CN101780456B - Crystal grain angle correction method applied to chip separating system - Google Patents

Abstract

The invention relates to a crystal grain angle correction method applied to a chip separating system, which mainly comprises the following steps: judging a deflection angle of target crystal grains; driving a swinging arm of a crystal grain conveying mechanism to rotate 90 degrees minus alpha when the deflection angle alpha of the target crystal grains is a positive number, simultaneously executing the difference-alpha deflection angle position compensation on an arrangement region, and placing the target crystal grains into the arrangement region; driving the swinging arm of the crystal grain conveying mechanism to rotate 90 degrees plus alpha when the deflection angle alpha of the target crystal grains is a negative number, simultaneously executing the multi-alpha deflection angle position compensation on the arrangement region, and placing the target crystal grains into the arrangement region; and driving the swinging arm of the crystal grain conveying mechanism to rotate 90 degrees when the deflection angle alpha of the target crystal grains is zero, and directly placing the target crystal grains into the arrangement region. The invention combines the rotation movement of the crystal grain conveying mechanism and the translational movement of the arrangement region for compensating the angle deflection of the crystal grains, carries out parallel dispatch between the position compensation of a material supply region and the arrangement region, and realizes the automatic correction of the crystal grain angle under the condition of not reducing the conveying speed.

Description

A kind of crystal grain angle correction method that is applied to chip separating system

Technical field

The present invention relates to led chip sorting field, particularly relate to a kind of crystal grain angle correction method that is applied to chip separating system.

Background technology

Common, in the led chip assorting room, require crystal grain according to type, with the form proper alignment of square sheet on chip film.Yet chip film is through cutting, pour mask, and will allow all crystal grain keep utterly relatively difficulty of proper alignment after the expansion.If crystal grain only is that the position is irregular, can proofread and correct to realize that by translation this ratio aspect motion control is easier to realize; If crystal grain angle of arrival deviation then needs to realize by rotation correction.Because the correction of any one crystal grain all needs to rotate whole chip film, this will cause the position of other all crystal grain on the chip film all can change, and bring very large difficulty for the accurate location of follow-up crystal grain.Therefore, how to carry out the angle correct of crystal grain, so that crystal grain can proper alignment becomes a difficult problem in the sorting process to the alignment area.

In the prior art, chip separating system comprises image identification system, chip rollway, crystal grain transfer mechanism and alignment area, and the chip rollway comprises XY cross platform, thimble and Z axis rotation platform.The general step of die grading is: XY cross platform is transferred crystal grain to the thimble center; Thimble jack-up is also stung film, and crystal grain is peeled off; Crystal grain transfer mechanism crawl crystal grain is placed the alignment area with crystal grain.If there is the crystal grain angular deviation, at first be the spinning movement of the Z axis rotation platform by the chip rollway with crystal grain angle correction after, again crystal grain is transferred to the alignment area and places.The bearing calibration of this crystal grain angle, because the angle correct at any crystal grain of feed zone all needs to rotate whole chip film, cause the position of other all crystal grain on this chip film all can change, thereby bring very large difficulty for the accurate location of follow-up crystal grain, simultaneously also have a strong impact on crystal grain angle correction speed, also reduced on the whole the separation velocity of chip.

Therefore, needing badly provides a kind of precise positioning that can either guarantee crystal grain, can give full play to again the ability of multiaxis Parallel Scheduling in the chip separating system, in the situation that does not reduce screen, can realize the undelayed angle self-correcting of crystal grain, thereby improve the crystal grain angle correction method that is applied to chip separating system of the separation velocity of chip.

Summary of the invention

Based on the deficiencies in the prior art, the problem that the present invention need to solve is: a kind of precise positioning that can either guarantee crystal grain is provided, can give full play to again the ability of multiaxis Parallel Scheduling in the chip separating system, in the situation that does not reduce screen, can realize the undelayed angle self-correcting of crystal grain, thereby improve the crystal grain angle correction method that is applied to chip separating system of the separation velocity of chip.

For addressing the above problem, the invention provides a kind of crystal grain angle correction method that is applied to chip separating system, described chip separating system comprises image identification system, chip rollway, crystal grain transfer mechanism and alignment area, described image identification system comprises high-speed camera, described chip rollway comprises XY cross platform, thimble and Z axis rotation platform, wherein, the method may further comprise the steps:

The range of deflection parameter of the crystal grain angle that allows in A, the described chip separating system of setting;

The XY cross platform of B, the described chip rollway of driving, all crystal grains on the chip film is transplanted on respectively the identified region of the camera lens of described high-speed camera, identify by machine vision, obtain center position coordinates and the deflection angle α of described all crystal grains;

C, the crystal grain of range of deflection that described deflection angle α is exceeded the crystal grain angle of described permission belong to and get rid of the crystal grain collection, remaining crystal grain is belonged to treat sorting crystal grain collection;

D, choose and describedly treat that one of them crystal grain that sorting crystal grain concentrates is as target crystal grain;

