CN101695854B - Scoring device and scoring method - Google Patents
Scoring device and scoring method Download PDFInfo
- Publication number
- CN101695854B CN101695854B CN 200910206631 CN200910206631A CN101695854B CN 101695854 B CN101695854 B CN 101695854B CN 200910206631 CN200910206631 CN 200910206631 CN 200910206631 A CN200910206631 A CN 200910206631A CN 101695854 B CN101695854 B CN 101695854B
- Authority
- CN
- China
- Prior art keywords
- substrate
- head
- scribe head
- line
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a scoring device and a scoring method. The scoring device comprises a scribe head to form predetermined scribe lines on the surface of a substrate; a counter head arranged at the opposite side relative to the substrate and used for pressing the substrate, wherein the counter head further comprises a pressure regulating part located between the contact portion and the pressing portion of the substrate. When the pressing portion applies a predetermined pressure toward the contact portion of the substrate, the pressure regulating part portion regulates the pressure applied to the substrate contact portion by absorbing the pressure; and a horizontal moving part used for moving the scribe head and the counter head along the horizontal direction. The forming of cutting lines and the splitting of the cutting lines are simultaneously operated in single equipment, thus, shortening the processing period and reducing the work space owing to the simple structure of the equipment. The substrate is split into a plurality of single chips.
Description
The present invention is that application number is 200610103316.9, the applying date is on July 18th, 2006, denomination of invention is divided an application for the invention of " scoring equipment and method and multi braking system ".
Technical field
The present invention relates to a kind of scoring equipment and method and a kind of multi braking system, and more particularly relate to a kind of scoring equipment and method and a kind of multi braking system, it can be carried out simultaneously in individual equipment in substrate formation and cut line and divide substrate along cutting line, thereby the processing time can be shortened, can reduce working space, by single treatment substrate is split into a plurality of monolithics, and form the line of cutting with unified degree of depth at substrate.
Background technology
Scoring equipment is used for cutting or the division substrate.Substrate refers to relatively large and has the plate of predetermined thickness, and it comprises semiconductor, flat-panel monitor, plate glass or acrylic plate.In particular, because the substrate of the liquid crystal display (LCD), plasma display device (PDP) and the Organic Light Emitting Diode (OLED) that are for example mainly formed by glass needs precise cutting, so the following scoring equipment of use.
In order to cut substrate, form at substrate surface in advance and cut line, and substrate is along cutting the line division.That is to say, as shown in Figure 1, when the cutter 1 that is formed by the material that demonstrates higher hardness (for example, diamond) vibrated and presses substrate G surface, substrate G was created in the vertical fracture C that extends on the thickness direction on the surface.Under this state, when cutter 1 is mobile along substrate G surface, as shown in Figure 2, form the continuous S that rules that cuts on the substrate G surface.Substrate G form cut line S after, by applying power and can make substrate G division along cutting line S.
Referring to Fig. 3, substrate G is loaded into (S10) on the predetermined workbench.Loading can manually finish or use additional loader mechanism automatically to finish.When having loaded substrate G, make the accurate position (S20) of substrate G registration on workbench of loading.Then, the scribe head that the cutter 1 of line S is cut in the formation with Fig. 1 moves to the position of expectation, and sets the height (scribe head is set step S30) of cutter 1.Cut line S (S40) by driving scribe head in substrate G formation.When line S is cut in substrate G formation, make substrate G move to the position of carrying out division to cutting line S, and follow load substrates G (S50).In this step, can further carry out the step of registration of the position of setting substrate G.Then, carry out along cutting the division (S60) of line S to substrate G.
Yet, in above-mentioned routine techniques, form the step of cutting line S, and division is formed with the step of the substrate G that cuts line S by independent equipment execution.In addition, owing to the step repetition of the movement, loading and the registration substrate G that are undertaken by suitable equipment, so the equipment complicated, the processing time increases greatly, and essential working space increases naturally.Especially in the time single substrate will being split into many monolithics, owing to the above-mentioned steps that needs to repeat Fig. 3, so can't shorten the processing time.
In addition, owing to be to be fixed on the surface of substrate G to carry out line in the situation of workbench, so be difficult to tackle the unevenness of workbench or substrate G itself.Therefore, be difficult to form the line of cutting with constant depth.
Summary of the invention
In order to solve above-mentioned and/or other problem, the invention provides: a kind of scoring equipment and method, it can be carried out simultaneously in individual equipment in substrate formation and cut line and divide substrate along cutting line, thereby the processing time can be shortened, so can reduce working space because described scoring equipment is simplified, by single treatment substrate is split into a plurality of monolithics, and form the line of cutting with unified degree of depth at described substrate; With a kind of multi braking system.
According to an aspect of the present invention, a kind of multi braking system comprises: workbench, and it is mounted with the substrate that stands to divide; A plurality of division modules, it divides described substrate by the predetermined line of cutting of each formation on the upper surface that is loaded into the described substrate on the described workbench and lower surface; Configuration module, it configures described division module with predetermined separation spacing; With move horizontally module, it makes described configuration module mobile in the direction of intersecting with the configuration direction of described division module.
