CN101764067A - Method for encapsulating similar solar spectrum LED - Google Patents
Method for encapsulating similar solar spectrum LED Download PDFInfo
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- CN101764067A CN101764067A CN 200910200629 CN200910200629A CN101764067A CN 101764067 A CN101764067 A CN 101764067A CN 200910200629 CN200910200629 CN 200910200629 CN 200910200629 A CN200910200629 A CN 200910200629A CN 101764067 A CN101764067 A CN 101764067A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The invention relates to a method for encapsulating a similar solar spectrum LED, and belongs to the technical field of LED encapsulation. The method adopts LED chips with different colors as light sources and integrates and encapsulates a plurality of LED chips with different colors covering a visible light range together, wherein each chip is electrically connected with the external through the corresponding pins; and white light is simulated to generate by controlling the radiant flux of each chip. In the method, a plurality of monochromatic light covering the visible light range are mixed to form the white light, the white light emitted from the sun can be more truly simulated; and the white light produced by the method has better color rendering property.
Description
Technical field
The invention belongs to LED encapsulation technology field, be specifically related to the method for packing of a kind solar spectrum LED.
Background technology
Be used to the LED device that throws light on now, the pattern of almost completely having used yellow fluorescent powder to add blue light produces white light, though its color rendering is high more a lot of than the high-pressure sodium lamp that conventional road lamp uses, the incandescent lamp of comparing the traditional lighting use is low.And this mode is when producing the white light of low colour temperature, its color substantial deviation blackbody radiance curve, nature very can't produce the white light of the low colour temperature of the high color temperature white light of the human similar sunlight of being accustomed to and flame or candle light in evolution.Therefore how to produce the white light of high-color rendering, high-quality white light becomes the key point that LED enters general lighting under the especially low colour temperature.Method that CREE at first adopts high color temperature white light LED to add red monochromatic light LED in same light fixture has obtained color rendering greater than 90 white light.OSRAM researched and developed the white light technology that adds green and red fluorescence powder based on blue-ray LED, obtained color rendering equally greater than 90 white light.The both is based on the fluorescent material technology, however the lower energy photon that adopts high-energy photon fluorescent material to excite mix and produce white light, even launching efficiency is 100% also will inevitably off-energy.And RGB three looks produce white light because its spectral component only contains RGB three looks, though its color rendering adds the white light that fluorescent material produces far above blue light, also have a certain distance apart from incandescent lamp.The present invention proposes the method for packing of the LED of a kind solar spectrum, LED is luminous without the direct outgoing of fluorescent material energy loss still less, multiple color LED comprises the sunlight that more multispectral one-tenth assigns to simulate continuous spectrum, has more color rendering near sunlight, can independently control its radiant flux to the LED of every kind of color, can simulate the sunlight under the different-colour.
Summary of the invention
The objective of the invention is to propose the method for packing of a kind solar spectrum LED.
The method for packing of the class solar spectrum LED that the present invention proposes, by led chip, support and metal base mutual encapsulation are formed, adopting the led chip of different colours is light source device, metal base is fixed in support central authorities, the led chip of different colours is solid brilliant on metal base, adopt the mode that is total to anode or common cathode to connect between the led chip of different colours, one utmost point of each color led chip is drawn by a corresponding pin, public electrode is drawn by a pin, led chip one utmost point is connected by gold thread with corresponding pin, and some silica gel is packaged into class solar spectrum LED in support at last.
Among the present invention, the color category of described led chip is greater than three kinds, and will be evenly distributed in the limit of visible spectrum, therefore can mix out the white light of high-color rendering.
Among the present invention, the led chip that color is identical adopts series system to connect.
Among the present invention, each led chip connects external connection electrical apparatus by corresponding pin.
Among the present invention, the pin of different LED chip correspondence adopts that two row are direct insertion to be evenly distributed in the metal base two bottom sides or to arrange with circular, fashion.
Among the present invention, distribute according to the solar spectrum energy of required simulation and to determine general ratio for the demand of shades of colour light radiant flux, consider the light efficiency of device power and each color chip, determine chip power and quantity that shades of colour is selected for use, the multiple chips of same color adopts and is connected in series.For high-power applications, power that can be according to actual needs doubles to the quantity of every kind of chip, and the chip of same same color is with being connected in series.