E, mobile described chip rollway are transferred to the center of described thimble with described target crystal grain according to the center position coordinates of described target crystal grain, wherein, and the center of described thimble and the centrally aligned of described camera lens;

F, the described thimble jack-up of driving are also stung film, and described target crystal grain is peeled off;

G, the described crystal grain transfer mechanism of driving grasp described target crystal grain;

H, the deflection angle α of the described target crystal grain among the described step G is judged, if the deflection angle α of described target crystal grain is timing, then drive the swing arm half-twist-α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of poor α deflection angle, described target crystal grain is placed the alignment area;

When if the deflection angle α of described target crystal grain is negative, then drive the swing arm half-twist+α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of many α deflection angle, described target crystal grain is placed the alignment area;

When if the deflection angle α of described target crystal grain is 0 °, then drive the swing arm half-twist of described crystal grain transfer mechanism, directly described target crystal grain is placed the alignment area;

Continue step I;

I, judge the described sorting crystal grain for the treatment of concentrates whether crystal grain is arranged, if then choose and describedly treat next crystal grain that sorting crystal grain concentrates as target crystal grain, and return step e; Otherwise, finish this crystal grain sorting.

Further,

Position compensation among the above-mentioned steps H is specially X side-play amount and the Y side-play amount of described target crystal grain in the platform coordinate system of described alignment area,

X side-play amount and Y side-play amount in the position compensation of described poor α deflection angle are calculated by following formula: $\left\{\begin{array}{c}X=R(\cos \mathrm{\β}-\cos (\mathrm{\β}+\mathrm{\α}))\\ Y=R(\sin (\mathrm{\β}+\mathrm{\α})-\sin \mathrm{\β})\end{array},\right.$

X side-play amount and Y side-play amount in the position compensation of described many α deflection angle are calculated by following formula: $\left\{\begin{array}{c}X=R(\cos (\mathrm{\β}-\mathrm{\α})-\cos \mathrm{\β})\\ Y=R(\sin \mathrm{\β}-\sin (\mathrm{\β}-\mathrm{\α})),\end{array}\right.$

Wherein, α is the deflection angle of described target crystal grain, and β is the start angle of described swing arm, and R is the length of described swing arm.

Further,

Above-mentioned steps I finishes further to comprise after this crystal grain sorting:

If step J user is dissatisfied to this crystal grain separation results, then can drive described chip film and rotate to an angle, choose one of them concentrated crystal grain of described eliminating crystal grain as target crystal grain;

Step K, mobile described chip rollway are transferred to the center of described thimble with the center position coordinates of described target crystal grain, wherein, and the centrally aligned of described thimble center and described camera lens;

Step L, the described thimble jack-up of driving are also stung film, and described target crystal grain is peeled off;

Step M, the described crystal grain transfer mechanism of driving grasp described target crystal grain;

The deflection angle α's of the described target crystal grain among step N, the described step M of judgement is positive and negative, if the deflection angle α of described target crystal grain is timing, then drive the swing arm half-twist-α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of poor α deflection angle, described target crystal grain is placed the alignment area;

When if the deflection angle α of described target crystal grain is negative, then drive the swing arm half-twist+α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of many α deflection angle, described target crystal grain is placed the alignment area;

When if the deflection angle α of described target crystal grain is 0 °, then drive the swing arm half-twist of described crystal grain transfer mechanism, directly described target crystal grain is placed the alignment area;

Continue step O;

Step O, judge described eliminating crystal grain concentrates whether crystal grain is arranged, if then choose next crystal grain that described eliminating crystal grain concentrates as target crystal grain, and return step K; Otherwise, finish whole crystal grain sortings.

Further,

The range of deflection of the crystal grain angle of the permission among the above-mentioned steps A is-15 °～+ 15 °.

Further,

The range of deflection of the crystal grain angle of the permission among the above-mentioned steps A is-9 °～+ 9 °.

The present invention also provides a kind of crystal grain angle correction method that is applied to chip separating system, described chip separating system comprises image identification system, chip rollway, crystal grain transfer mechanism and alignment area, described image identification system comprises high-speed camera, described chip rollway comprises XY cross platform, thimble and Z axis rotation platform, wherein, the method may further comprise the steps:

The range of deflection parameter of the crystal grain angle that allows in A, the described chip separating system of setting;

B, choose one of them crystal grain on the chip film as target crystal grain;

C, drive the XY cross platform of described chip rollway, described target crystal grain is transplanted on the identified region of the camera lens of described high-speed camera, identify by machine vision, obtain center position coordinates and the deflection angle α of described target crystal grain;

D, judge whether the deflection angle α of described target crystal grain exceeds the range of deflection of the crystal grain angle that allows in the described chip separating system, if then described target crystal grain is belonged to described eliminating crystal grain collection, and carry out following steps I; Otherwise, described target crystal grain is carried out following steps E;

E, mobile described chip rollway are transferred to the center of described thimble with described target crystal grain according to the center position coordinates of described target crystal grain, wherein, and the center of described thimble and the centrally aligned of described camera lens;

F, the described thimble jack-up of driving are also stung film, and described target crystal grain is peeled off;

