CN101740726B - Organic electroluminescent device and manufacturing method thereof - Google Patents

Organic electroluminescent device and manufacturing method thereof Download PDF

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Publication number
CN101740726B
CN101740726B CN200810227260A CN200810227260A CN101740726B CN 101740726 B CN101740726 B CN 101740726B CN 200810227260 A CN200810227260 A CN 200810227260A CN 200810227260 A CN200810227260 A CN 200810227260A CN 101740726 B CN101740726 B CN 101740726B
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positive photoresist
substrate
electrode
organic
insulating barrier
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CN101740726A (en
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王玉林
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Abstract

The invention relates to an organic electroluminescent device and a manufacturing method thereof. The method comprises the following steps: 1, forming a first electrode on a substrate; 2, continuously forming a non-photosensitive organic insulating material and a positive photoresist on the substrate, adopting a mask plate to perform exposure on the positive photoresist, performing developing and etching, and retaining the positive photoresist to form an insulating layer pattern; 3, forming the positive photoresist on the substrate after the step 2, adopting the mask plate capable of forming an isolation pole to perform exposure and developing on the positive photoresist formed in the step 3 so as to form an isolation pole pattern; 4, forming an organic material layer on the substrate after the step 3; and 5, forming a second electrode on the substrate after the step 4. The method avoids adopting a photosensitive organic insulating material with high price, can reduce the production cost of the insulating layer, and solves the problem of unstable contact caused by material variance between the insulating layer and the isolation pole.

