind hole with ultraviolet laser |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200910214609 CN101820731B (en) | 2009-12-31 | 2009-12-31 | Method for processing blind hole with ultraviolet laser |
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| CN101820731A CN101820731A (en) | 2010-09-01 |
| CN101820731B true CN101820731B (en) | 2012-08-08 |
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Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103212857B (en) * | 2012-01-19 | 2015-09-30 | 昆山思拓机器有限公司 | A kind of FPC method for processing blind hole |
| CN103231171A (en) * | 2013-04-24 | 2013-08-07 | 梅州市志浩电子科技有限公司 | Processing method of blind hole of printed circuit board |
| CN105983786B (en) * | 2015-02-04 | 2019-06-11 | 大族激光科技产业集团股份有限公司 | A method of glass processing is realized using laser |
| CN104816098A (en) * | 2015-03-24 | 2015-08-05 | 河源西普电子有限公司 | Technological method for machining second-order blind holes through UV laser |
| CN106624385B (en) * | 2016-11-30 | 2018-08-21 | 蓝思科技（长沙）有限公司 | The processing method that glass spiles |
| CN109994295A (en) * | 2019-04-18 | 2019-07-09 | 深圳市杰普特光电股份有限公司 | The resistance trimming method and system of resistor body |
| CN110385521B (en) * | 2019-08-29 | 2021-03-16 | 西安交通大学 | Femtosecond laser processing device and method for silicon carbide rapid deep etching |
| CN113543477B (en) * | 2020-04-17 | 2022-11-01 | 珠海方正科技高密电子有限公司 | Method for processing laser hole of circuit board and circuit board with laser hole |
| CN112096400A (en) * | 2020-08-13 | 2020-12-18 | 中国地质大学（武汉） | Concentric circle type laser drilling reaming process method |
| CN113210856B (en) * | 2021-04-22 | 2022-07-19 | 广东工业大学 | PCB short-wavelength pulse laser drilling method and related drilling device |
| CN113543526B (en) * | 2021-06-10 | 2022-12-06 | 景旺电子科技(龙川)有限公司 | Blind hole machining method and FPC multilayer board |
| CN115502585B (en) * | 2022-09-02 | 2023-05-09 | 广州添利电子科技有限公司 | Processing method of large-aperture radium perforation |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004082885A1 (en) * | 2003-03-17 | 2004-09-30 | Mitsubishi Denki Kabushiki Kaisha | Laser beam machining method |
| US7537667B2 (en) * | 2005-02-25 | 2009-05-26 | Kyocera Corporation | Method of processing composite green sheet |
| CN101610643A (en) * | 2009-07-14 | 2009-12-23 | 华中科技大学 | A kind of method of processing blind hole by laser |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004082885A1 (en) * | 2003-03-17 | 2004-09-30 | Mitsubishi Denki Kabushiki Kaisha | Laser beam machining method |
| US7537667B2 (en) * | 2005-02-25 | 2009-05-26 | Kyocera Corporation | Method of processing composite green sheet |
| CN101610643A (en) * | 2009-07-14 | 2009-12-23 | 华中科技大学 | A kind of method of processing blind hole by laser |
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Address after: 215312 No. 92 Chenjiabang Road, Penglang, Kunshan Development Zone, Suzhou City, Jiangsu Province Patentee after: Jiangsu Zhengye made Technology Co. Ltd. Address before: 215312 No. 92 Chenjiabang Road, Penglang, Kunshan Development Zone, Suzhou City, Jiangsu Province Patentee before: Kunshan Zhengye Electronic Co., Ltd. |
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