CN101794720A - Substrate buffering unit - Google Patents

Substrate buffering unit Download PDF

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Publication number
CN101794720A
CN101794720A CN201010003426A CN201010003426A CN101794720A CN 101794720 A CN101794720 A CN 101794720A CN 201010003426 A CN201010003426 A CN 201010003426A CN 201010003426 A CN201010003426 A CN 201010003426A CN 101794720 A CN101794720 A CN 101794720A
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mentioned
substrate
air
buffering unit
frame portion
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Granted
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CN201010003426A
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CN101794720B (en
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宫崎一仁
井本直树
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G45/00—Lubricating, cleaning, or clearing devices
    • B65G45/10—Cleaning devices
    • B65G45/22—Cleaning devices comprising fluid applying means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ventilation (AREA)

Abstract

The invention provides a substrate buffering unit for temporary retreating of substrate conveying toward one direction in the substrate conveying path, which can perform air purge of buffering space with high efficiency, and can reduce the cost. The substrate buffering unit includes: a box shape frame part (2), provided on the substrate conveying path, having a carrying part (6) for carrying the substrate and capable of moving the substrate to a specified position divorced from the substrate conveying path; a cleaning air supply component (4), provided on the upper surface or lateral surface of the box shape frame part, for supplying the cleaning air after purification; a ventilation path (5), for connecting together the cleaning air supply component and one lateral surface of the frame part; wherein the cleaning air supplied from the cleaning air supply component is supplied to the carrying part through an air leading-in mouth (7) formed on one lateral surface of the box shape frame part, and is supplied from the air guide exit (8) on the opposite side of the air leading-in mouth on the box shape frame part.

