CN101806478A - Cross air flue semiconductor thermoelectric refrigeration air-conditioner - Google Patents
Cross air flue semiconductor thermoelectric refrigeration air-conditioner Download PDFInfo
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Abstract
The invention discloses a cross air flue semiconductor thermoelectric refrigeration air-conditioner, which comprises semiconductor thermoelectric refrigeration radiating units provided with a plurality of groups of two-side cross fins, wherein the air flow passage directions of the two-side cross fins of the adjacent units and the pyroelectricities on one side of a close semiconductor thermoelectric refrigeration assembly are the same in pair to form a cross heat insulation and heat exchange air flue in which the plurality of groups of cross fins form paired refrigeration and paired heat dissipation and are vertical at intervals; and the units are driven by an indoor fan and an outdoor fan respectively to directly exchange heat with the indoor air flow and the outdoor air flow; therefore, in a mode of simple structure, low cost, safety and reliability, improved energy efficiency and convenient installation, the industrialized revolution of the semiconductor thermoelectric refrigeration air-conditioner is guided.
Description
(1) technical field
The present invention relates to semiconductor thermoelectric refrigeration and air-conditioning technical field.
(2) background technology
Past two is research the achieving no breakthrough property progress all the time of semiconductor thermoelectric (electronics) refrigerating material and device thereof during the decade, wants to produce the semiconductor thermoelectric refrigeration assembly of function admirable, and its thermoelectric material must have higher figure of merit zT.Having at present the most in the world, the semiconductor thermoelectric refrigeration material of high figure of merit zT is the Bi2 alloy.Yet recently, in the semiconductor thermoelectric refrigeration field, occurred research boom in the world, and obtained certain progress two kinds of novel semi-conductor thermoelectric cooling materials and device thereof.These two kinds of novel semi-conductor thermoelectric cooling materials and device are respectively: semiconductor quantum well superlattice film material and device thereof, and skutterudite type high temp semiconductor thermoelectric refrigeration material and device thereof.
The imagination that obtains higher figure of merit zT with the semiconductor quantum well superlattice structure is that the L.D.Hievs of the U.S. Massachusetts Institute of Technology equals at first to propose in 1993, they contrast in theory calculated form semiconductor two dimensional quantum well superlattice structure respectively with single carrying material and biobelt material after, the influence that figure of merit zT is produced.So-called single carrying material is meant the have a kind of carrier semi-conductor thermoelectric material in (electronics or hole), and having the most at present, the semi-conductor thermoelectric material of high figure of merit zT all is single carrying material.Scripts such as biobelt material such as semimetal are not desirable semi-conductor thermoelectric materials, yet with after its formation two dimensional quantum well superlattice structure, can effectively separate biobelt, change it into effective single carrier material.The contrast of their theory is calculated and shown: the figure of merit zT of its two dimensional quantum well superlattice structure is significantly increased than single carrying material, and figure of merit zT can reach more than 3.0 when 300K, is 3 times of conventional semiconductors thermoelectric material Bi2 alloy.This notional result deliver the research interest that causes researcher, because if experimental verification figure of merit zT can reach this value, the semiconductor thermoelectric refrigeration technology just is expected to contend with the mechanical refrigeration technology.Carrying out the semiconductor thermoelectric refrigeration material of SQW superlattice structure and the country of device research thereof at present has the U.S., Japan, Ukraine, Germany etc., and wherein the research effort with the U.S. and Japan is the most powerful.
In the Refrigeration ﹠ Air-Conditioning technical field, semiconductor thermoelectric refrigeration air-conditioner is owing to need not cold-producing medium and compressor, therefore compliance with environmental protection requirements more, and also lower to the requirement of manufacturing process.
The primary structure of existing semiconductor thermoelectric refrigeration air-conditioner is: be provided with the semiconductor thermoelectric refrigeration assembly and be used for loosing the refrigerating capacity of semiconductor thermoelectric refrigeration assembly or heating capacity to the needs refrigeration or heating the heat exchanger of air, this air heat exchanger is provided with heat transfer plate, on the side plate face of heat transfer plate, be fixed with some fins, the opposite side of air heat exchanger heat transfer plate abuts in a side surface of this semiconductor thermoelectric refrigeration assembly, this semiconductor thermoelectric refrigeration assembly opposite side surface reclines and one is used for the heat-conducting water box that heat that the semiconductor thermoelectric refrigeration assembly is distributed or cold take away, and this semiconductor thermoelectric refrigeration assembly is fastened between air heat exchanger and the heat-conducting water box; Described air heat exchanger and heat-conducting water box are formed with one deck alundum (Al layer respectively on the side of semiconductor thermoelectric refrigeration assembly that reclines separately; The heat transfer plate of described air heat exchanger is provided with for the standing surface that stand in the bottom in the thermoelectric refrigeration air-conditioner shell body, described fin is to be fixed on this heat transfer plate on the side plate face of this standing surface, the plane that described standing surface is and thermoelectric refrigeration air-conditioner bottom is parallel, and the free end of these fins all is directed downwards inclination (this structural design can referring to Chinese ZL200710084876.9 patent of invention) towards this standing surface.
