CN101707204B - Organic electroluminescent device and electronic device provided with same - Google Patents

Organic electroluminescent device and electronic device provided with same Download PDF

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Publication number
CN101707204B
CN101707204B CN2009102256543A CN200910225654A CN101707204B CN 101707204 B CN101707204 B CN 101707204B CN 2009102256543 A CN2009102256543 A CN 2009102256543A CN 200910225654 A CN200910225654 A CN 200910225654A CN 101707204 B CN101707204 B CN 101707204B
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layer
circuit board
illuminating element
organic illuminating
element layer
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CN101707204A (en
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莫尧安
李重君
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AU Optronics Corp
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AU Optronics Corp
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Abstract

The invention discloses an organic electroluminescent device, which comprises a substrate, an organic luminous element layer, a circuit board, a sealing compound layer, and an electrical connection layer, wherein the organic luminous element layer is positioned on the substrate, and comprises a first electrode layer, a luminous layer and a second electrode layer; the first electrode layer is arranged on the substrate, the luminous layer is arranged on the first electrode layer, and the second electrode layer is arranged on the luminous layer; the circuit board is arranged on the substrate and covers the organic luminous element layer; the sealing compound layer is positioned between the circuit board and the substrate so as to adhere the circuit board to the substrate; and the electrical connection layer is positioned between the circuit board and the substrate so as to ensure that the circuit board is electrically connected with the first electrode layer of the organic luminous element layer.

