CN101728367B - Image sensing module for reducing whole thickness and preventing electromagnetic interference - Google Patents
Image sensing module for reducing whole thickness and preventing electromagnetic interference Download PDFInfo
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- CN101728367B CN101728367B CN 200810170572 CN200810170572A CN101728367B CN 101728367 B CN101728367 B CN 101728367B CN 200810170572 CN200810170572 CN 200810170572 CN 200810170572 A CN200810170572 A CN 200810170572A CN 101728367 B CN101728367 B CN 101728367B
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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Abstract
The invention relates to an image sensing module for reducing whole thickness and preventing electromagnetic interference, comprising a flexibility base plate, an imaging sensor and a plurality of electronic elements; wherein the flexibility base plate comprises a first circuit board, a flexible folded plate which is formed by folding one side of the first circuit board upwards, and a second circuit board which is formed by extending the flexible folded plate forwards and is arranged above the first circuit board, wherein the second circuit board is provided with at least one first opening, the imaging sensor is electrically arranged on the first circuit board, and the imaging sensor is exposed by the first opening of the second circuit board; Isoelectronic elements are electrically arranged on the first circuit board and/or the second circuit board respectively and selectively, so as to lead the isoelectronic elements to be arranged between the first circuit board and the second circuit board.
Description
Technical field
The present invention relates to a kind of image sensing module, refer to a kind of image sensing module of reducing integral thickness and preventing electromagnetic interference of being used to especially
Background technology
With tradition; Complementary metal oxide semiconductor (ComplementaryMetal-Oxide-Semiconductor; CMOS) the special niche of image sensor is " low power consumption " and " small size "; Therefore the CMOS image sensor is convenient to be incorporated in the portable product of specific demand, for example has mobile phone and the notebook computer in less integration space etc.
See also shown in Figure 1A to Fig. 1 D, Figure 1A is the schematic top plan view of known image sensing module; Figure 1B is the front schematic view of known image sensing module; Fig. 1 C is the generalized section of the 1C-1C of Figure 1B; Fig. 1 D is the functional block diagram of known image sensing module.By can knowing among the above-mentioned figure, known a kind of image sensing module is provided, it comprises: a hard substrate 1, an image sensor 2, a plurality of electronic component 3, one anti-electromagnetic interference element 4, an and USB connector 5.Wherein, This image sensor 2 and these electronic components 3 are arranged on this hard substrate 1 all electrically; And should envelope this hard substrate 1 with the mode of only exposing this image sensor 2 around ground by anti-electromagnetic interference element 4, wherein this image sensor 2 is exposed to the open air by first opening 40 of this anti-electromagnetic interference element 4.Therefore, because this hard substrate 1 thickness h 1 own is added the thickness h 2 of these anti-electromagnetic interference element 4 bottoms, so cause known image sensing module can't reduce the shortcoming of integral thickness.
Moreover; Shown in Fig. 1 D, these electronic components 3 comprise at least: one is arranged between this USB connector 5 and this image sensor 2 and the low dropout voltage regulator (LDO (low dropout) Regulator) 30 and that is electrically connected at this USB connector 5 is electrically connected at the back segment integrated circuit (Backend IC) 31 of a side of this image sensor 2 away from this low dropout voltage regulator 30.Therefore, the signal S that is imported from this output/input interface 5 can be resent to this image sensor 2 at last earlier in regular turn via this low dropout voltage regulator 30 and this back segment integrated circuit 31.Yet, can know that by the transfer path of above-mentioned this signal S the transfer path of known this signal S still has improved space.
Therefore, above-mentioned known image sensing module still has following defective existence:
Because the thickness of this hard substrate 1 is bigger, so known image sensing module can't reach purpose of thinness.
Because these electronic components 3 are arranged in the confined space of this hard substrate 1 upper surface the purpose that can't realize miniaturization that causes electrically.
Known image sensing module must increase the problem that making of this anti-electromagnetic interference element 4 is used for improving electromagnetic interference, therefore causes the increase of known image sensing module integral thickness.
So along with the needs in market, the primary at present problem that solves of CMOS image sensor then is: reduce height so that be incorporated in the portable product with less integration space.