It is as follows that yet this patent of invention is provided with the shortcoming of heat-conducting water box:
1, the heat dissipation capacity of semiconductor thermoelectric refrigeration assembly need could finally pass to air in the environment by a plurality of links such as heat-conducting water box, circulating pump, pipeline, cooling tower, cooling blowers, thereby caused the heat transfer temperature loss in several years, make the temperature difference of semiconductor thermoelectric refrigeration assembly further to strengthen, therefore reduced the figure of merit zT of semiconductor thermoelectric refrigeration assembly;
2, the power power consumption of water circulating pump and cooling blower also makes the Energy Efficiency Ratio of system further reduce;
3, no matter heat-conducting water box of the prior art adopts copper or aluminum, and all manufacturing is complicated, with high costs, joint is numerous; Air-conditioner must be with numerous water tank operations in addition, has just greatly increased weight of equipment;
4, heat-conducting water box must strictly seal, otherwise recirculated water leakage in a single day will destroy the electrical insulating property of semiconductor thermoelectric refrigeration assembly, even the danger that is short-circuited;
5, the thermoelectric refrigeration air-conditioner that is provided with in each room all can't independent operating, must carry out cooperation by water circulating pump, pipe-line system, cooling tower etc., the through engineering approaches of its similar central air-conditioning is installed, debugging, safeguard all very complicated.
In at present traditional Refrigeration ﹠ Air-Conditioning technology, the application of steam compression type refrigeration is the most universal, detachable air conditioner on the market, central air-conditioning handpiece Water Chilling Units, freezer, refrigerator etc. all are cold-producing medium with freon, it comprises compressor, condenser, evaporimeter, expansion valve etc., and there is following problem in this refrigerating method:
1, destroy atmospheric ozone layer: freon uses, when keeping in repair, can decompose in atmospheric ozone layer as cold-producing medium, and chlorion is grabbed the ozone electronics, makes ozone molecule be transformed into oxygen molecule; Therefore ozone layer destroys and influences plant and halobiontic growth and breeding, and then harm humans health; Also produce additional greenhouse effects simultaneously, quicken polymer and wear out, finally destroy environment for human survival.These have caused that the whole mankind pays close attention to, and the Montreal protocol regulation of national governments' signature: it is the CFC production of representative that developed country stopped in 1996 with freon R12, the consumption of the low fluorine product of the year two thousand twenty restriction; Chinese Government promises to undertake the production that stopped the CFC product in 2002, stops using the CFC product in 2005, the production of the low fluorine product of restriction in 2010, and the year two thousand thirty stops the application of low fluorine product.This shows, the present most Refrigeration ﹠ Air-Conditioning products that use the low fluorine of R22 of China, its technical life is year surplus in the of remaining 10 only, and along with fast development of Chinese economy, forbids that the time also may further shift to an earlier date.
2, noise pollution: because the existence of rotatable parts such as compressor, have noise pollution inevitably, particularly current China city per capita living space is little, when housing condition is not too improved, this noise pollution just more directly, more outstanding, directly influence people's quality of life.
3, manufacturing process complexity: compressor, condenser, evaporimeter, expansion valve etc., its structure are all complicated, material and manufacture process requirement height, and detection means is tight, thereby makes it produce investment increasing, cost raising.
4, because the thermal inertia of refrigeration system is not of uniform size, make its fuzzy control and PID regulation technology all complicated, be difficult to accomplish accurate control, influenced the further raising of Refrigeration ﹠ Air-Conditioning product Energy Efficiency Ratio.
(3) summary of the invention
At the problems referred to above, purpose of the present invention: be the advantage separately of wanting comprehensive foregoing invention patent and existing split-type air conditioner device, improve its weak point, need not refrigerant and compressor to provide a kind of, and simple in structure, with low cost, safe and reliable, efficiency improves, novel crossed air flue semiconductor thermoelectric refrigeration air-conditioner easy for installation.
