CN101695797A - Spot coating type high-temperature tin alloy soldering paste and preparation method thereof - Google Patents
Spot coating type high-temperature tin alloy soldering paste and preparation method thereof Download PDFInfo
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- CN101695797A CN101695797A CN200910193227A CN200910193227A CN101695797A CN 101695797 A CN101695797 A CN 101695797A CN 200910193227 A CN200910193227 A CN 200910193227A CN 200910193227 A CN200910193227 A CN 200910193227A CN 101695797 A CN101695797 A CN 101695797A
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Abstract
The invention relates to the technical field of soldering paste, in particular to high-temperature tin alloy soldering paste for spot coating operation and a preparation method thereof. The soldering paste consists of a soldering flux and Sn/Pb/Ag tin-based alloy powder distributed in the soldering flux, wherein the soldering flux comprises 25 to 45 percent of polymerized rosin, 8 to 20 percent of hydrogenated rosin, 2 to 4 percent of modified hydrogenated castor oil, 2 to 4 percent of hydrogenated castor oil wax, 3 to 5 percent of activator, 1 to 2 percent of hydroquinone, 1 to 2 percent of ethylene bis stearamide and a solvent. A stearic acid dispersant is added into the soldering paste; the syringe type package is adopted; the soldering paste is packaged in a syringe through processes such as bubble removal by vacuum pumping and the like; and the soldering paste adopts air pressure extrusion spot coating operation. The soldering paste has the advantages of having steady performance, uniform spot coating and good welding performance, improving expansion rate and insulation resistance value, having no sintering and having easy cleaning particularly for a residue obtained after the reflow soldering at a high temperature of more than 340 DEG C.
Description
Technical field
The present invention relates to technical field of soldering paste, particularly relate to a kind of high-temperature tin alloy soldering paste that is used for the point coating type operation and preparation method thereof.
Background technology
High-temperature tin alloy soldering paste refers generally to the solder(ing) paste of Sn5/Pb92.5/Ag2.5 alloy, it is mainly used in the semiconductor packages welding of power tube, controllable silicon, rectifier etc., and the components and parts welding under high temperature welding procedure such as multilayer circuit board and the hot operation etc.Spot coating type high-temperature gold alloy solder tin cream requires the welding temperature height, goes out tin than great, air pressure extruding spot printing than the tin cream of other alloys, and existing tin cream is when at high temperature welding, occurring the solder joint the inside easily has the phenomenon of cavity, residue blackening, when storing, be easy to occur the problem of layering, tomography, and the phenomenon that glass putty separates with weld-aiding cream can occur.
Summary of the invention
One of purpose of the present invention is, for the shortcoming and deficiency that overcomes above-mentioned prior art, and provide a kind of stable performance, the uniform spot coating type high-temperature tin alloy soldering paste of spot printing, the easy cleaning thereby welding back residue is few can guarantee residue not sintering, easy cleaning after high temperature reflow more than 340 ℃.
Two of purpose of the present invention is, the preparation method of this solder(ing) paste also is provided.
The objective of the invention is to realize by following technical proposal:
A kind of spot coating type high-temperature tin alloy soldering paste, it is made up of scaling powder and kamash alloy powder, and described scaling powder is made up of following weight percentages:
Newtrex 25%～45%
Foral 5%～20%
Modified hydrogenated castor oil 2%～4%
Rilanit special wax 2%～4%
Activating agent 3%～5%
Hydroquinones 1%～2%
Ethylene bis stearic acid amide 1%～2%
Organic solvent is a surplus.
Wherein, described activating agent is the combination of a kind of and cyclohexylamine hydrochloride in glutaric acid, succinic anhydride or the phthalic anhydride.
Described organic solvent is one or both combination of terpinol, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, glycol hexyl ether or diglycidyl ether.
Described kamash alloy powder is a Sn5/Pb92.5/Ag2.5 high temperature alloy powder.
Described scaling powder and ashbury metal powder weight ratio are 13～10: 87～90.
The preparation method of above-described spot coating type high-temperature tin alloy soldering paste, preparation process is as follows:
A, the newtrex with above-mentioned amount, Foral and organic solvent place reactor to mix, and are heated with stirring to 145～155 ℃ dissolve;
B, add hydroquinones, modified hydrogenated castor oil, rilanit special wax and the ethylene bis stearic acid amide of above-mentioned amount in the reactor, add activating agent fully after the dissolving again;
Cool off after material in C, the question response still dissolves fully, obtain scaling powder in the time of cool to room temperature;
D, with scaling powder and kamash alloy powder according to 13～10: 87～90 part by weight mixes stirring in the vacuum dispersion machine, obtain the solder(ing) paste of this alloy after stirring.