Description

Substrate buffering unit
Technical field
The present invention relates to a kind of make carried along substrate transport path, for example be used for the substrate buffering unit that the glass substrate of flat-panel monitor (FPD) is temporarily kept out of the way from substrate transport path, particularly relate to a kind of substrate buffering unit that can carry out air purge expeditiously to space in the buffer unit.
Background technology
In the manufacture process of FPD, adopt photoetching technique in order to form circuit pattern on the glass substrate of using at FPD.Utilizing photoetching process to form circuit pattern carries out with such step: coating liquid against corrosion on glass substrate and form resist film, with circuit pattern accordingly with the resist film exposure, it is carried out development treatment.The production line that is provided with the each processing unit of processing such as carrying out liquid coating against corrosion, development treatment along conveying circuit (substrate transport path) is adopted in the formation of circuit pattern.In the process of carrying glass substrate along conveying circuit, manage the unit throughout glass substrate is implemented predetermined process.
But, in above-mentioned production line, in order to be adjusted at the opportunity that receives and submit substrate between the each processing unit, to be provided with usually the buffer unit that makes glass substrate temporarily keep out of the way and take care of glass substrate from conveying circuit.
As such buffer unit, this case applicant discloses the buffer unit (below be called the lift buffer unit) of moving into or take out of the lift formula of substrate by the frame portion lifting that allows to mounting compound glass substrate in patent documentation 1.
Substrate according to disclosed lift buffer unit in Fig. 9 simple declaration patent documentation 1 is kept out of the way action.Lift buffer unit 200 shown in Fig. 9 (a)～Fig. 9 (c) is arranged on the conveying circuit, comprises the frame portion 205 of the 202a～202f of mounting portion with the substrate that is the multilayer setting and can support the elevating mechanism 206 of this one 205 in lifting moving ground.
When needs make substrate keep out of the way lift buffer unit 200, stop to drive the auxiliary connecting gear 210 in directions X downstream.And, first substrate G1 shown in Fig. 9 (a), that transport from the directions X upstream side by housing 201 move into mouthful 201a and whole base plate by mounting when the 202a of mounting portion goes up, connecting gear 250a stops.Thus, form substrate G1 is positioned in state on the 202a of mounting portion.
Then, when transporting next substrate G2 from the directions X upstream side, remove being connected of connecting gear 250a and its drive source.
Then, utilize elevating mechanism 206 that frame portion 205 is risen, so that the 202b of mounting portion shown in any among the 202b～202f of mounting portion, for example Fig. 9 (b) is concordant with the height of conveying circuit, the connecting gear 250b of the 202b of mounting portion is connected in its drive division and drives connecting gear 250b.At this, become the state that substrate G1 keeps out of the way from conveying circuit together with the 202a of mounting portion.Then, when whole base plate G2 mounting is on the 202b of mounting portion, stop to drive connecting gear 250b.
By repeating this operation, till removing the holding state that substrate carries, follow-up substrate G3, the G4 that transports along conveying circuit ... be positioned in respectively the 202c of mounting portion, 202d ... go up and by keeping (with reference to Fig. 9 (c)).
But above-mentioned lift buffer unit 200 is set in the clean room with other unit.Ceiling portion in the clean room is provided with the clean air feedway that is known as FFU (fan filter unit), thus, is formed with the vertical laminar flow (sinking) that air flows downwards.
In the past, utilize this sinking to guarantee indoor cleannes and accommodated cleannes in the frame portion 205 of substrate.
Use the cutaway view of the buffer unit of Figure 10 to specify to be used for the structure that cleans in the elevator gear in the past.In addition, in Figure 10, use identical Reference numeral to describe with the member that in Fig. 9, has same function.
In Figure 10, in housing 201, be provided with as outer dress panel the frame portion 205 that can accommodate a plurality of substrates with multilayer and from below can support the elevating mechanism 206 of this one 205 in lifting moving ground.In addition, for frame portion 205,, move into substrate to the paper inboard from front side (outside the paper) in the drawings towards paper.
On the top board 201a of housing 201, be formed be used for for from above the clean air that flows downwards enter into slit (not shown) in the housing 201, be formed with the slit (not shown) that is used for exhaust in the lower side of housing 201.Therefore, in housing 201, as shown by arrows the clean air that blows to the upper surface of frame portion 205 from the top spread to frame portion 205 around, and flow downwards and be discharged from.
At this, the above-mentioned clean air that spreads to around the frame portion 205 imports in this one 205 from the side (air approaching face 205a) as the frame portion 205 of substrate resettlement section, and by by discharging with opposite flank, above-mentioned side, will clean in the frame portion 205.
Patent documentation 1: TOHKEMY 2007-250671 communique
But, for the sinking that the ceiling that utilizes the auto purification chamber expeditiously lowers, FFU need be positioned at lift buffer unit 200 directly over, when production line was set, this might be subjected to the restriction of the equipment disposition in the clean room.