The technical solution used in the present invention, promptly cross air flue semiconductor thermoelectric refrigeration air-conditioner as accompanying drawing 1 to shown in the accompanying drawing 4, wherein: the 1-both sides intersect the semiconductor thermoelectric refrigeration heat-sink unit of fin; 2-semiconductor thermoelectric refrigeration assembly; The 3-heat exchanger; 4-conducts heat dull and stereotyped; The exhausted electric heat-conducting layer of 5-; 6-is incubated installing plate; The 7-shell body; The 8-fin; 9-intersection insulation heat exchange air channel; The 10-thermal insulation wind pipe; The 11-indoor fan; The 12-airduct; The 13-outdoor fan; The 14-filter; The 15-wind-guiding grate; 16-ponding dish; The 17-drainpipe; The 18-electric heater.
According to accompanying drawing 1 to the cross air flue semiconductor thermoelectric refrigeration air-conditioner shown in the accompanying drawing 4: be provided with some groups of both sides and intersect the semiconductor thermoelectric refrigeration heat-sink unit 1 of fins, every unit 1 is provided with one group and constitutes the tabular semiconductor thermoelectric refrigeration assembly 2 of square, fastened being located between two identical heat exchangers 3, with refrigerating capacity and the heat dissipation capacity that semiconductor thermoelectric refrigeration assembly 2 two sides are produced, diffusing respectively indoor air stream and the flow of outside air in both sides heat exchanger 3;
Described two heat exchangers 3 are equipped with square and conduct heat dull and stereotyped 4, the side plate face closely abuts in by the side surface of exhausted electric heat-conducting layer 5 with semiconductor thermoelectric refrigeration assembly 2, the relative both sides of lateral plates are provided with the insulation installing plate 6 of pair of parallel in addition, interconnect and are installed in the shell body 7 so that organize semiconductor thermoelectric refrigeration heat-sink unit 1 more;
Be fixed with some and its parallel fins 8 in the same way between every pair of insulation installing plate 6, and the arranged direction square crossing of heat exchanger 3 fins 8 of semiconductor thermoelectric refrigeration assembly 2 both sides;
The semiconductor thermoelectric refrigeration heat-sink unit 1 of described many groups both sides intersection fin docks mutually, the both sides intersection fin 8 of its adjacent cells 1, the air flow channel direction is all identical in twos with the pyroelectricity of reclining semiconductor thermoelectric refrigeration assembly 2 one sides, so that many group intersection fins 8 are formed the refrigeration insulation heat exchange air channel of space in twos on same air-flow direction, and the heat radiation of forming the space on its square crossing air-flow direction in twos is incubated the heat exchange air channel, be collectively referred to as and intersect insulation heat exchange air channel 9, and respectively with indoor air stream and flow of outside air direct heat transfer;
The room air loop is formed with the thermal insulation wind pipe 10 that its room air air inlet is connected with air outlet in described intersection insulation heat exchange air channel 9, is provided with several chambers inner blower 11 in this loop; And the air inlet of its outdoor air and/or air outlet are connected with airduct 12, and the air outlet of this airduct 12 or air inlet are provided with some outdoor fans 13.
On the said structure basis:
Described room air thermal insulation wind pipe 10, its air inlet is provided with filter 14, and its air outlet is provided with wind-guiding grate 15.
In the described intersection insulation heat exchange air channel 9 the room air runner vertically downward, and the below of air outlet is provided with ponding dish 16 and drainpipe 17 thereof.
Described heat exchanger 3 is aluminum-made heat exchangers 3, and described exhausted electric heat-conducting layer 5 is to carry out the aluminum oxide coating 5 that differential arc oxidation forms exhausted electric heat conduction by the dull and stereotyped 4 side plate faces that recline thermoelectric cooling assembly 2 of aluminum heat transfer to heat exchanger 3.
Described heat exchanger 3 is copper heat exchangers 3, the potsherd 5 that described exhausted electric heat-conducting layer 5 is exhausted electric heat conduction.
Described semiconductor thermoelectric refrigeration assembly 2 is made up of semiconductor heat electric device and flow deflector, when semiconductor thermoelectric refrigeration assembly 2 freezes or heats, electric current flows into the semiconductor heat electric device through flow deflector, and corresponding cold junction face and hot junction face appear in every pair of semiconductor thermoelectric element.
One side of described insulation installing plate 6 is posted heat-insulation layer.
Described semiconductor thermoelectric refrigeration assembly 2 is located between two identical heat exchangers 3 screw, nut anchorage clip by some.
Intersecting the room air air outlet in insulation heat exchange air channel 9, in the thermal insulation wind pipe 10 between the wind-guiding grate 15, be provided for the auxiliary electric heater 18 that adds hot-air.