Therefore, by on can know that above-mentioned known press-key structure on reality is used, obviously has inconvenience and exists with defective.By above reason, the improving of the above-mentioned defective of inventor's thoughts, and according to the correlation experience of being engaged in for many years in this respect, the concentrated observation and research, and cooperate the utilization of scientific principle, and propose a kind of reasonable in design and effectively improve the present invention of above-mentioned defective.
Summary of the invention
Technical problem to be solved by this invention; Be to provide a kind of image sensing module of reducing integral thickness and preventing electromagnetic interference of being used to; Its through one have at least one first opening flexible base plate coat a plurality of electronic components on it; Reaching the purpose that prevents electromagnetic interference, and an image sensor passes this first opening and exposed to the open air the outside at this flexible base plate, to reduce the thickness of image sensing module.Therefore, image sensing module of the present invention can reduce integral thickness greatly and reach the purpose that prevents electromagnetic interference.
In order to solve the problems of the technologies described above, wherein a kind of scheme according to the present invention provides a kind of image sensing module of reducing integral thickness and preventing electromagnetic interference of being used to, and it comprises: a flexible base plate, an image sensor and a plurality of electronic component.Wherein, The pliability bending plate that bends on the side direction of this flexible base plate tool one first circuit board, by this first circuit board, and one extended forward to be arranged at the second circuit board of this first circuit board top by this pliability bending plate, wherein this second circuit board has at least one first opening.This image sensor is arranged on this first circuit board electrically, and this image sensor passes first opening of this second circuit board and exposed to the open air the outside at this second circuit board.These electronic components optionally electrically are arranged on this first circuit board and/or on this second circuit board respectively, so that these electronic components are set between this first circuit board and this second circuit board.In addition; The present invention further comprises: at least one insulation adhesion layer that is formed at wherein between two electronic components; And above-mentioned wherein two electronic components are arranged on this first circuit board respectively electrically and this second circuit board on, wherein this second circuit board through this insulation adhesion layer to be positioned at the top of this first circuit board.
Therefore, the image sensing module that is used to reduce integral thickness and prevent electromagnetic interference of the present invention has following advantage existence:
1, according to different design requirement; This flexible base plate can be following two kinds of patterns: first kind: except this bending plate tool pliability; This first circuit board and this second circuit board are all flexible circuit board, so this flexible base plate integral body all has flexual function; Second kind: have only this pliability bending plate to have pliability, and this first circuit board and this second circuit board are all non-flexible circuit board, so this flexible base plate only has the flexual function of part.
2, when the bending of this second circuit board through this pliability bending plate when moving to the top of this first circuit board; These electronic components are all hidden by this first circuit board and this second circuit board, and only this image sensor passes first opening of this second circuit board and exposed to the open air the outside at this second circuit board.Therefore, image sensing module of the present invention can reduce whole thickness greatly.
3, cover through the metal that this first circuit board and this second circuit board surrounded, can avoid these electronic components to receive extraneous electromagnetic interference.
4, the present invention's image sensing module of being used to reduce integral thickness and prevent electromagnetic interference further comprises: at least one insulation adhesion layer that is formed at wherein between two electronic components, and this second circuit board through this insulation adhesion layer to be positioned at the top of this first circuit board.In addition, this insulation adhesion layer also can be coated between this first circuit board and this second circuit board fully so that (1) this second circuit board can be more firmly through this insulation adhesion layer to be positioned at the top of this first circuit board; (2) these electronic component and these electronic components that are positioned on this second circuit board that are positioned on this first circuit board can reduce electromagnetic interference to each other.
5, image sensing module of the present invention further comprises: an output/input interface, wherein this output/input interface can be a universal serial bus (USB) connector, and this output/input interface is electrically connected at this low dropout voltage regulator.In addition, this output/input interface and this low dropout voltage regulator are arranged on this first circuit board all electrically, and this back segment integrated circuit is arranged on this second circuit board electrically.Therefore; The signal of importing from this output/input interface is through the transmission of these conducting metal tracks; So that this signal can be resent to this image sensor at last earlier in regular turn via this low dropout voltage regulator and this back segment integrated circuit, and then shortened the path that this signal transmits.