Described workbench comprises: frame, and it forms the outside; A plurality of support sections, it is coupled to described frame, supports described substrate, has predetermined rod-shape, and separated from one another so that the predetermined division module that formation is passed for the division module is passed the path; And standing part, it is formed on each of described support section in order to fix described substrate by the lower surface that holds substrate.
Thereby described support section is coupled to described frame and can moves at least one direction, in order to regulate the interval between the described support section.
Described standing part is a plurality of vacuum suckers, and its longitudinal direction along described support section provides, in order to use predetermined pull of vacuum to fix described substrate.
Described division module comprises: top division module, its upper surface at described substrate form cuts line and division substrate; With bottom division module, its lower surface at described substrate forms cuts line and division substrate, and wherein said upper and lower division module is configured to utilize and describedly moves horizontally module and through identical mobile route.
In the described upper and lower division module each includes: scribe head, and it forms at substrate surface and cuts line; With reverse head (counter head), its with respect to be inserted in its with described scribe head between described substrate and be positioned at a side opposite with described scribe head, oppositely head also cuts line and divide described substrate along described by pressing described substrate.
Described multi braking system further comprises the coupling part that connects described scribe head and described reverse head, wherein move horizontally partial coupling to described coupling part and make described coupling part mobile in the horizontal direction, thereby scribe head and reverse head are moved in the horizontal direction.
Described reverse head comprises: the substrate contact part, and it contacts another surface of described substrate; And pressing part, it promotes and presses described substrate contact part towards described substrate.
Described substrate contact partly has the rotatable drum structure, and is pressing described substrate when rotating with another Surface Contact of described substrate.
Described substrate contact partly has double-roller structure, and wherein said double-roller structure has with the predetermined central area that is spaced apart, and the core of scribe head is disposed in the described central area, and is corresponding with described central area.
Described reverse head comprises that further pressure regulating part divides, described pressure regulating part divides between substrate contact part and pressing part, and regulates the pressure that is applied to the substrate contact part by absorption pressure when pressing part partly applies predetermined pressure to substrate contact.
Described pressure regulating part divides and comprises: cylinder, and it assigns to partly exert pressure to substrate contact by pressing described press section; And load cell, it measures press section branch applied pressure.
Described reverse head further comprises retainer, the moving range of described retainer restriction substrate contact part on above-below direction.
In the described upper and lower division module each includes: stitch marker, and it forms at described substrate and cuts line; With press support section, it forms and to press in the step and another surface of support substrates cutting line, and wherein said stitch marker and the described support section of pressing be by additional driving arrangement operation, and towards equidirectional.
Described stitch marker is positioned at the center, and the described support section of pressing is symmetrical in the both sides of described stitch marker, in order to press and support near the both sides that are formed with the described position of cutting line.
Described stitch marker is configured to than the described support section of pressing relatively more near described substrate.
The described support section of pressing has the rotatable drum structure, and is pressing described substrate when rotating with another Surface Contact of described substrate.
The described support section of pressing has double-roller structure, and described double-roller structure has with the predetermined central area that is spaced apart, and the core of described stitch marker is disposed in the described central area, and is corresponding with described central area.
Described configuration module comprises: the top configuration module, and described top division module is disposed at wherein with predetermined being spaced apart; With the bottom configuration module, described bottom division module is disposed at wherein with predetermined being spaced apart.
Described multi braking system further comprises division module mobile unit, and described division module mobile unit moves described upper and lower division module with horizontal direction on configuration module.
Described multi braking system further comprises registration unit, and described registration unit registration is loaded into the position of the substrate on the workbench top.
Described multi braking system further comprises camera model, and described camera model acquisition is loaded into the information of the position of the substrate on the workbench, and described information is offered described registration unit.
According to a further aspect in the invention, a kind of scoring equipment comprises: scribe head, and it forms the predetermined line of cutting at substrate surface; Reverse head, it is positioned at a side opposite with scribe head with respect to substrate, and presses described substrate, and described reverse head further comprises: the substrate contact part, it contacts another surface of described substrate; Pressing part, it promotes and presses described substrate contact part towards described substrate; And pressure regulating part divides, described pressure regulating part divides between described substrate contact part and described pressing part, and when described pressing part partly applies predetermined pressure to described substrate contact, regulate the described pressure that is applied to described substrate contact part by absorption pressure; With move horizontally part, it makes scribe head and oppositely head is mobile in the horizontal direction.
Described scoring equipment further comprises the coupling part that connects scribe head and reverse head, wherein saidly move horizontally partial coupling to described coupling part and make described coupling part mobile in the horizontal direction, thereby make scribe head and oppositely head is mobile in the horizontal direction.
Described substrate contact partly has the rotatable drum structure, and is pressing described substrate when rotating with another Surface Contact of substrate.
Described substrate contact partly has double-roller structure, and described double-roller structure has with the predetermined central area that is spaced apart, and the core of described scribe head is disposed in the described central area, and is corresponding with described central area.
