CN101799694A - Temperature tactile representation device with variable heat capacity - Google Patents
Temperature tactile representation device with variable heat capacity Download PDFInfo
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- CN101799694A CN101799694A CN201010104011A CN201010104011A CN101799694A CN 101799694 A CN101799694 A CN 101799694A CN 201010104011 A CN201010104011 A CN 201010104011A CN 201010104011 A CN201010104011 A CN 201010104011A CN 101799694 A CN101799694 A CN 101799694A
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Abstract
The invention provides a temperature tactile representation device with variable heat capacity, which is provided with a semiconductor cooler, a radiator, two temperature sensors and a measurement and control circuit, wherein the semiconductor cooler is used as a core of temperature control and hand perception, and consists of a P-N structure which is energized with direct current and is provided a cold end surface and a hot end surface; the radiator comprises a switch chamber with a cavity and a cooling liquid-gas two-path switching system, the cooling liquid switching system feeds cooling liquid to the cavity of the switch chamber by a cooling liquid groove via pipelines, and the switch chamber is communicated with the cooling liquid groove via a cooling liquid outlet pipeline; the gas path switching system switches air by an air inlet pipeline and an air outlet pipeline which are communicated with the cavity of the switch chamber; the pipelines of the cooling liquid-gas two-path switching system are respectively provided with an electromagnetic valve and a pump which are in connection with output control signal of the measurement and control circuit; the measurement and control circuit has a well-known power supply circuit, an analog-to-digital conversion circuit, a signal conditioning circuit and a control chip; and the two temperature sensors are respectively used for collecting temperatures of hand and the semiconductor cooler and outputs the temperatures to the measurement and control circuit.
Description
Technical field
The present invention relates to the tactile sense reproduction in the virtual reality technology, especially a kind of temperature tactile representation device of variable heat capacity, this device can be realized the near-end reproduction of remote temperature sense of touch, belong to technical field of measurement and test.
Background technology
Along with the develop rapidly of electronic information technology, virtual reality technology becomes one of the most challenging information application technology of 21st century as the forward position and the focus of the research of current information technical field." many perception, interactivity and telepresenc " is the target that desirable virtual reality system is pursued.The importance of technology extensively has been familiar with and has been got+arrive to be furtherd investigate, continue to optimize and perfect power sense of touch algorithm and flexibility, texture sense of touch reproducing apparatus can be simulated virtual scene object flexibility, texture force touch characteristic preferably, and senses of touch such as shape sense of touch, temperature sense of touch can perceptual object style characteristic, heat attribute etc., still few in the human-computer interaction technology research in this field.
Sense of touch is the important means in the human perception external world.The temperature sense of touch is being brought into play important effect as a kind of of sense of touch in people's whole sensory perceptual system, staff has different temperature sensations when touching the object of different hot attributes, and the people can judge the hot attribute of object in view of the above.Up to the present, the research to sense of touch both at home and abroad all concentrates on the power sense of touch, also the appearance of strong tactile representation device.And the temperature sense of touch is as the main supplementary means of power sense of touch, sets up in sense of touch and brought into play important effect in the process.In virtual reality technology, add the temperature sense of touch and can strengthen people's telepresenc and feeling of immersion.
Temperature tactile sense reproduction technology is an emerging research direction, and related subject is numerous, and the subject of leap has many aspects such as circuit electronics, machinery, materialogy.Its widespread use in medical science, military affairs, robot simulation, industrial manufacturing, education and each field of amusement thereof will be further strengthened in the further investigation of temperature tactile sense reproduction technology.