Description

Organnic electroluminescent device and have the electronic installation of this Organnic electroluminescent device
Technical field
The present invention relates to a kind of light-emitting device, and particularly relevant for a kind of Organnic electroluminescent device and have the electronic installation of this Organnic electroluminescent device.
Background technology
Display of organic electroluminescence is the display of a kind of self-luminosity (Emissive).Because display of organic electroluminescence has the restriction of no visual angle, hangs down manufacturing cost, high answer speed (being about more than hundred times of liquid crystal), power saving, the DC driven that can be used in portable machine, operating temperature range is big and in light weight and can be with hardware device miniaturization and slimming or the like.Therefore, organic electroluminescent device has great development potentiality, is expected to become next novel flat-panel screens from generation to generation.
Display of organic electroluminescence is made up of a upper electrode layer, a lower electrode layer and the organic luminous layer that is sandwiched between two electrode layers, and wherein lower electrode layer generally is to adopt the electrically conducting transparent material, so that the light that organic luminous layer produced can penetrate out.Yet, because the impedance of general electrically conducting transparent material is than the metal material height, therefore when the organic electroluminescent display when large scale develops, and the power supply of display of organic electroluminescence is when being imported by single direction, and will make because of the impedance of bottom electrode is too high has significantly different near power input with pressure drop situation away from power input.Thus, will make that the luminous uniformity of display is not good.
In addition, enter organic luminous layer in the display of organic electroluminescence, generally all can utilize glass cover-plate that organic luminous layer is sealed in wherein in addition in order to block extraneous aqueous vapor and oxygen.In other words, traditional display of organic electroluminescence is because of the other glass cover-plate of needs, between therefore can expending the required cost of this glass cover-plate and organizing immediately.
Summary of the invention
The electronic installation that the invention provides a kind of Organnic electroluminescent device and have this Organnic electroluminescent device, it can save the use glass cover-plate.
In addition, Organnic electroluminescent device provided by the present invention and electronic installation with this Organnic electroluminescent device can solve traditional Organnic electroluminescent device is having visibly different problem near power input and pressure drop situation away from power input.
The present invention proposes a kind of Organnic electroluminescent device, and it comprises substrate, organic illuminating element layer, circuit board, adhesive layer and electrical knitting layer.The organic illuminating element layer is positioned on the substrate, and wherein the organic illuminating element layer comprises first electrode layer, luminescent layer and the second electrode lay, and first electrode layer is arranged on the substrate, and luminescent layer is arranged on first electrode layer, and the second electrode lay is arranged on the luminescent layer.Circuit board is arranged on the top of substrate, and covers organic light emitting element layer.Adhesive layer is between circuit board and substrate, so that circuit board is adhered on the substrate.Electrically knitting layer is between circuit board and substrate, so that first electrode layer of circuit board and organic illuminating element layer electrically connects.
The present invention proposes a kind of electronic installation in addition, and it comprises Organnic electroluminescent device and drive unit.Organnic electroluminescent device comprises substrate, organic illuminating element layer, circuit board, adhesive layer and electrical knitting layer.The organic illuminating element layer is positioned on the substrate, and wherein the organic illuminating element layer comprises first electrode layer, luminescent layer and the second electrode lay, and first electrode layer is arranged on the substrate, and luminescent layer is arranged on first electrode layer, and the second electrode lay is arranged on the luminescent layer.Circuit board is arranged on the top of substrate, and covers organic light emitting element layer.Adhesive layer is between circuit board and this substrate, so that circuit board is adhered on the substrate.Electrically knitting layer is between circuit board and substrate, so that first electrode layer of circuit board and organic illuminating element layer electrically connects.The circuit board of drive unit and Organnic electroluminescent device electrically connects.
Organnic electroluminescent device of the present invention directly is provided with circuit board with protection organic illuminating element layer on the organic illuminating element layer, so circuit board can directly replace traditional glass cover-plate, with save required cost that expends of glass cover-plate and group immediately between.In addition, cause is arranged on the circuit board of substrate top and first electrode layer of organic illuminating element layer electrically connects, so that the current signal on the circuit board can input to first electrode layer, it can avoid traditional Organnic electroluminescent device to have easily with single direction input power supply is having visibly different problem near power input and pressure drop situation away from power input.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended accompanying drawing to be described in detail below.
Description of drawings
Fig. 1 is the schematic top plan view of Organnic electroluminescent device according to an embodiment of the invention;
Fig. 2 is the generalized section of Fig. 1 along A-A ';
Fig. 3 is the equivalent circuit diagram of active organic light-emitting element layer according to an embodiment of the invention;
Fig. 4 to Fig. 6 is the generalized section according to the Organnic electroluminescent device of several embodiment of the present invention;
Fig. 7 to Fig. 8 is the schematic top plan view according to the Organnic electroluminescent device of several embodiment of the present invention;
Fig. 9 is the schematic diagram according to the electronic installation of one embodiment of the invention.
Wherein, Reference numeral
100: 102: the first electrode layers of substrate
104: luminescent layer 106: the second electrode lay
108: insulating barrier 110: the organic illuminating element layer
112: protective layer 114: colloidal materials
120; Adhesive layer 130: electrical knitting layer
200: circuit board 202: base material
204: conductor layer 206: cover layer
300: drive unit SL: scan line
DL: data wire PL: power supply line
P: pixel cell T1, T2: thin-film transistor
C: capacitor O: light-emitting diode
G: gap
Embodiment
