CN101793499A - Multi-measuring-head measuring method and device for micro/nano coordinate measurement - Google Patents
Multi-measuring-head measuring method and device for micro/nano coordinate measurement Download PDFInfo
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Abstract
The invention relates to a multi-measuring-head measuring method and a device for micro/nano coordinate measurement. A micro/nano multi-measuring-head system is installed on a three-dimensional high-precision displacement platform, an objective table is installed on a Z-direction translation table, and a pitching and deflection fine tuning mechanism is arranged under the objective table. A measuring device of the multi-measuring-head system is placed in an isolation cavity, and the control signals of the measuring device and the sensing signals of the multi-measuring-head system are connected with a data acquisition (DAQ) card, a control cabinet and a computer which are arranged outside the isolation cavity. The center of one measuring head is used as the origin of a coordinate system, and the position coordinates at which the other measuring heads are located are sequentially matched into the coordinate system. The multi-measuring-head system is corrected, and the position coordinates of each measuring head in the uniform coordinate system is corrected. When in measurement, the measuring head which is closest to the point to be measured is used for the measurement. The displacement of the corresponding three-dimensional platform corresponding to each point to be measured is converted into the coordinate of each point to be measured in the coordinate system, and the size to be measured is calculated. The invention has the advantages of high working efficiency and high measuring precision.
Description
Technical field
The present invention relates to the device and method of a kind of length metering test and micro-nano measurement of coordinates, particularly disclose a kind of many gauge head measuring methods and device that is used for micro-nano measurement of coordinates.
Background technology
Micro-nano measuring technique is the guarantee of micro-nano-technology development, also is its important ingredient.Along with the developing rapidly of micro-nano manufacturing technology that with semiconductor technology, MEMS technology, Ultraprecision Machining is representative, geometric measurement under the micro-nano-scale has also been had more demand, and its measuring task mainly comprises the following aspects [1]: 1) along the distance 2 between unidirectional two surfaces) distance 3 between two opposed surface) along the distance 4 between two planes of vertical direction) surface topography 5) thickness 6) depth-to-width ratio 7 of structure) roughness 8) flatness.These measuring task have following characteristics [2]: 1) error that causes of ergometry is bigger by 2) positioning error is bigger by 3) error that causes of temperature is little by 4) and the measured piece contour image be subject to foreign matter influence 5) influence of diffraction effect is big.From measuring classification, can be divided into plane surveying, tie up several aspects such as measurements, three-dimensional measurement from planar survey, 2.5.
The instrument that micro-nano-scale is measured has a variety of.Wherein, optical microscopy and scanning electron microscope technology are mainly used in the plane surveying, and methods such as contact pin type contourgraph (comprise machinery and optics contact pilotage two kinds) are mainly used in bench height etc. in planar survey, and scanning tunnel microscope, atomic force microscope etc. are mainly used in the dimension information of characterizing device and body structure surface.In micro/nano-scale three-dimensional measurement field, instrument such as Laser Scanning Confocal Microscope, white light interferometric, micro-nano coordinate measuring machine and method are more common measurement means at present.But owing to be subjected to the requirement and the defective of optical means to being measured by the sidewall of geodesic structure, edge of optical reflectivity of restriction, the measured device of optical diffraction limit, measuring method can not be carried out real three-dimensional measurement.
Therefore, micro-nano measurement of coordinates technology is the relatively effectively means that solve micro/nano-scale three-dimensional measurement problem at present, also is a research focus of current micro-nano-scale geometric measurement.For the requirement of tackling the geometric measurement under the micro-nano-scale (comprise improve measuring accuracy, increase work efficiency, tackle more sophisticated by geodesic structure and device etc.), the gauge head system of development specific use, utilize ultraprecise three-D displacement platform, set up a cover measurement mechanism, through calibration to gauge head system three-D displacement platform, be used for micro-nano measurement of coordinates, significant for the micro-nano-scale geometric measurement.
Summary of the invention
The object of the present invention is to provide a kind of many gauge head measuring methods and device that is used for micro-nano measurement of coordinates, can calibrate many gauge heads system, the collaborative surveying work of finishing measured workpiece of a plurality of gauge heads reduces the long distance of gauge head and moves, and increases work efficiency.Also have, can regard each gauge head of many gauge heads system as independently single gauge head mode of operation, each gauge head is measured measured size respectively, and incites somebody to action repeatedly measurement result averaged and standard deviation, reduce because the error that the principle of work defective is introduced improves measuring accuracy.Simultaneously, solve the problem of gauge head accidental damage when measuring, do not need to reinstall and calibrate gauge head, but switch gauge head, proceed to measure.Therefore, the measurement mechanism of many gauge heads system can improve measuring reliability, work efficiency and precision.
