CN101814586A - Clamping type substrate turnover device - Google Patents
Clamping type substrate turnover device Download PDFInfo
- Publication number
- CN101814586A CN101814586A CN200910246910A CN200910246910A CN101814586A CN 101814586 A CN101814586 A CN 101814586A CN 200910246910 A CN200910246910 A CN 200910246910A CN 200910246910 A CN200910246910 A CN 200910246910A CN 101814586 A CN101814586 A CN 101814586A
- Authority
- CN
- China
- Prior art keywords
- clamping
- driving mechanism
- substrate
- turnover device
- type substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 133
- 230000007306 turnover Effects 0.000 title claims abstract description 52
- 230000007246 mechanism Effects 0.000 claims abstract description 113
- 230000005540 biological transmission Effects 0.000 claims description 47
- 238000000465 moulding Methods 0.000 claims description 20
- 238000003825 pressing Methods 0.000 claims description 20
- 239000011553 magnetic fluid Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 17
- 230000008569 process Effects 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 210000001138 tear Anatomy 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- -1 therefore Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Presses And Accessory Devices Thereof (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009102469107A CN101814586B (en) | 2009-12-01 | 2009-12-01 | Clamping type substrate turnover device |
PCT/CN2009/076114 WO2011066701A1 (en) | 2009-12-01 | 2009-12-28 | Clamping type substrate turning device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009102469107A CN101814586B (en) | 2009-12-01 | 2009-12-01 | Clamping type substrate turnover device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101814586A true CN101814586A (en) | 2010-08-25 |
CN101814586B CN101814586B (en) | 2011-09-28 |
Family
ID=42621757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009102469107A Expired - Fee Related CN101814586B (en) | 2009-12-01 | 2009-12-01 | Clamping type substrate turnover device |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101814586B (en) |
WO (1) | WO2011066701A1 (en) |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101972501A (en) * | 2010-10-18 | 2011-02-16 | 迈柯唯医疗设备(苏州)有限公司 | Intelligent closed-loop identification, resetting and feedback device |
CN103871947A (en) * | 2012-12-14 | 2014-06-18 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Clamping device and plasma processing device |
CN104340729A (en) * | 2013-07-31 | 2015-02-11 | 哈里斯股份有限公司 | A thin-plate conveying device and a thin-plate cleaning system |
CN104340730A (en) * | 2013-07-31 | 2015-02-11 | 哈里斯股份有限公司 | Transparent panel cleaning system |
CN104761155A (en) * | 2015-03-27 | 2015-07-08 | 广东韦达尔科技有限公司 | Cooperation rotating mechanism of film sticking machine |
CN104772642A (en) * | 2014-01-14 | 2015-07-15 | 鸿富锦精密工业(深圳)有限公司 | Turnover device |
CN104816519A (en) * | 2015-03-27 | 2015-08-05 | 广东韦达尔科技有限公司 | Clamping apparatus of film laminating machine |
CN104828602A (en) * | 2015-03-27 | 2015-08-12 | 广东韦达尔科技有限公司 | Side-turning mechanism for laminator |
CN104843469A (en) * | 2015-04-27 | 2015-08-19 | 歌尔声学股份有限公司 | Tool turning device and turning method thereof |
CN105527469A (en) * | 2016-01-06 | 2016-04-27 | 珠海格力电器股份有限公司 | A clamping structure for changing FCT test equipment sky board |
CN105784724A (en) * | 2016-03-07 | 2016-07-20 | 京东方科技集团股份有限公司 | Flat panel product detecting device |
CN107322711A (en) * | 2017-08-25 | 2017-11-07 | 湖州民阁木业有限公司 | A kind of rotary wood board splicing machine |
CN107894518A (en) * | 2017-11-09 | 2018-04-10 | 奥士康科技股份有限公司 | A kind of double width material substrate examines car |
CN109454504A (en) * | 2018-12-28 | 2019-03-12 | 天津时代创业科技有限公司 | Automatical feeding system is used in table knife polishing |
CN110039470A (en) * | 2019-05-20 | 2019-07-23 | 昆明理工大学 | A kind of multi-functional special fixture on assembling line |
CN110491817A (en) * | 2019-09-03 | 2019-11-22 | 罗博特科智能科技股份有限公司 | A kind of adjustable slice turning device |
CN110540037A (en) * | 2018-08-21 | 2019-12-06 | 蓝思智能机器人(长沙)有限公司 | Hot bending forming equipment and mould turnover mechanism thereof |
CN112753788A (en) * | 2021-01-15 | 2021-05-07 | 韦祝英 | Tea leaf baking machine with automatic overturning function |
CN115948720A (en) * | 2023-03-14 | 2023-04-11 | 上海陛通半导体能源科技股份有限公司 | Thin film deposition apparatus |
CN116438642A (en) * | 2020-10-20 | 2023-07-14 | 塞姆西斯科有限责任公司 | Clamping device for fixing a substrate for surface treatment of the substrate |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2002050863A1 (en) * | 2000-12-19 | 2004-04-22 | 株式会社アドバンテスト | Sample carrier fixing mechanism |
GB2392309B (en) * | 2002-08-22 | 2004-10-27 | Leica Microsys Lithography Ltd | Substrate loading and unloading apparatus |
CN100390954C (en) * | 2004-05-09 | 2008-05-28 | 郑光镐 | Plane holding device |
JP4467367B2 (en) * | 2004-06-22 | 2010-05-26 | 大日本スクリーン製造株式会社 | Substrate reversing device, substrate transporting device, substrate processing device, substrate reversing method, substrate transporting method, and substrate processing method |