Described pressure regulating part divides and comprises: cylinder, and it assigns to partly exert pressure to substrate contact by pressing described press section; And load cell, it measures press section branch applied pressure.
Described reverse head further comprises retainer, the moving range of described retainer restriction substrate contact part on above-below direction.
According to another aspect of the invention, a kind of scribble method comprises: substrate (carry out form the line work of cutting line at described substrate place) is loaded on the workbench; Scribe head is reached reverse the line operating position that moves on the substrate surface that is positioned at the opposite side of described substrate with respect to described scribe head; Use predetermined pressing component, under predetermined pressure, press another surface corresponding to the substrate of described line operating position; Move scribe head and reverse head and carry out line work with identical speed in fact in the same direction.
Carry out simultaneously the movement of scribe head and pressing another lip-deep position of substrate.
In the moving process of scribe head and reverse head, pressing component is pressed the left and right sides of another corresponding position, lip-deep position of the substrate of scribe head bump, and carry out simultaneously at described substrate and form the line work of cutting line, with along the division work of cutting line division substrate.
Description of drawings
By describing the preferred embodiments of the present invention in detail referring to accompanying drawing, will be easier to understand above-mentioned and further feature and advantage of the present invention, in the accompanying drawing:
Fig. 1 is the figure of the conventional splitting system of explanation.
Fig. 2 is the plane of the substrate of Fig. 1.
Fig. 3 is the flow chart of the splitting system of key-drawing 1.
Fig. 4 is that explanation is according to the figure of the multi braking system of the embodiment of the invention.
Fig. 5 is the front view of the workbench in the multi braking system of Fig. 4.
Fig. 6 is the reduced graph of the multi braking system of Fig. 4.
Fig. 7 is the figure of the structure of the division module in the multi braking system of exploded view 4.
Fig. 8 is the enlarged drawing of the major part of Fig. 7.
Fig. 9 A to Fig. 9 C is the figure that shows the step of division substrate.
Figure 10 illustrates the according to another embodiment of the present invention figure of multi braking system.
Figure 11 is the enlarged drawing of the major part of Figure 10.
Figure 12 is the flow chart of explaining according to the scribble method of the embodiment of the invention.
The specific embodiment
In order to obtain to the present invention, its advantage with by implementing fully understanding of target that the present invention realizes, referring to the accompanying drawing of explanation the preferred embodiments of the present invention.
Hereinafter, will describe the present invention in detail by explain the preferred embodiments of the present invention referring to accompanying drawing.Same reference numerals represents similar elements in the accompanying drawing.
In below describing, think that substrate comprises semiconductor, comprise the flat-panel monitor of liquid crystal display (LCD), plasma display device (PDP) and Organic Light Emitting Diode (OLED), or plate glass and acrylic plate.
Fig. 4 is that explanation is according to the figure of the multi braking system of the embodiment of the invention.Fig. 5 is the front view of the workbench in the multi braking system of Fig. 4.Fig. 6 is the reduced graph of the multi braking system of Fig. 4.Fig. 7 is the figure of the structure of the division module in the multi braking system of exploded view 4.Fig. 8 is the enlarged drawing of the major part of Fig. 7.Fig. 9 A to Fig. 9 C is the figure that shows the step of division substrate.
Referring to Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8 and Fig. 9 A to Fig. 9 C, but mainly referring to Fig. 4, comprise according to the multi braking system of the embodiment of the invention: workbench 300, the substrate G that its loading remains to be divided; A plurality of division module B, it is on the upper surface and lower surface that are loaded into the substrate G on the workbench 300, and each forms predetermined cutting line S and divide substrate G; Configuration module 400, it is with predetermined separation spacing configuration division module B; With move horizontally module 500, its make configuration module 400 along cut the line S move.
Workbench 300 is the parts that are mounted with substrate G.Thereby substrate G is loaded on the upper surface of workbench 300 position of substrate G is fixed.Cut line S when forming at substrate G, and when cutting line S substrate G is carried out division, substrate G can not be at random mobile on the upper surface of workbench 300.When the position movement of substrate G, the linear forms that not only are difficult to expect form at substrate G cuts line S, and is difficult to accurately divide substrate G.Therefore, in case be loaded on the workbench 300, substrate G must be fixed thereon.
For reaching this purpose, such as among Fig. 5 displaying, workbench 300 comprises a plurality of support sections 310, be formed at division module mobile route 320 between indivedual support sections 310, be provided in a plurality of standing parts 330 of each support section 310, and the frame 340 that is coupled with it of support section 310.
The division module mobile route 320 that is formed between the support section 310 is the spaces that are formed between the support section 310.Such as after a while description, in the present embodiment, cut line S owing to not only on the upper surface of substrate G but also at its lower surface, forming, so division module B can approach or retreat with respect to the upper surface that is loaded into the substrate G on the workbench 300 and lower surface.Therefore division module B, in the present embodiment, formed division module mobile route 320, so that can cut line S forming near upper surface and the lower surface of substrate G and when moving horizontally and pressing substrate G.Division module mobile route 320 has is enough to size that division module B can be passed.