6, since a plurality of electronic components be assigned to fifty-fifty on the first circuit board with this second circuit board on, so the length of this first circuit board and this second circuit board all can be shortened.
Reach technology, means and the effect that predetermined purpose is taked in order further to understand the present invention; See also following about detailed description of the present invention and accompanying drawing; Believe the object of the invention, characteristic and characteristics; Go deep into and concrete understanding when getting one thus, yet appended accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Figure 1A is the schematic top plan view of known image sensing module;
Figure 1B is the front schematic view of known image sensing module;
Fig. 1 C is the generalized section of the 1C-1C of Figure 1B;
Fig. 1 D is the functional block diagram of known image sensing module;
The schematic top plan view of first embodiment of the image sensing module that Fig. 2 A is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate bent before);
The schematic top plan view of first embodiment of the image sensing module that Fig. 2 B is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate is bent the back);
Fig. 2 C is the side-looking generalized section of the image sensor of first embodiment of the invention;
Fig. 2 D is the generalized section of the 2D-2D of Fig. 2 B;
The functional block diagram of first embodiment of the image sensing module that Fig. 2 E is used to for the present invention to reduce integral thickness and prevent electromagnetic interference;
The schematic top plan view of second embodiment of the image sensing module that Fig. 3 A is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate bent before);
The schematic top plan view of second embodiment of the image sensing module that Fig. 3 B is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate is bent the back);
The schematic top plan view of the 3rd embodiment of the image sensing module that Fig. 4 A is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate bent before);
The schematic top plan view of the 3rd embodiment of the image sensing module that Fig. 4 B is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate is bent the back);
The schematic top plan view of the 4th embodiment of the image sensing module that Fig. 5 A is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate bent before); And
The schematic top plan view of the 4th embodiment of the image sensing module that Fig. 5 B is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate is bent the back).
[main element description of reference numerals]
[known]
Back segment integrated circuit 31
Signal S
[the present invention]
(first embodiment)
Flexible base plate 1a first circuit board 10a
Pliability bending plate 11a
The second circuit board 12a first opening 120a
Conducting metal track 13a
Lens 22a
Back segment integrated circuit 31a
Output/input interface 5a
Signal S
(second embodiment)
The first opening 120b
(the 3rd embodiment)
The first opening 120c
(the 4th embodiment)
The second circuit board 12d first opening 120d
The second opening 120d '
Light-emitting component 2d '
Embodiment
See also shown in Fig. 2 A to Fig. 2 E the schematic top plan view of first embodiment of the image sensing module that Fig. 2 A is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate bent before); The schematic top plan view of first embodiment of the image sensing module that Fig. 2 B is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate is bent the back); Fig. 2 C is the side-looking generalized section of the image sensor of first embodiment of the invention; Fig. 2 D is the generalized section of the 2D-2D of Fig. 2 B; The functional block diagram of first embodiment of the image sensing module that Fig. 2 E is used to for the present invention to reduce integral thickness and prevent electromagnetic interference.By can knowing among the above-mentioned figure, first embodiment of the invention provides a kind of image sensing module of reducing integral thickness and preventing electromagnetic interference of being used to, and it comprises: a flexible base plate 1a, an image sensor 2a, and a plurality of electronic component 3a.
Moreover; This flexible base plate 1a has the pliability bending plate 11a that bends on the side direction of a first circuit board 10a, by this first circuit board 10a, and one is extended forward to be arranged at the second circuit board 12a of this first circuit board 10a top by this pliability bending plate 11a; Wherein this first circuit board, this pliability bending plate and this second circuit board are together one-body molded, and this second circuit board 12a has at least one first opening 120a.Can know that by Fig. 2 A and Fig. 2 B in the first embodiment of the invention, the first opening 120a of this second circuit board 12a is closed first opening, and this closed first opening forms a ㄇ font.In addition, this flexible base plate 1a further has many conducting metal track 13a (only marking a part in graphic) that are printed on this first circuit board 10a, this pliability bending plate 11a and this second circuit board 12a.
