CN101787254A - 一种白光led胶水的制备方法 - Google Patents

一种白光led胶水的制备方法 Download PDF

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CN101787254A
CN101787254A CN200910233703A CN200910233703A CN101787254A CN 101787254 A CN101787254 A CN 101787254A CN 200910233703 A CN200910233703 A CN 200910233703A CN 200910233703 A CN200910233703 A CN 200910233703A CN 101787254 A CN101787254 A CN 101787254A
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CN101787254B (zh
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胡建红
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Jiangsu Wenrun Optoelectronic Co Ltd
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Joint Venture Jiangsu Wenrun Optoelectronics Co Ltd
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Abstract

本发明公开了一种白光LED胶水的制备方法,所述白光LED胶水是由配套使用的A、B双组分聚硅氧烷树脂构成,它大大改善了白光LED的光斑,使发光光圈均匀,完全可以解决常见的黄圈现象;使得白光LED的出光效率增加,白光LED的衰减大大降低,同时能有效提高白光LED亮度,对荧光粉有良好的分散性,耐老化,荧光粉不易沉淀。

Description

一种白光LED胶水的制备方法
技术领域
本发明涉及一种白光LED胶水的制备方法。
背景技术
目前,小功率白光LED均采用环氧树脂混合荧光粉,由于荧光粉比重大,烘烤成固体后,荧光粉沉淀,生产小角度白光LED时,光斑有严重黄圈,为了克服黄圈,通常采用在胶水中掺入一定比例的抗沉淀剂,但这又使得光反射增加,导致出光效率差,同时由于采用环氧基胶水配制,其耐黄变性能差,长期工作后,大量的热量使胶水黑化,导致晶片出光无法透过胶层,普通白光LED衰减严重,影响白光LED的使用寿命。
发明内容
技术问题
本发明的目的在于提供一种白光LED胶水的制备方法,所制备的胶水大大改善了白光LED的光斑,同时使得白光LED的出光效率增加,白光LED的衰减大大降低。
技术方案
本发明是通过以下技术方案予以实现的。
一种白光LED胶水的制备方法,它是由配套使用的A、B双组分聚硅氧烷树脂构成,其制备步骤如下:
制备A组分:(1)将99.9~99.98份的甲基苯基乙烯基聚硅氧烷树脂和0.02~0.1份的铂催化剂混合均匀;(2)加入1~10份的纳米气相二氧化硅,粒径为10~30nm,并搅拌均匀;(3)再加入1~10份的金属氧化物,并搅拌均匀即可;
制备B组分:将80~85份的硅胶、5~15份的二甲基氢甲硅烷氧基苯基硅烷和5~10份的二苯基双(二甲基乙烯基甲硅烷氧基)硅烷搅拌均匀即可;
上述份数均为质量份数。
上述的一种白光LED胶水的制备方法,其中,所述金属氧化物为二氧化钛、氧化锆或氧化钆中的一种或几种的混合物,所述金属氧化物的折射率>2.0,粒径为3~10μm。
有益效果