Standing part 330 is formed on the support section 310 in order to fix the substrate G that is loaded on the support section 310 by the lower surface that holds substrate G.That is to say, standing part 330 stationary substrate G are not in order to allow the position movement of substrate G during the process that substrate G is split into desired size.
In the present embodiment, standing part 330 is a plurality of vacuum suckers, and it uses pull of vacuum to fix substrate G.Vacuum sucker 330 penetrates support section 310 at the thickness direction of support section 310, and is formed uniformly along the longitudinal direction of support section 310.Although do not show in the accompanying drawing, the tube connector (not shown) that is connected to external vacuum pump (not shown) is coupled to vacuum sucker 330.Therefore, pass vacuum sucker 330 along with the suction by vavuum pump absorbs extraneous air, can hold and stationary substrate G.
Further provide the registration unit (not shown) that registration is loaded into the position of the substrate G on the workbench 300 at workbench 300.Position, the position that is loaded into the substrate G on the workbench 300 and the registration state of registration unit control workbench 300.
Manually or use additional mechanical arm (robot) automatically substrate G to be loaded on the workbench 300 in the present embodiment.Yet, when substrate G is unkitted when being stated from the tram, can't carry out accurate splitting operation.In the case, change substrate G the position in case registration in accurate division position.By change the position of substrate G with registration unit.Therefore, registration unit has on X and Y-direction travelling table 300 and makes the structure of workbench 300 rotations.
Division module B cuts line S in upper surface and the lower surface formation of substrate G, and divides substrate G by pressing substrate along line S.In an embodiment, as shown in Figure 6, division module B comprises top division module B1 and bottom division module B2.
Top division module B1 cuts line S so that division substrate G in the upper surface formation of substrate G.Bottom division module B2 cuts line S so that division substrate G in the lower surface formation of substrate G.Move horizontally module 500 and make in the horizontal direction (that is, on the direction of cutting line S) movement of upper and lower division module B1 and B2.When being moved horizontally module 500 and moving, upper and lower division module B1 is the horizontal movement path process that is configured to along identical with B2.
Therefore, owing to forming and division is formed at simultaneously and cuts line S on the upper surface of substrate G and the lower surface according to the multi braking system 1000 of the present embodiment, so not only can obtain very good division surface, and can greatly shorten working hours, therefore significantly shorten the time of sowing (tact time).
As shown in Figure 7, each among upper and lower division module B1 and the B2 all comprises scribe head 100 and reverse 200.Scribe head 100 200 is connected by coupling part (not shown) with being connected, and carries out division when moving horizontally when the coupling part is moved horizontally part (not shown), and is described below.
Generation of vibration part 110 produces predetermined vibration force with vibration cutter 122.Generation of vibration part 110 comprises actuator 112, actuator carriage 114, lower actuator plate 116 and upper actuator plate 118.The electric power that applies vibrates voluntarily actuator 112 and vibration force is provided.In the present embodiment, actuator 112 is the parallel stress actuators that are subjected in advance.
Can further provide lining (not shown) at the part place of actuator carriage 114 engagement shafts 130.Described lining is the linear movement of leading axle 130 not only, and prevents from damaging axle 130 owing to the corresponding raising of the linearity (straightness) of the friction that produces and cutter 122 during the linear reciprocal movement of axle 130.Therefore, lining is preferably formed by the material that shows than high resistance frictional force.In the present embodiment, use the linear metal lining as lining.
Although do not show in the accompanying drawing, generation of vibration part 110 can further comprise the actuator cooling segment, raises in order to prevent the temperature of actuator 112 in the process of actuator 112 vibrations.Only the part place configuration actuator cooling segment that applies the electrode of electric power to actuator 112 is being installed, just simplied system structure advantageously.The actuator cooling segment can further comprise the regulon (not shown) that offers the amount of the pressure of actuator cooling segment or cooling agent for adjusting.
In the present embodiment, cutter 122 is configured to slightly to depart from the center line of cutter handle 124.When 124 rotation of cutter handle, cutter 122 moves at the center line summary rear of cutter handle 124 along the path that the center line with cutter handle 124 conforms to.Therefore, the linearity of cutting line S that is formed by cutter 122 is improved.And, in the present embodiment, can further provide fixed support (not shown), its cutter 122 that will be coupled to cutter handle 124 is fixed, and makes it can not break away from cutter handle 124.
Cutter handle 124 can carry out pivot and rotate under the state that is coupled to axle 130.As mentioned above, this is in order to allow cutter 122 when moving horizontally, by the deviation structure of cutter 122 all the time along the path movement identical with the center line of cutter handle 124.Simultaneously, when cutter handle 124 rotating 360 degrees, owing to being difficult to the motion of cutter 122 is controlled, so need to carrying out pivot in predetermined angle, cutter handle 124 rotates.In the present embodiment, the predetermined portions of the side of excision axle 130 1 ends is to form excision recess (not shown).In the part corresponding to described excision recess of the sidewall of cutter handle 124, form through hole (not shown) at thickness direction.Wedge (not shown) is embedded in the through hole and is fixed in wherein, thereby makes wedge one end in contact excision recess.Wedge one end is treated and have a curved surface, thereby so that cutter handle 124 can carry out pivot in predetermined angle rotate.
