CN101726637A - Method and device thereof for aligning wafer probe cards - Google Patents
Method and device thereof for aligning wafer probe cards Download PDFInfo
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- CN101726637A CN101726637A CN200810173218A CN200810173218A CN101726637A CN 101726637 A CN101726637 A CN 101726637A CN 200810173218 A CN200810173218 A CN 200810173218A CN 200810173218 A CN200810173218 A CN 200810173218A CN 101726637 A CN101726637 A CN 101726637A
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- wafer probe
- probe cards
- monitor station
- driver
- alignment device
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Abstract
The invention relates to a method and a device thereof for aligning wafer probe cards. The device comprises a positioning substrate, a level surface, a driver and a seat stand, wherein the downward level surface is formed at the bottom of the positioning substrate; the driver is arranged below the level surface; and the seat stand capable of accommodating the wafer probe cards is slidingly arranged between the lower side of the level surface and the driver, and is driven by the driver to displace upwards, so that the surfaces of the wafer probe cards with a plurality probes are attached to the level surface, the wafer probe cards are horizontally positioned and the wafer probe cards are aligned so as to be favorable for calibrating positions and heights of the probes.
Description
Technical field
The present invention relates to a kind of probe to method for position and alignment device, particularly be used for controlling wafer probe cards to the method for homogeneous adjustment probe, and the device technique of implementing described method with the reference position.
Background technology
Wafer produce finish after, the test of need powering, and after the telecommunication output of determining described wafer is normal, more described wafer being cut.Described wafer is to utilize wafer probe cards (Probe Carb) test of powering, the end face of wafer probe cards has the probe of plural copper or steel, contact with the signal contact of plural integrated circuit (ICs) on the wafer separately, when wafer was powered test, test data can rely on the plural probe of wafer probe cards to transfer to each integrated circuit (ICs) of wafer respectively; Subsequently, can be from the test result of each integrated circuit (ICs) of wafer oppositely via described probe and probe passback; When the test the passback telecommunication for just often, judge that described wafer is certified products, described wafer branch can be cut to a plurality of integrated circuit.
And know that above-mentioned wafer probe is stuck in through after repeatedly using, and can cause some probes of its end face to produce crooked situation, the tip that causes all probes is not on sustained height; So, when wafer probe cards was powered test to wafer, crooked and highly inconsistent probe was easy to generate the phenomenon of arcing, caused wafer to burn in the power supply test process.Therefore, above-mentioned wafer probe is stuck in through after repeatedly using, and must be again the plural probe of its end face be carried out position and height correction, to guarantee the accurate position and the most advanced and sophisticated flatness thereof of plural probe.
Tradition is proofreaied and correct the practice of the plural probe of above-mentioned probe, be that described wafer probe cards is placed on the horizontal surface, the bottom surface subsides of probe are touched on described horizontal surface, cause described wafer probe cards and horizontal surface contraposition and horizontal putting, and the end face that makes probe is towards the top, so that using the detection microscope of movable observes the plural probe of its end face, and cooperate one to be situated between and to be located at the transparent adhesive film of the tool probe location between described microscope and each probe, with the position of proofreading and correct described probe and highly.Yet its shortcoming is, the bottom surface of tradition wafer probe cards exposes usually most electronic components, lead and structure accessory, therefore its flatness is relatively poor, causes still being easy to generate after described wafer probe cards and the horizontal surface contraposition problem of deflection, demands urgently being improved.
In addition, it is usually preferable in the bottom surface that above-mentioned wafer probe cards has the flatness of end face of plural probe; Yet in the horizontal alignment method of existing wafer probe cards and the device, not seeing yet to disclose has the technology of carrying out horizontal alignment with the end face of probe.
Summary of the invention
For effectively overcoming the problem in the above-mentioned background technology, purpose of the present invention aims to provide a kind of wafer probe cards to method for position and device thereof, especially a kind of method of carrying out horizontal alignment with the end face of wafer probe cards, and the device of implementing described method, help proofreading and correct the position and the height of the plural probe of described probe.