Owing to relate to the transmission and the control of temperature in the temperature tactile representation device, therefore the notion of specific heat capacity is very important, and specific heat capacity claims specific heat capacity again, is called for short specific heat capacity, be the thermal capacity of unit mass material, the absorption when promptly being unit mass object change unit temperature or the interior energy of release.The specific heat capacity value of common material is as shown in the table, and specific heat capacity is high more, and the identical temperature energy needed that raises is just many more.
| Air (room temperature) | ??1030(Jg(Kgg℃) -1) |
| Water | ??4200(Jg(Kgg℃) -1) |
| Kerosene | ??2100(Jg(Kgg℃) -1) |
| Ice | ??2100(Jg(Kgg℃) -1) |
Semiconductor refrigerating is named thermoelectric cooling or thermoelectric cooling again, is the material with thermoelectric energy conversion characteristic, and refrigerating function is arranged by direct current the time, therefore is called thermoelectric cooling.Thermoelectric cooling is that thermoelectric effect mainly is a Peltier effect.Peltier effect is exactly an electric current when flowing through the interface of two kinds of different conductors, will absorb heat from the external world, or emit heat to the external world.A P-type semiconductor and a N-type semiconductor are stacked together, pass through direct current in the above, then can on the joint of P-type semiconductor and N-type semiconductor, produce the exchange (as Fig. 1) of the temperature difference and heat, in the time of by big electric current, and under the good situation of hot-side heat dissipation, cold junction can be lowered the temperature soon.
At present abroad aspect temperature tactilely-perceptible and transcriber, mainly be single thermal source, the refrigeration of based semiconductor pyrogenicity, it is merely air-cooled or water-cooled, rate of temperature fall can reach-4 ℃/s, use air-cooled effect obviously not have the good of water-cooled, use the temperature sense of touch reproducing apparatus of water-cooled not consider in the process of heating, to make heating rate decline very fast because the existence of water has improved specific heat capacity at semiconductor cooler.
By retrieval, the patent of domestic tactile representation device based on temperature has CN200510038437.5 and CN200510038437.5, these two patents are based on the temperature tactile representation device of liquid coolant jet, adopt uniform temperature, the water jet of certain pressure gives the experimenter of near-end to realize the tactile sense reproduction of near-end.The present domestic temperature tactile representation device that does not also have the based semiconductor refrigerator.
Summary of the invention
At prior art, the present invention proposes a kind of temperature tactile representation device of variable heat capacity.The temperature variation of staff when this device can reproduce staff and touches different thermal capacity object.The people can be judged the thermal capacity of object according to temperature variation, realize the reproduction of remote environment.But the heating and cooling of this device rapid rate reach the heating rate of 10 ℃/s and the rate of temperature fall of-5 ℃/s, can change fast the conductor temperature refrigerator temperature and by certain algorithm controls in stationary temperature.
The technical scheme of apparatus of the present invention is: a kind of temperature tactile representation device of variable heat capacity, it is characterized in that: be provided with semiconductor cooler, heating radiator, temperature sensor and telemetry circuit, with the core of semiconductor cooler as temperature control and staff perception, wherein: semiconductor cooler system becomes by being connected with galvanic P-N structure, has hot and cold two end faces; Heating radiator comprises the switch room that is provided with cavity and liquid coolant, gas two-path switching system, and liquid coolant exchange system system advances liquid coolant by pipeline to switch room's cavity by the cooling liquid bath that is provided with, and the switch room is by going out coolant duct and cooling off liquid bath and be communicated with; Gas path switching system is by the inlet, outlet pipeline exchange of air that is communicated with switch room's cavity; Be provided with solenoid valve and pump respectively on the pipeline in liquid coolant, the gas two-path switching system, solenoid valve and pump are connected with the output control signal of telemetry circuit; Telemetry circuit contains known power circuit, analog to digital conversion circuit, signal conditioning circuit and control chip; Be provided with two temperature sensors, gather the temperature of staff and semiconductor cooler respectively and input to telemetry circuit.Liquid coolant can adopt water, kerosene, frozen water etc.
Said two temperature sensors all adopt the radiant type infrared sensor, and said semiconductor cooler adopts double-deck semiconductor cooler structure, also can adopt the semiconductor cooler of individual layer.