Among the present invention, the led chip of different colours can adopt the method for common anode or common cathode to connect, and a utmost point of every kind of color chip is drawn by a corresponding pin, public electrode is also drawn by a pin, for arranging of numerous external pins, can copy that two row in the integrated circuit encapsulation are direct insertion to be evenly distributed in the device both sides or circle waits other lead-out mode.Therefore can realize control easily, and the sunlight spectrum of simulating under the various different-colours satisfies different sight illuminations to device.
Beneficial effect of the present invention is: include by use and contained the multiple monochromatic light LED in the visible-range, the class solar spectrum LED device that this method for packing is made is the white light that sends of the real simulated sun more, and easily by control, come daylight, to satisfy the demand of different illumination sights with same device simulation different-colour.
Description of drawings
The sunlight relative spectral energy distributed when Fig. 1 was 5300k.
Fig. 2 is seven kinds of monochromatic LED imitation solar spectrum schematic diagrames.
Fig. 3 is that the synthetic class sunlight relative spectral energy of seven kinds of monochromatic LEDs distributes.
Fig. 4 is the 3D schematic diagram of embodiment 1.
Fig. 5 is the vertical view of embodiment 1.
Fig. 6 is the vertical view of embodiment 2.
Number in the figure: 1 is support, and 2 is metal base, and 3 is led chip, and 4 is gold thread.
Embodiment:
In the following detailed description and preferred embodiment that provides, can understand more comprehensively utility model of the present invention, these explanations and accompanying drawing are not limited in specific embodiment, and just play the effect of explaining and understanding.
Embodiment 1:
The LED modules with different colors chip that the present invention adopts can integratedly be packaged into the device of similar two row straight cutting forms, and the flow process of the enforcement that it is concrete is as follows:
The LED that selects for use wavelength to be respectively 7 kinds of colors of 630nm, 600nm, 580nm, 560nm, 530nm, 470nm, 450nm comes seven kinds of iris in the simulated solar irradiation.Adopt the low-power LED chip 3 of the vertical stratification of 60mA, its positive pole is down, and negative pole is last, every kind of color a slice.The led chip 3 that on the metal base 2 of support 1 central authorities, connects different colours with the method that is total to anode, with the silver slurry that seven LEDs chips 3 are brilliant admittedly, wherein six surround hexagon, and the 7th places hexagon central authorities.By beating gold thread 4 that led chip 3 is continuous with corresponding pin.In support, put silica gel, and the class solar spectrum LED device of the similar two row straight cutting chips of profile has promptly been made in baking.
Embodiment 2:
The LED modules with different colors chip that the present invention adopts can integratedly be packaged into the device of similar two row straight cutting forms, and the flow process of the enforcement that it is concrete is as follows:
The LED that selects for use wavelength to be respectively 6 kinds of colors of 630nm, 600nm, 560nm, 530nm, 470nm, 450nm comes simulated solar irradiation.Adopt the low-power LED chip 3 of the horizontal structure of 60mA, its negative pole is in central authorities, and is anodal in a side, every kind of color a slice, because the light efficiency of green LED is lower now, and the demand of green in mixed light is bigger, so the green LED of 530nm is with two.The led chip 3 that on the metal base 2 of support 1 central authorities, connects different colours, and the series connection of two LEDs of same color with the method that is total to anode, it is solid brilliant to use silver to starch seven LEDs chips 3, and wherein six surround hexagon, and the 7th places hexagon central authorities.By beating gold thread 4 that led chip 3 is continuous with corresponding pin.In support, put silica gel, and the class solar spectrum LED device of the similar two row straight cutting chips of profile has promptly been made in baking.
Claims (5)
1. the method for packing of a kind solar spectrum LED, it is characterized in that by led chip, support and metal base mutual encapsulation are formed, adopting the led chip of different colours is light source device, metal base is fixed in support central authorities, the led chip of different colours is solid brilliant on metal base, adopt the mode that is total to anode or common cathode to connect between the led chip of different colours, one utmost point of each color led chip is drawn by a corresponding pin, public electrode is drawn by a pin, led chip one utmost point is connected by gold thread with corresponding pin, and some silica gel is packaged into class solar spectrum LED in support at last.
2. the method for packing of class solar spectrum LED according to claim 1, the color category that it is characterized in that described led chip be greater than three kinds, and will be evenly distributed in the limit of visible spectrum.
3. the method for packing of class solar spectrum LED according to claim 1 is characterized in that the identical led chip of color adopts series system to connect.
4. the method for packing of class solar spectrum LED according to claim 1 is characterized in that each led chip connects external connection electrical apparatus by corresponding pin.