For reaching above-mentioned purpose, a kind of wafer probe cards of the present invention comprises method for position:
Provide a location substrate, its bottom tool horizontal surface downwards on one day;
Transfer one wafer probe cards is to described horizontal surface below, and the surface (being the end face of probe) of tool plural number probe that makes described wafer probe cards is towards the top; And
Drive described wafer probe cards by the past top offset in described horizontal surface below, and make the surface subsides of the tool plural number probe of described probe be against described horizontal surface, make the horizontal location of wafer probe cards.
In view of the above, carry out the purpose of horizontal alignment with the end face of wafer probe cards, and then help proofreading and correct the position and the height of the plural probe of described probe to reach above-mentioned.Wherein,
Described wafer probe cards be accept one be located in the horizontal surface below driver drives and toward top offset.
In addition, a kind of wafer probe cards alignment device of the present invention comprises:
One location substrate;
One day, horizontal surface downwards was formed on described location B.B.P;
One driver is located at described horizontal surface below; And
One seat stand, can put a wafer probe cards, the surface of tool plural number probe that makes described wafer probe cards is towards the top, and seat stand is slidingly installed between described horizontal surface below and the described driver, and accept described driver drives and past top offset, and make the surface subsides of described wafer probe jig plural number probe be against described horizontal surface, make the horizontal location of wafer probe cards.Wherein,
Described location substrate is located at a monitor station top, described driver is located in the described monitor station, and the inner chute that forms of the monitor station between location substrate and the driver, described chute is at distolateral formation one notch of monitor station, but the abutment platform is implanted and is slidingly installed between described horizontal surface below and the driver.But the positioning port of described monitor station top tool one embedding group location substrate, and be provided with at least one positioning baffle between positioning port and the location substrate.
Described monitor station is slidingly installed on the board; Described monitor station is axially to be slidingly installed on the base along one first, and described base is axially to be slidingly installed on the described board along one second.Tool one first axial driver on the described base can drive described monitor station and endwisely slip along first, and tool one second axial driver on the described board, can drive base and endwisely slip along second.
Establish a spring between the distolateral and board of described monitor station, and screw rod is adjusted in spiral shell resistance one on the distolateral board of monitor station, it is distolateral to push against described monitor station, and it is distolateral to rotate described adjustment screw rod pushing and pressing monitor station, rotates with the control detection platform.
At least one movable detector lens of tool on the described board is positioned at described monitor station top.Tool one observation port on the substrate of described location can be for the probe of exposed described wafer probe cards.Tool one hanging stick on the described board extends between the observation port of detector lens and location substrate, holds the transparent adhesive film of a tool probe location above the probe of wafer probe cards with outstanding.
Described driver is to drive seat stand toward top offset with vertical direction, and described driver can be a cylinder, and a cylinder masthead portion tool one of cylinder can push against the supporting plate of seat stand toward top offset.
Described seat stand top is slidingly equipped with some anchor clamps, with clamping location wafer probe cards.The some guide channels that communicate of described seat stand top tool, described anchor clamps are to be slidingly installed in the guide channel separately.Described clamp base embedding group has at least one magnetic element, and anchor clamps are adsorbed in the guide channel.
Compared with prior art, the beneficial effect that the present invention has is: the present invention carries out horizontal alignment with the end face that wafer probe cards has a probe, and then helps proofreading and correct the position and the height of the plural probe of described probe.
Description of drawings
Fig. 1 is the front view of board of the present invention;
Fig. 2 is a cut-away view of monitor station of the present invention;
Fig. 3 is the side view of board of the present invention;
Fig. 4 is another cut-away view of monitor station of the present invention;
Fig. 5 is the vertical view of board of the present invention;
Fig. 6 is that seat stand of the present invention moves to the outer vertical view of chute;
Fig. 7 is a vertical view of putting wafer probe cards on the seat stand of the present invention;
The cut-away view that Fig. 8 and Fig. 9 are seat stand transfer probe of the present invention to the chute;
Figure 10 moves on the driver drives seat stand transfer probe of the present invention to paste the cut-away view that supports horizontal surface;
Figure 11 is the vertical view of the exposed plural probe of observation port of the present invention;
Figure 12 is that monitor station of the present invention is subjected to the screw rod pushing and pressing and the vertical view of rotation;
Figure 13 is a process flow diagram of the present invention.
