CN101685706A - Electronic component unit and method for manufacturing same - Google Patents
Electronic component unit and method for manufacturing same Download PDFInfo
- Publication number
- CN101685706A CN101685706A CN200910177762A CN200910177762A CN101685706A CN 101685706 A CN101685706 A CN 101685706A CN 200910177762 A CN200910177762 A CN 200910177762A CN 200910177762 A CN200910177762 A CN 200910177762A CN 101685706 A CN101685706 A CN 101685706A
- Authority
- CN
- China
- Prior art keywords
- accessory
- container
- metal terminal
- electronic component
- component unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 238000000034 method Methods 0.000 title claims description 18
- 239000002184 metal Substances 0.000 claims description 73
- 229910052751 metal Inorganic materials 0.000 claims description 73
- 229920005989 resin Polymers 0.000 claims description 52
- 239000011347 resin Substances 0.000 claims description 52
- 238000005266 casting Methods 0.000 claims description 34
- 238000005452 bending Methods 0.000 claims description 9
- 230000000994 depressogenic effect Effects 0.000 claims description 6
- 238000002788 crimping Methods 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 abstract description 75
- 238000010125 resin casting Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 description 44
- 230000015556 catabolic process Effects 0.000 description 9
- 238000009413 insulation Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020938 Sn-Ni Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910008937 Sn—Ni Inorganic materials 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/14—Protection against electric or thermal overload
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The inventive capacitor unit is characterized by comprising a capacitor part and an external container for accommodating the capacitor part, and forming by resin casting in the external container through a condition that the front end of a leadframe is exposed out of the outside of the external container. The external container is provided with an external cover and an external cup, the external cover is provided with protrusions extending to the side of the external cup on the inner side of the external container. The front end of the leadframe is led out to the outside of the external container from between the external cover and the external cup, and the leadframe is sandwiched by the inner wall side of the external cup and the protrusions.
Description
Technical field
The present invention relates to by being contained in electronic unit in the container and making the electronic component unit that formed by resin cast in this container and the manufacture method of this electronic component unit.
Background technology
All the time, as the technology in such a field, the electronic component unit of being put down in writing in the open 2-79020 communique of well-known Japanese utility model application.This electronic component unit be the electronic unit of a kind of capacitor etc. be housed inside in the container and in this container by the electronic component unit of resin cast.In the manufacturing of this electronic component unit, electronic unit is housed inside in the container of top opening, is injected into the casting resin material in the container under the metal terminal that extends from the electrode of electronic unit is led to state container outside and makes it curing.Thereby further carried out bending and finish electronic component unit again leading to the outer metal terminal of container.
As previously discussed, thus obtain to have carried by in container, electronic unit being carried out resin cast in the excellent electronic component unit scheme of being used as that is applicable to high-pressure applications of performance aspect the resistance to pressure.
Yet in the manufacturing process of this electronic unit, in the electronic unit element is contained in the container during the casting resin material cured, the position of electronic unit element in container is unsettled, thereby has the situation of occurrence positions skew.Like this, because the position of electronic unit element is offset, therefore may there be the situation of the desired characteristic that can't obtain electronic component unit.In addition, the position of the electronic unit element in container takes place under the situation of skew, and the position of electronic component unit also is offset with respect to installation base plate.
Summary of the invention
Therefore, the present invention with electronic component unit that a kind of offset that can suppress the electronic unit in the container is provided with and manufacture method be purpose.
Electronic component unit of the present invention is characterized in that, possesses: the container that has article body and be fixed in the electronic unit of the metal terminal on this article body and hold electronic unit; And carrying out resin cast electronic component unit is exposed under the state in the outside of container container by the front end at metal terminal in forms; Container has the 1st accessory and the 2nd accessory, the 1st accessory has the projection of extending to the 2nd accessory side in container, the front end of metal terminal is drawn to the outside of container between the 1st accessory and the 2nd accessory, and metal terminal is sandwiched by the projection of the internal face of the 2nd accessory and the 1st accessory in container.
In this electronic component unit, the metal terminal of electronic unit is sandwiched by the projection of the internal face of the 2nd accessory of container and the 1st accessory, and the front end of metal terminal is from being led to the outside of container between the 1st accessory and the 2nd accessory.Therefore, in the manufacture process of this electronic component unit, when forming container and being disposed at electronic unit in the container, make up the 1st accessory and the 2nd accessory, thereby can become the state between the internal face that metal terminal with electronic unit is clamped into the projection of the 1st accessory and the 2nd accessory.At this moment, metal terminal is fixed by being sandwiched by projection and internal face, fixes with respect to container so its result is the electronic unit integral body that comprises this metal terminal.Like this, before injecting casting resin,, can be suppressed at the offset in container of electronic unit because electronic unit is fixed with respect to this container.
In addition, specifically, the 2nd accessory is the cup-shape that the end is arranged, and projection can be used as the formation of the bottom surface side of the opening surface that is inserted into the 2nd accessory.
In addition, article body have be equipped on the surface and with the surface electrode of metal terminal different poles, projection also can be between surface electrode and metal terminal.In this electronic component unit, detour in container metal terminal and be equipped between the surface electrode of the lip-deep heteropole of article body and have casting resin, but exist the insulation breakdown of this resin to become the situation of problem.With respect to this, according to the above-mentioned formation of electronic component unit, as the projection of the part of container between surface electrode and metal terminal.The projection that becomes a container part is considered to its insulating reliability than casting resin height, thus be present in by such a projection between the surface electrode of metal terminal and heteropole, thus can suppress above-mentioned insulation breakdown.
In addition, the 2nd accessory is the cup-shape that the end is arranged, and metal terminal can be along the bottom surface of the 2nd accessory and inwall side and forming.Constitute by this, metal terminal detours from the position that article body departs from container, so can suppress the insulation breakdown between metal terminal and the article body.
