CN101797714A - Wafer online cleaning device of polishing machine - Google Patents
Wafer online cleaning device of polishing machine Download PDFInfo
- Publication number
- CN101797714A CN101797714A CN 201010129842 CN201010129842A CN101797714A CN 101797714 A CN101797714 A CN 101797714A CN 201010129842 CN201010129842 CN 201010129842 CN 201010129842 A CN201010129842 A CN 201010129842A CN 101797714 A CN101797714 A CN 101797714A
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- China
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- connecting rod
- cleaning device
- wafer
- platen
- polishing machine
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a wafer online cleaning device of a polishing machine. The wafer online cleaning device comprises a spray pipe, a bedplate and a rotary cylinder, wherein the spray pipe is hinged with the bedplate; the rotary cylinder is fixed with the bedplate; a water pipe connecting bar is fixed on the spray pipe; a cylinder connecting bar is fixed on the cylinder; and an intermediate connecting bar is hinged between the water pipe connecting bar and the cylinder connecting bar to form a hinge four-bar mechanism. The wafer online cleaning device of the polishing machine has the advantages of simple structure, convenient operation and capability of effectively and timely improving polishing quality of wafer surface and obviously improving the rate of finished products of polished wafers.
Description
Technical field
The present invention relates to a kind of wafer online cleaning device of polishing machine.
Background technology
Semicon industry is in the single-sided polishing technological process to wafer, and wafer cleans with pure water through needing to be transplanted on special-purpose cleaning equipment after the polishing.Studies show that,, make wafer finish to reduce greatly, and influence the final yield rate of wafer to the surface quality of cleaning during this period of time at glossing because oxidation reaction takes place in air the fine particle that wafer surface is adhered to.Therefore, in order to improve the quality of finish of wafer, can make wafer in time obtain clear water after the polishing process that is preferably in wafer is finished and clean.
Summary of the invention:
Technical problem to be solved by this invention provides a kind of simple in structure, easy to operate wafer online cleaning device of polishing machine.
The present invention adopts following technical scheme:
The present invention includes jet pipe, platen and oscillating cylinder, wherein, jet pipe and platen are hinged, oscillating cylinder and platen are fixed, be fixed with the water pipe connecting rod on the jet pipe, be fixed with air cylinder connecting rod on the cylinder rod, a hinged intermediate connecting rod constitutes four-bar linkage between water pipe connecting rod and air cylinder connecting rod.
Jet pipe of the present invention is provided with two nozzles, the swinging end of jet pipe is provided with plug, the other end is connected with pipe joint, elbow bend and vertical tube successively, the water pipe connecting rod is fixed on the lower end of elbow bend, be provided with bearing block and spacer ring between vertical tube and platen, bearing block and platen are fixed, and spacer ring and vertical tube are fixed, for movingly, be provided with bearing between vertical tube and bearing block between spacer ring and bearing block.
Be provided with sealing ring between bearing block of the present invention and spacer ring, be provided with sealing ring between spacer ring and vertical tube equally.
Oscillating cylinder of the present invention is fixed on the sealing shroud, and sealing shroud and platen are fixed.
Beneficial effect of the present invention:
Wafer online cleaning device of polishing machine provided by the present invention is simple in structure, and is easy to operate, uses this device can improve the quality of wafer surface polishing timely and effectively, can obviously improve the yield rate of polished silicon wafer.This device is a kind of special matching used device of the original special glazing machine of semicon industry that is, is installed in during use on the former polishing machine, after polishing process is finished, just can in time go ahead of the rest to the wafer after polished and clean once.
Description of drawings
Fig. 1 is that the master of an embodiment of the present invention looks the sectional structure schematic diagram;
Fig. 2 is the plan structure schematic diagram of Fig. 1.
In the accompanying drawings: 1-nozzle 2-pipe joint 3-elbow bend 4-spacer ring 5-rotating shaft lid 6-connecting rod rotating shaft 7-air cylinder connecting rod 8-sealing shroud 9-oscillating cylinder 10-vertical tube 11-bearing 12-bearing cap 13-bearing block 14-sealing ring 15-platen 16-intermediate connecting rod 17-water pipe connecting rod 18-jet pipe 19-plug.
The specific embodiment
The invention will be further described below in conjunction with the embodiment accompanying drawing:
Referring to accompanying drawing, the present invention includes nozzle 1, jet pipe 18, connecting rod, oscillating cylinder 9 etc.Wherein, an end that connects nozzle 1 on the jet pipe 18 is embedded with a plug 19, and the other end is connected with a right angle elbow 3 by pipe joint 2, connects a vertical tube 10 in elbow 3 lower ends.Elbow 3 lower end outer walls and water pipe connecting rod 17 interference fit, water pipe connecting rod 17 other ends are by connecting rod rotating shaft 6 and intermediate connecting rod socket about in the of 16, and intermediate connecting rod 16 other ends and air cylinder connecting rod 7 are by another connecting rod rotating shaft socket about in the of 6.Be movingly between each connecting rod and the rotating shaft, each fixes rotating shaft lid 5 on two rotating shafts.Air cylinder connecting rod 7 and cylinder rod interference fit, oscillating cylinder 9 is fixed on the sealing shroud 8 by screw, and sealing shroud 8 and platen 15 are fixing.Be provided with bearing block 13 and spacer ring 4 between vertical tube 10 and the platen 15, be provided with sealing ring 14 between spacer ring 4 and the bearing block 13, be provided with sealing ring equally between spacer ring 4 and the vertical tube 10.Be interference fit between vertical tube 10 and the spacer ring 4, for movingly, establish a bearing 11 between bearing block 13 and the vertical tube 10 between spacer ring 4 and the bearing block 13, bearing block 13 is fixing with platen 15.