Therefore, need to improve by the height of regulating cutter part 120 along the uneven surface of substrate G the upper formed linearity of cutting line S of substrate G.Therefore, in the present embodiment, provide height adjusting unit 140, it detects the unevenness of substrate G, and reflects in real time detected unevenness, in order to regulate the height of cutter part 120.Height adjusting unit 140 can be load cell, its extended length when the weighing load that it is applied is not more than predetermined value, and when the weighing load that it is applied is not less than predetermined value its Length Contraction.
Up/down movable part 170 is coupled to mainboard 160 and drives mainboard 160 in the up/down direction.Up/down movable part 170 comprises at the bottom of the side group 172, be provided in motor 174, ball screw 176 on the mainboard 160 and removable 178.
Although show in the accompanying drawing, up/down movable part 170 further comprises guiding linear block and the linear guide device of the linear movement of mainboard 160.Linear block is coupled to mainboard 160 and guides the linear movement of mainboard 160.The linear guide device is coupled to linear block and guides the direction of motion of linear block.
Referring to Fig. 7 and Fig. 8, reverse 200 is configured in a side opposite with scribe head 100 with respect to substrate G, and scribe head 100 form cut line S in another surface (lower surface) of support substrates G.That is to say, when scribe head 100 moves in the horizontal direction and line S is cut in formation continuously on substrate G surface, reverse 200 with scribe head 100 lower surface of mobile and support substrates G in the horizontal direction side by side, in order to form the constant line S that cuts by apply identical power to substrate G.
Comprise substrate contact part 210 and pressing part 220 for reverse 200.Substrate G is also pressed in another surface of substrate contact part 210 contact substrate G.In the present embodiment, substrate contact part 210 has the rotatable drum structure, rotates with another Surface Contact of substrate G and presses substrate G at described structure intermediate roll 212.In particular, in the present embodiment, as shown in Figure 8, substrate contact part 210 has double-roller structure, and when two cylinders 212 during with predetermined being spaced apart, described double-roller structure has central area 214.Central area 214 is positioned at the position corresponding with the cutter 122 of scribe head 100.Therefore, the part that cutter 122 is pressed in fact and can't help cylinder 212 and support, and the adjacent central area 214 of the part of pressing with cylinder 212 is pressed by cutter 122.
Pressing part 220 is pressed substrate contact part 210 by pressing substrate contact part 210 towards substrate G.Pressing part 220 is coupled to the other end of substrate contact part 210, and promotes substrate contact part 210 towards substrate G.Substrate contact part 210 and pressing part 220 are coupled to single guide plate 230, match each other thereby its center line is maintained in.Substrate contact part 210 can be guaranteed accurate linear movement by coupling and with guide plate 230, linear guide device and linear block.
Further comprise that pressure regulating part divides 240 for reverse 200, pressure regulating part divides 240 to be provided between substrate contact part 210 and the pressing part 220, and absorbs described power when pressing part 220 when substrate contact part 210 applies power above scheduled volume.
Owing to treating that thickness by the substrate G of splitting system according to the present invention 1000 divisions is very thin and hardness is very low, so when applying excessive power, substrate G may damage.Therefore, pressure regulating part divides 240 controls to be applied to the pressure of substrate G, makes it be no more than predefined level.In addition, pressure regulating part divides 240 to make the pressure that is applied to substrate G constant all the time, thereby can form the unified S that rules that cuts.In the present embodiment, use load cell to divide 240 as pressure regulating part.
Further comprise retainer 250 for reverse 200, it defines the mobile upper limit and the mobile lower limit of substrate contact part 210.Retainer 250 prevents that substrate contact part 210 from moving and crooked or breaking-up substrate G towards substrate egregiously.Retainer 250 is configured in around the substrate contact part 210.
Although show in the accompanying drawing, the coupling part connect scribe head 100 with reverse 200.In the present embodiment, scribe head 100 and reverse 200 are connected to each other and are mobile together simultaneously.Therefore, reverse 200 part of directly pressing substrate G, wherein scribe head 100 forms at described part place and cuts line S.
Moving horizontally part makes scribe head 100 and reverse 200 mobile in the horizontal direction.In the present embodiment and since the coupling part connect scribe head 100 with reverse 200, so the preferred levels movable part is coupled to the coupling part, so that mobile link part flatly.When moving horizontally part of horizontal ground mobile link part, scribe head 100 can move with identical speed in the same direction with reverse 200.
Among upper and lower division module B1 and the B2 each all comprises above-mentioned scribe head 100 and reverse 200.Yet scribe head 100 and reverse 's 200 configuration differs from one another.That is to say, as shown in Figure 6, in top division module B1, upside place and reverse 200a that scribe head 100a is configured in substrate G are configured in the downside place, and in bottom division module B2, downside place and reverse 200b that scribe head 100b is configured in substrate G are configured in the upside place.