CN101510523B (en) * | 2009-03-19 | 2010-08-25 | 友达光电股份有限公司 | Substrate overturn platform and method for substrate overturn |
-
2009
- 2009-12-01 CN CN2009102469107A patent/CN101814586B/en not_active Expired - Fee Related
- 2009-12-28 WO PCT/CN2009/076114 patent/WO2011066701A1/en active Application Filing
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101972501A (en) * | 2010-10-18 | 2011-02-16 | 迈柯唯医疗设备(苏州)有限公司 | Intelligent closed-loop identification, resetting and feedback device |
CN103871947A (en) * | 2012-12-14 | 2014-06-18 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Clamping device and plasma processing device |
CN104340729A (en) * | 2013-07-31 | 2015-02-11 | 哈里斯股份有限公司 | A thin-plate conveying device and a thin-plate cleaning system |
CN104340730A (en) * | 2013-07-31 | 2015-02-11 | 哈里斯股份有限公司 | Transparent panel cleaning system |
CN104340729B (en) * | 2013-07-31 | 2017-04-12 | 哈里斯股份有限公司 | A thin-plate conveying device and a thin-plate cleaning system |
CN104772642B (en) * | 2014-01-14 | 2017-02-15 | 鸿富锦精密工业(深圳)有限公司 | Turnover device |
CN104772642A (en) * | 2014-01-14 | 2015-07-15 | 鸿富锦精密工业(深圳)有限公司 | Turnover device |
CN104816519A (en) * | 2015-03-27 | 2015-08-05 | 广东韦达尔科技有限公司 | Clamping apparatus of film laminating machine |
CN104828602A (en) * | 2015-03-27 | 2015-08-12 | 广东韦达尔科技有限公司 | Side-turning mechanism for laminator |
CN104761155A (en) * | 2015-03-27 | 2015-07-08 | 广东韦达尔科技有限公司 | Cooperation rotating mechanism of film sticking machine |
CN104816519B (en) * | 2015-03-27 | 2017-05-17 | 广东韦达尔科技有限公司 | Clamping apparatus of film laminating machine |
CN104761155B (en) * | 2015-03-27 | 2017-05-17 | 广东韦达尔科技有限公司 | Cooperation rotating mechanism of film sticking machine |
CN104843469A (en) * | 2015-04-27 | 2015-08-19 | 歌尔声学股份有限公司 | Tool turning device and turning method thereof |
CN105527469A (en) * | 2016-01-06 | 2016-04-27 | 珠海格力电器股份有限公司 | A clamping structure for changing FCT test equipment sky board |
CN105784724A (en) * | 2016-03-07 | 2016-07-20 | 京东方科技集团股份有限公司 | Flat panel product detecting device |
CN107322711A (en) * | 2017-08-25 | 2017-11-07 | 湖州民阁木业有限公司 | A kind of rotary wood board splicing machine |
CN107894518A (en) * | 2017-11-09 | 2018-04-10 | 奥士康科技股份有限公司 | A kind of double width material substrate examines car |
CN110540037A (en) * | 2018-08-21 | 2019-12-06 | 蓝思智能机器人(长沙)有限公司 | Hot bending forming equipment and mould turnover mechanism thereof |
CN109454504A (en) * | 2018-12-28 | 2019-03-12 | 天津时代创业科技有限公司 | Automatical feeding system is used in table knife polishing |
CN110039470A (en) * | 2019-05-20 | 2019-07-23 | 昆明理工大学 | A kind of multi-functional special fixture on assembling line |
CN110491817A (en) * | 2019-09-03 | 2019-11-22 | 罗博特科智能科技股份有限公司 | A kind of adjustable slice turning device |
CN110491817B (en) * | 2019-09-03 | 2024-04-26 | 罗博特科智能科技股份有限公司 | Adjustable sheet turning device |
CN116438642A (en) * | 2020-10-20 | 2023-07-14 | 塞姆西斯科有限责任公司 | Clamping device for fixing a substrate for surface treatment of the substrate |
CN112753788A (en) * | 2021-01-15 | 2021-05-07 | 韦祝英 | Tea leaf baking machine with automatic overturning function |
CN112753788B (en) * | 2021-01-15 | 2022-11-22 | 湖北小稀藤茶叶有限公司 | Tea leaf baking machine with automatic overturning function |
CN115948720A (en) * | 2023-03-14 | 2023-04-11 | 上海陛通半导体能源科技股份有限公司 | Thin film deposition apparatus |
CN115948720B (en) * | 2023-03-14 | 2023-06-02 | 上海陛通半导体能源科技股份有限公司 | Thin film deposition apparatus |
Also Published As
Publication number | Publication date |
---|---|
WO2011066701A1 (en) | 2011-06-09 |
CN101814586B (en) | 2011-09-28 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PP01 | Preservation of patent right |
Effective date of registration: 20131205 Granted publication date: 20110928 |
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RINS | Preservation of patent right or utility model and its discharge | ||
PD01 | Discharge of preservation of patent |
Date of cancellation: 20140905 Granted publication date: 20110928 |
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PP01 | Preservation of patent right |
Effective date of registration: 20140905 Granted publication date: 20110928 |
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RINS | Preservation of patent right or utility model and its discharge | ||
PD01 | Discharge of preservation of patent |
Date of cancellation: 20150905 Granted publication date: 20110928 |
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PP01 | Preservation of patent right |
Effective date of registration: 20150905 Granted publication date: 20110928 |
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RINS | Preservation of patent right or utility model and its discharge | ||
PD01 | Discharge of preservation of patent |
Date of cancellation: 20210904 Granted publication date: 20110928 |
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PD01 | Discharge of preservation of patent | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110928 Termination date: 20131201 |