Fig. 1 is the schematic top plan view of Organnic electroluminescent device according to an embodiment of the invention.Fig. 2 is the generalized section of Fig. 1 along A-A '.Please be simultaneously with reference to Fig. 1 and Fig. 2, the Organnic electroluminescent device of present embodiment comprises substrate 100, organic illuminating element layer 110, circuit board 200, adhesive layer 120 and electrical knitting layer 130.
Substrate 100 is a transparency carrier, and it can be transparent glass substrate or transparent flexible substrate.Substrate 100 mainly is the usefulness as the element of carrying Organnic electroluminescent device.For the light that organic electroluminescent device is produced can transmit from substrate 100, substrate 100 is to adopt transparent or light-transmitting materials.In general, the Organnic electroluminescent device from substrate 100 bright dippings is called bottom-emission type Organnic electroluminescent device again.
Organic illuminating element layer 110 is positioned on the substrate 100.Particularly, organic illuminating element layer 110 comprises first electrode layer 102, luminescent layer 104 and the second electrode lay 106, wherein first electrode layer 102 is arranged on the substrate 100, and luminescent layer 104 is arranged on first electrode layer 102, and the second electrode lay 106 is arranged on the luminescent layer 104.First electrode layer 102 is a transparent electrode layer, and its material can be metal oxide, as indium tin oxide or indium-zinc oxide or the like.Luminescent layer 104 is an organic luminous layer, and it can comprise red organic light emission pattern, green organic light emission pattern and blue organic light emission pattern or mix the different colours that the light of each frequency spectrum produces (for example, white, tangerine, purple .. etc.) luminous pattern.The second electrode lay 106 can be metal electrode layer.According to other embodiment, organic illuminating element layer 110 can more comprise electronics input layer, hole input layer, electron transfer layer and hole transmission layer or the like.In addition,, comprise more on first electrode layer 102 being coated with patterned insulation layer 108 that defining a plurality of unit areas, and luminescent layer 104 is formed in the unit area that patterned insulation layer 108 defined according to embodiments of the invention.
Organic illuminating element layer 110 can be passive organic light-emitting element layer or active organic light-emitting element layer.If organic illuminating element layer 110 is the passive organic light-emitting element layer, first electrode layer 102 and the second electrode lay 106 are made of many strip electrodes pattern respectively so, and the setting interlaced with each other of the electrode pattern of the electrode pattern of first electrode layer 102 and the second electrode lay 106 is to constitute a plurality of pixel cells.
If organic illuminating element layer 110 is the active organic light-emitting element layer, this organic illuminating element layer 110 is made of many data wire DL, multi-strip scanning line SL, many power supply line PL and a plurality of pixel cell P, as shown in Figure 3.Each dot structure P can with a data wire DL wherein, wherein one scan line SL and wherein a power supply line PL electrically connect.And each dot structure P comprises at least one OTFT T1, T2, capacitor C and Organic Light Emitting Diode O.In the present embodiment, the element of dot structure P is be that example illustrates with two thin-film transistors capacitors of collocation (2T1C), but is not in order to limiting the present invention, and the present invention does not limit the interior OTFT of each dot structure P and the number of capacitor.In the dot structure P of 2T1C form, the source electrode of OTFT T1 can be connected with data wire DL, and grid can electrically connect with scan line SL, and drain electrode can be connected with the grid of OTFT T2; The grid of OTFT T2 is and the drain electrode of OTFT T1 that source electrode is to electrically connect with power supply line PL, and drain electrode is to electrically connect with Organic Light Emitting Diode O.The grid of the end of capacitor C and the drain electrode of OTFT T1 and OTFT T2 electrically connects, and the other end of capacitor C then is that source electrode and the power supply line PL with OTFT T2 electrically connects.The active organic light-emitting element layer 110 of above-mentioned Fig. 3 only is used for illustrating, so that those skilled in the art can understand the present invention and enforcement according to this, but it is not in order to limit the present invention.In other embodiment, can also adopt the layout designs of the active organic light-emitting element layer of other kinds form.
Please continue with reference to Fig. 1 and Fig. 2, circuit board 200 is arranged on the top of substrate 100 again, and covers organic light emitting element layer 110.In the present embodiment, circuit board 200 comprises base material 202, conductor layer 204 and cover layer 206, and wherein conductor layer 204 is sandwiched between base material 202 and the cover layer 206.Circuit board 200 can be flexible circuit board, for example is bendable printed circuit board (PCB) (FPC).
Adhesive layer 120 is between circuit board 200 and substrate 100, and it is in order to be adhered to circuit board 200 on the substrate 100.Adhesive layer 120 can be photo-hardening adhesive material or heat hardening adhesive material.In the present embodiment, in order to make circuit board 200 can tightly be adhered on the substrate 100 and to block extraneous aqueous vapor and oxygen enters organic illuminating element layer 110, preferably around organic illuminating element layer 100, be coated with adhesive layer 120.But, the invention is not restricted to this, in other embodiment, if organic illuminating element layer 110 has had other the design of blocking aqueous vapor and oxygen, can also be only at a wherein side of organic illuminating element layer 110, wherein both sides or three sides coating adhesive layer 120 wherein, get final product so long as circuit board 200 can be adhered on the substrate 100.
Electrically knitting layer 130 is between circuit board 200 and substrate 100, so that first electrode layer 102 of circuit board 200 and organic illuminating element layer 110 electrically connects.More specifically, first electrode layer 102 of organic illuminating element layer 110 more extends to the zone of adhesive layer 102 peripheries, and first electrode layer 102 that extends to adhesive layer 102 outer peripheral areas is not covered by any rete.And the circuit board 200 that is positioned at substrate 100 tops extends to first electrode layer, 102 places of adhesive layer 102 outer peripheral areas in correspondence, and its conductor layer 204 is exposed, and just is not coated with cover layer 206 on the conductor layer 204 herein.Thus, between first electrode layer 102 that extends to adhesive layer 102 outer peripheral areas and the conductor layer 204 that is exposed out, form electrical knitting layer 130, just can be so that first electrode layer 102 of the conductor layer of circuit board 200 204 and organic illuminating element layer 110 electrically connects.In the present embodiment, electrically knitting layer 130 for example is an aeolotropic lead glue.But, in other embodiment, can also adopt the electrical grafting material of other kinds form.