In addition,, when the air quantity of sinking arrives the lift buffer unit, also weaken significantly, in housing 201, can't obtain the air quantity of supplying clean air fully of in frame portion 205, trying one's best even directly over buffer unit 200, FFU is set.
Therefore, in the past by be provided with as shown in figure 10, be used for a large amount of clean airs is drawn in the frame portion 205 and it is discharged to buffer unit 200 outer exhaust apparatus 220 dealing with the problems referred to above.
But, when being provided with exhaust apparatus 220, need be provided for the pipe arrangement equipment of automatic exhauster 220 exhaust outside the clean room, there is the such problem of equipment cost rising.
In addition, frame portion 205 utilizes elevating mechanism 206 to carry out lifting moving in housing 201, and the spatial volume of frame portion 205 belows changes thereupon.Therefore, during frame portion 205 each lifting moving, the space around the elevating mechanism 206 all is compressed or expands, and might roll dust by elevating mechanism 206, has dust and enters in the frame portion 205.
For this problem, in the past, surrounded elevating mechanism 206 with shell 212 as shown in figure, utilize the air in the exhaust apparatus 220 attraction shells 212 and carry out pump-down process.
But, in this case, also need pipe arrangement equipment be set in the clean room, there is the such problem of cost rising.
And in the structure of in the past frame portion 205, the clean air that imports from air approaching face 205a is discharged from exhaust apparatus 220 by the transport driving 213 as substrate feed drive portion.
But, after the exhaust of exhaust apparatus 220 action stops, becoming negative pressure state in the frame portion 205 and make air inversion, exist the dust that produces from transport driving 213 to flow into the such problem of mounting portion.
Summary of the invention
The present invention promptly makes in these cases, its purpose is to provide a kind of substrate buffering unit of temporarily keeping out of the way to a direction substrate conveying that makes in substrate transport path, this substrate buffering unit can clean cushion space with air expeditiously, and can reduce cost.
In order to solve above-mentioned problem, substrate buffering unit of the present invention is used for temporarily being housed in the substrate transport path substrate conveying, this substrate is kept out of the way from the aforesaid substrate transport path, it is characterized in that, this substrate buffering unit comprises: the frame portion of case shape, it is arranged on the aforesaid substrate transport path, has the mounting portion that is used for the mounting substrate, and this substrate can be moved to the assigned position that breaks away from the aforesaid substrate transport path; The clean air supply part, upper surface or side that it is arranged on the frame portion of above-mentioned case shape are used to supply with the clean air after being cleaned; Ventilating path, it is used for a side of above-mentioned clean air supply part and above-mentioned portion is coupled together; Supply with the clean air that comes from above-mentioned clean air supply part and supplied to above-mentioned mounting portion by the air introducing port from a side of the frame portion that is arranged at above-mentioned case shape, and by from the frame portion that is arranged on above-mentioned case shape, discharge with the air export mouth on the side of above-mentioned air introducing port opposite side.
By constituting in this wise, even exhaust apparatus is not set, also can form the flowing of clean air of enough flows in the mounting portion of each layer in the downstream of frame portion, guarantee the cleannes in the frame portion.
Thereby, also can unlike in the past, consider the configuration mode of FFU in the clean room, can not be subjected to clean room's side restriction production line is set.
In addition, because exhaust apparatus needn't be set, therefore, increase that can the suppression equipment cost, and, can make the frame portion in the downstream that is positioned at the clean air supply part be barotropic state, therefore, can eliminate because of the problem (adverse current when running stops etc.) that exhaust apparatus produces is set.
Also be preferably, the frame portion of above-mentioned case shape has in inside the shell that is provided with the case shape of a plurality of above-mentioned mounting portion with multilayer, on a side of above-mentioned shell, be provided with a plurality of above-mentioned air introducing ports accordingly with each mounting portion, in above-mentioned ventilating path, be provided with the distribution rectification element that is used for clean air is assigned to above-mentioned a plurality of air introducing ports with the multilayer setting.
By this distribution rectification element is set, can make the shunt volume homogenizing that imports to each layer of air introducing port.
Also be preferably, this substrate buffering unit comprises the expansion rectification element, and this expansion rectification element is arranged at above-mentioned air introducing port, and the clean air that is used for supplying to from this air introducing port in the above-mentioned mounting portion expands to fan-shaped.
By this expansion rectification element is set, can makes the clean air that to be directed to each mounting portion and expand to fan-shaped, as can not to be detained air-flow state in mounting portion.
In addition, utilize to expand to fan-shaped air-flow, not only can suppress air and move into to take out of from substrate and mouthful flow into, also can move into and take out of a mouthful exhaust from substrate.