Description

Organic electroluminescence device and manufacturing approach thereof
Technical field
The present invention relates to technical field of flat panel display, relate in particular to a kind of organic electroluminescence device and manufacturing approach thereof.
Background technology
Organic electroluminescence device is called Organic Light Emitting Diode (Organic Light EmittingDiode again; Be called for short OLED); It is a kind of novel flat-panel display device; Compare with liquid crystal display device, OLED has active illuminating, high brightness, ultra-thin, low-power consumption, with great visual angle and plurality of advantages such as operating temperature range is wide.
In the structure of OLED device, insulating barrier is one of indispensable part, and the effect of insulating barrier comprises restriction elemental area size, confirm the accurate position of display unit pixel and stop to be short-circuited between negative electrode and the anode etc.
Usually, in OLED preparation of devices process, on substrate, apply photo-sensistive polyimide (ployimide is called for short PI), to light sensitivity PI exposure, development, form the insulating barrier figure, on insulating barrier, prepare insulated column then through mask plate.PI is a kind of organic insulating material, can be as the insulating barrier in the OLED device.
The technology of prior art for preparing OLED device obtains the insulating barrier figure owing to directly the material that forms insulating barrier is made public, thus need use photosensitive organic insulating material, but light sensitivity PI costs an arm and a leg, and OLED device production cost is unfavorable for reducing; And the material of insulating barrier and insulated column is different usually, can cause the contact between insulated column and the insulating barrier unstable, thereby influences the stability of OLED device.
Summary of the invention
The problem that the object of the invention exists in being directed against prior art; A kind of OLED and manufacturing approach thereof are provided; Avoid adopting expensive photosensitive organic insulating material, and overcome between insulating barrier and the insulated column because the contact problem of unstable that materials variances causes.
To achieve these goals, the invention provides a kind of organic electroluminescence device manufacturing approach, comprising:
Step 1, on substrate, form first electrode;
Step 2, on the substrate that is formed with said first electrode, form continuously non-photosensitivity property organic insulating material and positive photoresist; The mask plate that employing can form the insulating barrier figure makes public to said positive photoresist; Develop then and etching, and keep positive photoresist, form the insulating barrier figure;
Step 3, through forming positive photoresist on the substrate of said step 2, the mask plate that employing can form insulated column makes public to the positive photoresist that forms in the said step 3 and develops formation insulated column figure; The material of the positive photoresist that forms in the step 3 is identical with the positive photoresist material of formation in the step 2;
Form organic material layer on step 4, the substrate after the said step 3 of process;
Form second electrode on step 5, the substrate after the said step 4 of process.
To achieve these goals, the present invention also provides a kind of organic electroluminescence device, comprising:
First electrode is arranged on the substrate;
Insulating barrier is arranged on the substrate that is formed with said first electrode, and the material of said insulating barrier is a non-photosensitivity property organic insulating material;
Positive photoresist is arranged on the said insulating barrier;
Insulated column is arranged on the said positive photoresist, and the material of said insulated column is identical with said positive photoresist;
Organic material layer is formed on said insulated column, positive photoresist and said first electrode;
Second electrode is formed on the said organic material layer.
Organic electroluminescence device provided by the invention and manufacturing approach thereof; On the substrate that is formed with first electrode, form common non-photosensitivity property organic insulating material and positive photoresist continuously; Employing can form the mask plate of insulating barrier figure to the positivity resist exposure, and the etching of developing then forms the insulating barrier figure; So just avoided adopting expensive light sensitivity organic insulation layer material; Can reduce the cost of the part of insulating barrier in the organic electroluminescence device, thereby reduce the cost of whole organic electroluminescence device, and the material of insulated column is identical with the material of positive photoresist under being formed on insulated column; Can avoid since insulated column and insulating layer material difference cause contact instability, help improving the stability of organic electroluminescence device.
Through accompanying drawing and embodiment, technical scheme of the present invention is done further detailed description below.
Description of drawings
Shown in Figure 1 for forming first electrode structural representation afterwards in the organic electroluminescence device manufacturing approach of the present invention;
Shown in Figure 2 for forming insulating barrier structural representation afterwards in the organic electroluminescence device manufacturing approach of the present invention;
Shown in Figure 3 for forming insulated column structural representation afterwards in the organic electroluminescence device manufacturing approach of the present invention;
Shown in Figure 4 for forming second electrode structural representation afterwards in the organic electroluminescence device manufacturing approach of the present invention.
Embodiment
OLED manufacturing approach provided by the invention comprises the steps:
Step 1, on substrate, form first electrode;
Step 2, on the substrate that is formed with first electrode, form continuously non-photosensitivity property organic insulating material and positive photoresist; The mask plate that employing can form the insulating barrier figure makes public to said positive photoresist; Develop then and etching, and keep positive photoresist, form the insulating barrier figure;
Step 3, through forming positive photoresist on the substrate of step 2, the mask plate that employing can form insulated column makes public to the positive photoresist that forms in the step 3, forms the insulated column figure; The material of the positive photoresist that forms in the step 3 is identical with the material of positive photoresist in the step 2;
Form organic material layer on step 4, the substrate after process step 3;
Form second electrode on step 5, the substrate after process step 4.
The difference of this method and OLED manufacturing approach of the prior art is: OLED manufacturing approach provided by the invention; When forming insulating barrier; On the substrate that is formed with first electrode, form earlier the common organic insulating material of one deck non-photosensitivity property, on the common organic insulating material of non-photosensitivity property, form positive photoresist then, through to the positivity resist exposure; Develop then and etching, obtain the figure of insulating barrier.Adopt this method; Can not need adopt expensive photosensitive organic insulating material; And just can form insulating barrier with the relatively low common organic insulating material of price, can reduce the cost of insulating barrier part among the OLED like this, thereby reduce the cost of whole 0LED.And in the prior art, when forming insulating barrier, only on substrate, form one deck light sensitivity organic insulation layer material; Through light sensitivity organic insulation layer material is directly made public; The etching of developing then forms the insulating barrier figure, such technology; The inevitable requirement insulating layer material is a light sensitivity, thereby has caused the increase of insulating barrier departmental cost among the OLED.In addition; Positive photoresist needs to keep in step 2; On the positive photoresist that step 2 forms, form insulated column in the step 3; And the material of the positive photoresist in the material of insulated column and the step 2 is identical, can avoid like this since insulating barrier and the materials variances of insulated column cause contact instability.
The implementation procedure of OLED manufacturing approach of the present invention is described below in conjunction with concrete technology.