Solder(ing) paste of the present invention is made up of scaling powder and kamash alloy powder, newtrex that scaling powder is selected for use and Foral are resin material, not only improved the adhesiveness of tin cream, protect and prevent the effect of postwelding PCB oxidation once again, and provide certain activity to remove the oxidation material of PCB metal film pad top layer and part welding position; It is that thixotropic agent plays the viscosity and the thixotropic property of regulating solder(ing) paste that the present invention selects modified hydrogenated castor oil and rilanit special wax for use, prevents from use to occur to trail, the effect of phenomenon such as adhesion; The effect that activating agent selects for use the combination of a kind of and cyclohexylamine hydrochloride in glutaric acid, succinic anhydride or the phthalic anhydride can not only better remove the oxidation material of PCB metal film pad top layer and part welding position has the effect that reduces metal surface tension simultaneously; Wherein ethylene bis stearic acid amide is a kind of dispersant with high efficiency, and adding the weld-aiding cream of phenomenon a certain amount of ethylene bis stearic acid amide separates with to(for) the layering that improves solder(ing) paste, tomography and glass putty has significantly and improve.
Owing to take technique scheme to make the technology of the present invention compared with the prior art have following advantage and effect:
A) it is even to go out tin, does not have big point during spot printing, and electrical property is good;
B) good stability does not have layering, thinning and ignore phenomenon when continuous spot printing;
C) rate of spread of raising solder(ing) paste has improved the insulation impedance value, has reduced the corrosivity of postwelding residue to base material, the service life of having improved solder(ing) paste;
D) temperature of this solder(ing) paste welding is lower, helps reducing the fire damage to electronic devices and components;
E) the few and easy cleaning of welding back residue can guarantee residue not sintering, easy cleaning after high temperature reflow more than 340 ℃.
Solder(ing) paste of the present invention can be widely used in the spot printing operation in the components and parts welding process under high temperature welding procedure, the hot operations such as the semiconductor packages welding, multilayer circuit board of power tube, controllable silicon, rectifier etc.
The specific embodiment
Embodiment 1
Scaling powder raw material: newtrex 25g, Foral 20g, modified hydrogenated castor oil 2g, rilanit special wax 4g, glutaric acid 2g, cyclohexylamine hydrochloride 1g, hydroquinones 1g, stearic acid dispersant 1g and terpinol 30g, diethylene glycol monobutyl ether 14g.
Preparation method: with the 25g newtrex, 20g Foral and 30g terpinol, after mixing, the 14g diethylene glycol monobutyl ether is heated with stirring to 145 ℃ dissolve, add the 1g hydroquinones then, the modified hydrogenated castor oil of 2g, 4g rilanit special wax and 1g ethylene bis stearic acid amide, add the 2g glutaric acid fully after the dissolving again, the 1g cyclohexylamine hydrochloride, after dissolving fully, cools off above material, obtain scaling powder in the time of cool to room temperature, get scaling powder 12g and in the vacuum dispersion machine, mix stirring, obtain the solder(ing) paste of this alloy after stirring with Sn5/Pb92.5/Ag2.5 soldering alloy powder 88g.
Embodiment 2
Scaling powder raw material: newtrex 30g, Foral 15g, modified hydrogenated castor oil 3g, rilanit special wax 3g, succinic anhydride 2g, cyclohexylamine hydrochloride 1g, hydroquinones 1.5g, stearic acid dispersant 2g and diethylene glycol monohexyl ether 20, diglycidyl ether 22.5g.
Preparation method: with the 30g newtrex, 15g Foral and 20g diethylene glycol monohexyl ether, 22.5g be heated with stirring to 150 ℃ dissolve after diglycidyl ether mixes, add the 1.5g hydroquinones then, the modified hydrogenated castor oil of 3g, 3g rilanit special wax and 1.5g ethylene bis stearic acid amide, add the 2g succinic anhydride fully after the dissolving again, the 1g cyclohexylamine hydrochloride, after dissolving fully, cools off above material, obtain scaling powder in the time of cool to room temperature, get scaling powder 11g and in the vacuum dispersion machine, mix stirring, obtain the solder(ing) paste of this alloy after stirring with Sn5/Pb92.5/Ag2.5 soldering alloy powder 89g.
