CN101724872B - Non-cyanide gilding saline solution - Google Patents
Non-cyanide gilding saline solution Download PDFInfo
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- CN101724872B CN101724872B CN 200810143363 CN200810143363A CN101724872B CN 101724872 B CN101724872 B CN 101724872B CN 200810143363 CN200810143363 CN 200810143363 CN 200810143363 A CN200810143363 A CN 200810143363A CN 101724872 B CN101724872 B CN 101724872B
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- amino
- gold
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- cyanide
- gilding
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Abstract
The invention relates to a method for preparing non-cyanide gilding saline solution. The gold of the non-cyanide gilding saline solution exists in a state of water-soluble ions; and a ligand (a complexing agent) which coordinates the gold is a material of amino acids. The non-cyanide gilding saline solution can be prepared by adopting IEMEC technology, and can be used in the industries of PCBs (printed circuit boards), metal plating, catalyst manufacture, metal powder, nano materials and the like.
Description
Technical field
The present invention relates to a kind of preparation method of non-cyanide gilding saline solution, the gold of this non-cyanide gilding saline solution exists with the water soluble ion state, with the part (complexing agent) of golden coordination be the amino acids material.Adopt IEMEC (electrolysis with ion-exchange film) can prepare non-cyanide gilding saline solution, it can be applicable in the industries such as PCB (printed circuit board (PCB)), five metals plating, catalyzer manufacture, metal-powder and nano material.
Background technology
In the procedure for processing of the industries such as printed-wiring board (PWB) (being called for short PCB), plating, metal-powder, nano material and catalyzer manufacture, often must use a kind of containing golden solution, but the Asia gold potassium cyanide that this kind of gold-containing solution be take containing prussiate at present is as main, it produce and use procedure in all exist great potential safety hazard and problem of environmental pollution.Though sulfurous acid gold salt and solution thereof have product, its stability limit its use.Exploitation does not have potential safety hazard, in its manufacture and use procedure, security is good, to the negative impact of environment, little new type water-solubility gold-containing solution is contemporary requirement, is also purpose of the present invention.
Summary of the invention
The present invention relates to the preparation method of a kind of non-cyanide gilding saline solution (being water-soluble gold-containing solution), this cyanogen-less gold salt take on chemical constitution that to adopt amino acid ligand be feature, can adopt the technology such as IEMEC (electrolysis with ion-exchange film) technique or other chemosynthesis in preparation process, it can be applicable to the fields such as PCB (printed circuit board (PCB)) industry, five metals electroplating industry, metal-powder, nano material and catalyzer manufacture.
An object of the present invention is, a kind of chemical constitution of brand-new cyanogen-less gold salt is provided, its prominent feature is to use the part (L also claim complexing agent etc.) of amino acid as central metal gold (Au); Another object of the present invention is, the preparation method of this new non-cyanide gilding saline solution is provided.
(1), by first aspect of the present invention, this new cyanogen-less gold salt adopts the amino acid material as part.Amino acid molecular was both to have contained amino (NH in its mechanism
2), again containing carboxylic acid group (COOH ,-CO
2h) be characteristics, the amino acid of indication of the present invention has following features on its molecular structure: having an amino and the distance of an acidic group on its molecule (skeleton) carbochain at least is a carbon atom or two carbon atoms.Amino and the distance of acidic group on its molecule carbon chain is the normal title alpha amino acid of a carbon atom, as: glycine CH
2nH
2(CO
2h), its amino and the acidic group distance on (skeleton) carbochain is a carbon atom; Amino and the distance of acidic group on its molecule carbon chain is the normal title beta amino acids of two carbon atoms, as: (NH
2) CH
2cH
2(CO
2h).Can use a seed amino acid during actual the use, also the available mixture formed by two or more amino acid.
Relevant Application Areas comprises: the fields such as PCB industry, plating, metal-powder, nano material and catalyzer manufacture.
(2), by second aspect of the present invention, above-mentioned new non-cyanide gilding saline solution can adopt IEMEC, technology, the conventional inorganic technology such as synthetic in its preparation process.