G, the described crystal grain transfer mechanism of driving grasp described target crystal grain;

H, the deflection angle α of the described target crystal grain among the described step G is judged, if the deflection angle α of described target crystal grain is timing, then drive the swing arm half-twist-α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of poor α deflection angle, described target crystal grain is placed the alignment area;

When if the deflection angle α of described target crystal grain is negative, then drive the swing arm half-twist+α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of many α deflection angle, described target crystal grain is placed the alignment area;

When if the deflection angle α of described target crystal grain is 0 °, then drive the swing arm half-twist of described crystal grain transfer mechanism, directly described target crystal grain is placed the alignment area;

Continue step I;

I, judge whether crystal grain is arranged on the described chip film, if then choose next crystal grain on the described chip film as target crystal grain, and return step C; Otherwise, finish this crystal grain sorting.

Further,

Position compensation among the above-mentioned steps G is specially X side-play amount and the Y side-play amount of described target crystal grain in the platform coordinate system of described alignment area,

X side-play amount and Y side-play amount in the position compensation of described poor α deflection angle are calculated by following formula: $\left\{\begin{array}{c}X=R(\cos \mathrm{\β}-\cos (\mathrm{\β}+\mathrm{\α}))\\ Y=R(\sin (\mathrm{\β}+\mathrm{\α})-\sin \mathrm{\β})\end{array},\right.$

X side-play amount and Y side-play amount in the position compensation of described many α deflection angle are calculated by following formula: $\left\{\begin{array}{c}X=R(\cos (\mathrm{\β}-\mathrm{\α})-\cos \mathrm{\β})\\ Y=R(\sin \mathrm{\β}-\sin (\mathrm{\β}-\mathrm{\α})),\end{array}\right.$

Wherein, α is the deflection angle of described target crystal grain, and β is the start angle of described swing arm, and R is the length of described swing arm.

Further,

Above-mentioned steps I finishes further to comprise after this crystal grain sorting:

If step J user is dissatisfied to this crystal grain separation results, then can drive described chip film and rotate to an angle, one of them crystal grain that described eliminating crystal grain is concentrated is as target crystal grain;

Step K, mobile described chip rollway are transferred to the center of described thimble with described target crystal grain according to the center position coordinates of described target crystal grain, wherein, and the center of described thimble and the centrally aligned of described camera lens;

Step L, the described thimble jack-up of driving are also stung film, and described target crystal grain is peeled off;

Step M, the described crystal grain transfer mechanism of driving grasp described target crystal grain;

Step N, the deflection angle α of the described target crystal grain among the described step G is judged, if the deflection angle α of described target crystal grain is timing, then drive the swing arm half-twist-α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of poor α deflection angle, described target crystal grain is placed the alignment area;

When if the deflection angle α of described target crystal grain is negative, then drive the swing arm half-twist+α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of many α deflection angle, described target crystal grain is placed the alignment area;

When if the deflection angle α of described target crystal grain is 0 °, then drive the swing arm half-twist of described crystal grain transfer mechanism, directly described target crystal grain is placed the alignment area;

Continue step O;

Step O, judge described eliminating crystal grain concentrates whether crystal grain is arranged, if then choose next crystal grain that described eliminating crystal grain concentrates as target crystal grain; Otherwise, finish whole crystal grain sortings.

Further,

The range of deflection of the crystal grain angle of the permission among the above-mentioned steps A is-15 °～+ 15 °.

Further,

The range of deflection of the crystal grain angle of the permission among the above-mentioned steps A is-9 °～+ 9 °.

Chip separating system among the present invention comprises image identification system, chip rollway, crystal grain transfer mechanism and alignment area, described image identification system comprises high-speed camera, described chip rollway comprises XY cross platform and thimble, wherein, the method mainly comprises: the deflection angle α to target crystal grain judges, if the deflection angle α of target crystal grain is timing, then drive the swing arm half-twist-α of crystal grain transfer mechanism, simultaneously the alignment area is carried out the position compensation of poor α deflection angle, target crystal grain is placed the alignment area; When if the deflection angle α of target crystal grain is negative, then drive the swing arm half-twist+α of crystal grain transfer mechanism, simultaneously the alignment area is carried out the position compensation of many α deflection angle, target crystal grain is placed the alignment area; When if the deflection angle α of target crystal grain is 0 °, then drive the swing arm half-twist of crystal grain transfer mechanism, directly target crystal grain is placed the alignment area.

Compared with prior art, the present invention compensates the angular deviation of crystal grain with the translational motion of alignment area in conjunction with rotatablely moving of crystal grain transfer mechanism, between feed zone and alignment area position compensation, carry out Parallel Scheduling, in the situation that does not reduce screen, realized the self-correcting of crystal grain angle.Can guarantee the precise positioning of crystal grain; can give full play to again the ability of multiaxis Parallel Scheduling in the chip separating system; so that crystal grain obtains undelayed angle correct, not only improved the speed of crystal grain angle correction, also further improved the separation velocity of chip simultaneously.