Referring to Fig. 4, configuration module 400 comprises a plurality of division module B with constant arranged spaced again.Division module B is configured and can moves at configuration module 400.For reference, number and the size of division module B change according to needed design.The installation interval of division module B can be regulated, thus regulating allocation module 400 correspondingly.
Although do not show in the accompanying drawing, configuration module 400 comprises the top configuration module, and the bottom configuration module.In the configuration module of top, top division module B1 is with the predetermined space configured separate.In the configuration module of bottom, bottom division module B2 is with the predetermined space configured separate.And, because division module B can move horizontally at configuration module 400, so preferably further provide the module mobile unit (not shown) that each division module B is moved with horizontal direction on each in upper and lower division module B1 and B2 on configuration module 400.
Move horizontally module 500 make configuration module 400 with the direction of the configuration perpendicular direction of division module B on (that is, on the direction of cutting line S) move horizontally.In the present embodiment, after top division module B1 and bottom division module B2 are coupled to configuration module 400, move horizontally module 500 and make configuration module 400 mobile in the horizontal direction.Therefore, the division module B that is coupled to configuration module 400 has identical in fact speed and can move in the same direction.
In addition, according to the multi braking system 1000 of the present embodiment, further comprise camera model 600 as shown in Figure 4.Camera model 600 is accurately measured the position that is loaded into the substrate G on the workbench 300, and will be provided to registration unit about the information of position.That is to say, when substrate G was set, camera model 600 was taken the mark on the precalculated position of substrate G, and judged the position of substrate G based on captured mark.This information is offered registration unit, thereby can accurately be regulated by registration unit the position of substrate G.
In the operation of the multi braking system 1000 of configuration, at first, setting workbench 300 and the position that divides module B based on required size and the division specification of substrate G as mentioned above.Regulate interval between the support section 310 that is provided on the workbench 300 based on the specification of substrate G and division specification.Also regulate the interval of division module B.
Then, shown in Fig. 9 A, substrate G is positioned on the workbench 300.Camera model 600 usefulness previous on the specific part of substrate G indicated mark check the position of substrate G.When the position of substrate G is inappropriate, use registration unit that substrate G is moved to accurate position.
In the present embodiment, because the upper and lower divides module B1 and B2 is configured on the fore-and-aft direction in parallel with each other, so substrate G is positioned to separate predetermined distance with frame 340.Described separating distance through setting so that division module B can enter.
Then, shown in Fig. 9 B, will divide module B and move to the starting position, for dividing and then setting.That is to say, division module B is moved to for the position before the starting position of division substrate G, and set to maintain the At The Height that division module B can contact the both sides of substrate G.When having set division module B fully, shown in Fig. 9 C, operant level mobile module 500 flatly moves division module B, and carries out division.
Describe aforesaid operations in detail referring to Figure 12.At first, substrate G is loaded into (S110) on the workbench 300.Proofread and correct the position of substrate G, thereby substrate G is moved to accurate position (S120).The position of substrate G is the relative position with respect to the scribe head 100 of showing among Fig. 7 and reverse 200.Therefore, can by when substrate G is fixed to workbench 300 on workbench 300 moving substrate G or travelling table 300 itself regulate the position of substrate G.
Then, scribe head 100 is moved to the line starting position to carry out scribe head and set step (S130) thus prepare as line/division work.In this step, after scribe head 100 being moved to the line starting position, reduce the height of scribe head 100 so that the surface of contact substrate G.
Then, move to the position corresponding with the starting position of ruling (S140) with reverse 200.In this step, after moving to the position corresponding with the position that is set with scribe head 100, the apparent surface's on the line surface of pressing substrate G for reverse 200 the part corresponding to the line starting position.Preferably, not a single point of pressing corresponding to the line starting point, but press two points that are positioned at corresponding to the both sides place of the point of line starting point.Therefore, advantageously reduce to be applied to the load of substrate G, and carry out simultaneously division by pressing the both sides that are formed with the substrate G that cuts line S.During this period, can while execution in step S130 and 140.
Then, in mobile scribe head 100 and reverse 200, carry out line and division (S150).In this step, when scribe head 100 when reverse 200 is moved with identical speed in the same direction, side by side carry out the formation of cutting line S and along cutting the division of line S to substrate G.
According to the present embodiment, owing to can in individual equipment, carry out simultaneously the formation of cutting line S and the division of cutting line S, thus can shorten the processing time, and because the designs simplification of equipment, so can reduce working space.And, can substrate G be split into a plurality of monolithics by single treatment.In addition, can form the S that rules that cuts with unified degree of depth at substrate G.
Figure 10 illustrates the according to another embodiment of the present invention figure of multi braking system.Figure 11 is the enlarged drawing of the major part of Figure 10.As shown in Figure 10 and Figure 11, multi braking system 2000 has structure and the shape identical with above-mentioned multi braking system 1000 according to another embodiment of the present invention.Yet top division module 2100 and bottom division module 2200 are different from the upper and lower division module of above-mentioned multi braking system 1000.Therefore, no longer repeat the description for other element, and only describe top division module 2100 and bottom division module 2200 herein.