In addition, as shown in Figure 1, in the present embodiment, above-mentioned electrical knitting layer 130 be positioned at organic illuminating element layer 110 relatively to dual-side.Therefore, the current signal on the circuit board 200 can be simultaneously inputed in the organic illuminating element layer 110 by the both sides of organic illuminating element layer 110.Therefore, this kind mode can reduce and makes organic illuminating element layer 110 that obvious pressure drop be arranged easily by the single direction input current signal and cause the luminous uniformity of organic illuminating element layer 110 not good.
In addition; present embodiment is the current signal of covering board 200 on can making circuit board 200 simultaneously inputs in the organic illuminating element layer 110 by the both sides of organic illuminating element layer 110 on organic illuminating element layer 110; circuit board 200 can suffer scratch or damage to avoid organic illuminating element layer 110 simultaneously as the cover layer of protection organic illuminating element layer 110.
Fig. 4 is the generalized section of Organnic electroluminescent device according to another embodiment of the present invention.The embodiment of Fig. 4 is similar to Fig. 1, so components identical represents with identical label, and no longer repeats to give unnecessary details at this.The embodiment of Fig. 4 and Fig. 1 difference are that the Organnic electroluminescent device of Fig. 4 more comprises a protective layer 112, and it covers organic light emitting element layer 110, enter in the organic illuminating element layer 110 to block extraneous aqueous vapor and oxygen.Protective layer 112 can be inorganic material or organic material, and it for example is to adopt the mode that deposits or be coated with to be formed on the surface of organic luminous layer 110.
In the embodiment of Fig. 4, have clearance G between protective layer 112 and the circuit board 200, according to other embodiments of the invention, as shown in Figure 5, can more be included in and insert adhesive layer 120 in the clearance G.In other words; adhesive layer 120 except be formed on organic illuminating element layer 110 around; more comprise in the clearance G that is formed between protective layer 112 and the circuit board 200; so can further strengthen the adhesion strength between circuit board 200 and the substrate 100, and can further block extraneous aqueous vapor and oxygen enters in the organic illuminating element layer 110.
The embodiment of above-mentioned Fig. 5 inserts adhesive layer 120 in the clearance G between protective layer 112 and circuit board 200.But; the invention is not restricted to this; in other embodiment; as shown in Figure 6; can also in the clearance G between protective layer 112 and the circuit board 200, insert colloidal materials (gel material) 114; or can enter in the organic illuminating element layer 110 further to block extraneous aqueous vapor and oxygen through the UV or the colloid of hot curing.
(embodiment of Fig. 1) in the above-described embodiment, electrically knitting layer 130 be formed in organic illuminating element layer 110 relatively to both sides.But, the invention is not restricted to this, in other embodiment, electrically connect layer 130 also can be formed on wherein three side edge (as the embodiment of Fig. 7) of organic illuminating element layer 110 or be positioned at organic illuminating element layer 110 around (as the embodiment of Fig. 8).If wherein three the side edge designs at organic illuminating element layer 110 electrically connect layer 130, as shown in Figure 7, current signal on the circuit board 200 can be simultaneously inputed in the organic illuminating element layer 110 by three side edge of organic illuminating element layer 110 so, makes organic illuminating element layer 110 that obvious pressure drop be arranged easily by the single direction input current signal of organic illuminating element layer 110 and causes the luminous uniformity of organic illuminating element layer 110 not good to solve.Similarly, if all design electrically connects layer 130 around organic illuminating element layer 110, as shown in Figure 8, so the current signal on the circuit board 200 can be simultaneously by inputing in the organic illuminating element layer 110 around the organic illuminating element layer 110, make organic illuminating element layer 110 that obvious pressure drop be arranged easily by the single direction input current signal of organic illuminating element layer 110 and cause the luminous uniformity of organic illuminating element layer 110 not good to solve.
Fig. 9 is the schematic diagram according to the electronic installation of one embodiment of the invention.Please refer to Fig. 9, the electronic installation of present embodiment comprises Organnic electroluminescent device 180 and drive unit 300.Organnic electroluminescent device 180 can be as the described Organnic electroluminescent device of the arbitrary embodiment of above-mentioned Fig. 1 to Fig. 8, and the circuit board 200 of drive unit 300 and Organnic electroluminescent device 180 electrically connects.This drive unit 300 mainly is to use and different according to the product of Organnic electroluminescent device 180.For instance, if Organnic electroluminescent device 180 is the usefulness as display, the drive unit 300 with Organnic electroluminescent device 180 electric connections is to be used for driving the drive system that Organnic electroluminescent device 180 shows the usefulness of various images so.If Organnic electroluminescent device 180 is the usefulness as luminaire, the drive unit 300 with Organnic electroluminescent device 180 electric connections will be bright, the dark or drive system of other operations that is used for driving Organnic electroluminescent device 180 so.
In sum, Organnic electroluminescent device of the present invention directly is provided with circuit board with protection organic illuminating element layer on the organic illuminating element layer.In other words, circuit board can directly replace traditional glass cover-plate, between therefore can saving the required cost that expends of glass cover-plate and organizing immediately.
In addition, because of first electrode layer electric connection of the circuit board that is arranged on substrate top, so that the current signal on the circuit board can input to first electrode layer with the organic illuminating element layer.Particularly, according to embodiments of the invention, the current signal on the circuit board can or input to the organic illuminating element layer all around simultaneously by both sides, three sides of organic illuminating element layer.Therefore, can avoid traditional Organnic electroluminescent device to have easily and visibly different problem arranged near power input and pressure drop situation away from power input with single direction input power supply.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.