Also be preferably, the frame portion of above-mentioned case shape, with the side of above-mentioned air introducing port opposite side on be formed with a plurality of above-mentioned air export mouths, and, the cross section of a plurality of above-mentioned air export mouths is a hollow structure, the frame portion of above-mentioned case shape comprises: the substrate transfer unit, and it is used for moving into respect to above-mentioned mounting portion takes out of substrate; The feed drive parts, it is arranged on the downstream that is fed into the clean air in the above-mentioned mounting portion, is used to drive the aforesaid substrate transfer unit; The drive system exhaust component, the air export mouth of itself and above-mentioned hollow structure is separated, and only discharges the clean air that is fed into above-mentioned feed drive parts.
By the air export mouth is made such hollow structure, the downstream with respect to exhaust in the pipe becomes barotropic state, can prevent that the air inversion and the air that are discharged from from flowing into outside frame portion.
In addition, carry out rectification, can prevent to flow into mounting portion from the dust that the feed drive parts produce by exhaust pathway is separated.
Also be preferably, be respectively equipped with the flow throttle part that is used for being limited in this air export mouth flow air flow at above-mentioned a plurality of air export mouths.
By adjusting above-mentioned flow throttle part, can make the air displacement homogenizing of the air of discharging from all air export mouths at each air export mouth place.
Also be preferably, this substrate buffering unit comprises the housing of the shell that covers above-mentioned portion at least, in the clearance space between the shell of above-mentioned housing and above-mentioned portion, be provided with partition member on the outer wall of the inwall of above-mentioned housing or shell, this partition member is used for forming independently respectively the clearance space between the medial surface of a side above-mentioned portion, that be formed with above-mentioned air introducing port and above-mentioned air export mouth and the above-mentioned housing relative with this side.
By this partition member is set, can not spread to the another side of shell from the exhaust of air export mouth, can prevent from that exhaust from moving into from substrate to take out of mouth and flow into mounting portion.
Adopt the present invention, can obtain to make the substrate buffering unit of in substrate transport path, temporarily keeping out of the way, and this substrate buffering unit can carry out air purge to cushion space expeditiously, and can reduce cost to a direction substrate conveying.
Description of drawings
Fig. 1 is the sectional view of substrate buffering unit of the present invention.
Fig. 2 is that A-A among Fig. 1 is to looking cutaway view (vertical view in the unit housings).
Fig. 3 is that B-B among Fig. 2 is to looking cutaway view.
Fig. 4 is that C-C among Fig. 2 is to looking cutaway view.
Fig. 5 is that D-D among Fig. 1 is to looking cutaway view.
Fig. 6 is the cutaway view that distributes rectification element.
Fig. 7 is the stereogram of expansion rectification element.
Fig. 8 is the cutaway view of flow restriction member.
Fig. 9 is used to illustrate that the substrate of lift buffer unit keeps out of the way the figure of action.
Figure 10 is used to illustrate the cutaway view that is used for the structure that will clean in the lift buffer unit in the past.
Embodiment
Below, describe the execution mode of substrate buffering unit of the present invention with reference to the accompanying drawings in detail.Substrate buffering unit of the present invention for example is arranged on the production line that utilizes photo-mask process to form circuit pattern, temporarily accommodates the glass substrate that the FPD as processed substrate uses and makes this glass substrate withdraw from production line.
In addition, can be suitable for Fig. 9 be the buffer unit of lift formula of example explanation to substrate buffering unit of the present invention.In the following embodiments, the example that is applied to the lift buffer unit is described.
Fig. 1 is the sectional view of substrate buffering unit of the present invention, Fig. 2 is that A-A among Fig. 1 is to looking cutaway view (vertical view in the unit housings), Fig. 3 be B-B among Fig. 2 to looking cutaway view, Fig. 4 be C-C among Fig. 2 to looking cutaway view, Fig. 5 is that D-D among Fig. 1 is to looking cutaway view.
Illustrated substrate buffering unit 100 comprises: can be with the frame portion 2 glass substrate G, case shape of multilayer (among the figure being 6 layers) mounting as processed substrate in unit housings 1; Support this one 2 from the below and make the elevating mechanism 3 of these 2 lifting moving.
Glass substrate G is moved in this substrate buffering unit 100 by mouthful 1a that moves into from example unit housings 1 as shown in Figure 3, Figure 4, and is accommodated in the frame portion 2, is suitably taken out of from mouthful 1b that takes out of of opposite side then.
Moving into mouthful 1a and taking out of mouthful 1b of above-mentioned housing 1 is set to concordant with the height and position of the substrate conveying circuit (substrate transport path) of the so-called advection mode in upstream that is arranged on buffer cell 100 and downstream.
As shown in Figure 1, frame portion 2 has the shell 20 of case shape, for example is provided with (the 6a～6f) of the mounting portion 6 of 6 laminar substrate G in this shell 20.As shown in Figure 3, Figure 4, in shell 20, above-mentioned housing 1 take out of the relative side of a mouthful 1a, 1b with moving into, be provided with a plurality of substrates accordingly with the mounting portion 6 of each layer and move into mouthful 2a and take out of a mouthful 2b.
Because frame portion 2 (shell 20) can utilize elevating mechanism 3 lifting moving in housing 1, therefore, move into when taking out of glass substrate G in mounting portion 6 with respect to specified layer, frame portion 2 utilizes elevating mechanism 3 lifting moving, makes the mounting portion 6 of this specified layer be positioned at the above-mentioned height of moving into mouthful 1a and taking out of mouthful 1b.