In the present embodiment, top division module 2100 and bottom division module 2200 comprise and are configured and towards the stitch marker 2110 and 2210 of equidirectional, and press support section 2120 and 2220. Stitch marker 2110 and 2210 is to form at substrate G to cut line S, and to press support wheel 2120 and 2220 be to press during line forms step and another surface of support substrates G cutting.
In the present embodiment, because stitch marker 2110 and 2210 and press support section 2120 and 2220 the configuration in the same direction, so stitch marker 2110 and 2210 is provided in the center, and press the both sides that support section 2120 and 2220 is provided in stitch marker 2110 and 2210 symmetrically.Therefore, press support section 2120 and 2220 press and support by stitch marker 2110 and 2210 form cut the line S the both sides, position.
In the present embodiment, stitch marker 2110 and 2210 and press support section 2120 and 2220 and operated in the up/down direction by additional driving arrangement preferably.Stitch marker 2110 and 2210 forms at substrate G and cuts line S, forms support substrates G in the step with pressing support section 2120 and 2220 cutting line, needs different power and different working depths.Preferably, stitch marker 2110 and 2210 and press support section 2120 and operate separately and be independently controlled by different driving arrangements with 2220, rather than simultaneously operation.
In particular, because stitch marker 2110 and 2210 is to form by the upper surface that penetrates substrate G to cut line S, so preferably stitch marker 2110 and 2210 is configured to further outstanding towards substrate G.That is to say, when press support section 2120 with 2220 by the surface that contacts substrate G during support substrates G, because stitch marker 2110 and 2210 need to be by forming groove at substrate G in the substrate G surface of further advancing by leaps and bounds, so stitch marker 2110 and 2210 is configured to than pressing support section 2120 and 2220 more near substrate G.
Although referring to the preferred embodiments of the present invention particular display and described the present invention, but be understood by those skilled in the art that, can carry out various variations on form and the details to it under the prerequisite without departing from the spirit and scope of the present invention, wherein the spirit and scope of the present invention are limited by the accompanying claims.
As mentioned above, according to the present invention, owing to can in individual equipment, carry out simultaneously the formation of cutting line S and the division of cutting line S, thus can shorten the processing time, and because the designs simplification of equipment, so can reduce working space.And, can substrate G be split into a plurality of monolithics by single treatment.
Claims (9)
1. scoring equipment is characterized in that it comprises:
Scribe head, it forms the predetermined line of cutting at substrate surface;
Reverse head, it is positioned at a side opposite with described scribe head with respect to described substrate, and presses described substrate, and described reverse head further comprises: the substrate contact part, it contacts another surface of described substrate; Pressing part, it promotes and presses described substrate contact part towards described substrate; And pressure regulating part divides, described pressure regulating part divides between described substrate contact part and described pressing part, and when described pressing part partly applies predetermined pressure to described substrate contact, regulate the described pressure that is applied to described substrate contact part by absorption pressure; With
Move horizontally part, it moves described scribe head and described reverse head in the horizontal direction.
2. scoring equipment according to claim 1, it is characterized in that it further comprises the coupling part, described coupling part connects described scribe head and described reverse head, wherein saidly move horizontally partial coupling to described coupling part and make described coupling part mobile in the horizontal direction, thereby make described scribe head and described reverse head mobile in described horizontal direction.
3. scoring equipment according to claim 1 is characterized in that wherein said substrate contact partly has the rotatable drum structure, and is pressing described substrate when rotating with described another Surface Contact of described substrate.
4. scoring equipment according to claim 3, it is characterized in that wherein said substrate contact partly has double-roller structure, described double-roller structure has with the predetermined central area that is spaced apart, and the core of described scribe head is disposed in the described central area, and is corresponding with described central area.
5. scoring equipment according to claim 1 is characterized in that wherein said pressure regulating part divides to comprise:
Cylinder, it assigns to partly exert pressure to described substrate contact by pressing described press section; With
Load cell, it measures the described pressure that described pressing part applies.
6. scoring equipment according to claim 1 is characterized in that wherein said reverse head comprises that further retainer, described retainer limit described substrate contact part in the moving range of above-below direction.
7. scribble method is characterized in that it comprises:
Substrate is loaded on the workbench, wherein will carries out at described substrate place forming the line work of cutting line;
Scribe head is reached reverse the lip-deep line operating position that moves to described substrate that is positioned at the opposite side of described substrate with respect to described scribe head;
Use predetermined pressing component, under predetermined pressure, press another surface corresponding to the described substrate of described line operating position; With
Move described scribe head and described reverse head and carry out described line work with identical speed in fact in the same direction.
8. method according to claim 7 is characterized in that wherein carrying out simultaneously the movement of described scribe head and pressing described another lip-deep described position of described substrate.