The present invention be achieved in that be used for micro-nano measurement of coordinates many gauge heads measurement mechanism as shown in Figure 1.A kind of measurement mechanism that is used for many gauge heads system of micro-nano measurement of coordinates, micro-nano many gauge heads system is installed on the three-dimensional high-precision displacement platform, constitute a cover measurement mechanism, the three-D displacement platform by X to translation stage, Y assembles to translation stage to translation stage and Z, Z installs objective table on translation stage, the objective table upper surface is a surface level, be used to place measured workpiece, pitching and beat micro-adjusting mechanism are arranged below the objective table, can adjust the loading end of objective table, make it vertical to strictness with the Z of three-dimensional platform; Location about at the three-D displacement platform has 4 columns, on 4 columns one flat plate is installed, and many gauge heads system is fixed on the flat board by clamping device.The X of three-D displacement platform, the precision of Y and Z axle, available laser interferometer is calibrated, and leaves very large space between 4 columns, is convenient to place the mirror group and the debugging calibration of interferometer.The measurement mechanism of many gauge heads system is placed in the separate cavities, and is isolated with external environment, reduces and disturbs.Each lead of the transducing signal of the control signal of measurement mechanism and many gauge heads system is guided to the outside by the hole on the separate cavities, and with data collecting card (DAQ card), control box links to each other with computing machine.The principle of work block diagram of the three-dimensional measuring apparatus of many gauge heads system as shown in Figure 2.
The unified coordinate system of many gauge heads system.On objective table, place calibrated bolck, successively to the X+ of each gauge head, X-, Y+, the sensitivity of all directions of Y-, resolving power, and calibrate the position between each gauge head.Give each gauge head numbering, look from the angle of overlooking gauge head, as No. 1 gauge head, according to clockwise order, gauge head is numbered No. 1 successively with the gauge head in the lower left corner, and No. 2 ..., n number, n＞2 wherein.At Fig. 1, all get n=4 among Fig. 2 and Fig. 3.As main gauge head, its center matches other several gauge heads position coordinates in the coordinate system successively as the initial point of many gauge heads system coordinate system with No. 1 gauge head.
The calibration of many gauge heads system.With the Y-direction calibration to each gauge head is example, shown in Fig. 3 (a).Calibrated bolck is placed on centre position on the objective table, and the workplace of adjusting calibrated bolck is towards the Y+ direction, and vertical with Y-axis.By moving of computer control three-D displacement platform, when No. 1 gauge head of calibrated bolck workplace contact, produce trigger pip, as coordinate system Y-axis zero point.Moving of control three-dimensional platform contacts No. 2 successively with calibrated bolck, and No. 3 ..., the n gauge head, and write down the displacement of Y-axis translation stage respectively, as No. 2, No. 3 ..., the Y-of n gauge head is to the coordinate in coordinate system.Equally, calibrate X+, X-and the coordinate of Y+ direction in coordinate system of each gauge head with calibrated bolck.Then, the reference field of calibrated bolck is placed on the objective table, workplace is towards the Z+ direction, successively to the Z of each gauge head to the coordinate in coordinate system, shown in Fig. 3 (b).At every turn with calibrated bolck contact gauge head the time, the signal of gauge head sensing unit induction is converted to voltage swing, by computer recording data and curve plotting.According to the displacement of three-dimensional platform, analyze the sensitivity and the resolving power of gauge head.Each gauge head need be to the spherical radius of gauge head before forming many gauge heads system, sensitivity, and gauge head parameters such as resolving power are calibrated, and calibration data is used for the error compensation of measuring process.
Utilize the measurement mechanism of many gauge heads system to measure.During measuring workpieces, many gauge heads system is fixed, and measured workpiece is along with three-dimensional platform moves, by measuring with the nearest gauge head in measured point.When measuring next putting, switch gauge head, this nearest gauge head of chosen distance.When switching gauge head, control, on software interface, select stand-by gauge head, the respective channel of DAQ card is opened, close other passages by computing machine.During measurement, the work gauge head is transferred to the DAQ card with induced signal, and other gauge heads are in off position.According to the calibration data of many gauge heads system, with each displacement of the three-dimensional platform of each measured point correspondence, be converted to the coordinate of each the measured point correspondence in the coordinate system, calculate measured size.