The said IEMEC of the present invention (ion exchange membrane electrolysis coupling) is the electrolysis with ion-exchange film coupling technology, be characterized in the anodic reaction of electrochemical reaction and cathodic reaction are kept apart, spacer adopts ion-exchange membrane, and form to the one-way with sun or anionic membrane by stream of electrons that coupling is redeposited to prevent the water-soluble gold ion synthetic in positive column from moving to cathodic area becomes solid, relevant device details are shown in another patent of invention (Chinese invention patent 200810031721.3 of our company, title: electrolytic semi-reactor and application thereof, applicant: Changsha platinum shark environmental protection equipment company, date of application: on 07 10th, 2008), its schematic diagram is as shown in Figure 1: anode adopts the proof gold plate, negative electrode adopts stainless-steel sheet, film adopts cationic exchange membrane, the characteristics of positive column electrolyte solution are to contain amino-acid compound, as glycine etc., in actual the use, can add potassium hydroxide or other alkali make electrolyte solution be alkalescence with guarantee amino-acid compound with the negatively charged ion state (as gly
-) exist, formed like this gold complex is the anionic complex compound as [Au (gly)
2]
-, etc., they are stopped and can not move on to cathodic area in positive column by cationic membrane.And the electrolyte solution in cathodic area can be identical from anolyte also can be different, as ammonia-ammonium chloride, phosphoric acid salt buffered soln etc.The electrochemical reaction of positive column (take glycine gly as example) as:
the accompanying drawing explanation:
Fig. 1 is IEMEC cyanogen-less gold liquid preparing process schematic flow sheet
Being 1. wherein direct supply, is 2. gold anode, is 3. negative plate, is 4. cationic exchange membrane, is 5. wire, is 6. the IEMEC cell body.
embodiment:
Embodiment 1:
900 milliliters, the mixture that modulation is comprised of 200 gram Padils and some gram deionized waters, with 35% sodium hydroxide solution, by its pH regulator, be 9.5---10.2, finally with deionized water, be charged to 1 liter, this liquid is placed in respectively to cathodic area and the positive column of IEMEC device as shown in drawings, it is 1. wherein direct supply, 2. be gold anode, 3. be negative plate, 4. be cationic exchange membrane, 5. be wire, 6. be the IEMEC cell body, negative plate adopts 30 square centimeters of stainless steel plates, anode is 20 square centimeters of gold, regulate the output voltage of direct supply at 12V ± 0.5V, keeping the temperature of the solution of negative and positive polar region is 40-55 ℃ of scope, after 6 hours, antianode district solution detects and finds that its gold concentration is greater than 0.5 grams per liter, explanation can prepare by this law the gold solution that does not contain cyanogen.
Embodiment 2:
Modulation is by 75 gram Padils, 75 gram cysteic acids, 50 gram L-glutamic acid, 900 milliliters, the mixture that 50 gram potassium hydroxide and some gram deionized waters form, with 35% sodium hydroxide solution, by its pH regulator, be 9.1-10.3, finally with deionized water, be charged to 1 liter, this liquid is placed in respectively to cathodic area and the positive column of IEMEC device as shown in drawings, it is 1. wherein direct supply, 2. be gold anode, 3. be negative plate, 4. be cationic exchange membrane, 5. be wire, 6. be the IEMEC cell body, negative plate adopts 25 square centimeters of stainless steel plates, anode is thick 25 microns, the goldleaf that area is 25 square centimeters, regulate the output voltage of direct supply in the 9V-11.5 scope, keeping the temperature of the solution of negative and positive polar region is below 50 ℃, after 8 hours, antianode district solution detects and finds that its gold concentration reaches 0.6 grams per liter, explanation can prepare by this law the water-soluble gold solution that does not contain cyanogen.