Description of drawings

The invention will be further described to utilize accompanying drawing, but the embodiment in the accompanying drawing does not consist of any limitation of the invention.

Fig. 1 is the method flow diagram of the first embodiment of a kind of crystal grain angle correction method that is applied to chip separating system of the present invention;

Fig. 2 is the method flow diagram of the second embodiment of a kind of crystal grain angle correction method that is applied to chip separating system of the present invention;

Fig. 3 is that schematic diagram is ajusted in the rotation of the deflection angle α of crystal grain of the present invention when being 0 °;

Fig. 4 is that schematic diagram is ajusted in the rotation of the deflection angle α of crystal grain of the present invention when being positive-angle;

Fig. 5 is that schematic diagram is ajusted in the rotation of the deflection angle α of crystal grain of the present invention when being negative angle.

The specific embodiment

The invention will be further described with the following Examples:

Embodiment 1:

The embodiment of a kind of crystal grain angle correction method that is applied to chip separating system of the present invention is a kind of method flow diagram of the present invention as shown in Figure 1.

Concrete, a kind of crystal grain angle correction method that is applied to chip separating system, wherein, described chip separating system comprises image identification system, chip rollway, crystal grain transfer mechanism and alignment area, described image identification system comprises high-speed camera, described chip rollway comprises XY cross platform, thimble and Z axis rotation platform, and wherein, the method may further comprise the steps:

The range of deflection parameter of the crystal grain angle that allows in step 101, the described chip separating system of setting; Wherein, this parameter can be selected different range of deflection values according to user's needs, and the range of deflection of the crystal grain angle of industrial permission commonly used is-15 °～+ 15 ° or-9 °～+ 9 °.

The XY cross platform of step 102, the described chip rollway of driving is transplanted on all crystal grains on the chip film respectively the identified region of the camera lens of described high-speed camera, identify by machine vision, obtain center position coordinates and the deflection angle α of described all crystal grains; Wherein, this identified region depends on the position of camera lens fully, the center of described identified region and the center superposition of described camera lens, and the change in location with pallet does not change.Wherein, the center position coordinates of described crystal grain is the physical deflection with respect to the center of described camera lens.

Step 103, the crystal grain of range of deflection that the deflection angle α in the described all crystal grains is exceeded the crystal grain angle of described permission belong to and get rid of the crystal grain collection, remaining crystal grain in the described all crystal grains is belonged to treat sorting crystal grain collection; Because the crystal grain that deflection angle α is larger can be undetected when chip detection, so that the larger crystal grain of these deflection angles α does not possess detected parameters.Therefore when carrying out die grading, therefore the automatic eliminating of the crystal grain that these undesirable deflection angles are larger arranges and gets rid of the crystal grain collection and treat sorting crystal grain collection outside the scope of crystal grain sorting.

Step 104, choose and describedly treat that one of them crystal grain that sorting crystal grain concentrates is as target crystal grain.

Step 105, mobile described chip rollway are transferred to the center of described thimble with described target crystal grain according to the center position coordinates of described target crystal grain, wherein, and the center of described thimble and the centrally aligned of described camera lens.Namely so that the cross aligning is carried out at the center of the center of camera lens and thimble.

Step 106, the described thimble jack-up of driving are also stung film described target crystal grain are peeled off.

Step 107, the described crystal grain transfer mechanism of driving grasp described target crystal grain.The suction nozzle that is specially in the crystal grain transfer mechanism is drawn target crystal grain.

Step 108, the deflection angle α of the described target crystal grain in the described step 107 is judged, if the deflection angle α of described target crystal grain is timing, as shown in Figure 4, then drive the swing arm half-twist-α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of poor α deflection angle, described target crystal grain is placed the alignment area; If when the deflection angle α of described target crystal grain is negative, as shown in Figure 5, then drive the swing arm half-twist+α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of many α deflection angle, described target crystal grain is placed the alignment area; When if the deflection angle α of described target crystal grain is 0 °, as shown in Figure 3, then drive the swing arm half-twist of described crystal grain transfer mechanism, directly described target crystal grain is placed the alignment area; Continue step 109.

Step 109, judge the described sorting crystal grain for the treatment of concentrates whether crystal grain is arranged, if then choose and describedly treat next crystal grain that sorting crystal grain concentrates as target crystal grain, and return step 105; Otherwise, finish this crystal grain sorting.

Concrete, the position compensation in the above-mentioned steps 108 is specially X side-play amount and the Y side-play amount of described target crystal grain in the platform coordinate system of described alignment area,

X side-play amount and Y side-play amount in the position compensation of described poor α deflection angle are calculated by following formula: $\left\{\begin{array}{c}X=R(\cos \mathrm{\β}-\cos (\mathrm{\β}+\mathrm{\α}))\\ Y=R(\sin (\mathrm{\β}+\mathrm{\α})-\sin \mathrm{\β})\end{array},\right.$

X side-play amount and Y side-play amount in the position compensation of described many α deflection angle are calculated by following formula: $\left\{\begin{array}{c}X=R(\cos (\mathrm{\β}-\mathrm{\α})-\cos \mathrm{\β})\\ Y=R(\sin \mathrm{\β}-\sin (\mathrm{\β}-\mathrm{\α})),\end{array}\right.$

Wherein, α is the deflection angle of described target crystal grain, and β is the start angle of described swing arm, and R is the length of described swing arm.The high-speed camera Direct Recognition that the start angle β of this swing arm arranges by described alignment area.Common, the start angle β of swing arm after the identification and the length R of swing arm can be preserved as the parameter of system, and need not to repeat the adjustment of systematic parameter.