The invention has the beneficial effects as follows: the collaborative surveying work of finishing measured workpiece of (1) a plurality of gauge heads, reduce the long distance of gauge head and move, increase work efficiency.(2) can regard each gauge head of many gauge heads system as independently single gauge head mode of operation, each gauge head is measured measured size respectively, and will be repeatedly measurement result averaged and standard deviation, reduce because the error that the principle of work defective is introduced improves measuring accuracy.The problem of gauge head accidental damage does not need to reinstall and calibrate gauge head when (3) solving measurement, but switches gauge head, proceeds to measure.Therefore, the measurement mechanism of many gauge heads system can improve measuring reliability, work efficiency and precision.
Description of drawings
Fig. 1 is the used measurement mechanism synoptic diagram of measuring method of the present invention;
Fig. 2 is the principle of work block diagram of the used measurement mechanism of measuring method of the present invention;
Fig. 3 a is that the used measurement mechanism of measuring method of the present invention is calibrated the X of many gauge heads and the schematic diagram of Y-axis coordinate;
Fig. 3 b is that the used measurement mechanism of measuring method of the present invention is calibrated the X of many gauge heads and the schematic diagram of Z axial coordinate;
Fig. 4 is the used measurement mechanism surveying work process flow diagram of measuring method of the present invention.
In Fig. 1: 1, flat board; 2, many gauge heads system; 3, column; 4, objective table; 5, micro-adjusting mechanism; 6, three-D displacement platform.
Embodiment
With reference to the accompanying drawings 1 and 2, the measurement mechanism that the inventive method is used, Z are installed objective table 4 on translation stage, pitching and beat micro-adjusting mechanism 5 are arranged below the objective table.4 columns 3 are arranged around three-D displacement platform 6, one flat plate 1 is installed above is used for fixing many gauge heads system 2.The measurement mechanism of many gauge heads system 2 is placed in the separate cavities, the DAQ card that the transducing signal of the control signal of measurement mechanism and many gauge heads system and separate cavities are outer, and control box links to each other with computing machine.With the initial point of a gauge head center, other several gauge heads position coordinates are matched in the coordinate system successively as coordinate system.System calibrates to many gauge heads, and the position coordinates of each gauge head in unified coordinate system calibrated.During measurement, by measuring with the nearest gauge head in measured point.When measurement is some down, switch gauge head, this nearest gauge head of chosen distance.Displacement with the three-D displacement platform of each measured point correspondence is converted to the coordinate of each measured point in coordinate system, calculates measured size.
The surveying work process flow diagram of the calibration of many gauge heads system and its measurement mechanism as shown in Figure 4, its principle is shown in accompanying drawing 3a, 3b.The measurement mechanism of many gauge heads system will be calibrated through installing, and these several key links of measurements and calculations machine software processes could be carried out surveying work.For the workpiece that measuring accuracy is had relatively high expectations, can regard each gauge head of many gauge heads system as independently single gauge head mode of operation.Each gauge head is measured measured size respectively, and incites somebody to action repeatedly measurement result averaged and standard deviation, as the net result of measuring.This method can be utilized the average effect of error, reduces because the error that the principle of work defective is introduced improves measuring accuracy.
During measuring workpieces, many gauge heads system is fixed, and measured workpiece is along with three-dimensional platform moves, by measuring with the nearest gauge head in measured point.When measuring next putting, switch gauge head, this nearest gauge head of chosen distance.When switching gauge head, control, on software interface, select stand-by gauge head, the respective channel of DAQ card is opened, close other passages by computing machine.During measurement, the work gauge head is transferred to the DAQ card with induced signal, and other gauge heads are in off position.According to the calibration data of many gauge heads system, with each displacement of the three-dimensional platform of each measured point correspondence, be converted to the coordinate of each the measured point correspondence in the coordinate system, calculate measured size.
Claims (6)
1. many gauge head measuring methods that are used for micro-nano measurement of coordinates, it is characterized in that: micro-nano many gauge heads system is installed on the three-dimensional high-precision displacement platform, constitute a cover measurement mechanism, the three-D displacement platform by X to translation stage, Y assembles to translation stage to translation stage and Z, Z installs objective table on translation stage, the objective table upper surface is a surface level, be used to place measured workpiece, pitching and beat micro-adjusting mechanism are arranged below the objective table, can adjust the loading end of objective table, make it vertical to strictness with the Z of three-dimensional platform; Location about at the three-D displacement platform has 4 columns, on 4 columns one flat plate is installed, and many gauge heads system is fixed on the flat board by clamping device.