Operation principle of the present invention 1 is described as follows to accompanying drawing 4 in conjunction with the accompanying drawings:
In the semiconductor thermoelectric refrigeration heat-sink unit 1 of many groups both sides intersection fin, semiconductor thermoelectric refrigeration assembly 2 parallel with one another is switched on simultaneously, electric current flows into the semiconductor heat electric device through wherein flow deflector, cold junction face and hot junction face occur in the both sides of every pair of semiconductor thermoelectric element by thermoelectric action; Refrigerating capacity that is produced and heat dissipation capacity are then passed through the exhausted electric heat-conducting layer 5 of semiconductor thermoelectric refrigeration assembly 2 both sides respectively, pass to the intersection fin of being arranged between the heat transfer dull and stereotyped 4 of both sides heat exchanger 3 and the every pair of insulation installing plate 6 thereof 8, thereby in the both sides that intersect insulation heat exchange air channel 9, form the room air refrigeration air channel and the outdoor air heat dissipation wind channel of square crossing respectively, be used for air-conditioning or defrosting; Perhaps by changing the electric current cathode and anode directions of semiconductor thermoelectric refrigeration assembly 2, with the working method conversion that realizes refrigeration, heats, thereby form the room air heat dissipation wind channel and the outdoor air refrigeration air channel of square crossing respectively, be used for heating; At this moment:
1, refrigeration-operation of air conditioner: indoor fan 11 starts synchronously, flow through filter 14 to be filtered to drive room air, thermal insulation wind pipe 10 flow through again with insulation, the intersection of flowing through vertically downward after indoor fan 11 pressurizations then is incubated the room air refrigeration air channel in the heat exchange air channel 9, to take away the refrigerating capacity that semiconductor thermoelectric refrigeration assembly 2 energising backs are produced, the cooling, the drying that are used for air-conditioning process, and a condensate water that produces brought in the ponding dish 16 of bottom in the same way, and discharge shell bodies 7 from drainpipe 17; After the air flow when controlling in its inlet chamber is flowed again through wind-guiding grate 15 in cooling, dried air; At this moment, outdoor fan 13 also starts synchronously, with the outdoor air heat dissipation wind channel of drive chamber's external air-water advection through intersecting in the insulation heat exchange air channel 9, taking away the heat dissipation capacity that semiconductor thermoelectric refrigeration assembly 2 energising backs are produced, and after the pressurization of outdoor fan 13 again from airduct 12 discharging environment.
2, heat-heating operation: indoor fan 11 starts synchronously, flow through filter 14 to be filtered to drive room air, thermal insulation wind pipe 10 flow through again with insulation, the intersection of flowing through vertically downward after indoor fan 11 pressurizations then is incubated room air heat dissipation wind channel and the electric heater 18 in the heat exchange air channel 9, successively to take away the back heat dissipation capacity that is produced of semiconductor thermoelectric refrigeration assembly 2 energisings and/or the heat dissipation capacity of electric heater 18, be used for heating, at last through the air stream of heating again through wind-guiding grate 15, the air flow when controlling in its inlet chamber; At this moment, outdoor fan 13 also starts synchronously, with the outdoor air refrigeration air channel of drive chamber's external air-water advection through intersecting in the insulation heat exchange air channel 9, taking away the refrigerating capacity that semiconductor thermoelectric refrigeration assembly 2 energising backs are produced, and after the pressurization of outdoor fan 13 again from airduct 12 discharging environment.
3, refrigeration-defrosting operation: indoor fan 11 starts synchronously, flow through filter 14 to be filtered to drive room air, thermal insulation wind pipe 10 flow through again with insulation, the intersection of flowing through vertically downward after indoor fan 11 pressurizations then is incubated the room air refrigeration air channel in the heat exchange air channel 9, to take away the refrigerating capacity that semiconductor thermoelectric refrigeration assembly 2 energising backs are produced, at last through cooled air stream again through wind-guiding grate 15, the air flow when controlling in its inlet chamber; At this moment, outdoor fan 13 also starts synchronously, with the outdoor air heat dissipation wind channel of drive chamber's external air-water advection in intersection insulation heat exchange air channel 9, to take away the heat dissipation capacity that semiconductor thermoelectric refrigeration assembly 2 energising backs are produced, be used for defrosting, and after the pressurization of outdoor fan 13, discharge environment from airduct 12 again.