In addition, this position compensation amount X side-play amount and Y side-play amount can be used as systematic parameter and keep for a long time.

Concrete, above-mentioned steps 109 finishes further to comprise after this crystal grain sorting:

If step 110 user is dissatisfied to this crystal grain separation results, then can drive described chip film and rotate to an angle, choose one of them concentrated crystal grain of described eliminating crystal grain as target crystal grain.

Step 111, mobile described chip rollway are transferred to the center of described thimble with the center position coordinates of described target crystal grain, wherein, and the centrally aligned of described thimble center and described camera lens.

Step 112, the described thimble jack-up of driving are also stung film, and described target crystal grain is peeled off.

Step 113, the described crystal grain transfer mechanism of driving grasp described target crystal grain.

The deflection angle α's of the described target crystal grain among step 114, the described step M of judgement is positive and negative, if the deflection angle α of described target crystal grain is timing, then drive the swing arm half-twist-α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of poor α deflection angle, described target crystal grain is placed the alignment area; When if the deflection angle α of described target crystal grain is negative, then drive the swing arm half-twist+α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of many α deflection angle, described target crystal grain is placed the alignment area; When if the deflection angle α of described target crystal grain is 0 °, then drive the swing arm half-twist of described crystal grain transfer mechanism, directly described target crystal grain is placed the alignment area; Continue step 115.

Step 115, judge described eliminating crystal grain concentrates whether crystal grain is arranged, if then choose next crystal grain that described eliminating crystal grain concentrates as target crystal grain, and return step K; Otherwise, finish whole crystal grain sortings.

This step 110 can also for: if the user is dissatisfied to this crystal grain separation results, then can reset the range of deflection parameter of the crystal grain angle that allows in the described chip separating system, and remaining crystal grain on the chip film is carried out again sorting.

In addition, between step 108 and step 109, may further include following optimization sorting step:

Record described target crystal grain and place the position coordinates Pg (X of alignment area _g, Y _g);

If the optical center position coordinates of alignment area is C (X _c, Y _c), described crystal grain transfer mechanism leaves the alignment area after placing and finishing, and simultaneously, drives the platform coordinate system of alignment area, according to the X-axis displacement of platform coordinate system is: X _c-X _g, the moving distance of y-axis shift is: Y _c-Y _g, described target crystal grain is moved to the position, optical center of described alignment area;

Drive the image identification system of alignment area, scan this target crystal grain, if described target crystal grain marshalling then continues execution in step 109; If described target crystal grain is misaligned, can further carry out the translation compensation by image identification system.

Embodiment 2:

The embodiment of a kind of crystal grain angle correction method that is applied to chip separating system of the present invention is another kind of method flow diagram of the present invention as shown in Figure 2.

Concrete, a kind of crystal grain angle correction method that is applied to chip separating system, wherein, described chip separating system comprises image identification system, chip rollway, crystal grain transfer mechanism and alignment area, described image identification system comprises high-speed camera, described chip rollway comprises XY cross platform, thimble and Z axis rotation platform, and wherein, the method may further comprise the steps:

The range of deflection parameter of the crystal grain angle that allows in step 201, the described chip separating system of setting.

Step 202, choose one of them crystal grain on the chip film as target crystal grain.

Step 203, the XY cross platform that drives described chip rollway are transplanted on the identified region of the camera lens of described high-speed camera with described target crystal grain, identify by machine vision, obtain center position coordinates and the deflection angle α of described target crystal grain.Wherein, this identified region depends on the position of camera lens fully, the center of described identified region and the center superposition of described camera lens, and the change in location with pallet does not change.Wherein, the center position coordinates of described crystal grain is the physical deflection with respect to the center of described camera lens.

Step 204, judge whether the deflection angle α of described target crystal grain exceeds the range of deflection of the crystal grain angle that allows in the described chip separating system, if then described target crystal grain is belonged to described eliminating crystal grain collection, and carry out following steps 209; Otherwise, described target crystal grain is carried out following steps 205; Wherein, the range of deflection of the crystal grain angle of the permission of this system intialization can be selected different range of deflection values according to user's needs, and the range of deflection of the crystal grain angle of industrial permission commonly used is-15 °～+ 15 ° or-9 °～+ 9 °.Because the crystal grain that deflection angle α is larger can be undetected when chip detection, so that the larger crystal grain of deflection angle α does not possess detected parameters, therefore when carrying out die grading, therefore the automatic eliminating of the crystal grain that undesirable deflection angle α is larger arranges and gets rid of the crystal grain collection outside the scope of crystal grain sorting.