2. a kind of many gauge head measuring methods that are used for micro-nano measurement of coordinates according to claim 1, it is characterized in that: the X of described three-D displacement platform, the precision of Y and Z axle, available laser interferometer is calibrated, leave very large space between 4 columns, be convenient to place the mirror group and the debugging calibration of interferometer, the measurement mechanism of many gauge heads system is placed in the separate cavities, isolated with external environment, reduce and disturb, each lead of the transducing signal of the control signal of measurement mechanism and many gauge heads system is guided to the outside by the hole on the separate cavities, and with the DAQ card, control box links to each other with computing machine.
3. a kind of many gauge head measuring methods that are used for micro-nano measurement of coordinates according to claim 1, it is characterized in that: on described objective table, place calibrated bolck, successively to the X+ of each gauge head, X-, Y+, the sensitivity of all directions of Y-, resolving power, and calibrate the position between each gauge head, give each gauge head numbering, from overlooking many gauge heads system, with the gauge head in the lower left corner as No. 1 gauge head, according to clockwise order, gauge head is numbered No. 1 successively, No. 2 ..., n number, n＞2 wherein, as main gauge head, its center matches other several gauge heads position coordinates in the coordinate system successively as the initial point of many gauge heads system coordinate system with No. 1 gauge head.
4. a kind of many gauge head measuring methods that are used for micro-nano measurement of coordinates according to claim 3, it is characterized in that: during the X-direction calibration of each gauge head, calibrated bolck is placed on centre position, left side on the objective table, the workplace of adjusting calibrated bolck is towards the X+ direction, and it is vertical with X-axis, by moving of computer control three-D displacement platform, when No. 1 gauge head of calibrated bolck workplace contact, produce trigger pip, as coordinate system X-axis zero point, moving of control three-dimensional platform, contact successively No. 2 with calibrated bolck, No. 3, the n gauge head, and write down the displacement of X-axis translation stage respectively, as No. 2, No. 3 ... the X-of n gauge head is to the coordinate in coordinate system, equally, calibrate the X+ of each gauge head with calibrated bolck, Y-and the coordinate of Y+ direction in coordinate system, then, the reference field of calibrated bolck is placed on the objective table, workplace is towards the Z+ direction, successively to the Z of each gauge head to the coordinate in coordinate system, the time at every turn with calibrated bolck contact gauge head, the signal of gauge head sensing unit induction, be converted to voltage swing, by computer recording data and curve plotting, according to the displacement of three-dimensional platform, analyze the sensitivity and the resolving power of gauge head, each gauge head need be to the spherical radius of gauge head, sensitivity before forming many gauge heads system, gauge head parameters such as resolving power are calibrated, and calibration data is used for the error compensation of measuring process.
5. a kind of many gauge head measuring methods that are used for micro-nano measurement of coordinates according to claim 1, it is characterized in that: during measuring workpieces, many gauge heads system is fixed, measured workpiece is along with three-dimensional platform moves, by measuring with the nearest gauge head in measured point, when measuring next putting, switch gauge head, this nearest gauge head of chosen distance, when switching gauge head, control by computing machine, on software interface, select stand-by gauge head, the respective channel of DAQ card is opened, close other passages, during measurement, the work gauge head is transferred to the DAQ card with induced signal, and other gauge heads are in off position, calibration data according to many gauge heads system, with each displacement of the three-dimensional platform of each measured point correspondence, be converted to the coordinate of each the measured point correspondence in the coordinate system, calculate measured size.
6. many gauge heads measurement mechanism that is used for micro-nano measurement of coordinates that forms by the described method of claim 1, it is characterized in that: during described measurement mechanism micro-nano many gauge heads system is installed on the three-dimensional high-precision displacement platform, described three-dimensional high-precision displacement platform by X to translation stage, Y assembles to translation stage to translation stage and Z, Z installs objective table on translation stage, the objective table upper surface is a surface level, the pitching and the beat micro-adjusting mechanism that fuse with carrier are arranged below the objective table, location about at the three-dimensional high-precision displacement platform has 4 columns, on 4 columns one flat plate is installed, described micro-nano many gauge heads system is fixed on the bottom surface at dull and stereotyped center by clamping device.