Step 1 is specially: preparation one layer thickness is tin indium oxide (ITO) film of 50～200nm on substrate; On ito thin film, be coated with one deck photoresist then; To the photoresist prebake conditions; The mask plate that utilization can form first electrode pattern makes public to photoresist, and the photoresist with the sensitization part removes through development again, and the figure of the photoresist after the development is consistent with the figure of first electrode.Then, with not etched away, form the figure of first electrode by the ito thin film of photoresist protection.First electrode is an anode, also can be negative electrode, uses ITO as anode material usually.Be illustrated in figure 1 as and form first electrode structural representation afterwards in the organic electroluminescence device manufacturing approach of the present invention, first electrode 2 is bar shaped, is set in parallel on the substrate 1.
Step 2 is specially: the common organic insulation layer material of spin coating one deck non-photosensitivity property on through the substrate after the step 1; The EKPI-305 II B electronic isolation glue produced of Beijing Bo Mi scientific & technical corporation for example; To this organic insulation layer material prebake conditions; Spin coating one deck positive photoresist on the common organic insulation layer material of non-photosensitivity property to the positive photoresist prebake conditions, adopts the mask plate that can form the insulating barrier figure that positive photoresist is made public then again; The positive photoresist development of sensitization part is removed, the figure of the positive photoresist after the development is consistent with the insulating barrier figure again.To do not etched away then, form the insulating barrier figure, and keep positive photoresist by the non-photosensitivity property organic insulation layer material of positive photoresist protection.For the reinforced insulation performance, can continue under 220～300 degrees centigrade temperature, substrate to be cured baking 30 to 60 minutes.Be illustrated in figure 2 as and form insulating barrier structural representation afterwards in the organic electroluminescence device manufacturing approach of the present invention; The organic insulation layer material 3 and positive photoresist 4 continuous being formed on the substrate 1 of common non-photosensitivity property; The insulating barrier figure be formed on the substrate 1 with the perpendicular bar chart of first electrode 2 of bar shaped; White space between first electrode 2 of bar shaped also has insulating barrier in addition; White space 41 on the positive photoresist promptly is the pixel region that limits through insulating barrier, has etched away positive photoresist and organic insulation layer material on this zone 41, has exposed first electrode 2.
Need to prove that the insulating barrier figure that provides in the step 2 is a kind of example, because different OLED device pixel region designing requirements is different, and insulating barrier is used for limiting the pixel region shape, so the insulating barrier figure also can be different.
Step 3 is specially: spin coating one deck positive photoresist on through the substrate after the step 2; Prebake conditions under 90 to 100 degrees centigrade temperature; With the mask plate that can form the insulated column figure positive photoresist is made public then, sensitization positive photoresist is partly removed through development, clean again; Toasted afterwards 10 minutes, and obtained the up big and down small trapezoidal insulated column figure that falls.Be illustrated in figure 3 as and form insulated column structural representation afterwards in the organic electroluminescence device manufacturing approach of the present invention, be formed on the positive photoresist 4 of step 2 formation with first electrode, 2 one group of vertical parallel insulated column 5.The material of the positive photoresist in insulated column 5 and the step 2 is identical.
Step 4, the substrate that will pass through after the step 3 are sent in the vacuum chamber; To fall trapezoidal insulated column is the direct vapor deposition organic material layer of mask; Perhaps for color OLED; Can pass through variform mask plate, the pixel region of the organic material vapor deposition of R, G, B three looks to appointment, pixel region promptly is the pixel region that limits through the insulating barrier figure in the step 2.Organic material layer can be an individual layer, also can be multilayer, and the multilayer organic material layer can comprise hole/electron injecting layer, hole/electron transfer layer and RGB luminescent layer etc.
Step 5, the substrate that will pass through after the step 4 are sent in the vacuum chamber, and vapor deposition layer of metal film on the substrate forms second electrode.The material of metallic film can be aluminium, silver or other stable metal or alloy.Second electrode can anode, also can be negative electrode, uses metal as negative electrode usually.Be illustrated in figure 4 as and form second electrode structural representation afterwards in the organic electroluminescence device manufacturing approach of the present invention; The organic material layer 6 and second electrode 7 are formed on insulated column 5, positive photoresist 4 and first electrode 2; Etching has exposed a part of first electrode 2 in the step 2; So there is organic material layer 6 to be formed on first electrode 2 in the step 5, on organic material layer 6 second electrode 7.
Through step 1 after the step 6, can outside the viewing area on the substrate, be coated with fabric width frame glue, will be attached on the envelope frame glue with the corresponding glass of display area size or metal rear seal-cover then and carry out cure package.
The structure of organic electroluminescence device provided by the invention is as shown in Figure 4; The structure of this organic electroluminescence device is: first electrode 2 is arranged on the substrate 1; Insulating barrier 3 is arranged on the substrate 1 that is formed with first electrode 2, and positive photoresist 4 is arranged on the insulating barrier 3, and insulated column 5 is arranged on the positive photoresist 4; Organic material layer 6 is formed on insulated column 5, positive photoresist 4 and first electrode 2, and second electrode 7 is formed on the organic material layer 6.Wherein, insulated column 5 is that positive photoresist exposure imaging etching forms, and positive photoresist 4 is identical with the material of insulated column 5
The material of first electrode 2 can be ITO; The material of insulating barrier 3 is common organic insulating materials of non-light sensitivity; For example can be common non-photosensitivity property PI, positive photoresist 4 be identical with the material of insulated column 5, and the material of organic material layer 6 can be the electroluminescent organic material in the OLED device; Organic material layer 6 can be an individual layer, also can be multilayer.The material of second electrode 7 can be stable metal or alloys such as aluminium, silver.
Organic electroluminescence device provided by the invention and manufacturing approach thereof; On the substrate that is formed with first electrode, form common non-photosensitivity property organic insulating material and positive photoresist continuously; Employing can form the mask plate of insulating barrier figure to the positivity resist exposure, and the etching of developing then forms the insulating barrier figure; So just avoided adopting expensive light sensitivity organic insulation layer material; Can reduce the cost of the part of insulating barrier in the organic electroluminescence device, thereby reduce the cost of whole organic electroluminescence device, and the material of insulated column is identical with the material of positive photoresist under being formed on insulated column; Can avoid since insulated column and insulating layer material difference cause contact instability, help improving the stability of organic electroluminescence device.
What should explain at last is: above embodiment is only in order to explaining technical scheme of the present invention, but not to its restriction; Although with reference to previous embodiment the present invention has been carried out detailed explanation, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these are revised or replacement, do not make the spirit and the scope of the essence disengaging various embodiments of the present invention technical scheme of relevant art scheme.