In addition; According to different design requirements; This flexible base plate 1a can be following two kinds of patterns: (1) first kind: except this bending plate 11a tool pliability; This first circuit board 10a and this second circuit board 12a are all flexible circuit board, so this flexible base plate 1a integral body all has flexual function; (2) second kinds: have only this pliability bending plate 11a to have pliability, and this first circuit board 10a and this second circuit board 12a are all non-flexible circuit board, so this flexible base plate 1a only has the flexual function of part.
In addition, this image sensor 2a is arranged on this first circuit board 10a electrically, and this image sensor 2a is exposed to the open air by the first opening 120a of this second circuit board 12a.In other words; As the bending of this second circuit board 12a through this pliability bending plate 11a (from Fig. 2 A to Fig. 2 B) when moving to the top of this first circuit board 10a; These electronic components 3a is all hidden by this first circuit board 10a and this second circuit board 12a, and only this image sensor 2a passes the first opening 120a of this second circuit board 12a and exposed to the open air the outside at this second circuit board 12a.Therefore, image sensing module of the present invention can reduce whole thickness greatly.
In addition; Shown in Fig. 2 C; In first embodiment; This image sensor 2a can be a complementary metal oxide semiconductor (Complementary Metal-Oxide-Semiconductor; CMOS), and this image sensor of transducer 2a has and is built in this body 20a in the body 20a, one and is arranged at image sensing chip 21a on this first circuit board 10a, and at least one being positioned in this body 20a to be arranged at the lens 22a of this image sensing chip 21a top electrically, wherein this image sensing chip 21a through the mode of routing to be electrically connected at the conducting metal track 13a on this first circuit board 10a.
Moreover, these electronic components 3a be arranged at electrically optionally respectively that this first circuit board 10a goes up and/or this second circuit board 12a on so that these electronic components 3a is set between this first circuit board 10a and this second circuit board 12a.In addition, the metal that is surrounded through this first circuit board 10a and this second circuit board 12a covers, and can avoid these electronic components 3a to receive extraneous electromagnetic interference.
In addition; Shown in Fig. 2 D; The image sensing module that the present invention is used to reduce integral thickness and prevent electromagnetic interference further comprises: at least one insulation adhesion layer 4a that is formed at wherein between two electronic component 3a; And above-mentioned wherein two electronic component 3a are arranged at electrically respectively that this first circuit board 10a goes up and this second circuit board 12a on, wherein this second circuit board 12a through this insulation adhesion layer 4a to be positioned at the top of this first circuit board 10a.In addition, this insulation adhesion layer 4a also can coat between this first circuit board 10a and this second circuit board 12a fully so that (1) this second circuit board 12a can be more firmly through this insulation adhesion layer 4a to be positioned at the top of this first circuit board 10a; (2) these electronic component 3a and these electronic component 3a that are positioned on this second circuit board 12a that are positioned on this first circuit board 10a can reduce electromagnetic interference to each other.
Shown in Fig. 2 E; In first embodiment, these electronic components 3a comprises at least: a low dropout voltage regulator (LDO (low dropout) Regulator) 30a and is arranged at back segment integrated circuit (Backend IC) 31a between this low dropout voltage regulator 30a and this image sensor 2a electrically.In addition, image sensing module of the present invention further comprises: an output/input interface 5a, wherein this output/input interface 5a can be a universal serial bus (USB) connector, and this output/input interface 5a is electrically connected at this low dropout voltage regulator 30a.In addition, this output/input interface 5a and this low dropout voltage regulator 30a are arranged on this first circuit board 10a all electrically, and this back segment integrated circuit 31a is arranged on this second circuit board 12a electrically.Therefore; The signal S that is imported from this output/input interface 5a is through the transmission of these conducting metal tracks 13a; So that this signal S can be earlier in regular turn via this low dropout voltage regulator 30a and this back segment integrated circuit 31a; Be resent to this image sensor 2a at last, and then shortened the path that this signal S transmits.