The principle of work of apparatus of the present invention: two radiant type infrared sensors, a temperature that is used to measure staff, (advantage of infrared measurement of temperature is non-cpntact measurement to a temperature that is used for measuring in real time semiconductor cooler, response speed is fast, high 1～4 order of magnitude of sensor that remolding sensitivity is traditional, volume is little, and is in light weight, this device uses infrared sensor to come temperature is measured in real time, and reaction velocity has been brought facility for control fast).By the folding of telemetry circuit control electromagnetic valve and the action of pump, when semiconductor cooler need heat, control signal 1 made the liquid coolant closed electromagnetic valve, control signal 2 is opened the pneumoelectric magnet valve, air pump starts, and air enters switch room's cavity, has reduced the thermal capacity of switch room's cavity inside.When semiconductor cooler need freeze, control signal 1 was opened the liquid coolant solenoid valve, and control signal 2 is closed the pneumoelectric magnet valve, and coolant pump starts, and liquid coolant enters switch room's cavity, has improved the thermal capacity of switch room's cavity inside.Cavity volume in the switch room is certain, whole switch room has different thermal capacity when therefore filling different materials (liquid coolant or air) in the cavity, thereby make the hot junction face cooling of semiconductor cooler or the speed that heats up change, also just directly influenced the cooling or the heating rate of the cold junction face of semiconductor cooler.Because the use that liquid coolant/autogenous cutting changes can promptly be controlled at temperature on the temperature of experiment for the second time after experiment finishes for the first time, make the time of experiment for the first time and the time of experiment for the second time to shorten, reduce the time of reproduction experiment.The temperature sensing data that have far-end in the telemetry circuit control chip, earlier semiconductor cooler is controlled at the temperature of the staff of measuring by infrared sensing, the temperature of semiconductor cooler is controlled at the temperature value of staff, and device does not dispel the heat to improve heating rate when heating.When the reproduction touch temperature is higher than staff temperature, control liquid coolant, autogenous cutting change, make air enter switch room's cavity, when staff is placed on the semiconductor cooler, the DC electrode direction at control semiconductor cooler two ends can make semiconductor cooler heat or freeze, and the temperature of controlling semiconductor cooler according to the temperature sensing data in real time of control chip allows the experimenter experience the variation of temperature process; When the reproduction touch temperature is lower than staff temperature, control liquid coolant autogenous cutting changes, make liquid coolant enter switch room's cavity, when staff is placed on the semiconductor cooler, the electrode direction at control semiconductor cooler two ends makes the semiconductor cooler refrigeration, and the temperature of controlling semiconductor cooler according to the temperature sensing data in real time of control chip allows the experimenter experience the variation of temperature process.Whole device is realized being rapidly heated and fast cooling, but the thermal characteristics of virtual reappearance different objects.The inventive point of apparatus of the present invention is to pass through the thermal capacity of liquid coolant, gas interchange system change temperature transcriber, and the refrigeration exchange media adopts liquid coolant, gas, and heat exchange device comprises gas, coolant pump and semiconductor cooler.
Compared with prior art, beneficial effect of the present invention is:
1, the people can carry out the temperature tactile sense reproduction to thermal capacity long-range or that virtual environment sensing hand is touched by temperature tactile representation device, makes it produce temperature sense of touch telepresenc, feeling of immersion;
2, the method that adopts heating to hold has improved the speed of the intensification and the cooling of temperature tactile representation device, enlarges the kind that temperature tactile representation device reproduces the object thermal characteristics;
3, radiation temperature sensor can be realized high speed, high precision non-contact type temperature measurement;
4, can reduce temperature tactile representation device greatly and carry out the needed time of repeated experiments;
5, rate temperature change fast, programming rate is better than 10 ℃/s, and rate of temperature fall is better than-5 ℃/s.