Step 205, mobile described chip rollway are transferred to the center of described camera lens and the center of described thimble with described target crystal grain according to the center position coordinates of described target crystal grain.Namely so that the cross aligning is carried out at the center of the center of camera lens and thimble.

Step 206, the described thimble jack-up of driving are also stung film described target crystal grain are peeled off.

Step 207, the described crystal grain transfer mechanism of driving grasp described target crystal grain.The suction nozzle that is specially in the crystal grain transfer mechanism is drawn target crystal grain.

The deflection angle α's of the described target crystal grain in step 208, the described step 207 of judgement is positive and negative, if the deflection angle α of described target crystal grain is timing, as shown in Figure 4, then drive the swing arm half-twist-α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of poor α deflection angle, described target crystal grain is placed the alignment area; If when the deflection angle α of described target crystal grain is negative, as shown in Figure 5, then drive the swing arm half-twist+α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of many α deflection angle, described target crystal grain is placed the alignment area; When if the deflection angle α of described target crystal grain is 0 °, as shown in Figure 3, then drive the swing arm half-twist of described crystal grain transfer mechanism, directly described target crystal grain is placed the alignment area; Continue step 209.

Step 209, judge whether crystal grain is arranged on the described chip film, if then choose next crystal grain on the described chip film as target crystal grain, and return step 203; Otherwise, finish this crystal grain sorting.

Concrete, the position compensation in the above-mentioned steps 208 is specially X side-play amount and the Y side-play amount of described target crystal grain in the platform coordinate system of described alignment area,

X side-play amount and Y side-play amount in the position compensation of described poor α deflection angle are calculated by following formula: $\left\{\begin{array}{c}X=R(\cos \mathrm{\β}-\cos (\mathrm{\β}+\mathrm{\α}))\\ Y=R(\sin (\mathrm{\β}+\mathrm{\α})-\sin \mathrm{\β})\end{array},\right.$

X side-play amount and Y side-play amount in the position compensation of described many α deflection angle are calculated by following formula: $\left\{\begin{array}{c}X=R(\cos (\mathrm{\β}-\mathrm{\α})-\cos \mathrm{\β})\\ Y=R(\sin \mathrm{\β}-\sin (\mathrm{\β}-\mathrm{\α})),\end{array}\right.$

Wherein, α is the deflection angle of described target crystal grain, and β is the start angle of described swing arm, and R is the length of described swing arm.The high-speed camera Direct Recognition that the start angle β of this swing arm arranges by described alignment area.Common, the start angle β of swing arm after the identification and the length R of swing arm can be preserved as the parameter of system, and need not to repeat the adjustment of systematic parameter.

In addition, this position compensation amount X side-play amount and Y side-play amount can be used as systematic parameter and keep for a long time.

Concrete, further comprise after the above-mentioned steps 209:

If step 210 user is dissatisfied to this crystal grain separation results, then can drive described chip film and rotate to an angle, one of them crystal grain that described eliminating crystal grain is concentrated is as target crystal grain.

Step 211, mobile described chip rollway are transferred to the center of described thimble with described target crystal grain according to the center position coordinates of described target crystal grain, wherein, and the center of described thimble and the centrally aligned of described camera lens.

Step 212, the described thimble jack-up of driving are also stung film, and described target crystal grain is peeled off.

Step 213, the described crystal grain transfer mechanism of driving grasp described target crystal grain.

Step 214, the deflection angle α of the described target crystal grain among the described step G is judged, if the deflection angle α of described target crystal grain is timing, then drive the swing arm half-twist-α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of poor α deflection angle, described target crystal grain is placed the alignment area; When if the deflection angle α of described target crystal grain is negative, then drive the swing arm half-twist+α of described crystal grain transfer mechanism, simultaneously described alignment area is carried out the position compensation of many α deflection angle, described target crystal grain is placed the alignment area; When if the deflection angle α of described target crystal grain is 0 °, then drive the swing arm half-twist of described crystal grain transfer mechanism, directly described target crystal grain is placed the alignment area; Continue step 214.

Step 215, judge described eliminating crystal grain concentrates whether crystal grain is arranged, if then choose next crystal grain that described eliminating crystal grain concentrates as target crystal grain; Otherwise, finish whole crystal grain sortings.

In addition, between step 208 and step 209, may further include following optimization sorting step:

Record described target crystal grain and place the position coordinates Pg (X of alignment area _g, Y _g);

If the optical center position coordinates of alignment area is C (X _c, Y _c), described crystal grain transfer mechanism leaves the alignment area after placing and finishing, and simultaneously, drives the platform coordinate system of alignment area, according to the X-axis displacement of platform coordinate system is: X _c-X _g, the moving distance of y-axis shift is: Y _c-Y _g, described target crystal grain is moved to the position, optical center of described alignment area;

Drive the image identification system of alignment area, scan this target crystal grain, if described target crystal grain marshalling then continues execution in step 209; If described target crystal grain is misaligned, can further carry out the translation compensation by image identification system.