In addition, with after substrate G mounting is in the mounting portion 6 of regulation, utilize elevating mechanism 3 to make frame portion 2 lifting moving, thereby this substrate G is kept out of the way from the substrate conveying circuit to the assigned position that breaks away from the substrate conveying circuit.
In addition, as Fig. 1, shown in Figure 5, in each mounting portion 6, be provided with a plurality of roller shape conveying axis 13 (substrate transfer unit) that are used for conveying substrate side by side, be provided with in each end of 13 to be used to rotate and drive each axle rotary drive mechanism 14 (feed drive parts) that constitutes by motor etc. of 13.
In this buffer cell 100, as shown in Figure 2, be provided with a plurality of (among the figure being 4) FFU (fan filter unit) 4a～4d (being generically and collectively referred to as FFU4) at shell 20 upper surfaces of frame portion 2.These FFU4 are such unit: have the fan that drives to the prescribed direction rotation respectively, utilize the rotation of fan to suck air from the top, generate the air (clean air) that was cleaned by filter and also this cleaned air passes is blowed to the below.That is, FFU4 plays the effect of clean air supply part.
At the ventilating path 5 (5a, 5b, 5c, 5d) that is provided with below each FFU4 as the stream of the clean air below being blown to, this ventilating path 5 is communicated in and is provided with aforesaid substrate and moves on the side of the side quadrature of taking out of a mouthful 1a, 1b in frame portion 2.
Be described more specifically, a plurality of air introducing ports 7 (air introducing port) on a side shown in Figure 3, as to be formed on above-mentioned the portion 2 that above-mentioned ventilating path 5 is communicated with import clean airs to frame portion 2.These air introducing ports 7 for example be provided with in the vertical the number of plies with mounting portion identical 6 layers, in the horizontal be 6, amount to 36.That is,, be provided with 6 air introducing ports 7 in its side for 1 layer of mounting portion 6.
Under the situation of this execution mode, whole 36 air introducing ports 7 correspondingly are divided into 4 groups with the quantity that is arranged on the FFU4 on frame portion 2 tops.That is, as shown in Figure 3, be divided into group 7A, 7B 2 groups about this, be divided into group 7C, 7D 2 groups about this with the following 3 layers corresponding air introducing port 7 of the 6d of mounting portion, 6e, 6f with the last 3 layers corresponding air introducing port 7 of the 6a of mounting portion, 6b, 6c.
Wherein, supply with from 9 air introducing ports 7 of group 7A, supply with from 9 air introducing ports 7 of group 7B by the clean air that FFU4b supplies with by the clean air that FFU4a supplies with.In addition, supply with from 9 air introducing ports 7 of group 7C, supply with from 9 air introducing ports 7 of group 7D by the clean air that FFU4d supplies with by the clean air that FFU4c supplies with.
At this, from each FFU4 respectively to vertical 3 layers air introducing port 7 supplying clean airs, in order to make its shunt volume more even, be provided with in front of the introducing port in ventilating path 5 as shown in Figure 6, correspondingly distribute the distribution rectification element 10 of air-flow with 3 layers of introducing port 7.
In addition, as shown in Figure 6, the distribution wall 10a of this distribution rectification element 10,10b are set to its position and can move freely along the direction shown in the arrow among the figure, utilize its position adjustment to adjust the flow that is directed to the clean air in the 3 layer of air introducing ports 7, so that this flow homogenizing more.
And the air-flow expectation of the clean air that supplies with from FFU4 is for after being imported to mounting portion from air introducing port 7, shown in arrow among Fig. 5 with fan out, make clean air arrive the state in each corner of mounting portion 6.
Therefore, for each mounting portion 6, in the air introducing port 7 of left and right sides both end sides, be provided with expansion rectification element 12 shown in the stereogram of Fig. 7 for example, that be used for the air flow direction of direction expansion to the left and right.By this expansion rectification element 12 is set, being directed to clean air in each mounting portion 6 becomes as illustrated in fig. 5 the state that can not be detained air-flow with fan out, in mounting portion 6.
Utilization is with the air flows of fan-shaped expansion, not only can suppress air and move into from substrate and take out of a mouthful 2a, 2b and flow into, and also can move into from substrate and take out of a mouthful 2a, 2b and carry out exhaust.
On the other hand, on shell 20, with the side of the side opposite side that is formed with above-mentioned a plurality of air introducing ports 7 on, be provided for discharging the air export mouth 8 of the air that is fed into each mounting portion 6 accordingly with every layer of mounting portion 6.That is, as shown in Figure 4, be provided with in the vertical the number of plies with mounting portion 6 identical 6 layers, be 6 air export mouth 8 (6 air export mouths 8 being set) in the horizontal for each mounting portion 6.
Wherein, the hole that the air export mouth 8a of two ends, left and right sides row offers flat on the sidewall of frame portion 2 in Fig. 4 forms.
In addition, be located at 4 row air export mouth 8b between the air export mouth 8a of two ends, above-mentioned left and right sides row extend regulation as shown in Figure 1 and Figure 2 on discharge directions length, its cross section is hollow structure (for example pipe of a flat structure).