6, this device integral body is used to reproduce long-range temperature data, and remote temperature-sensing data (along with the temperature data of time variation) have been stored on the control chip of near-end.The control circuit of near-end carries out temperature control according to the temperature sensing data of storage to semiconductor cooler, for controlling the temperature of semiconductor system device better, use infrared temperature sensor that the semiconductor cooler of near-end is carried out temperature survey, and the data of measuring are fed back to closed-loop control of control chip formation.
Description of drawings
Fig. 1 is the relation in semiconductor cooler working current and cold junction hot junction;
Fig. 2,3 is respectively the overall construction drawing and the theory diagram of apparatus of the present invention;
Fig. 4 is the exchange system block diagram of heating radiator in apparatus of the present invention;
Fig. 5 is the switch room of heating radiator in apparatus of the present invention;
Fig. 6 is that liquid coolant, autogenous cutting change synoptic diagram.
Embodiment
Referring to Fig. 2,3, the temperature tactile representation device of variable heat capacity of the present invention, be provided with semiconductor cooler 4, heating radiator, two infrared temperature sensors 2,3 and telemetry circuit 1, (adopt double-deck semiconductor cooler with semiconductor cooler, the performance of double-deck semiconductor cooler doubles than the performance of the semiconductor cooler of individual layer under same environment) as the core of temperature control and staff perception, wherein: semiconductor cooler 1 is to become by being connected with galvanic P-N structure, has hot and cold two end faces; Heating radiator comprises the switch room 10 (being fixed on mainboard 1 by back up pad 9) that is provided with cavity (cavity is used for flowing of liquid coolant or air so that semiconductor cooler can be taken away heat in refrigeration) and liquid coolant (can adopt water), gas two-path switching system, liquid coolant exchange system system advances liquid coolant by pipeline to switch room's 10 cavitys by the cooling liquid bath 11 that is provided with, and switch room 10 is communicated with cooling liquid bath 11 by going out coolant duct; Gas path switching system is by the inlet, outlet pipeline exchange of air that is communicated with switch room's 10 cavitys; Be provided with solenoid valve 5,8 and pump 7,6 on the pipeline in liquid coolant, the gas two-path switching system respectively, solenoid valve 5,8 and pump 7,6 are connected with the output control signal of telemetry circuit; Telemetry circuit (being arranged on the mainboard 1) contains known power circuit, analog to digital conversion circuit, signal conditioning circuit and control chip, control chip is controlled the operation of whole device, two infrared temperature sensors 2,3 place semiconductor cooler 4 upper surfaces one side, gather the temperature of staff and semiconductor cooler respectively and input to telemetry circuit, semiconductor cooler 4 lower surfaces and switch room 10 fit, and constitute contact and transmit heat.
Referring to Fig. 4,5,6, the switch room 10 of heating radiator is a cavity structure, be provided with inlet, outlet 12,14 and liquid coolant import and export 13,15, they respectively with pipeline, cooling liquid bath 11 and air communication after, under the solenoid valve that in corresponding pipeline, is provided with and the control of pump, realize that as required the liquid coolant, the autogenous cutting that enter switch room 10 change, changed thermal capacity.
Claims (3)
1. the temperature tactile representation device of a variable heat capacity, it is characterized in that: be provided with semiconductor cooler, heating radiator, temperature sensor and telemetry circuit, with the core of semiconductor cooler as temperature control and staff perception, wherein: semiconductor cooler system becomes by being connected with galvanic P-N structure, has hot and cold two end faces; Heating radiator comprises the switch room that is provided with cavity and liquid coolant, gas two-path switching system, and liquid coolant exchange system system advances liquid coolant by pipeline to switch room's cavity by the cooling liquid bath that is provided with, and the switch room is by going out coolant duct and cooling off liquid bath and be communicated with; Gas path switching system is by the inlet, outlet pipeline exchange of air that is communicated with switch room's cavity; Be provided with solenoid valve and pump respectively on the pipeline in liquid coolant, the gas two-path switching system, solenoid valve and pump are connected with the output control signal of telemetry circuit; Telemetry circuit contains known power circuit, analog to digital conversion circuit, signal conditioning circuit and control chip; Be provided with two temperature sensors, gather the temperature of staff and semiconductor cooler respectively and input to telemetry circuit.