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| CN103075952A (en) * | 2012-12-20 | 2013-05-01 | 上海市计量测试技术研究院 | Micro-touch measurement head for measuring micro-nano three-dimensional size |
| CN103075951A (en) * | 2012-12-20 | 2013-05-01 | 上海市计量测试技术研究院 | Three-dimensional micro touch probe based on capacitive sensor array |
| CN105136024A (en) * | 2015-05-11 | 2015-12-09 | 上海交通大学 | Light path switching device and micro-nano measurement system integrated with multiple probes |
| CN107588746A (en) * | 2017-09-11 | 2018-01-16 | 大连理工大学 | A kind of accurate quick capacity checking device of chaining pin and its method of work |
| CN111238426A (en) * | 2020-02-24 | 2020-06-05 | 重庆市计量质量检测研究院 | Standard device for calibrating measurement error of micro-nano coordinate measurement system |
| CN111947571A (en) * | 2020-07-16 | 2020-11-17 | 深圳市中图仪器股份有限公司 | Micro-force measuring type three-dimensional comprehensive thread measuring machine measuring head and measuring method thereof |
| CN112284313A (en) * | 2020-10-27 | 2021-01-29 | 深圳市勤丽华铖科技有限公司 | High-precision double-measuring-head measuring block comparator |
| CN113759823A (en) * | 2021-09-18 | 2021-12-07 | 中国工程物理研究院机械制造工艺研究所 | Tracking error identification and compensation method for ultra-precision machine tool |
| CN114659446A (en) * | 2022-03-07 | 2022-06-24 | 西安工业大学 | Contact type measuring instrument for efficiently measuring shape and position errors of plane inner hole group |
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| CN103075952A (en) * | 2012-12-20 | 2013-05-01 | 上海市计量测试技术研究院 | Micro-touch measurement head for measuring micro-nano three-dimensional size |
| CN103075951A (en) * | 2012-12-20 | 2013-05-01 | 上海市计量测试技术研究院 | Three-dimensional micro touch probe based on capacitive sensor array |
| CN103075952B (en) * | 2012-12-20 | 2015-04-29 | 上海市计量测试技术研究院 | Micro-touch measurement head for measuring micro-nano three-dimensional size |
| CN103075951B (en) * | 2012-12-20 | 2015-04-29 | 上海市计量测试技术研究院 | Three-dimensional micro touch probe based on capacitive sensor array |
| CN105136024A (en) * | 2015-05-11 | 2015-12-09 | 上海交通大学 | Light path switching device and micro-nano measurement system integrated with multiple probes |
| CN105136024B (en) * | 2015-05-11 | 2017-11-21 | 上海交通大学 | Light path switching device and the micro-nano measuring system for integrating multiple gauge heads |
| CN107588746A (en) * | 2017-09-11 | 2018-01-16 | 大连理工大学 | A kind of accurate quick capacity checking device of chaining pin and its method of work |
| CN111238426A (en) * | 2020-02-24 | 2020-06-05 | 重庆市计量质量检测研究院 | Standard device for calibrating measurement error of micro-nano coordinate measurement system |
| CN111947571A (en) * | 2020-07-16 | 2020-11-17 | 深圳市中图仪器股份有限公司 | Micro-force measuring type three-dimensional comprehensive thread measuring machine measuring head and measuring method thereof |
| CN111947571B (en) * | 2020-07-16 | 2021-08-31 | 深圳市中图仪器股份有限公司 | Micro-force measuring type three-dimensional comprehensive thread measuring machine measuring head and measuring method thereof |
| CN112284313A (en) * | 2020-10-27 | 2021-01-29 | 深圳市勤丽华铖科技有限公司 | High-precision double-measuring-head measuring block comparator |
| CN112284313B (en) * | 2020-10-27 | 2022-02-18 | 深圳市勤丽华铖科技有限公司 | High-precision double-measuring-head measuring block comparator |
| CN113759823A (en) * | 2021-09-18 | 2021-12-07 | 中国工程物理研究院机械制造工艺研究所 | Tracking error identification and compensation method for ultra-precision machine tool |
| CN113759823B (en) * | 2021-09-18 | 2023-02-03 | 中国工程物理研究院机械制造工艺研究所 | Tracking error identification and compensation method for ultra-precision machine tool |
| CN114659446A (en) * | 2022-03-07 | 2022-06-24 | 西安工业大学 | Contact type measuring instrument for efficiently measuring shape and position errors of plane inner hole group |
| CN114659446B (en) * | 2022-03-07 | 2024-01-26 | 西安工业大学 | Contact type measuring instrument for efficiently measuring shape and position errors of plane inner hole group |
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Granted publication date: 20110928 Termination date: 20160330 |