9. method according to claim 7, it is characterized in that wherein in the moving process of described scribe head and described reverse head, described pressing component is pressed the left and right sides with respect to another corresponding position, lip-deep position of the described substrate of described scribe head bump, and carry out simultaneously at described substrate and form described described line work of cutting line, with along described division work of cutting the described substrate of line division.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2005-0065816 | 2005-07-20 | ||
| KR1020050065812A KR100681828B1 (en) | 2005-07-20 | 2005-07-20 | Multi braking system |
| KR1020050065816A KR100674017B1 (en) | 2005-07-20 | 2005-07-20 | Apparatus for scribing |
| KR10-2005-0065812 | 2005-07-20 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101033169A Division CN1974167B (en) | 2005-07-20 | 2006-07-18 | Multi split system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101695854A CN101695854A (en) | 2010-04-21 |
| CN101695854B true CN101695854B (en) | 2013-03-06 |
Family
ID=42140998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910206631 Expired - Fee Related CN101695854B (en) | 2005-07-20 | 2006-07-18 | Scoring device and scoring method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101695854B (en) |
| TW (1) | TWI326274B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024000332A1 (en) * | 2022-06-29 | 2024-01-04 | 超能高新材料股份有限公司 | Plate cut-off machine capable of synchronously cutting off and detecting strength of plate, and cut-off method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5785225A (en) * | 1991-12-06 | 1998-07-28 | Loomis Industries, Inc. | Frangible semiconductor wafer dicing apparatus which employs scribing and breaking |
| CN1192043A (en) * | 1997-02-28 | 1998-09-02 | 惠普公司 | Improved scribe and break of hard-to-scribe materials |
| JP2001235733A (en) * | 2000-02-22 | 2001-08-31 | Matsushita Electric Ind Co Ltd | Method for cutting liquid crystal display panel |
| KR20050019815A (en) * | 2002-07-02 | 2005-03-03 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Pasted base board cutting system and base board cutting method |
| JP2005132685A (en) * | 2003-10-31 | 2005-05-26 | Kawaguchiko Seimitsu Co Ltd | Automatic glass scriber |
-
2006
- 2006-07-10 TW TW95125018A patent/TWI326274B/en not_active IP Right Cessation
- 2006-07-18 CN CN 200910206631 patent/CN101695854B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5785225A (en) * | 1991-12-06 | 1998-07-28 | Loomis Industries, Inc. | Frangible semiconductor wafer dicing apparatus which employs scribing and breaking |
| CN1192043A (en) * | 1997-02-28 | 1998-09-02 | 惠普公司 | Improved scribe and break of hard-to-scribe materials |
| JP2001235733A (en) * | 2000-02-22 | 2001-08-31 | Matsushita Electric Ind Co Ltd | Method for cutting liquid crystal display panel |
| KR20050019815A (en) * | 2002-07-02 | 2005-03-03 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Pasted base board cutting system and base board cutting method |
| JP2005132685A (en) * | 2003-10-31 | 2005-05-26 | Kawaguchiko Seimitsu Co Ltd | Automatic glass scriber |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200706506A (en) | 2007-02-16 |
| CN101695854A (en) | 2010-04-21 |
| TWI326274B (en) | 2010-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1974167B (en) | Multi split system | |
| CN101525211B (en) | Marking apparatus and apparatus and method for cutting substrate by same | |
| CN101952213B (en) | Processing machine of plate glass | |
| KR100889308B1 (en) | Scribing apparatus and method, apparatus for cutting substrate using the scribing apparatus | |
| CN101695854B (en) | Scoring device and scoring method | |
| KR20130014835A (en) | A breaking apparatus using breaking bar | |
| KR101770569B1 (en) | Automatic transferring device for moter shaft | |
| CN1772434A (en) | Substrate positioning device | |
| KR102067987B1 (en) | Apparatus for cutting substrate | |
| KR101349740B1 (en) | Apparatus for painting chassis for display device | |
| JPH1190900A (en) | Liquid crystal display panel dividing method and device | |
| CN108724352A (en) | A kind of multiple rows of multidirectional borehole drill construction of plank | |
| CN112692417B (en) | Spot welding equipment for copper sheet and copper net of vapor chamber | |
| KR20090089925A (en) | The feed table supporting structure for press | |
| CN101063763A (en) | System and method for removing blank glass from panel | |
| KR101279674B1 (en) | Glass scriber | |
| KR20210034167A (en) | Dummy removing unit | |
| KR102003229B1 (en) | A laser etching machine combined with drilling | |
| CN106252051B (en) | A kind of inductance adhering device | |
| KR20130091673A (en) | Scribing apparatus | |
| KR100905898B1 (en) | Scribing apparatus, apparatus and method for cutting substrate using the same | |
| CN108218214A (en) | Substrate holding unit and the scribing equipment with the substrate holding unit | |
| JP2003221252A (en) | Method for making groove for cutting on mother glass substrate and its device | |
| KR102103216B1 (en) | Apparatus for processing glass using laser | |
| KR101822842B1 (en) | A breaking apparatus using breaking bar |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130306 Termination date: 20170718 |