CN101718424B - 大功率led灯的镁合金散热结构 - Google Patents
大功率led灯的镁合金散热结构 Download PDFInfo
- Publication number
- CN101718424B CN101718424B CN2010100025532A CN201010002553A CN101718424B CN 101718424 B CN101718424 B CN 101718424B CN 2010100025532 A CN2010100025532 A CN 2010100025532A CN 201010002553 A CN201010002553 A CN 201010002553A CN 101718424 B CN101718424 B CN 101718424B
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- CN
- China
- Prior art keywords
- magnesium alloy
- copper
- led lamp
- heat
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000861 Mg alloy Inorganic materials 0.000 title claims abstract description 108
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000000741 silica gel Substances 0.000 claims abstract description 31
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 239000000956 alloy Substances 0.000 claims abstract description 11
- 239000011049 pearl Substances 0.000 claims description 60
- 230000005855 radiation Effects 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000012141 concentrate Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000010949 copper Substances 0.000 abstract description 72
- 229910052802 copper Inorganic materials 0.000 abstract description 72
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 28
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract 9
- 238000000576 coating method Methods 0.000 abstract 9
- 150000001879 copper Chemical class 0.000 description 44
- 238000005516 engineering process Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 229910000838 Al alloy Inorganic materials 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 238000005266 casting Methods 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 229910001051 Magnalium Inorganic materials 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 210000001787 dendrite Anatomy 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000008014 freezing Effects 0.000 description 2
- 238000007710 freezing Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010100025532A CN101718424B (zh) | 2010-01-09 | 2010-01-09 | 大功率led灯的镁合金散热结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010100025532A CN101718424B (zh) | 2010-01-09 | 2010-01-09 | 大功率led灯的镁合金散热结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101718424A CN101718424A (zh) | 2010-06-02 |
CN101718424B true CN101718424B (zh) | 2013-05-29 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010100025532A Expired - Fee Related CN101718424B (zh) | 2010-01-09 | 2010-01-09 | 大功率led灯的镁合金散热结构 |
Country Status (1)
Country | Link |
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CN (1) | CN101718424B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103511926A (zh) * | 2013-09-25 | 2014-01-15 | 苏州东亚欣业节能照明有限公司 | Led射灯 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1401446A (zh) * | 2002-05-20 | 2003-03-12 | 沈阳工业大学 | 镁合金散热器片及其制造方法 |
CN1553760A (zh) * | 2003-05-26 | 2004-12-08 | 王立华 | 铝或镁或其合金基高散热孔金属化印制线路板及制造方法 |
CN2735151Y (zh) * | 2004-07-30 | 2005-10-19 | 品能光电技术(上海)有限公司 | 发光二极管模组聚光灯 |
CN101082394A (zh) * | 2006-06-01 | 2007-12-05 | 深圳市乔立实业发展有限公司 | 光控led路灯 |
CN101290100A (zh) * | 2007-04-19 | 2008-10-22 | 宁波安迪光电科技有限公司 | Led照明装置的外壳 |
CN101319775A (zh) * | 2008-07-18 | 2008-12-10 | 杜国平 | 功率型led灯具中高导热柔性填隙材料 |
CN101534599A (zh) * | 2008-03-14 | 2009-09-16 | 西安孚莱德光电科技有限公司 | Led散热基板及其制造方法 |
CN201326917Y (zh) * | 2008-11-24 | 2009-10-14 | 孙坚 | Led日光灯 |
-
2010
- 2010-01-09 CN CN2010100025532A patent/CN101718424B/zh not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1401446A (zh) * | 2002-05-20 | 2003-03-12 | 沈阳工业大学 | 镁合金散热器片及其制造方法 |
CN1553760A (zh) * | 2003-05-26 | 2004-12-08 | 王立华 | 铝或镁或其合金基高散热孔金属化印制线路板及制造方法 |
CN2735151Y (zh) * | 2004-07-30 | 2005-10-19 | 品能光电技术(上海)有限公司 | 发光二极管模组聚光灯 |
CN101082394A (zh) * | 2006-06-01 | 2007-12-05 | 深圳市乔立实业发展有限公司 | 光控led路灯 |
CN101290100A (zh) * | 2007-04-19 | 2008-10-22 | 宁波安迪光电科技有限公司 | Led照明装置的外壳 |
CN101534599A (zh) * | 2008-03-14 | 2009-09-16 | 西安孚莱德光电科技有限公司 | Led散热基板及其制造方法 |
CN101319775A (zh) * | 2008-07-18 | 2008-12-10 | 杜国平 | 功率型led灯具中高导热柔性填隙材料 |
CN201326917Y (zh) * | 2008-11-24 | 2009-10-14 | 孙坚 | Led日光灯 |
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CN101718424A (zh) | 2010-06-02 |
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Address after: 528400, Guangdong, Zhongshan Town, Tanzhou Town, No. 2, the first floor of the factory floor Patentee after: GUANGDONG WENDA MAGNESIUM TECHNOLOGY CO.,LTD. Address before: 528400, Guangdong, Zhongshan Town, Tanzhou Town, No. 2, the first floor of the factory floor Patentee before: ZHONGSHAN WENDA MAGNESIUM TECHNOLOGY CO.,LTD. |
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Denomination of invention: Magnesium alloy heat radiating structure of large-power LED lamp Effective date of registration: 20190723 Granted publication date: 20130529 Pledgee: Bank of China Limited by Share Ltd. Zhongshan branch Pledgor: GUANGDONG WENDA MAGNESIUM TECHNOLOGY CO.,LTD. Registration number: 2019440000269 |
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