The present invention compensates the angular deviation of crystal grain with the translational motion of alignment area in conjunction with rotatablely moving of crystal grain transfer mechanism, between feed zone and alignment area position compensation, carry out Parallel Scheduling, in the situation that does not reduce screen, realized the self-correcting of crystal grain angle.

Should be noted that at last; above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although with reference to preferred embodiment the present invention has been done to explain; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement technical scheme of the present invention, and not break away from essence and the scope of technical solution of the present invention.

Claims (8)

1. crystal grain angle correction method that is applied to chip separating system, described chip separating system comprises image identification system, chip rollway, crystal grain transfer mechanism and alignment area, described image identification system comprises high-speed camera, described chip rollway comprises XY cross platform, thimble and Z axis rotation platform, it is characterized in that the method may further comprise the steps:

The range of deflection parameter of the crystal grain angle that allows in A, the described chip separating system of setting;

B, drive the XY cross platform of described chip rollway, all crystal grains on the chip film is transplanted on respectively the identified region of the camera lens of described high-speed camera, identify by machine vision, obtain center position coordinates and the deflection angle of described all crystal grains

C, with described deflection angle

The crystal grain of range of deflection that exceeds the crystal grain angle of described permission belongs to gets rid of the crystal grain collection, remaining crystal grain is belonged to treat sorting crystal grain collection;

D, choose and describedly treat that one of them crystal grain that sorting crystal grain concentrates is as target crystal grain;

E, mobile described chip rollway are transferred to the center of described thimble with described target crystal grain according to the center position coordinates of described target crystal grain, wherein, and the center of described thimble and the centrally aligned of described camera lens;

F, the described thimble jack-up of driving are also stung film, and described target crystal grain is peeled off;

G, the described crystal grain transfer mechanism of driving grasp described target crystal grain;

H, to the deflection angle of the described target crystal grain among the described step G

Judge, if the deflection angle of described target crystal grain Be timing, then drive the swing arm rotation of described crystal grain transfer mechanism

-

, it is poor simultaneously described alignment area to be carried out

The position compensation of deflection angle is placed the alignment area with described target crystal grain;

If the deflection angle of described target crystal grain When negative, then drive the swing arm rotation of described crystal grain transfer mechanism

+

, carry out many to described alignment area simultaneously The position compensation of deflection angle is placed the alignment area with described target crystal grain;

If the deflection angle of described target crystal grain

For

The time, then drive the swing arm rotation of described crystal grain transfer mechanism

, directly described target crystal grain is placed the alignment area;

Continue step I;

I, judge the described sorting crystal grain for the treatment of concentrates whether crystal grain is arranged, if then choose and describedly treat next crystal grain that sorting crystal grain concentrates as target crystal grain, and return step e; Otherwise, finish this crystal grain sorting;

Wherein, the position compensation among the described step H is specially described target crystal grain in the platform coordinate system of described alignment area

Side-play amount and

Side-play amount,

Described poor

In the position compensation of deflection angle

Side-play amount and

Side-play amount is calculated by following formula:

,

Described many

In the position compensation of deflection angle

Side-play amount and

Side-play amount is calculated by following formula:

,

Wherein, Be the deflection angle of described target crystal grain,

Be the start angle of described swing arm, Length for described swing arm.

2. the crystal grain angle correction method that is applied to chip separating system according to claim 1 is characterized in that,

Described step I finishes further to comprise after this crystal grain sorting:

If step J user is dissatisfied to this crystal grain separation results, then drive described chip film and rotate to an angle, choose one of them concentrated crystal grain of described eliminating crystal grain as target crystal grain;

Step K, mobile described chip rollway are transferred to the center of described thimble with the center position coordinates of described target crystal grain, wherein, and the centrally aligned of described thimble center and described camera lens;

Step L, the described thimble jack-up of driving are also stung film, and described target crystal grain is peeled off;

Step M, the described crystal grain transfer mechanism of driving grasp described target crystal grain;

The deflection angle of the described target crystal grain among step N, the described step M of judgement

Positive and negative, if the deflection angle of described target crystal grain

Be timing, then drive the swing arm rotation of described crystal grain transfer mechanism -

, it is poor simultaneously described alignment area to be carried out

The position compensation of deflection angle is placed the alignment area with described target crystal grain;

If the deflection angle of described target crystal grain

When negative, then drive the swing arm rotation of described crystal grain transfer mechanism

+

, carry out many to described alignment area simultaneously

The position compensation of deflection angle is placed the alignment area with described target crystal grain;

If the deflection angle of described target crystal grain

For

The time, then drive the swing arm rotation of described crystal grain transfer mechanism

, directly described target crystal grain is placed the alignment area;

Continue step O;

Step O, judge described eliminating crystal grain concentrates whether crystal grain is arranged, if then choose next crystal grain that described eliminating crystal grain concentrates as target crystal grain, and return step K; Otherwise, finish whole crystal grain sortings.