本发明所述方法制备的白光LED胶水,大大改善了白光LED的光斑,使发光光圈均匀,完全可以解决常见的黄圈现象;使得白光LED的出光效率增加,白光LED的衰减大大降低,同时能有效提高白光LED亮度,对荧光粉有良好的分散性,耐老化,荧光粉不易沉淀。
具体实施方式
图1是环氧树脂基的A、B双组分白光LED胶水(BG48A/B)的常温寿命试验可靠性试验报告;
图2是本发明聚硅氧烷树脂基A、B双组分白光LED胶水(聚硅氧烷A/B)的常温寿命试验可靠性试验报告。
以下通过具体实施例对本发明作进一步说明:
一种白光LED胶水的制备方法,它是由配套使用的A、B双组分聚硅氧烷树脂构成,其制备步骤如下:
制备A组分:(1)将99.9~99.98份的甲基苯基乙烯基聚硅氧烷树脂和0.02~0.1份的铂催化剂混合均匀;(2)加入1~10份的纳米气相二氧化硅,并搅拌均匀;(3)再加入1~10份的金属氧化物,并搅拌均匀即可;
制备B组分:将80~85份的硅胶、5~15份的二甲基氢甲硅烷氧基苯基硅烷和5~10份的二苯基双(二甲基乙烯基甲硅烷氧基)硅烷搅拌均匀即可;
上述份数均为质量份数。
实施例1
一种白光LED胶水的制备方法,它是由配套使用的A、B双组分聚硅氧烷树脂构成,其制备步骤如下:制备A组分:(1)将99.9质量份的甲基苯基乙烯基聚硅氧烷树脂和0.1质量份的铂催化剂混合均匀;(2)加入1质量份的纳米气相二氧化硅,粒径为10nm,并搅拌均匀;(3)再加入1质量份的二氧化钛,4质量份的氧化锆,并搅拌均匀即可;制备B组分:将80质量份的硅胶、15质量份的二甲基氢甲硅烷氧基苯基硅烷和5质量份的二苯基双(二甲基乙烯基甲硅烷氧基)硅烷搅拌均匀即可;
实施例2
一种白光LED胶水的制备方法,它是由配套使用的A、B双组分聚硅氧烷树脂构成,其制备步骤如下:制备A组分:(1)将99.95质量份的甲基苯基乙烯基聚硅氧烷树脂和0.05质量份的铂催化剂混合均匀;(2)加入5质量份的纳米气相二氧化硅,粒径为20nm,并搅拌均匀;(3)再加入1质量份的二氧化钛,并搅拌均匀即可;制备B组分:将83质量份的硅胶、10质量份的二甲基氢甲硅烷氧基苯基硅烷和7质量份的二苯基双(二甲基乙烯基甲硅烷氧基)硅烷搅拌均匀即可;
实施例3
一种白光LED胶水的制备方法,它是由配套使用的A、B双组分聚硅氧烷树脂构成,其制备步骤如下:制备A组分:(1)将99.98质量份的甲基苯基乙烯基聚硅氧烷树脂和0.02质量份的铂催化剂混合均匀;(2)加入10质量份的纳米气相二氧化硅,粒径为30nm,并搅拌均匀;(3)再加入5质量份的氧化锆,5质量份的氧化钆,并搅拌均匀即可;制备B组分:将85质量份的硅胶、5质量份的二甲基氢甲硅烷氧基苯基硅烷和10质量份的二苯基双(二甲基乙烯基甲硅烷氧基)硅烷搅拌均匀即可;
实施例4
一种白光LED胶水的制备方法,它是由配套使用的A、B双组分聚硅氧烷树脂构成,其制备步骤如下:制备A组分:(1)将99.9质量份的甲基苯基乙烯基聚硅氧烷树脂和0.1质量份的铂催化剂混合均匀;(2)加入8质量份的纳米气相二氧化硅,粒径为30nm,并搅拌均匀;(3)再加入2质量份的二氧化钛,6质量份的氧化锆,并搅拌均匀即可;制备B组分:将85质量份的硅胶、5质量份的二甲基氢甲硅烷氧基苯基硅烷和10质量份的二苯基双(二甲基乙烯基甲硅烷氧基)硅烷搅拌均匀即可;
按本发明所述方法制备的A、B双组分白光LED胶水:
储存:不用时,可将配制好的A组分和B组分存放于室温下的阴凉干燥处;
使用时:只需要将B组分加入到A组分中,并加入荧光粉,搅拌均匀即可用于点胶。例如:可将B组分与A组分按1∶1的质量比将B组分加入到A组分中,再加入荧光粉,荧光粉含量占混合体系的质量百分比可为5~10%,将混合体系搅拌均匀,即可用于点胶,烘烤条件:120~150℃下烘烤1~2h。

Claims (2)