As shown in Figure 5, the air export mouth 8b of such hollow structure be arranged on respectively rotation drive a plurality of axles 13 in each mounting portion 6 axle rotary drive mechanism 14 near.
Illustrate in greater detail, a plurality of rotary drive mechanism 14 tegmentum members 15 (drive system exhaust component) cover, and as shown in Figure 5, the air export mouth 8b of above-mentioned hollow structure is to pass interspersed setting of mode in this lid member 15.As Fig. 1, shown in Figure 4, be provided with the blast pipe 16 (drive system exhaust component) that extends downwards in the bottom of lid member 15, the front end of blast pipe 16 is open near elevating mechanism 3.
That is, the clean air that has passed through mounting portion 6 mainly flows in the air export mouth 8b of hollow structure, just is not discharged from by axle rotary drive mechanism 14.In addition, the flow through clean air of a rotary drive mechanism 14 is discharged from blast pipe 16.Carry out rectification by separating exhaust pathway in this wise, can prevent to flow into mounting portion 6 from the dust that axle rotary drive mechanism 14 produces.
In addition, as mentioned above, air export mouth 8b is a flat, make the hollow structure of specific length, and, shown in the cutaway view of Fig. 8, be provided with as the tabular flow throttle ele-ment 11 that is used for the throttle part of limit air flow at the fore-end of each export mouth 8b.
Thus, the downstream with respect to exhaust in the above-mentioned hollow structure becomes barotropic state, can prevent that the air inversion and the air that are discharged from from flowing into wherein outside frame portion 2.
In addition, by adjust the angle of inclination of flow throttle ele-ment 11 at each export mouth 8b place, can make the air displacement of the air of discharging more even from all air export mouths 8.
In addition, be arranged on such buffer cell 100 in the clean room, utilizing sinking under the situation of its ceiling supplying clean air, as shown in Figure 1, owing to be formed with the slit 1c that is used to import air at the upper surface of housing 1, therefore, supplying clean air in the last direction housing 1 of housing 1.In addition owing to be formed with exhaust slit 1d in the bottom of housing 1, therefore, supply with the clean air that comes spread to frame portion 2 around, discharged by exhaust slit 1d from housing 1 bottom.
At this, as shown in Figure 2, be provided with near the internal face (perhaps also can be the outside wall surface of shell 20) four jiaos in housing 1 and be used for dividing plate 12 (partition member) that each space relative with the inner surface of housing 1, each side of frame portion 2 separated.
By this partition member 12 is set, can not flow to the another side side of shell 20 from the exhaust of air export mouth 8, can prevent from that exhaust from moving into from substrate to take out of a mouthful 2a, 2b and flow into mounting portion 6.
In addition, the clean air that is directed in the frame portion 2 from air introducing port 7 is also moved into and is taken out of a mouthful 2a, 2b and discharge from being arranged at substrate on the shell 20.Flow in the clearance space of this exhaust stream between housing 1 and shell 20, discharged by exhaust slit 1d from housing 1 bottom.Therefore, and only be that the clean air of supplying with from the clean room is compared, can be more expeditiously to carrying out air purge in the housing 1.
In addition, moving into respect to each mounting portion 6 when taking out of substrate G, if utilize elevating mechanism 3 to make frame portion 2 lifting moving in housing 1, then therefore the surrounding space generation compression-expansion of elevating mechanism 3, can produce and roll air.But even roll air owing to produce this, the clean air that also has enough flows also flows at each mounting portion 6 place under the effect of FFU4, is discharged by the exhaust slit 1d from housing 1 bottom, and therefore, dust can not flow in the frame portion 2.
In addition, even FFU4 shuts down, the frame portion 2 that is positioned at the downstream of FFU4 also is a barotropic state, therefore, can prevent that dust from flowing into.
As mentioned above, adopt embodiments of the present invention, in buffer cell 100, utilize the action of FFU4 to generate clean air, clean air is fed into each mounting portion 6 of frame portion 2 from air introducing port 7 by ventilating path 5, supply with the clean air that comes and mainly be discharged from from the air export mouth 8 that is arranged at each layer.
Utilize this structure,, also can in the mounting portion 6 of each layer, form the flowing of clean air of enough flows, can guarantee the cleannes in the frame portion 2 even exhaust apparatus is not set in the downstream.
Thereby, also can unlike in the past, consider the mode of the configuration of FFU in the clean room, can not be subjected to the clean room restriction manufacturing line is set.
In addition, because exhaust apparatus needn't be set, therefore, increase that can the suppression equipment cost, and, can eliminate because of the problem (adverse current when running stops etc.) that exhaust apparatus produces is set.
In addition, in the above-described embodiment, represented to be arranged on the example of (shell 20) upper surface of frame portion 2, but substrate buffering unit of the present invention is not limited to this mode as the FFU4 of clean air supply part.For example, also can be arranged on (shell 20) side of frame portion 2 as the above-mentioned FFU4 of clean air supply part.
In addition, represented to apply the present invention to the example of the lift buffer unit of multiple field, but the present invention is not limited to this mode.For example, also can not multiple field but the base-plate buffering device of one deck, in addition, also can be applied to not adopt the elevating mechanism 3 of frame portion 2 and utilize robot arm etc. to move into the buffer unit of taking out of a plurality of substrates.