Embodiment 3
Scaling powder raw material: newtrex 30g, Foral 15g, modified hydrogenated castor oil 4g, rilanit special wax 2g, glutaric acid 1g, cyclohexylamine hydrochloride 2g, hydroquinones 2g, stearic acid dispersant 2g and 42g terpinol.
Preparation method: with the 30g newtrex, after mixing, 15g Foral and 42g terpinol be heated with stirring to 150 ℃ dissolve, add the 2g hydroquinones then, the modified hydrogenated castor oil of 4g, 2g rilanit special wax and 2g ethylene bis stearic acid amide, add the 1g glutaric acid fully after the dissolving again, the 2g cyclohexylamine hydrochloride, after dissolving fully, cools off above material, obtain scaling powder in the time of cool to room temperature, get scaling powder 13g and in the vacuum dispersion machine, mix stirring, obtain the solder(ing) paste of this alloy after stirring with Sn5/Pb92.5/Ag2.5 soldering alloy powder 87g.
Embodiment 4
Scaling powder raw material: newtrex 30g, Foral 20g, modified hydrogenated castor oil 2g, rilanit special wax 3g, succinic anhydride 2g, cyclohexylamine hydrochloride 1g, hydroquinones 1g, stearic acid dispersant 2g and 38g diethylene glycol monohexyl ether.
Preparation method: with the 30g newtrex, after mixing, 20g Foral and 38g diethylene glycol monohexyl ether be heated with stirring to 155 ℃ dissolve, add the 1g hydroquinones then, the modified hydrogenated castor oil of 2g, 3g rilanit special wax and 2g ethylene bis stearic acid amide, add the 2g succinic anhydride fully after the dissolving again, the 2g cyclohexylamine hydrochloride, after dissolving fully, cools off above material, obtain scaling powder in the time of cool to room temperature, get scaling powder 12.5g and in the vacuum dispersion machine, mix stirring, obtain the solder(ing) paste of this alloy after stirring with Sn5/Pb92.5/Ag2.5 soldering alloy powder 87.5g.
Embodiment 5
Scaling powder raw material: newtrex 30g, Foral 20g, modified hydrogenated castor oil 3g, rilanit special wax 2g, phthalic anhydride 1g, cyclohexylamine hydrochloride 3g, hydroquinones 2g, stearic acid dispersant 1g and terpinol 38g.
Preparation method: with the 30g newtrex, after mixing, 20g Foral and 38g terpinol be heated with stirring to 150 ℃ dissolve, add the 2g hydroquinones then, the modified hydrogenated castor oil of 3g, 2g rilanit special wax and 1g ethylene bis stearic acid amide, add the 1g phthalic anhydride fully after the dissolving again, the 3g cyclohexylamine hydrochloride, after dissolving fully, cools off above material, obtain scaling powder in the time of cool to room temperature, get scaling powder 12g and in the vacuum dispersion machine, mix stirring, obtain the solder(ing) paste of this alloy after stirring with Sn5/Pb92.5/Ag2.5 soldering alloy powder 88g.
Embodiment 6
Scaling powder raw material: newtrex 35g, Foral 15g, modified hydrogenated castor oil 2g, rilanit special wax 3g, glutaric acid 2.5g, cyclohexylamine hydrochloride 2.5g, hydroquinones 1g, stearic acid dispersant 2g and diethylene glycol monobutyl ether 37g
Preparation method: with the 35g newtrex, after mixing, 15g Foral and 37g diethylene glycol monobutyl ether be heated with stirring to 150 ℃ dissolve, add the 1g hydroquinones then, the modified hydrogenated castor oil of 2g, 3g rilanit special wax and 2g ethylene bis stearic acid amide, add the 2.5g glutaric acid fully after the dissolving again, 2.5g cyclohexylamine hydrochloride, after dissolving fully, cools off above material, obtain scaling powder in the time of cool to room temperature, get scaling powder 11g and in the vacuum dispersion machine, mix stirring, obtain the solder(ing) paste of this alloy after stirring with Sn5/Pb92.5/Ag2.5 soldering alloy powder 89g.