1.一种白光LED胶水的制备方法,其特征在于,它是由配套使用的A、B双组分聚硅氧烷树脂构成,其制备步骤如下:
制备A组分:(1)将99.9~99.98份的甲基苯基乙烯基聚硅氧烷树脂和0.02~0.1份的铂催化剂混合均匀;(2)加入1~10份的纳米气相二氧化硅,粒径为10~30nm,并搅拌均匀;(3)再加入1~10份的金属氧化物,并搅拌均匀即可;
制备B组分:将80~85份的硅胶、5~15份的二甲基氢甲硅烷氧基苯基硅烷和5~10份的二苯基双(二甲基乙烯基甲硅烷氧基)硅烷搅拌均匀即可;
上述份数均为质量份数。
2.如权利要求1所述的一种白光LED胶水的制备方法,其特征在于,所述金属氧化物为二氧化钛、氧化锆或氧化钆中的一种或几种的混合物,所述金属氧化物的折射率>2.0,粒径为3~10μm。
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Cited By (9)

* Cited by examiner, † Cited by third party
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CN102191009A (zh) * 2011-03-18 2011-09-21 赣州市赐彩油墨涂料实业有限公司 一种双组份改质剂及其制备与施工方法
CN102569614A (zh) * 2010-12-31 2012-07-11 第一毛织株式会社 封装材料以及包含封装材料的电子器件
CN102775954A (zh) * 2012-08-18 2012-11-14 邵成芬 高折射率、高透光率高功率led封装硅胶及其制备方法
CN102888205A (zh) * 2012-10-25 2013-01-23 上纬(上海)精细化工有限公司 一种有机聚硅氧烷封装用胶组合物
CN104710964A (zh) * 2013-12-11 2015-06-17 佛山市新翔星化工有限公司 一种led封装硅胶及其制备方法
CN104893600A (zh) * 2015-05-14 2015-09-09 天津德高化成新材料股份有限公司 发光二极管快速封装粘性荧光胶膜及制备方法及应用
CN108611045A (zh) * 2018-04-19 2018-10-02 武汉华星光电技术有限公司 荧光胶及其制备方法、背光模组
CN112266783A (zh) * 2020-10-30 2021-01-26 杭州数通光电有限公司 荧光胶体、高光效光源及高光效光源的制作方法
JP7441187B2 (ja) 2021-01-28 2024-02-29 日本特殊陶業株式会社 保持装置

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CN101436625A (zh) * 2007-11-13 2009-05-20 宁波安迪光电科技有限公司 白光发光二极管的封装方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102569614A (zh) * 2010-12-31 2012-07-11 第一毛织株式会社 封装材料以及包含封装材料的电子器件
CN102191009A (zh) * 2011-03-18 2011-09-21 赣州市赐彩油墨涂料实业有限公司 一种双组份改质剂及其制备与施工方法
CN102191009B (zh) * 2011-03-18 2013-06-05 赣州市赐彩油墨涂料实业有限公司 一种双组份改质剂及其制备与施工方法
CN102775954A (zh) * 2012-08-18 2012-11-14 邵成芬 高折射率、高透光率高功率led封装硅胶及其制备方法
CN102775954B (zh) * 2012-08-18 2013-10-30 邵成芬 高折射率、高透光率高功率led封装硅胶及其制备方法
CN102888205A (zh) * 2012-10-25 2013-01-23 上纬(上海)精细化工有限公司 一种有机聚硅氧烷封装用胶组合物
CN104710964A (zh) * 2013-12-11 2015-06-17 佛山市新翔星化工有限公司 一种led封装硅胶及其制备方法
CN104893600A (zh) * 2015-05-14 2015-09-09 天津德高化成新材料股份有限公司 发光二极管快速封装粘性荧光胶膜及制备方法及应用
CN104893600B (zh) * 2015-05-14 2017-05-17 天津德高化成新材料股份有限公司 发光二极管快速封装粘性荧光胶膜及制备方法及应用
CN108611045A (zh) * 2018-04-19 2018-10-02 武汉华星光电技术有限公司 荧光胶及其制备方法、背光模组
CN112266783A (zh) * 2020-10-30 2021-01-26 杭州数通光电有限公司 荧光胶体、高光效光源及高光效光源的制作方法
JP7441187B2 (ja) 2021-01-28 2024-02-29 日本特殊陶業株式会社 保持装置

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