Claims (5)

1. an organic electroluminescence device manufacturing approach is characterized in that, comprising:
Step 1, on substrate, form first electrode;
Step 2, on the substrate that is formed with said first electrode, form continuously non-photosensitivity property organic insulating material and positive photoresist; The mask plate that employing can form the insulating barrier figure makes public to said positive photoresist; Develop then and etching, and keep positive photoresist, form the insulating barrier figure;
Step 3, through forming positive photoresist on the substrate of said step 2, the mask plate that employing can form insulated column makes public to the positive photoresist that forms in the said step 3 and develops formation insulated column figure; The material of the positive photoresist that forms in the step 3 is identical with the positive photoresist material of formation in the step 2;
Form organic material layer on step 4, the substrate after the said step 3 of process;
Form second electrode on step 5, the substrate after the said step 4 of process.
2. organic electroluminescence device manufacturing approach according to claim 1; It is characterized in that said step 2 specifically comprises: on the substrate that is formed with said first electrode, form non-photosensitivity property organic insulating material, to said non-photosensitivity property organic insulating material prebake conditions; On said non-photosensitivity property organic insulating material, form positive photoresist again; Said positive photoresist is carried out prebake conditions, and the mask plate that employing can form the insulating barrier figure makes public to said positive photoresist, develops then and etching; And keep said positive photoresist, form the insulating barrier figure;
Under 220 to 300 degrees centigrade temperature, said substrate was toasted 30 to 60 minutes.
3. organic electroluminescence device manufacturing approach according to claim 2 is characterized in that, is specially at formation positive photoresist on the said non-photosensitivity property organic insulating material: spin coating positive photoresist on said non-photosensitivity property organic insulating material.
4. organic electroluminescence device manufacturing approach according to claim 1 and 2 is characterized in that, said step 1 is specially: first electrode that on substrate, forms the strip that is parallel to each other.
5. an organic electroluminescence device is characterized in that, comprising:
First electrode is arranged on the substrate;
Insulating barrier is arranged on the substrate that is formed with said first electrode, and the material of said insulating barrier is a non-photosensitivity property organic insulating material;
Positive photoresist is arranged on the said insulating barrier;
Insulated column is arranged on the said positive photoresist, and the material of said insulated column is identical with said positive photoresist;
Organic material layer is formed on said insulated column, positive photoresist and said first electrode;
Second electrode is formed on the said organic material layer.
CN200810227260A 2008-11-25 2008-11-25 Organic electroluminescent device and manufacturing method thereof Active CN101740726B (en)

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CN102569538B (en) * 2010-12-22 2013-11-27 上海蓝光科技有限公司 Stripping method for use during manufacturing of light-emitting diode chip electrode
CN102769995B (en) * 2011-06-21 2016-05-04 京东方科技集团股份有限公司 A kind of attaching method for packing and substrate of substrate
CN104733504A (en) * 2015-03-18 2015-06-24 京东方科技集团股份有限公司 OLED substrate, manufacturing method, OLED panel and display device
CN104992925B (en) 2015-07-13 2019-02-22 合肥鑫晟光电科技有限公司 The production method of conductive via structure, array substrate and display device
CN109690782A (en) * 2017-07-12 2019-04-26 深圳市柔宇科技有限公司 The manufacturing method of display
CN109698262A (en) * 2017-10-24 2019-04-30 山东浪潮华光光电子股份有限公司 A kind of electrode preparation method of LED chip
CN107910292B (en) 2017-11-14 2020-04-10 京东方科技集团股份有限公司 Preparation method of cathode isolation retaining wall, display panel and preparation method of display panel

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CN1509124A (en) * 2002-12-20 2004-06-30 铼宝科技股份有限公司 Organic planar light-emitting device and transparent electrode board manufacturing method
CN1791287A (en) * 2004-12-17 2006-06-21 上海广电电子股份有限公司 Method for manufacturing transparent anode and electrode lead wire of organic luminescent display unit
CN101304076A (en) * 2008-06-23 2008-11-12 中国科学院长春应用化学研究所 Method for processing cathode insulated column of organic luminous display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
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CN1509124A (en) * 2002-12-20 2004-06-30 铼宝科技股份有限公司 Organic planar light-emitting device and transparent electrode board manufacturing method
CN1791287A (en) * 2004-12-17 2006-06-21 上海广电电子股份有限公司 Method for manufacturing transparent anode and electrode lead wire of organic luminescent display unit
CN101304076A (en) * 2008-06-23 2008-11-12 中国科学院长春应用化学研究所 Method for processing cathode insulated column of organic luminous display device

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