Embodiment 7
Scaling powder raw material: newtrex 40g, Foral 10g, modified hydrogenated castor oil 3.5g, rilanit special wax 3.5g, phthalic anhydride 3g, cyclohexylamine hydrochloride 1g, hydroquinones 1.5g, stearic acid dispersant 1.5g and diethylene glycol monobutyl ether 18g, terpinol solvent 18g
Preparation method: with the 40g newtrex, 10g Foral and 18g diethylene glycol monobutyl ether, after mixing, the 18g terpinol is heated with stirring to 150 ℃ dissolve, add the 1.5g hydroquinones then, 3.5g modified hydrogenated castor oil, 3.5g rilanit special wax and 1.5g ethylene bis stearic acid amide, add the 3g phthalic anhydride fully after the dissolving again, the 1g cyclohexylamine hydrochloride, after dissolving fully, cools off above material, obtain scaling powder in the time of cool to room temperature, get scaling powder 11.5g and in the vacuum dispersion machine, mix stirring, obtain the solder(ing) paste of this alloy after stirring with Sn5/Pb92.5/Ag2.5 soldering alloy powder 88.5g.
Embodiment 8
Scaling powder raw material: newtrex 45g, Foral 5g, modified hydrogenated castor oil 3g, rilanit special wax 4g, phthalic anhydride 3g, cyclohexylamine hydrochloride 1g, hydroquinones 1.8g, stearic acid dispersant 1.5g and diethylene glycol monobutyl ether 15g, terpinol 20.7g
Preparation method: with the 45g newtrex, 5g Foral and 15g diethylene glycol monobutyl ether, 20.7g be heated with stirring to 150 ℃ dissolve after terpinol mixes, add the 1.8g hydroquinones then, the modified hydrogenated castor oil of 3g, 4g rilanit special wax and 1.5g ethylene bis stearic acid amide, add the 3g phthalic anhydride fully after the dissolving again, the 1g cyclohexylamine hydrochloride, after dissolving fully, cools off above material, obtain scaling powder in the time of cool to room temperature, get scaling powder 13g and in the vacuum dispersion machine, mix stirring, obtain the solder(ing) paste of this alloy after stirring with Sn5/Pb92.5/Ag2.5 soldering alloy powder 87g.
Comparison example 1
Get the 25g newtrex, 15g Foral, the modified hydrogenated castor oil of 2g, 4g rilanit special wax, the 2g glutaric acid, 1g cyclohexylamine hydrochloride, 30g terpinol, the 15g diethylene glycol monobutyl ether, the 1g antioxidant with the preparation method of above-mentioned organic materials by above-mentioned scaling powder, dissolves mixing of materials such as newtrex, Foral, organic solvent together, add antioxidant and thixotropic agent then, add activating agent fully after the dissolving again.Cool off after above material dissolves fully, add surfactant in the time of cool to room temperature again, continue cooling, obtain scaling powder.Scaling powder and Sn5/Pb92.5/Ag2.5 solder alloy powder are mixed stirring according to 12: 88 part by weight in the vacuum dispersion machine, obtain the solder(ing) paste of this alloy.
Comparison example 2
Get the 30g newtrex, the 15g Foral, the modified hydrogenated castor oil of 3g, 3g rilanit special wax, 3g succinic anhydride, the 20g diethylene glycol monobutyl ether, the 25g diglycidyl ether, the 1g antioxidant dissolves mixing of materials such as newtrex, Foral, organic solvent earlier together, add antioxidant and thixotropic agent then, add activating agent fully after the dissolving again.Cool off after above material dissolves fully, add surfactant in the time of cool to room temperature again, continue cooling, obtain scaling powder.Scaling powder and Sn5/Pb92.5/Ag2.5 solder alloy powder are mixed stirring according to 11: 89 part by weight in the vacuum dispersion machine, obtain the solder(ing) paste of this alloy.
Embodiment product and existing procucts performance comparison the results are shown in Table 1
Table 1 embodiment product and existing procucts performance comparison result
As can be seen from Table 1, the solder(ing) paste that adds the ethylene bis stearic acid amide dispersant in every respect performance all be better than not adding stearic acid dispersant solder(ing) paste.
Solder(ing) paste of the present invention is applied to the spot printing operation in the components and parts welding process under high temperature welding procedure, the hot operations such as the semiconductor packages welding, multilayer circuit board of power tube, controllable silicon, rectifier etc., stable performance, spot printing is even, and welding performance is good.