Embodiment
Below the wafer probe cards of the present invention effect that can produce just to method for position and device thereof, conjunction with figs. is described in detail as follows with preferred embodiment:
See also Fig. 1, disclose the front view of preferred embodiment of the present invention, and cooperate Fig. 2 to Fig. 4 that wafer probe cards alignment device of the present invention is described, comprise a circular location substrate 1, one day horizontal surface 11, a driver 2 and seat stand 3 downwards; Described horizontal surface 11 is formed on substrate 1 bottom, described location, described driver 2 is located at described horizontal surface 11 belows, described seat stand 3 is slidingly installed between described horizontal surface 11 belows and the described driver 2 (cooperating shown in Figure 6), can accept described driver 2 drives and past top offset (cooperating shown in Figure 10), and can put a wafer probe cards 9 on the seat stand 3, the end face 93 of tool plural number probe 91 that makes described wafer probe cards 9 is towards the top.
In more concrete enforcement, the present invention also comprises:
Described location substrate 1 is located at a monitor station 4 tops (as Fig. 2, Fig. 4 and shown in Figure 6), described monitor station 4 tops are provided with a circular positioning port 41, and but location substrate 1 embedding group is in described positioning port 41, and between positioning port 41 and location substrate 1, be provided with at least one positioning baffle 42, with backstop, fixing described location substrate 1, and positioning baffle 42 can be plural number on present embodiment; Described location substrate 1 is provided with a circle observation mouth 12, can be for the probe 91 of exposed described wafer probe cards 9, described monitor station 4 can rely on positioning port 41 and positioning baffle 42 embedding groups to organize the different location substrate 1 of observation port 12 diameters more, is desired to carry out the wafer probe cards 9 of horizontal alignment to cooperate.Described driver 2 is located in the described monitor station 4, and the 4 inner chutes 43 that form of the monitor station between location substrate 1 and the driver 2, described chute 43 is at monitor station 4 distolateral formation one notches 44, but abutment platform 3 is implanted and is slidingly installed between described horizontal surface 11 belows and the driver 2, and seat stand 3 also can slide onto outside the chute 43 via described notch 44.
Described monitor station 4 is slidingly installed on the worktable 51 of a board 5 (as Fig. 1 to shown in Figure 5); Described monitor station 4 can axially be slidingly installed on the base 40 along one first, and described base 40 can axially be slidingly installed on the worktable 51 of described board 5 along one second, described first axially can be the longitudinal axis of board 5, and described second axially can be the transverse axis of board 5; Wherein, described base 40 end faces are provided with two slide rails 45, described monitor station 4 relies on two slide blocks 46 of its bottom surface to be slidingly installed on two slide rails 45, and base 40 end faces are equiped with one first axial driver 47, can drive described monitor station 4 and endwisely slip along first; Described worktable 51 end faces also are provided with two slide rails 52, described base 40 relies on two slide blocks 48 of its bottom surface to be slidingly installed on two slide rails 52, and described worktable 51 end faces are equiped with one second axial driver 53, can drive base 40 and endwisely slip along second; The composition of the described first and second axial driver 47,53 all can be a motor 471,531 and a belt or a ball lead screw 472,532 in this enforcement.
40 of the bases of described monitor station 4 distolateral vicinity one angles and board 5 end faces are established a spring 55 (as shown in Figure 5), and spiral shell group one is adjusted screw rod 56 on the base 40 of board 5 end faces that monitor station 4 is distolateral, pushes against on the cambered surface 49 of described monitor station 4 another angles of distolateral vicinity (as shown in Figure 2); So, rely on to rotate the distolateral cambered surface 49 of described adjustment screw rod 56 pushing and pressing monitor stations 4, promptly the described monitor station 4 of may command rotates (as shown in figure 12), during can rely on described spring 55 packing monitor stations 4, arbitrarily rotate to avoid monitor station 4.