Therefore compared with prior art, technical advantage of the present invention is as follows:
1, improve Energy Efficiency Ratio: the heat dissipation capacity of semiconductor thermoelectric refrigeration assembly 2 can be directly passed to surrounding air by outdoor fan 13, thereby need not be by the circulatory system and the cooling tower of cooling water, both reduced heat transfer temperature loss, the investment and the power consumption of water circulating pump and cooling blower have also been saved, therefore significantly improved Energy Efficiency Ratio of the present invention, make this value can between 2.7-6, change in one day, thereby than the energy-conservation about 20-30% of convertible frequency air-conditioner, than the common air-conditioning economize on electricity more than 40%;
2, no heat-conducting water box: owing to save heat-conducting water box, both reduced manufacturing cost of the present invention, and also alleviated its operating weight, and avoided the leakage of recirculated water in the heat-conducting water box simultaneously at all, and made the present invention more safe and reliable;
3, exhausted electric heat conduction: substitute the exhausted electric conducting strip 5 of original pottery with the exhausted electric heat conducting coating 5 of alundum (Al, thereby make heat exchanger 3 and semiconductor thermoelectric refrigeration assembly 2 when keeping electrical insulating property, also has good heat conductivity, to avoid heat transfer temperature loss, improve the Energy Efficiency Ratio of semiconductor thermoelectric refrigeration heat-sink unit 1, and make its overall structure compact more;
4, environmental protection: need not cold-producing medium, avoid the destruction of cold-producing medium to atmospheric ozone layer fully, also can not form the greenhouse effects of atmosphere, is real Green Product;
5, electrodeless adjusting: the electrodeless input power that precisely realizes semiconductor thermoelectric refrigeration assembly 2 Switching Power Supplies is regulated, and avoids using the unnecessary start and stop in the period; High-precision in addition PID control and indoor systemic circulation air quantity can be on the bases of indoor ± 0.2 ℃ precision constant temperature, and the air drying when avoiding freezing is guaranteed indoor needed constant relative humidity;
6, reliability: need not mechanical moving element and wearing and tearing thereof such as powerful compressor, circulating pump, cooling blower in the system, need not lubricating oil and oil return thereof control, its core semiconductor thermoelectric cooling assembly 2 has passed through 200,000 hours anti-aging test, convert according to the average operation time, can use safely 30 years, thereby improve reliability;
7, low noise: mechanical moving elements such as compressor-free, circulating pump, cooling blower, produced when having only the running of indoor and outdoor small-power blower fans than low noise;
8, starting current:, therefore just significantly reduced starting current required for the present invention because semiconductor thermoelectric refrigeration assembly 2 need not to overcome the machinery inertial when starting;
9, electromagnetic compatibility: system need not frequency converter, therefore no electromagnetic interference need not electromagnetism suppressing device, in the exigent occasion of electromagnetic interference, as industries such as communication, power station, TV, broadcasting, calculating, monitoring, accurate laboratories, all can use relievedly safely;
10, designs simplification: need not (compressor etc.) refrigerant loop, (circulating pump etc.) circulating water loop, (cooling blower etc.) cooling air loop and control system thereof, thereby can installation, the control of the concentrated and through engineering approaches of the refrigeration system of existing central air-conditioning, circulation, cooling tower etc. significantly be reduced to dispersion of the present invention and electrification of domestic and install, controls; Not only existing split-type air conditioner can be replaced comprehensively, and existing central air-conditioning can be replaced comprehensively;
11, independent control:, can realize the input power of product of the present invention its operation of independent control, Switching Power Supply in each room and household cost allocation etc. easily, and not disturb mutually, thereby significantly simplify its maintenance, maintenance work for large-scale building;
12, economy: initial cost is lower, and operating cost is low, and life cycle is long.
The present invention is provided with the semiconductor thermoelectric refrigeration heat-sink unit of many groups both sides intersection fin, the both sides intersection fin of its adjacent cells, its air flow channel direction is all identical in twos with the pyroelectricity of reclining semiconductor thermoelectric refrigeration assembly one side, and how group intersection fins freeze in twos is incubated the heat exchange air channel with dispel the heat in twos space and vertical intersecting to form; And drive by indoor fan and outdoor fan respectively, with indoor air stream and flow of outside air direct heat transfer; Thereby with simple in structure, with low cost, safe and reliable, efficiency improve, mode easy for installation, the industrialization revolution of guiding semiconductor thermoelectric refrigeration air-conditioning!
(4) description of drawings
Below in conjunction with the drawings and specific embodiments, the present invention will be further described.
Accompanying drawing 1 is the exploded view of the semiconductor thermoelectric refrigeration heat-sink unit 1 of both sides of the present invention intersection fin.
Accompanying drawing 2 is stereograms of the semiconductor thermoelectric refrigeration heat-sink unit 1 of both sides of the present invention intersection fin.
Accompanying drawing 3 is structural representations of cross air flue semiconductor thermoelectric refrigeration air-conditioner of the present invention.
Accompanying drawing 4 is stereograms of cross air flue semiconductor thermoelectric refrigeration air-conditioner of the present invention.