Claims (6)
1. spot coating type high-temperature tin alloy soldering paste, it is made up of scaling powder and kamash alloy powder, it is characterized in that, and described scaling powder is made up of following weight percentages:
Newtrex 25%～45%
Foral 5%～20%
Modified hydrogenated castor oil 2%～4%
Rilanit special wax 2%～4%
Activating agent 3%～5%
Hydroquinones 1%～2%
Ethylene bis stearic acid amide 1%～2%
Organic solvent is a surplus.
2. spot coating type high-temperature tin alloy soldering paste according to claim 1 is characterized in that, described activating agent is the composition of a kind of and cyclohexylamine hydrochloride in glutaric acid, succinic anhydride or the phthalic anhydride.
3. spot coating type high-temperature tin alloy soldering paste according to claim 1 is characterized in that, described organic solvent is one or both a composition of terpinol, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, glycol hexyl ether or diglycidyl ether.
4. spot coating type high-temperature tin alloy soldering paste according to claim 1 is characterized in that, described kamash alloy powder is a Sn5/Pb92.5/Ag2.5 high temperature alloy powder.
5. spot coating type high-temperature tin alloy soldering paste according to claim 1 is characterized in that, described scaling powder and ashbury metal powder weight ratio are 13～10: 87～90.
6. the preparation method of the described spot coating type high-temperature tin alloy soldering paste of claim 1 is characterized in that, preparation process is as follows:
A, the newtrex with above-mentioned amount, Foral and organic solvent place reactor to mix, and are heated with stirring to 145～155 ℃ dissolve;
B, add hydroquinones, modified hydrogenated castor oil, rilanit special wax and the ethylene bis stearic acid amide of above-mentioned amount in the reactor, add activating agent fully after the dissolving again;
Cool off after material in C, the question response still dissolves fully, obtain scaling powder in the time of cool to room temperature;
D, with scaling powder and kamash alloy powder according to 13～10: 87～90 part by weight mixes stirring in the vacuum dispersion machine, obtain the solder(ing) paste of this alloy after stirring.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102049631A (en) * | 2010-12-14 | 2011-05-11 | 东莞市特尔佳电子有限公司 | Spot coating type high-temperature soldering paste and preparation method thereof |
| CN102069323A (en) * | 2010-12-14 | 2011-05-25 | 东莞市特尔佳电子有限公司 | Intermediate-temperate tin alloy soldering paste used for through hole coating and preparation method thereof |
| CN102371443A (en) * | 2011-09-06 | 2012-03-14 | 云南锡业锡材有限公司 | Flux suitable for multiple tin-based welding pastes and preparation method thereof |
| CN108544140A (en) * | 2018-04-26 | 2018-09-18 | 东莞市仁信电子有限公司 | Semiconductor special-purpose high temperature solder(ing) paste |
| CN111571065A (en) * | 2020-05-14 | 2020-08-25 | 深圳市唯特偶新材料股份有限公司 | Solder paste for improving BGA packaging welding performance and preparation method thereof |
-
2009
- 2009-10-23 CN CN200910193227A patent/CN101695797A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102049631A (en) * | 2010-12-14 | 2011-05-11 | 东莞市特尔佳电子有限公司 | Spot coating type high-temperature soldering paste and preparation method thereof |
| CN102069323A (en) * | 2010-12-14 | 2011-05-25 | 东莞市特尔佳电子有限公司 | Intermediate-temperate tin alloy soldering paste used for through hole coating and preparation method thereof |
| CN102069323B (en) * | 2010-12-14 | 2013-05-29 | 东莞市特尔佳电子有限公司 | Intermediate-temperate tin alloy soldering paste used for through hole coating and preparation method thereof |
| CN102371443A (en) * | 2011-09-06 | 2012-03-14 | 云南锡业锡材有限公司 | Flux suitable for multiple tin-based welding pastes and preparation method thereof |
| CN102371443B (en) * | 2011-09-06 | 2017-03-15 | 云南锡业锡材有限公司 | It is applied to scaling powder of multiple tinbase solder(ing) pastes and preparation method thereof |
| CN108544140A (en) * | 2018-04-26 | 2018-09-18 | 东莞市仁信电子有限公司 | Semiconductor special-purpose high temperature solder(ing) paste |
| CN111571065A (en) * | 2020-05-14 | 2020-08-25 | 深圳市唯特偶新材料股份有限公司 | Solder paste for improving BGA packaging welding performance and preparation method thereof |
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Open date: 20100421 |