Claims (1)
1. the preparation method of a non-cyanide gilding saline solution, it is characterized in that: the solution that contains amino-acid compound of take is electrolytic solution, and goldleaf is anode, uses the preparation of electrolysis with ion-exchange film technique, wherein, the characteristics of described electrolysis with ion-exchange film technique are that the anodic reaction of electrochemical reaction and cathodic reaction are kept apart, spacer adopts ion-exchange membrane, and form to the one-way with sun or anionic membrane by stream of electrons that coupling is redeposited to prevent the water-soluble gold ion synthetic in positive column from moving to cathodic area becomes solid, concrete technology is: anode adopts the proof gold plate, negative electrode adopts stainless-steel sheet, film adopts cationic exchange membrane, the characteristics of positive column electrolyte solution are to contain amino-acid compound, in actual the use, can add potassium hydroxide or other alkali to make electrolyte solution be alkalescence to guarantee that amino-acid compound exists with the negatively charged ion state, formed like this gold complex is the anionic complex compound, they are stopped and can not move on to cathodic area in positive column by cationic membrane, and the electrolyte solution in cathodic area can be identical from anolyte also can be different, wherein, have an amino and acidic group in described amino-acid compound at least on its molecule carbon chain and the distance of this amino and acidic group is a carbon atom or two carbon atoms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810143363 CN101724872B (en) | 2008-10-20 | 2008-10-20 | Non-cyanide gilding saline solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810143363 CN101724872B (en) | 2008-10-20 | 2008-10-20 | Non-cyanide gilding saline solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101724872A CN101724872A (en) | 2010-06-09 |
| CN101724872B true CN101724872B (en) | 2013-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810143363 Expired - Fee Related CN101724872B (en) | 2008-10-20 | 2008-10-20 | Non-cyanide gilding saline solution |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101899688B (en) * | 2010-07-24 | 2012-09-05 | 福州大学 | Cyanide-free gold plating solution for plating gold |
| CN102731536A (en) * | 2012-06-29 | 2012-10-17 | 长沙铂鲨环保设备有限公司 | Anionic type gold complex and application thereof |
| CN104762652B (en) * | 2015-04-27 | 2017-06-20 | 栾善东 | A kind of compound acid system PCB vertical continuous electroplanting device and method |
| CN105420771A (en) * | 2015-12-23 | 2016-03-23 | 苏州市金星工艺镀饰有限公司 | Environment-friendly cyanide-free gilding electroplating liquid |
| CN110106537A (en) * | 2019-06-26 | 2019-08-09 | 浙江金卓首饰有限公司 | A kind of preparation method of the electroforming solution being used to prepare the hard gold of 3D and the hard gold of 3D |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1193615A (en) * | 1966-06-24 | 1970-06-03 | Texas Instruments Ltd | Electrodeposition of Gold. |
| US6620304B1 (en) * | 1999-06-19 | 2003-09-16 | Gerhard Hoffacker | Bath system for galvanic deposition of metals |
| US6733651B1 (en) * | 1999-06-01 | 2004-05-11 | W. C. Heraeus Gmbh & Co. Kg | Method for producing a cyanide-free solution of a gold compound that is suitable for galvanic gold baths |
| CN101182637A (en) * | 2006-11-16 | 2008-05-21 | 方景礼 | Alkalescent chemical silver plating solution |
-
2008
- 2008-10-20 CN CN 200810143363 patent/CN101724872B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1193615A (en) * | 1966-06-24 | 1970-06-03 | Texas Instruments Ltd | Electrodeposition of Gold. |
| US6733651B1 (en) * | 1999-06-01 | 2004-05-11 | W. C. Heraeus Gmbh & Co. Kg | Method for producing a cyanide-free solution of a gold compound that is suitable for galvanic gold baths |
| US6620304B1 (en) * | 1999-06-19 | 2003-09-16 | Gerhard Hoffacker | Bath system for galvanic deposition of metals |
| CN101182637A (en) * | 2006-11-16 | 2008-05-21 | 方景礼 | Alkalescent chemical silver plating solution |
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|---|---|
| CN101724872A (en) | 2010-06-09 |
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