Described board 5 is provided with at least one movable detector lens 6 (as shown in Figure 3), be positioned at described monitor station 4 tops, described detector lens 6 can be a low-power microscope 61 and a high-power microscope 62 (as shown in Figure 1) in this enforcement, worktable 51 edges of described board 5 are provided with a bolster 54, and described low power and high- power microscope 61,62 all to be slidingly installed in described bolster 54 distolateral, and low power and high- power microscope 61,62 can accept a driving that is located at the distolateral cylinder 63 of described bolster 54 simultaneously, and at the bolster 54 distolateral transversal displacements that carry out synchronously.
Be installed with a hanging stick 7 (as shown in Figures 1 to 4) on the worktable 51 of described board 5, extend between the observation port 12 of detector lens 6 and location substrate 1, hold the transparent adhesive film 71 of a tool probe location above the probe 91 of wafer probe cards 9 with outstanding.Described driver 2 is to drive seat stand 3 toward top offsets with vertical direction, and described driver 2 can be a cylinder in this enforcements, and a supporting plate 22 (cooperating shown in Figure 10) that can push against seat stand 3 past top offsets is established at a cylinder bar 21 tops of cylinder.
Described seat stand 3 tops are provided with some guide channels 30 (as Fig. 2, Fig. 4 and shown in Figure 6), each guide channel 30 communicates in described seat stand 3 central authorities, and the sliding respectively anchor clamps 31 of establishing in each guide channel 30, with clamping, the described wafer probe cards 9 in location (cooperating Fig. 7 and shown in Figure 8), and described anchor clamps 31 bottom embedding groups have at least one magnetic element 311, described magnetic element 311 can be a magnet in this enforcement, can be adsorbed on voluntarily in the guide channel 30 after impelling described anchor clamps 31 to move to the location.
The composition that relies on above-mentioned member can comprise the following steps: for implementing wafer probe cards of the present invention to method for position according to this
(1) provide the horizontal surface 81 of described location substrate 1 to carry out horizontal alignment benchmark (as Fig. 2, Fig. 4 and shown in Figure 13) as wafer probe cards 9.
(2) on described seat stand 3, put wafer probe cards 9, make the end face of a bottom surface 92 subsides touch base platforms 3 of probe 9, and make end face 93 that probe 9 has plural probe 91 towards the top, rely on described anchor clamps 31 clampings, location described wafer probe cards 82 (as Fig. 6, Fig. 7, Fig. 8 and shown in Figure 13) again.
(3) utilize described seat stand 3 transfer wafer probe cards 9 to implant in the chute 43 of monitor station 4, and be positioned 83 (as Fig. 8, Fig. 9 and shown in Figure 13) between horizontal surface 11 and the driver 2 from notch 44.
(4) use the supporting plate 22 pushing and pressing seat stands 3 transfer wafer probe cards 9 of driver 2 toward top offset, the end face 93 that causes described wafer probe cards 9 is by the past top offset in described horizontal surface 11 belows, and then subsides are against 84 (as Figure 10 and shown in Figure 13) on the described horizontal surface, make wafer probe cards 9 horizontal location, and wafer probe cards 9 can be by described observation port 12 exposed plural probes 91 (as shown in figure 11).
In view of the above, described wafer probe cards 9 has been finished horizontal alignment, the user can adjust hanging stick 7 earlier, with the transparent adhesive film 71 and described probe 91 mutual corresponding (as Fig. 1 and shown in Figure 2) of adjusting described tool probe location, if have the departure of some angles between the probe location of described probe 91 of discovery and glued membrane 71, turn described adjustment screw rod 56 and control described monitor station 4 rotations (as shown in figure 12), with the amount of angular deviation between the probe location that compensates described probe 91 and glued membrane 71; Subsequently, can utilize low-power microscope 61 to observe and adjust the position and the height of described probe 91 by described transparent adhesive film 71, and collocation uses high-power microscope 62 to observe and adjust the position and the height of described probe 91 by described transparent adhesive film 71, skew condition with some probes 91 of the described wafer probe cards 9 of calibration one by one, cause the tip of all probes 91 to be positioned on the sustained height, and then guarantee the accurate position and the most advanced and sophisticated flatness thereof of plural probe 91.