Claims (7)

1. substrate buffering unit, it is used for temporarily being housed in the substrate transport path substrate conveying, and this substrate is kept out of the way from the aforesaid substrate transport path, it is characterized in that,
This substrate buffering unit comprises:
The frame portion of case shape, it is arranged in the aforesaid substrate transport path, has the mounting portion that is used for the mounting substrate, and aforesaid substrate can be moved to the assigned position that breaks away from the aforesaid substrate transport path;
The clean air supply part, upper surface or side that it is arranged on above-mentioned case shape frame portion are used to supply with the clean air after being cleaned;
Ventilating path, it is used for a side of above-mentioned clean air supply part and above-mentioned portion is coupled together;
Supply with the clean air that comes from above-mentioned clean air supply part and supplied to above-mentioned mounting portion by the air introducing port from a side of the frame portion that is arranged at above-mentioned case shape, and by from the frame portion that is arranged on above-mentioned case shape, discharge with the air export mouth on the side of above-mentioned air introducing port opposite side.
2. substrate buffering unit according to claim 1 is characterized in that,
The frame portion of above-mentioned case shape has in inside the shell that the case shape of a plurality of above-mentioned mounting portion is set with multilayer;
In a side of above-mentioned shell, be provided with a plurality of above-mentioned air introducing ports accordingly with each mounting portion with the multilayer setting;
In above-mentioned ventilating path, be provided with the distribution rectification element that is used for clean air is assigned to above-mentioned a plurality of air introducing ports.
3. substrate buffering unit according to claim 1 and 2 is characterized in that,
This substrate buffering unit comprises the expansion rectification element, and this expansion rectification element is arranged at above-mentioned air introducing port, and the clean air that is used for supplying to from this air introducing port in the above-mentioned mounting portion expands to fan-shaped.
4. substrate buffering unit according to claim 1 and 2 is characterized in that,
The frame portion of above-mentioned case shape, with the side of above-mentioned air introducing port opposite side on be formed with a plurality of above-mentioned air export mouths, and the cross section of a plurality of above-mentioned air export mouths is a hollow structure;
The frame portion of above-mentioned case shape comprises:
The substrate transfer unit, it is used for moving into respect to above-mentioned mounting portion takes out of substrate;
The feed drive parts, it is arranged on the downstream that is fed into the clean air in the above-mentioned mounting portion, is used to drive the aforesaid substrate transfer unit;
The drive system exhaust component, the air export mouth of itself and above-mentioned hollow structure is separated, and only discharges the clean air that is fed into above-mentioned feed drive parts.
5. substrate buffering unit according to claim 4 is characterized in that,
Be respectively equipped with the flow throttle part that is used for being limited in this air export mouth flow air flow at above-mentioned a plurality of air export mouths.
6. substrate buffering unit according to claim 1 and 2 is characterized in that,
This substrate buffering unit comprises the housing of the shell that covers above-mentioned portion at least, in the clearance space between the shell of above-mentioned housing and above-mentioned portion, be provided with partition member on the inwall of above-mentioned housing, this partition member is used for forming independently respectively the clearance space between the medial surface of a side above-mentioned portion, that be formed with above-mentioned air introducing port and above-mentioned air export mouth and the above-mentioned housing relative with this side.
7. substrate buffering unit according to claim 1 and 2 is characterized in that,
This substrate buffering unit comprises the housing of the shell that covers above-mentioned portion at least, in the clearance space between the shell of above-mentioned housing and above-mentioned portion, be provided with partition member on the outer wall of above-mentioned shell, this partition member is used for forming independently respectively the clearance space between the medial surface of a side above-mentioned portion, that be formed with above-mentioned air introducing port and above-mentioned air export mouth and the above-mentioned housing relative with this side.
CN2010100034264A 2009-02-03 2010-01-15 Substrate buffering unit Expired - Fee Related CN101794720B (en)