See also shown in Fig. 3 A to Fig. 3 B the schematic top plan view of second embodiment of the image sensing module that Fig. 3 A is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate bent before); The schematic top plan view of second embodiment of the image sensing module that Fig. 3 B is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate is bent the back).By knowing among the above-mentioned figure; Second embodiment of the invention provides a kind of image sensing module of reducing integral thickness and preventing electromagnetic interference of being used to; Wherein the maximum difference of second embodiment and first embodiment is: in a second embodiment; The first opening 120b of one second circuit board 12b is open first opening, and this open first opening forms a hollow.Therefore, an image sensor 2b passes the first opening 120b of this second circuit board 12b and is exposed to the open air the outside at this second circuit board 12b.
See also shown in Fig. 4 A to Fig. 4 B the schematic top plan view of the 3rd embodiment of the image sensing module that Fig. 4 A is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate bent before); The schematic top plan view of the 3rd embodiment of the image sensing module that Fig. 4 B is used to for the present invention to reduce integral thickness and prevent electromagnetic interference (flexible base plate is bent the back).By knowing among the above-mentioned figure; Third embodiment of the invention provides a kind of image sensing module of reducing integral thickness and preventing electromagnetic interference of being used to; Wherein the maximum difference of the 3rd embodiment and first embodiment is: in the 3rd embodiment; The first opening 120c of one second circuit board 12c is open first opening, and this open first opening forms a L font.Therefore, an image sensor 2c passes the first opening 120c of this second circuit board 12c and is exposed to the open air the outside at this second circuit board 12c.In addition because a plurality of electronic component 3c are assigned to fifty-fifty that a first circuit board 10c goes up and this second circuit board 12c on, so the length of this first circuit board 10c and this second circuit board 12c all can be shortened.
See also shown in Fig. 5 A to Fig. 5 B the front schematic view of the 4th embodiment of the image sensing module that it is used to for the present invention to reduce integral thickness and prevent electromagnetic interference.By knowing among the above-mentioned figure, at least one image sensor 2d and at least one light-emitting component 2d ' all are arranged on the first circuit board 10d, and a second circuit board 12d has at least one first opening 120d and at least one second opening 120d '.In addition, this image sensor 2d is exposed to the open air by the first opening 120d of this second circuit board 12d, and this light-emitting component 2d ' is exposed to the open air by the second opening 120d ' of this second circuit board 12d.Moreover the first opening 120d of this second circuit board 12d and the second opening 120d ' also can be an open opening, and this open opening forms a hollow or forms a L font.
In sum; The present invention through one have at least one first opening flexible base plate coat a plurality of electronic components on it; To reach the purpose that prevents electromagnetic interference; And an image sensor passes this first opening and is exposed to the open air the outside at this flexible base plate, to reduce the thickness of image sensing module.Therefore, image sensing module of the present invention can reduce integral thickness greatly and reach the purpose that prevents electromagnetic interference.
But; The above; Be merely the detailed description and the accompanying drawing of the best specific embodiment of the present invention, but characteristic of the present invention is not limited thereto, and non-in order to restriction the present invention; All scopes of the present invention should be as the criterion with claim; All closing in the embodiment of the spirit variation similar with it of claim of the present invention all should be contained in the category of the present invention, in the field of the invention any those of ordinary skill can think easily and variation or revise all can be encompassed within the scope of patent protection of this case.
Claims (14)
1. one kind is used to the image sensing module that reduces integral thickness and prevent electromagnetic interference, it is characterized in that, comprising:
One flexible base plate; The pliability bending plate that bends on the side direction of its tool one first circuit board, by this first circuit board, and one extend forward to be arranged at the second circuit board of this first circuit board top by this pliability bending plate; Wherein this second circuit board has at least one first opening, and this flexible base plate has many conducting metal tracks that are printed on this first circuit board, this pliability bending plate and this second circuit board;
One image sensor, it is arranged on this first circuit board electrically, and this image sensor passes first opening of this second circuit board and exposed to the open air the outside at this second circuit board; And
A plurality of electronic components; It optionally electrically is arranged on this first circuit board and/or on this second circuit board respectively; So that these electronic components are set between this first circuit board and this second circuit board; Wherein, These a plurality of electronic components comprise at least: one is arranged on this first circuit board and the low dropout voltage regulator and that is electrically connected at this first circuit board is arranged on this second circuit board and is electrically connected at the back segment integrated circuit of this second circuit board; This back segment integrated circuit is electrically connected between this low dropout voltage regulator and this image sensor, and this back segment integrated circuit is electrically connected at this low dropout voltage regulator and this image sensor respectively through two in these many conducting metal tracks.