According to above-mentioned, the present invention carries out horizontal alignment with the end face 93 that wafer probe cards 9 has a probe 91, and then helps proofreading and correct the position and the height of the plural probe 91 of described probe 9.
More than explanation is just illustrative for the purpose of the present invention; and nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited; can make many modifications, variation or equivalence, but all will fall within protection scope of the present invention.
Claims (17)
1. a wafer probe cards is characterized in that: may further comprise the steps method for position:
One location substrate is provided, and its bottom has a horizontal surface towards the below;
Transfer one wafer probe cards is to described horizontal surface below, and the surface of a tool plural number probe that makes described wafer probe cards is towards the top; And,
Drive described wafer probe cards by the past top offset in described horizontal surface below, and make the surface subsides of the tool plural number probe of described probe be against described horizontal surface, make the horizontal location of wafer probe cards.
According to the described wafer probe cards of claim 1 to method for position, it is characterized in that: described wafer probe cards be accept one be located in the horizontal surface below driver drives and toward top offset.
3. wafer probe cards alignment device is characterized in that: comprising:
One location substrate;
One day, horizontal surface downwards was formed on described location B.B.P;
One driver is located at described horizontal surface below; And,
One seat stand, can put a wafer probe cards, the surface of tool plural number probe that makes described wafer probe cards is towards the top, and seat stand is slidingly installed between described horizontal surface below and the described driver, and accept described driver drives and past top offset, and make the surface subsides of described wafer probe jig plural number probe be against described horizontal surface, make the horizontal location of wafer probe cards.
4. according to the described wafer probe cards alignment device of claim 3, it is characterized in that: described location substrate is located at a monitor station top, described driver is located in the described monitor station, and the inner chute that forms of the monitor station between location substrate and the driver, described chute is at distolateral formation one notch of monitor station, but the abutment platform is implanted and is slidingly installed between described horizontal surface below and the driver.
5. according to the described wafer probe cards alignment device of claim 4, it is characterized in that: but described monitor station top has the positioning port of an embedding group location substrate, and be provided with at least one positioning baffle between positioning port and the location substrate.
6. according to the described wafer probe cards alignment device of claim 4, it is characterized in that: described monitor station is slidingly installed on the board.
7. according to the described wafer probe cards alignment device of claim 6, it is characterized in that: described monitor station is axially to be slidingly installed on the base along one first, and described base is axially to be slidingly installed on the described board along one second.
8. according to the described wafer probe cards alignment device of claim 6, it is characterized in that: have one first axial driver on the described base, can drive described monitor station and endwisely slip along first, and have one second axial driver on the described board, can drive base and endwisely slip along second.
9. according to the described wafer probe cards alignment device of claim 6, it is characterized in that: be provided with a spring between the distolateral and board of described monitor station, and the spiral shell group has one to adjust screw rod on the distolateral board of monitor station, described adjustment screw rod pushes against in described monitor station distolateral, it is distolateral to rotate described adjustment screw rod pushing and pressing monitor station, rotates with the control detection platform.
10. according to the described wafer probe cards alignment device of claim 6, it is characterized in that: have at least one movable detector lens on the described board, described movable detector lens is positioned at described monitor station top.
11., it is characterized in that according to claim 3,4,6 or 10 described wafer probe cards alignment device: have an observation port on the substrate of described location, can be for the probe of exposed described wafer probe cards.
12. according to the described wafer probe cards alignment device of claim 11, it is characterized in that: tool one hanging stick on the described board, extend between the observation port of detector lens and location substrate, hold one and have the transparent adhesive film of probe location above the probe of wafer probe cards with outstanding.
13. according to claim 3,4 or 6 described wafer probe cards alignment device, it is characterized in that: described driver is to drive seat stand toward top offset with vertical direction.