It is the quadric chain of power with oscillating cylinder 9 that wafer online cleaning device of polishing machine provided by the present invention is one.Oscillating cylinder 9 drives the reciprocally swinging that jet pipe 18 is done certain angle by air cylinder connecting rod 7, intermediate connecting rod 16 and water pipe connecting rod 17.Water tank is connected by flexible pipe in vertical tube 10 lower ends, and the pure water in the water tank enters jet pipe 18 by flexible pipe, vertical tube 10, elbow bend 3, pipe joint 2 successively, finally carries out hydroblasting by two nozzles 1 to wafer.
Claims (4)
1. wafer online cleaning device of polishing machine, it is characterized in that it comprises jet pipe (18), platen (15) and oscillating cylinder (9), wherein, jet pipe (18) is hinged with platen (15), oscillating cylinder (9) is fixing with platen (15), be fixed with water pipe connecting rod (17) on the jet pipe (18), be fixed with air cylinder connecting rod (7) on the cylinder rod, a hinged intermediate connecting rod (16) constitutes four-bar linkage between water pipe connecting rod (17) and air cylinder connecting rod (7).
2. wafer online cleaning device of polishing machine according to claim 1, it is characterized in that described jet pipe (18) is provided with two nozzles (1), the swinging end of jet pipe (18) is provided with plug (19), the other end successively with pipe joint (2), elbow bend (3) and vertical tube (10) connect, water pipe connecting rod (17) is fixed on the lower end of elbow bend (3), be provided with bearing block (13) and spacer ring (4) between vertical tube (10) and platen (15), bearing block (13) is fixing with platen (15), spacer ring (4) is fixing with vertical tube (10), for movingly, be provided with bearing (11) between vertical tube (10) and bearing block (13) between spacer ring (4) and bearing block (13).
3. wafer online cleaning device of polishing machine according to claim 2 is characterized in that being provided with sealing ring (14) between described bearing block (13) and spacer ring (4), is provided with sealing ring equally between spacer ring (4) and vertical tube (10).
4. wafer online cleaning device of polishing machine according to claim 1 is characterized in that described oscillating cylinder (9) is fixed on the sealing shroud (8), and sealing shroud (8) is fixing with platen (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101298429A CN101797714B (en) | 2010-03-23 | 2010-03-23 | Wafer online cleaning device of polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101298429A CN101797714B (en) | 2010-03-23 | 2010-03-23 | Wafer online cleaning device of polishing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101797714A true CN101797714A (en) | 2010-08-11 |
| CN101797714B CN101797714B (en) | 2012-07-11 |
Family
ID=42593634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101298429A Expired - Fee Related CN101797714B (en) | 2010-03-23 | 2010-03-23 | Wafer online cleaning device of polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101797714B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102294329A (en) * | 2011-07-11 | 2011-12-28 | 苏州赤诚洗净科技有限公司 | Precleaning device for silicon wafer of solar cell |
| CN103707179A (en) * | 2012-10-03 | 2014-04-09 | 株式会社荏原制作所 | Substrate cleaning apparatus and polishing apparatus |
| WO2014089942A1 (en) * | 2012-12-14 | 2014-06-19 | 北京七星华创电子股份有限公司 | Rinsing machine swinging spraying device and method |
| US20150209834A1 (en) * | 2012-12-14 | 2015-07-30 | Beijing Sevenstar Electronics Co., Ltd. | Swing spray device of cleaning apparatus and cleaning method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1185028A (en) * | 1996-12-12 | 1998-06-17 | 瓦克硅电子半导体材料股份公司 | Method and device for polishing semiconductor wafers |
| KR20030053376A (en) * | 2001-12-22 | 2003-06-28 | 동부전자 주식회사 | Apparatus for removing Photo Resists, and Method for removing Photo Resists on the surface of wafer using the same |
| KR20070028190A (en) * | 2005-09-07 | 2007-03-12 | 동부일렉트로닉스 주식회사 | Photo resist dispense arm that autometically fixs nozzle position |
-
2010
- 2010-03-23 CN CN2010101298429A patent/CN101797714B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1185028A (en) * | 1996-12-12 | 1998-06-17 | 瓦克硅电子半导体材料股份公司 | Method and device for polishing semiconductor wafers |
| KR20030053376A (en) * | 2001-12-22 | 2003-06-28 | 동부전자 주식회사 | Apparatus for removing Photo Resists, and Method for removing Photo Resists on the surface of wafer using the same |
| KR20070028190A (en) * | 2005-09-07 | 2007-03-12 | 동부일렉트로닉스 주식회사 | Photo resist dispense arm that autometically fixs nozzle position |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102294329A (en) * | 2011-07-11 | 2011-12-28 | 苏州赤诚洗净科技有限公司 | Precleaning device for silicon wafer of solar cell |
| CN103707179A (en) * | 2012-10-03 | 2014-04-09 | 株式会社荏原制作所 | Substrate cleaning apparatus and polishing apparatus |
| US10096492B2 (en) | 2012-10-03 | 2018-10-09 | Ebara Corporation | Substrate cleaning apparatus and polishing apparatus |
| WO2014089942A1 (en) * | 2012-12-14 | 2014-06-19 | 北京七星华创电子股份有限公司 | Rinsing machine swinging spraying device and method |
| US20150209834A1 (en) * | 2012-12-14 | 2015-07-30 | Beijing Sevenstar Electronics Co., Ltd. | Swing spray device of cleaning apparatus and cleaning method |
| US9744565B2 (en) * | 2012-12-14 | 2017-08-29 | Beijing Sevenstar Electronics Co., Ltd. | Swing spray device of cleaning apparatus and cleaning method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101797714B (en) | 2012-07-11 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 Termination date: 20160323 |