5. the method for packing of class solar spectrum LED according to claim 1, the pin that it is characterized in that different LED chip correspondence adopt that two row are direct insertion to be evenly distributed in the metal base two bottom sides or to arrange with circular, fashion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910200629 CN101764067A (en) | 2009-12-24 | 2009-12-24 | Method for encapsulating similar solar spectrum LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910200629 CN101764067A (en) | 2009-12-24 | 2009-12-24 | Method for encapsulating similar solar spectrum LED |
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| Publication Number | Publication Date |
|---|---|
| CN101764067A true CN101764067A (en) | 2010-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200910200629 Pending CN101764067A (en) | 2009-12-24 | 2009-12-24 | Method for encapsulating similar solar spectrum LED |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969293A (en) * | 2012-11-20 | 2013-03-13 | 宜兴市环洲微电子有限公司 | Common-anode small-power silicon-controlled module and manufacturing process thereof |
| CN103162100A (en) * | 2011-12-08 | 2013-06-19 | 苏州市世纪晶源电力科技有限公司 | Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip |
| CN106229312A (en) * | 2016-08-30 | 2016-12-14 | 厦门华联电子有限公司 | A kind of full spectrum CSP packaged light source and manufacture method thereof |
| CN106783821A (en) * | 2016-12-26 | 2017-05-31 | 南昌大学 | The full-spectrum LED encapsulating structure and its method for packing of a kind of unstressed configuration powder |
| CN106796003A (en) * | 2014-09-09 | 2017-05-31 | 深圳市客为天生态照明有限公司 | One species solar spectrum LED structure |
| WO2018053773A1 (en) * | 2016-09-23 | 2018-03-29 | 深圳市客为天生态照明有限公司 | Sun-like spectrum led lamp bead structure |
| US10718490B2 (en) | 2016-09-23 | 2020-07-21 | Shenzhen Keweitian Eco-Lighting Co., Ltd. | LED lamp bead structure having quasi-solar spectrum |
-
2009
- 2009-12-24 CN CN 200910200629 patent/CN101764067A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103162100A (en) * | 2011-12-08 | 2013-06-19 | 苏州市世纪晶源电力科技有限公司 | Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip |
| CN102969293A (en) * | 2012-11-20 | 2013-03-13 | 宜兴市环洲微电子有限公司 | Common-anode small-power silicon-controlled module and manufacturing process thereof |
| US10480750B2 (en) | 2014-09-09 | 2019-11-19 | Shenzhen Keweitian Eco-Lighting Co., LTD | Solar spectrum-like LED structure |
| CN106796003B (en) * | 2014-09-09 | 2019-06-21 | 深圳市客为天生态照明有限公司 | One type solar spectrum LED structure |
| CN106796003A (en) * | 2014-09-09 | 2017-05-31 | 深圳市客为天生态照明有限公司 | One species solar spectrum LED structure |
| CN106229312B (en) * | 2016-08-30 | 2018-10-12 | 厦门华联电子股份有限公司 | A kind of full spectrum CSP packaged light sources and its manufacturing method |
| CN106229312A (en) * | 2016-08-30 | 2016-12-14 | 厦门华联电子有限公司 | A kind of full spectrum CSP packaged light source and manufacture method thereof |
| WO2018053773A1 (en) * | 2016-09-23 | 2018-03-29 | 深圳市客为天生态照明有限公司 | Sun-like spectrum led lamp bead structure |
| CN109716014A (en) * | 2016-09-23 | 2019-05-03 | 深圳市客为天生态照明有限公司 | One type solar spectrum LED lamp bead structure |
| US10718490B2 (en) | 2016-09-23 | 2020-07-21 | Shenzhen Keweitian Eco-Lighting Co., Ltd. | LED lamp bead structure having quasi-solar spectrum |
| CN109716014B (en) * | 2016-09-23 | 2021-03-30 | 深圳市客为天生态照明有限公司 | Solar spectrum-like LED lamp bead structure |
| CN106783821A (en) * | 2016-12-26 | 2017-05-31 | 南昌大学 | The full-spectrum LED encapsulating structure and its method for packing of a kind of unstressed configuration powder |
| CN106783821B (en) * | 2016-12-26 | 2020-11-20 | 南昌大学 | Full-spectrum LED packaging structure without fluorescent powder and packaging method thereof |
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Application publication date: 20100630 |