(5) specific embodiment
As accompanying drawing 1 to shown in the accompanying drawing 4, among the embodiment of the 2.4kW refrigerating capacity cross air flue semiconductor thermoelectric refrigeration air-conditioner that the present invention proposes, be provided with 24 groups of both sides intersection fins, the semiconductor thermoelectric refrigeration heat-sink unit 1 of total input electric power 0.686kW, every unit 1 is provided with one group and constitutes square 120mm * 120mm, the semiconductor thermoelectric refrigeration assembly 2 that thick 10mm is tabular, by the screw of 4 couples of diameter 4mm, the nut anchorage clip is located between two identical heat exchangers 3, with 100W refrigerating capacity and the 131W heat dissipation capacity that semiconductor thermoelectric refrigeration assembly 2 two sides are produced, diffusing respectively indoor air stream and the flow of outside air in both sides heat exchanger 3; Described two heat exchangers 3 are made by aluminium, and be provided with the heat transfer flat board 4 of square 140mm * 140mm, thick 5mm, described heat transfer dull and stereotyped 4 is to be made by aluminium, the exhausted electric heat-conducting layer 5 of side plate face by square 130mm * 130mm, thick 0.5mm closely abuts in a side surface of semiconductor thermoelectric refrigeration assembly 2, and described exhausted electric heat-conducting layer 5 is to carry out the aluminum oxide coating 5 that differential arc oxidation forms the thin and fine and close exhausted electric heat conduction of one deck by the dull and stereotyped 4 side plate faces that recline thermoelectric cooling assembly 2 that conduct heat of the aluminum to heat exchanger 3.Make heat exchanger 3 and semiconductor thermoelectric refrigeration assembly 2 when keeping electrical insulating property, also have good heat conductivity like this; And, not only can avoid heat transfer temperature loss with the exhausted electric conducting strip 5 of exhausted electric heat conducting coating 5 alternative original potteries, with the Energy Efficiency Ratio of raising semiconductor thermoelectric refrigeration heat-sink unit 1, and make its overall structure compact more.The relative both sides of lateral plates are provided with the insulation installing plate 6 of the 140mm * 30mm of pair of parallel, thick 5mm in addition, post the thick PE heat-insulation layer of 10mm in its outside, interconnect and are installed in the shell body 7 so that organize semiconductor thermoelectric refrigeration heat-sink unit 1 more; The every pair of insulation is fixed with some and its 120mm * 30mm in the same way, the parallel aluminium fin 8 of thick 0.35mm, pitch of fins 2.0mm between the installing plate 6, and being fixed in the described aluminum heat transfer dull and stereotyped 4, and the arranged direction square crossing of heat exchanger 3 fins 8 of semiconductor thermoelectric refrigeration assembly 2 both sides by soldering; The semiconductor thermoelectric refrigeration heat-sink unit 1 of described 24 groups of both sides intersection fin docks mutually, the both sides intersection fin 8 of its adjacent cells 1, the air flow channel direction is all identical in twos with the pyroelectricity of reclining semiconductor thermoelectric refrigeration assembly 2 one sides, so that 24 groups intersect fin 8 and form the refrigeration insulation heat exchange air channel of 12 spaces in twos on same air-flow direction, and the heat radiation of forming 12 spaces on its square crossing air-flow direction in twos is incubated heat exchange air channel (air channel at two ends respectively is half), be collectively referred to as and intersect insulation heat exchange air channel 9, and respectively with indoor air stream and flow of outside air direct heat transfer.The room air loop is formed with the thermal insulation wind pipe 10 that its room air air inlet is connected with air outlet in described intersection insulation heat exchange air channel 9, is provided with 3 groups of indoor fans 11 in this loop, its global cycle air quantity 1440m
3/ h, and the air inlet of thermal insulation wind pipe 10 is provided with filter 14, and its air outlet is provided with wind-guiding grate 15; And the air inlet of its outdoor air and/or air outlet are connected with airduct 12, and the air outlet of this airduct 12 or air inlet are provided with 6 outdoor fans 13, its global cycle air quantity 1886m
3/ h.The room air runner vertically downward in intersection insulation heat exchange air channel 9, and the below of air outlet is provided with the drainpipe 17 of ponding dish 16 and diameter 10mm thereof, to collect the condensate water that the surface formed and fell along vertical fins 8, because on the surface of fin 8, therefore the flow direction of condensate water is identical with flowing to of room air, has just avoided current against airflow obstruction problem that wind direction very easily caused.Semiconductor thermoelectric refrigeration assembly 2 is to form made semiconductor heat electric device behind the two dimensional quantum well superlattice structure by the biobelt material, and composition such as flow deflector, when semiconductor thermoelectric refrigeration assembly 2 freezes or heats, electric current flows into semiconductor thermoelectric refrigeration assembly 2 through flow deflector, and corresponding cold junction face and hot junction face appear in every pair of semiconductor thermoelectric element.Intersecting the room air air outlet in insulation heat exchange air channel 9, in the thermal insulation wind pipe 10 between the wind-guiding grate 15, be provided for the auxiliary 1kW power electric heater 18 that adds hot-air.