2. the image sensing module that reduces integral thickness and prevent electromagnetic interference of being used to as claimed in claim 1, it is characterized in that: this first circuit board and this second circuit board are all flexible circuit board.
3. the image sensing module that reduces integral thickness and prevent electromagnetic interference of being used to as claimed in claim 1, it is characterized in that: this first circuit board and this second circuit board are all non-flexible circuit board.
4. the image sensing module that reduces integral thickness and prevent electromagnetic interference of being used to as claimed in claim 1, it is characterized in that: first opening of this second circuit board is closed first opening, and this closed first opening forms a hollow.
5. the image sensing module that reduces integral thickness and prevent electromagnetic interference of being used to as claimed in claim 1, it is characterized in that: first opening of this second circuit board is open first opening.
6. the image sensing module that reduces integral thickness and prevent electromagnetic interference of being used to as claimed in claim 5, it is characterized in that: this open first opening forms a ㄇ font.
7. the image sensing module that reduces integral thickness and prevent electromagnetic interference of being used to as claimed in claim 5, it is characterized in that: this open first opening forms a L font.
8. the image sensing module that reduces integral thickness and prevent electromagnetic interference of being used to as claimed in claim 1 is characterized in that: this image sensor has and is built in this body in the body, one and is arranged at image sensing chip on this first circuit board, and at least one being positioned in this body to be arranged at the lens of this image sensing chip top electrically.
9. the image sensing module that reduces integral thickness and prevent electromagnetic interference of being used to as claimed in claim 1, it is characterized in that: this image sensor is a complementary metal oxide semiconductor transducer.
10. the image sensing module that reduces integral thickness and prevent electromagnetic interference of being used to as claimed in claim 1; It is characterized in that; Further comprise: at least one insulation adhesion layer that is formed at wherein between two electronic components; And above-mentioned wherein two electronic components are arranged on this first circuit board respectively electrically and this second circuit board on, wherein this second circuit board through this insulation adhesion layer to be positioned at the top of this first circuit board.
11. the image sensing module that reduces integral thickness and prevent electromagnetic interference of being used to as claimed in claim 1; It is characterized in that; Further comprise: an output/input interface; It is electrically connected at this low dropout voltage regulator, and wherein this output/input interface is arranged on this first circuit board electrically.
12. the image sensing module that reduces integral thickness and prevent electromagnetic interference of being used to as claimed in claim 1, it is characterized in that: this first circuit board, this pliability bending plate and this second circuit board are together one-body molded.
13. the image sensing module that reduces integral thickness and prevent electromagnetic interference of being used to as claimed in claim 1 is characterized in that, further comprises: at least one light-emitting component that is arranged on this first circuit board.
14. the image sensing module that reduces integral thickness and prevent electromagnetic interference of being used to as claimed in claim 13; It is characterized in that: this second circuit board further has at least one second opening, and this light-emitting component is exposed to the open air by second opening of this second circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810170572 CN101728367B (en) | 2008-10-23 | 2008-10-23 | Image sensing module for reducing whole thickness and preventing electromagnetic interference |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810170572 CN101728367B (en) | 2008-10-23 | 2008-10-23 | Image sensing module for reducing whole thickness and preventing electromagnetic interference |
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| CN101728367A CN101728367A (en) | 2010-06-09 |
| CN101728367B true CN101728367B (en) | 2012-11-07 |
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| CN105572840B (en) * | 2014-11-11 | 2018-11-30 | 信泰光学(深圳)有限公司 | It is thinned optical lens |
| KR20160110861A (en) * | 2015-03-13 | 2016-09-22 | 삼성디스플레이 주식회사 | Flexible circuit substrate and display device including the same |
| CN109061879A (en) * | 2018-08-22 | 2018-12-21 | Oppo广东移动通信有限公司 | Light projector and its detection method of rupture, depth camera and electronic device |
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