2. according to the temperature tactile representation device of the described variable heat capacity of claim 1, it is characterized in that: two temperature sensors are the radiant type infrared sensor.
3. according to the temperature tactile representation device of claim 1 or 2 described variable heat capacities, it is characterized in that: semiconductor cooler adopts double-deck semiconductor cooler structure.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010101040116A CN101799694B (en) | 2010-02-01 | 2010-02-01 | Temperature tactile representation device with variable heat capacity |
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| CN2010101040116A CN101799694B (en) | 2010-02-01 | 2010-02-01 | Temperature tactile representation device with variable heat capacity |
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| CN101799694A true CN101799694A (en) | 2010-08-11 |
| CN101799694B CN101799694B (en) | 2011-08-10 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101968664A (en) * | 2010-09-30 | 2011-02-09 | 东南大学 | Surface temperature signal fast generating device |
| CN102323838A (en) * | 2011-08-16 | 2012-01-18 | 东南大学 | A kind of many heat source high-speeds temperature reappears system |
| CN102331800A (en) * | 2011-05-18 | 2012-01-25 | 东南大学 | Multi-heat-source temperature touch representing device |
| CN102635987A (en) * | 2012-04-28 | 2012-08-15 | 青岛大学 | Auxiliary refrigerating system of semitight heat capacity variable refrigerating plant |
| CN103279151A (en) * | 2013-05-20 | 2013-09-04 | 东南大学 | Wearable structure of temperature recurrence device and wearable temperature recurrence device |
| CN105843380A (en) * | 2016-03-17 | 2016-08-10 | 广东小天才科技有限公司 | Environmental temperature simulation method and device for virtual reality scene |
-
2010
- 2010-02-01 CN CN2010101040116A patent/CN101799694B/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101968664A (en) * | 2010-09-30 | 2011-02-09 | 东南大学 | Surface temperature signal fast generating device |
| CN101968664B (en) * | 2010-09-30 | 2012-06-27 | 东南大学 | Surface temperature signal fast generating device |
| CN102331800A (en) * | 2011-05-18 | 2012-01-25 | 东南大学 | Multi-heat-source temperature touch representing device |
| CN102331800B (en) * | 2011-05-18 | 2013-09-18 | 东南大学 | Multi-heat-source temperature touch representing device |
| CN102323838A (en) * | 2011-08-16 | 2012-01-18 | 东南大学 | A kind of many heat source high-speeds temperature reappears system |
| CN102323838B (en) * | 2011-08-16 | 2013-08-28 | 东南大学 | Multi-heat-source high-speed temperature reproduction system |
| CN102635987A (en) * | 2012-04-28 | 2012-08-15 | 青岛大学 | Auxiliary refrigerating system of semitight heat capacity variable refrigerating plant |
| CN102635987B (en) * | 2012-04-28 | 2015-01-14 | 青岛大学 | Auxiliary refrigerating system of semitight heat capacity variable refrigerating plant |
| CN103279151A (en) * | 2013-05-20 | 2013-09-04 | 东南大学 | Wearable structure of temperature recurrence device and wearable temperature recurrence device |
| CN103279151B (en) * | 2013-05-20 | 2015-02-18 | 东南大学 | Wearable structure of temperature recurrence device and wearable temperature recurrence device |
| CN105843380A (en) * | 2016-03-17 | 2016-08-10 | 广东小天才科技有限公司 | Environmental temperature simulation method and device for virtual reality scene |
| CN105843380B (en) * | 2016-03-17 | 2019-05-14 | 广东小天才科技有限公司 | Environmental temperature simulation method and device for virtual reality scene |
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| CN101799694B (en) | 2011-08-10 |
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Granted publication date: 20110810 Termination date: 20140201 |