3. the crystal grain angle correction method that is applied to chip separating system according to claim 2 is characterized in that,

The range of deflection of the crystal grain angle of the permission in the described steps A is

～

4. the crystal grain angle correction method that is applied to chip separating system according to claim 2 is characterized in that,

The range of deflection of the crystal grain angle of the permission in the described steps A is

～

5. crystal grain angle correction method that is applied to chip separating system, described chip separating system comprises image identification system, chip rollway, crystal grain transfer mechanism and alignment area, described image identification system comprises high-speed camera, described chip rollway comprises XY cross platform, thimble and Z axis rotation platform, it is characterized in that the method may further comprise the steps:

The range of deflection parameter of the crystal grain angle that allows in A, the described chip separating system of setting;

B, choose one of them crystal grain on the chip film as target crystal grain;

C, drive the XY cross platform of described chip rollway, described target crystal grain is transplanted on the identified region of the camera lens of described high-speed camera, identify by machine vision, obtain center position coordinates and the deflection angle of described target crystal grain

The deflection angle of D, the described target crystal grain of judgement

The range of deflection that whether exceeds the crystal grain angle that allows in the described chip separating system is if then belong to described target crystal grain and get rid of the crystal grain collection, and carry out following steps I; Otherwise, described target crystal grain is carried out following steps E;

E, mobile described chip rollway are transferred to the center of described thimble with described target crystal grain according to the center position coordinates of described target crystal grain, wherein, and the center of described thimble and the centrally aligned of described camera lens;

F, the described thimble jack-up of driving are also stung film, and described target crystal grain is peeled off;

G, the described crystal grain transfer mechanism of driving grasp described target crystal grain;

H, to the deflection angle of the described target crystal grain among the described step G

Judge, if the deflection angle of described target crystal grain

Be timing, then drive the swing arm rotation of described crystal grain transfer mechanism

-

, it is poor simultaneously described alignment area to be carried out

The position compensation of deflection angle is placed the alignment area with described target crystal grain;

If the deflection angle of described target crystal grain

When negative, then drive the swing arm rotation of described crystal grain transfer mechanism

+

, carry out many to described alignment area simultaneously

The position compensation of deflection angle is placed the alignment area with described target crystal grain;

If the deflection angle of described target crystal grain For

The time, then drive the swing arm rotation of described crystal grain transfer mechanism

, directly described target crystal grain is placed the alignment area;

Continue step I;

I, judge whether crystal grain is arranged on the described chip film, if then choose next crystal grain on the described chip film as target crystal grain, and return step C; Otherwise, finish this crystal grain sorting;

Wherein, the position compensation among the described step H is specially described target crystal grain in the platform coordinate system of described alignment area

Side-play amount and

Side-play amount,

Described poor In the position compensation of deflection angle

Side-play amount and

Side-play amount is calculated by following formula:

,

Described many

In the position compensation of deflection angle Side-play amount and

Side-play amount is calculated by following formula:

,

Wherein, Be the deflection angle of described target crystal grain,

Be the start angle of described swing arm,

Length for described swing arm.

6. the crystal grain angle correction method that is applied to chip separating system according to claim 5 is characterized in that,

Described step I finishes further to comprise after this crystal grain sorting:

If step J user is dissatisfied to this crystal grain separation results, then drive described chip film and rotate to an angle, one of them crystal grain that described eliminating crystal grain is concentrated is as target crystal grain;

Step K, mobile described chip rollway are transferred to the center of described thimble with described target crystal grain according to the center position coordinates of described target crystal grain, wherein, and the center of described thimble and the centrally aligned of described camera lens;

Step L, the described thimble jack-up of driving are also stung film, and described target crystal grain is peeled off;

Step M, the described crystal grain transfer mechanism of driving grasp described target crystal grain;

Step N, to the deflection angle of the described target crystal grain among the described step M

Judge, if the deflection angle of described target crystal grain

Be timing, then drive the swing arm rotation of described crystal grain transfer mechanism

-

, it is poor simultaneously described alignment area to be carried out

The position compensation of deflection angle is placed the alignment area with described target crystal grain;

If the deflection angle of described target crystal grain

When negative, then drive the swing arm rotation of described crystal grain transfer mechanism

+

, carry out many to described alignment area simultaneously

The position compensation of deflection angle is placed the alignment area with described target crystal grain;

If the deflection angle of described target crystal grain

For

The time, then drive the swing arm rotation of described crystal grain transfer mechanism

, directly described target crystal grain is placed the alignment area;

Continue step O;

Step O, judge described eliminating crystal grain concentrates whether crystal grain is arranged, if then choose next crystal grain that described eliminating crystal grain concentrates as target crystal grain; Otherwise, finish whole crystal grain sortings.

7. the crystal grain angle correction method that is applied to chip separating system according to claim 6 is characterized in that,

The range of deflection of the crystal grain angle of the permission in the described steps A is

～

8. the crystal grain angle correction method that is applied to chip separating system according to claim 7 is characterized in that,

The range of deflection of the crystal grain angle of the permission in the described steps A is

～

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