The embodiment of the invention when 27 ℃ of 35 ℃ of ambient air temperatures and indoor air temperatures, can realize the specified refrigeration work consumption 2.4kW of air-conditioning, single-phase electricity 220V, 50Hz, input electric power 0.686kW, the coefficient of performance 3.5, room air air circulation 1440m
3/ h, outdoor air air circulation 1886m
3/ h is apart from unit 1m place operation noise 46dB (A), operating weight 40kg.When 20 ℃ of 7 ℃ of ambient air temperatures and indoor air temperatures, can realize the specified power 2.8kW that heats of heating, single-phase electricity 220V, 50Hz, input electric power 0.686kW, the coefficient of performance 4.1, room air air circulation 1440m
3/ h, outdoor air air circulation 1886m
3/ h is apart from unit 1m place operation noise 46dB (A), operating weight 40kg.
Claims (9)
1. cross air flue semiconductor thermoelectric refrigeration air-conditioner, it intersects the semiconductor thermoelectric refrigeration heat-sink unit (1) of fin by both sides; Semiconductor thermoelectric refrigeration assembly (2); Heat exchanger (3); Conduct heat dull and stereotyped (4); Exhausted electric heat-conducting layer (5); Insulation installing plate (6); Shell body (7); Fin (8); Intersect and be incubated heat exchange air channel (9); Thermal insulation wind pipe (10); Indoor fan (11); Airduct (12); Outdoor fan (13); Filter (14); Wind-guiding grate (15); Ponding dish (16); Drainpipe (17); Electric heater (18) is formed, it is characterized in that: the semiconductor thermoelectric refrigeration heat-sink unit (1) that is provided with some groups of both sides intersection fins, every unit (1) is provided with one group and constitutes the tabular semiconductor thermoelectric refrigeration assembly (2) of square, fastened being located between two identical heat exchangers (3), with refrigerating capacity and the heat dissipation capacity that semiconductor thermoelectric refrigeration assembly (2) two sides are produced, diffusing respectively indoor air stream and the flow of outside air in both sides heat exchanger (3); Described two heat exchangers (3) are equipped with square heat transfer dull and stereotyped (4), the side plate face closely abuts in by the side surface of exhausted electric heat-conducting layer (5) with semiconductor thermoelectric refrigeration assembly (2), the relative both sides of lateral plates are provided with the insulation installing plate (6) of pair of parallel in addition, interconnect and are installed in the shell body (7) so that organize semiconductor thermoelectric refrigeration heat-sink unit (1) more; Be fixed with some and its parallel fins (8) in the same way between every pair of insulation installing plate (6), and the arranged direction square crossing of heat exchanger (3) fin (8) of semiconductor thermoelectric refrigeration assembly (2) both sides; Semiconductor thermoelectric refrigeration heat-sink unit (1) butt joint mutually of described many groups both sides intersection fin, the both sides intersection fin (8) of its adjacent cells (1), the air flow channel direction is all identical in twos with the pyroelectricity of reclining semiconductor thermoelectric refrigeration assembly (2) one sides, so that many group intersection fins (8) are formed the refrigeration insulation heat exchange air channel of space in twos on same air-flow direction, and the heat radiation of forming the space on its square crossing air-flow direction in twos is incubated the heat exchange air channel, be collectively referred to as and intersect insulation heat exchange air channel (9), and respectively with indoor air stream and flow of outside air direct heat transfer; The room air loop is formed with the thermal insulation wind pipe (10) that its room air air inlet is connected with air outlet in described intersection insulation heat exchange air channel (9), is provided with several chambers inner blower (11) in this loop; And the air inlet of its outdoor air and/or air outlet are connected with airduct (12), and air outlet of this airduct (12) or air inlet are provided with some outdoor fans (13).
2. cross air flue semiconductor thermoelectric refrigeration air-conditioner according to claim 1 is characterized in that: room air thermal insulation wind pipe (10), its air inlet are provided with filter (14), and its air outlet is provided with wind-guiding grate (15).
3. cross air flue semiconductor thermoelectric refrigeration air-conditioner according to claim 1 is characterized in that: intersect the middle room air runner in insulation heat exchange air channel (9) vertically downward, and the below of air outlet is provided with ponding dish (16) and drainpipe (17) thereof.