Applications Claiming Priority (2)

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JP2009022813A JP4884486B2 (en) 2009-02-03 2009-02-03 Substrate buffer unit
JP2009-022813 2009-02-03

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CN101794720B CN101794720B (en) 2012-05-30

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JP6760406B2 (en) * 2017-02-07 2020-09-23 村田機械株式会社 Stocker
KR102032923B1 (en) * 2019-01-07 2019-10-16 무진전자 주식회사 Apparatus for wafer treatment

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JPH10120109A (en) * 1996-10-17 1998-05-12 Sanki Eng Co Ltd Inline type paper sheet stocker
JP4616493B2 (en) * 2001-03-28 2011-01-19 三機産業設備株式会社 Substrate stock equipment
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JP4884039B2 (en) * 2006-03-14 2012-02-22 東京エレクトロン株式会社 Substrate buffer apparatus, substrate buffering method, substrate processing apparatus, control program, and computer-readable storage medium
JP4899939B2 (en) * 2007-03-05 2012-03-21 ムラテックオートメーション株式会社 Stocker for clean room

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CN115135211B (en) * 2020-02-25 2023-09-01 Lg电子株式会社 cleaning device

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TWI425585B (en) 2014-02-01
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TW201036091A (en) 2010-10-01
JP2010182744A (en) 2010-08-19
KR20100089770A (en) 2010-08-12

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