14. according to the described wafer probe cards alignment device of claim 13, it is characterized in that: described driver is a cylinder, and a cylinder masthead portion of cylinder has a supporting plate that can push against seat stand toward top offset.
15. according to claim 3,4 or 6 described wafer probe cards alignment device, it is characterized in that: described seat stand top is slidingly equipped with some anchor clamps, with clamping location wafer probe cards.
16. according to the described wafer probe cards alignment device of claim 15, it is characterized in that: the some guide channels that communicate of described seat stand top tool, described anchor clamps are to be slidingly installed in the guide channel separately.
17. according to the described wafer probe cards alignment device of claim 16, it is characterized in that: described clamp base embedding group has at least one magnetic element, and anchor clamps are adsorbed in the guide channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810173218A CN101726637A (en) | 2008-10-24 | 2008-10-24 | Method and device thereof for aligning wafer probe cards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810173218A CN101726637A (en) | 2008-10-24 | 2008-10-24 | Method and device thereof for aligning wafer probe cards |
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| CN101726637A true CN101726637A (en) | 2010-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200810173218A Pending CN101726637A (en) | 2008-10-24 | 2008-10-24 | Method and device thereof for aligning wafer probe cards |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102879616A (en) * | 2011-07-12 | 2013-01-16 | 南茂科技股份有限公司 | Probe card |
| CN103091521A (en) * | 2013-01-08 | 2013-05-08 | 上海交通大学 | Method of probe and lead foot automatic aiming and probe station testing system thereof |
| CN104704623B (en) * | 2012-10-09 | 2017-07-25 | 东京毅力科创株式会社 | Probe card installation method |
| CN108459180A (en) * | 2017-02-21 | 2018-08-28 | 意法半导体股份有限公司 | For can magnetic actuation device probe card and test system including probe card |
| CN110579492A (en) * | 2019-10-22 | 2019-12-17 | 苏州精濑光电有限公司 | silicon-based OLED panel lighting inspection method |
| CN110736860A (en) * | 2018-07-18 | 2020-01-31 | 均豪精密工业股份有限公司 | Method for correcting position of mechanism after probe card replacement and measuring device thereof |
| CN116148511A (en) * | 2023-04-21 | 2023-05-23 | 深圳市恒雾科技有限公司 | Atomizer resistance testing device |
| CN116774019A (en) * | 2023-08-24 | 2023-09-19 | 杭州中安电子有限公司 | Wafer burn-in test equipment |
-
2008
- 2008-10-24 CN CN200810173218A patent/CN101726637A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102879616A (en) * | 2011-07-12 | 2013-01-16 | 南茂科技股份有限公司 | Probe card |
| CN102879616B (en) * | 2011-07-12 | 2015-04-08 | 南茂科技股份有限公司 | Probe card |
| CN104704623B (en) * | 2012-10-09 | 2017-07-25 | 东京毅力科创株式会社 | Probe card installation method |
| CN103091521A (en) * | 2013-01-08 | 2013-05-08 | 上海交通大学 | Method of probe and lead foot automatic aiming and probe station testing system thereof |
| CN108459180A (en) * | 2017-02-21 | 2018-08-28 | 意法半导体股份有限公司 | For can magnetic actuation device probe card and test system including probe card |
| CN110736860A (en) * | 2018-07-18 | 2020-01-31 | 均豪精密工业股份有限公司 | Method for correcting position of mechanism after probe card replacement and measuring device thereof |
| CN110736860B (en) * | 2018-07-18 | 2021-11-26 | 均豪精密工业股份有限公司 | Method for correcting position of mechanism after probe card replacement and measuring device thereof |
| CN110579492A (en) * | 2019-10-22 | 2019-12-17 | 苏州精濑光电有限公司 | silicon-based OLED panel lighting inspection method |
| CN116148511A (en) * | 2023-04-21 | 2023-05-23 | 深圳市恒雾科技有限公司 | Atomizer resistance testing device |
| CN116774019A (en) * | 2023-08-24 | 2023-09-19 | 杭州中安电子有限公司 | Wafer burn-in test equipment |
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Open date: 20100609 |