4. cross air flue semiconductor thermoelectric refrigeration air-conditioner according to claim 1, it is characterized in that: described heat exchanger (3) is aluminum-made heat exchanger (3), and described exhausted electric heat-conducting layer (5) is to carry out the aluminum oxide coating (5) that differential arc oxidation forms exhausted electric heat conduction by dull and stereotyped (4) the recline side plate face of thermoelectric cooling assembly (2) that conducts heat of the aluminum to heat exchanger (3).
5. cross air flue semiconductor thermoelectric refrigeration air-conditioner according to claim 1 is characterized in that: described heat exchanger (3) is copper heat exchanger (3), and described exhausted electric heat-conducting layer (5) is the potsherd (5) of exhausted electric heat conduction.
6. cross air flue semiconductor thermoelectric refrigeration air-conditioner according to claim 1, it is characterized in that: described semiconductor thermoelectric refrigeration assembly (2) is made up of semiconductor heat electric device and flow deflector, when semiconductor thermoelectric refrigeration assembly (2) freezes or heats, electric current flows into the semiconductor heat electric device through flow deflector, and corresponding cold junction face and hot junction face appear in every pair of semiconductor thermoelectric element.
7. cross air flue semiconductor thermoelectric refrigeration air-conditioner according to claim 1 is characterized in that: a side of described insulation installing plate (6) is posted heat-insulation layer.
8. cross air flue semiconductor thermoelectric refrigeration air-conditioner according to claim 1 is characterized in that: described semiconductor thermoelectric refrigeration assembly (2), by some screw, nut anchorage clip are located between two identical heat exchangers (3).
9. cross air flue semiconductor thermoelectric refrigeration air-conditioner according to claim 1, it is characterized in that: intersecting the room air air outlet in insulation heat exchange air channel (9), in the thermal insulation wind pipe 10 between the wind-guiding grate (15), be provided for the auxiliary electric heater (18) that adds hot-air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010141500A CN101806478A (en) | 2010-04-06 | 2010-04-06 | Cross air flue semiconductor thermoelectric refrigeration air-conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010141500A CN101806478A (en) | 2010-04-06 | 2010-04-06 | Cross air flue semiconductor thermoelectric refrigeration air-conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101806478A true CN101806478A (en) | 2010-08-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010141500A Pending CN101806478A (en) | 2010-04-06 | 2010-04-06 | Cross air flue semiconductor thermoelectric refrigeration air-conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101806478A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103732037A (en) * | 2012-10-12 | 2014-04-16 | 台达电子工业股份有限公司 | Heat exchanging device and electronic device with the same |
| CN105823198A (en) * | 2016-05-12 | 2016-08-03 | 广州市雷子克电气机械有限公司 | Heat exchange device and semiconductor air conditioner comprising same |
| WO2018171367A1 (en) * | 2017-03-20 | 2018-09-27 | 上海安闻汽车电子有限公司 | Temperature regulating device, system and method |
| CN109798649A (en) * | 2018-11-30 | 2019-05-24 | 陈柏年 | Semiconductor full heat recovery device, fresh air ventilator and rotary dehumidifier |
| CN111397049A (en) * | 2020-04-20 | 2020-07-10 | 珠海格力电器股份有限公司 | Semiconductor air conditioner |
| CN112696751A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Air conditioning device based on 3D temperature-uniforming plate module |
-
2010
- 2010-04-06 CN CN201010141500A patent/CN101806478A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103732037A (en) * | 2012-10-12 | 2014-04-16 | 台达电子工业股份有限公司 | Heat exchanging device and electronic device with the same |
| CN103732037B (en) * | 2012-10-12 | 2016-12-21 | 台达电子工业股份有限公司 | Heat-exchange device and apply its electronic installation |
| CN105823198A (en) * | 2016-05-12 | 2016-08-03 | 广州市雷子克电气机械有限公司 | Heat exchange device and semiconductor air conditioner comprising same |
| WO2018171367A1 (en) * | 2017-03-20 | 2018-09-27 | 上海安闻汽车电子有限公司 | Temperature regulating device, system and method |
| CN109798649A (en) * | 2018-11-30 | 2019-05-24 | 陈柏年 | Semiconductor full heat recovery device, fresh air ventilator and rotary dehumidifier |
| CN111397049A (en) * | 2020-04-20 | 2020-07-10 | 珠海格力电器股份有限公司 | Semiconductor air conditioner |
| CN112696751A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Air conditioning device based on 3D temperature-uniforming plate module |
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Application publication date: 20100818 |