Claims (16)

1. an Organnic electroluminescent device is characterized in that, comprising:
One substrate;
One organic illuminating element layer, be positioned on this substrate, wherein this organic illuminating element layer comprises one first electrode layer, a luminescent layer and a second electrode lay, this first electrode layer is arranged on this substrate, this luminescent layer is arranged on this first electrode layer, and this second electrode lay is arranged on this luminescent layer;
One circuit board is arranged on the top of this substrate, and covers this organic illuminating element layer;
One adhesive layer is between this circuit board and this substrate, so that this circuit board is adhered on this substrate;
One electrical knitting layer is between this circuit board and this substrate, so that this first electrode layer of this circuit board and this organic illuminating element layer electrically connects; And,
One protective layer, it covers this organic illuminating element layer, has a gap between this circuit board and this protective layer, has also inserted this adhesive layer or colloid material in this gap.
2. Organnic electroluminescent device according to claim 1 is characterized in that, this organic illuminating element layer is an active organic light-emitting element layer or a passive organic light-emitting element layer.
3. Organnic electroluminescent device according to claim 1 is characterized in that, this adhesive layer is positioned at least one side of this organic illuminating element layer.
4. Organnic electroluminescent device according to claim 3 is characterized in that, this adhesive layer be positioned at this organic illuminating element layer around.
5. Organnic electroluminescent device according to claim 1 is characterized in that, this electrical knitting layer be positioned at least this organic illuminating element layer relatively to dual-side.
6. Organnic electroluminescent device according to claim 5 is characterized in that, this electrical knitting layer be positioned at wherein three side edge of this organic illuminating element layer or be positioned at this organic illuminating element layer around.
7. Organnic electroluminescent device according to claim 1 is characterized in that, this electrical knitting layer comprises an aeolotropic conductive layer.
8. Organnic electroluminescent device according to claim 1 is characterized in that, this circuit board is a flexible circuit board.
9. an electronic installation is characterized in that, comprising:
One Organnic electroluminescent device comprises:
One substrate;
One organic illuminating element layer, be positioned on this substrate, wherein this organic illuminating element layer comprises one first electrode layer, a luminescent layer and a second electrode lay, this first electrode layer is arranged on this substrate, this luminescent layer is arranged on this first electrode layer, and this second electrode lay is arranged on this luminescent layer;
One circuit board is arranged on the top of this substrate, and covers this organic illuminating element layer;
One adhesive layer is between this circuit board and this substrate, so that this circuit board is adhered on this substrate;
One electrical knitting layer is between this circuit board and this substrate, so that this first electrode layer of this circuit board and this organic illuminating element layer electrically connects; And,
One protective layer, it covers this organic illuminating element layer, has a gap between this circuit board and this protective layer, has also inserted this adhesive layer or colloid material in this gap;
One drive unit, this circuit board of this drive unit and this Organnic electroluminescent device electrically connects.
10. electronic installation according to claim 9 is characterized in that, this organic illuminating element layer is an active organic light-emitting element layer or a passive organic light-emitting element layer.
11. electronic installation according to claim 9 is characterized in that, this adhesive layer is positioned at least one side of this organic illuminating element layer.
12. electronic installation according to claim 10 is characterized in that, this adhesive layer be positioned at this organic illuminating element layer around.
13. electronic installation according to claim 9 is characterized in that, this electrical knitting layer be positioned at least this organic illuminating element layer relatively to dual-side.
14. electronic installation according to claim 13 is characterized in that, this electrical knitting layer be positioned at wherein three side edge of this organic illuminating element layer or be positioned at this organic illuminating element layer around.
15. electronic installation according to claim 9 is characterized in that, this electrical knitting layer comprises an aeolotropic conductive layer.
16. electronic installation according to claim 9 is characterized in that, this circuit board is a flexible circuit board.
CN2009102256543A 2009-11-27 2009-11-27 Organic electroluminescent device and electronic device provided with same Active CN101707204B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009102256543A CN101707204B (en) 2009-11-27 2009-11-27 Organic electroluminescent device and electronic device provided with same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009102256543A CN101707204B (en) 2009-11-27 2009-11-27 Organic electroluminescent device and electronic device provided with same

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Publication Number Publication Date
CN101707204A CN101707204A (en) 2010-05-12
CN101707204B true CN101707204B (en) 2011-09-07

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