In addition, specifically, the 2nd accessory is the cup-shape that the end is arranged, and the 1st accessory is a tubular, can form container thereby overlap each other by the opening that makes the 1st and the 2nd accessory.Constitute according to this,, on this container, have opening in that the 1st and the 2nd accessory is overlapped and forms under the state of container.Therefore, this opening can be used as the inlet that is used for casting resin is injected into internal tank, and the injection process of casting resin is simplified.
In addition, can be crooked to the notes profile of the casting resin that carries out resin cast in the container.The surface and a plurality of metal terminals that are used as electronic component unit in this notes profile are led under the situation outside the container, annotate the profile bending by making, thereby can extend at the lip-deep metal terminal of electronic component unit surface distance each other, and can suppress insulation breakdown between the metal terminal.
In addition, a kind of manufacture method of electronic component unit, it is characterized in that: be a kind of manufacture method of making the electronic component unit of electronic component unit, this electronic component unit possesses: have article body and the container that is fixed in the electronic unit of the metal terminal on this article body and holds electronic unit, and this electronic component unit carries out resin cast be exposed under the state in the outside of container container by the front end at metal terminal in and forms; Container has the 1st accessory and the 2nd accessory, and the 1st accessory has the projection of extending to the 2nd accessory side in container; The manufacture method of this electronic component unit possesses following 5 operations: the 1st operation is contained in the article body of electronic unit the inboard of the 2nd accessory; The 2nd operation, the metal terminal of electronic unit is sandwiched by the projection of the internal face of the 2nd accessory and the 1st accessory, and with the front end of this metal terminal from being led to the mode in the outside of container between the 1st accessory and the 2nd accessory, the 1st accessory and the combination of the 2nd accessory are formed container; The 3rd operation, inaccessible metal terminal are led to the slit of terminal extension in the outside of container; The 4th operation is injected into casting resin in the container and makes it to solidify and to carrying out resin cast in the container; The 5th operation, the metal terminal that will be led to the outside of container bends to the shape of regulation.
In this manufacture method, in the 2nd operation, the metal terminal of electronic unit is sandwiched by the projection of the internal face of the 2nd accessory of container and the 1st accessory, and the front end of metal terminal is from being led to the outside of container between the 1st accessory and the 2nd accessory.Therefore, in the 2nd operation, when forming container and being disposed at electronic unit in the container, make up the 1st accessory and the 2nd accessory, thereby can be clamped into the state between the internal face of the projection of the 1st accessory and the 2nd accessory as metal terminal with electronic unit.At this moment, metal terminal is fixed by being sandwiched by projection and internal face, fixes with respect to container so its result is the electronic unit integral body that comprises this metal terminal, afterwards, in the 4th operation, can inject casting resin under the state that electronic unit is fixed.Like this, because can carry out resin cast, so can suppress the offset in container of electronic unit with electronic unit state fixing in container with respect to this container.
In addition, in the 3rd operation, on the terminal extension, can pass through thermo-compressed, ultrasonic wave crimping or binding agent jointing metal terminal and the 1st and the 2nd accessory, thus inaccessible slit.Metal terminal engages by any one means in above-mentioned thermo-compressed, ultrasonic wave crimping or the binding agent reliably with the 1st and the 2nd accessory, so can be suppressed at the leakage from the terminal extension of the casting resin that is injected in the 4th operation.
In addition, on the 1st accessory and the 2nd accessory, has the terminal junction surface respectively, this terminal junction surface direction of drawing along metal terminal on the terminal extension sets from outside wall surface is outstanding, and in the 3rd operation, be engaged in metal terminal, in the 5th operation, metal die can be depressed into than the terminal junction surface of metal terminal more on the position of front and make this metal terminal bending.
Give prominence to along the direction of drawing of metal terminal from the outside wall surface of the 1st accessory and the 2nd accessory at the terminal junction surface of jointing metal terminal in the 3rd operation, so the bonding area of metal terminal and the 1st and the 2nd accessory becomes big on the terminal extension, can inaccessible more reliably terminal extension.So, in making the 5th operation of derivative metal terminal bending, be depressed into than above-mentioned terminal junction surface metal die more on the position of front, so avoided the breakage at the terminal junction surface that causes owing to metal die, its result can reduce the bad order of the electronic component unit of finishing etc.
Electronic component unit according to the present invention with and manufacture method, can suppress the offset of electronic unit in container.
Description of drawings
Fig. 1 is the stereogram of expression as the capacitor unit of the 1st execution mode of electronic component unit involved in the present invention.
Fig. 2 is the exploded perspective view of the capacitor unit of Fig. 1.
Fig. 3 is the sectional view of the capacitor unit of Fig. 1.
Fig. 4 is the stereogram of shape of outer dress lid of the capacitor unit of Fig. 1 of seeing from the below of expression.
Fig. 5 is the front elevation of an operation of manufacture method of the capacitor unit of presentation graphs 1.
Fig. 6 (a) is the front elevation of the subsequent handling of presentation graphs 5, (b) is its plane graph.
Fig. 7 is the sectional view of the subsequent handling of presentation graphs 6.
Fig. 8 (a) is the front elevation of the subsequent handling of presentation graphs 7, (b) is its plane graph.
Fig. 9 is the sectional view of the subsequent handling of presentation graphs 8.
Figure 10 is the sectional view of the subsequent handling of presentation graphs 9.
Figure 11 is the sectional view of the subsequent handling of expression Figure 10.
Figure 12 is the sectional view of the subsequent handling of expression Figure 11.
The sectional view of Figure 13 to be expression compare with the capacitor unit of Figure 12 other capacitor unit.
Figure 14 is the sectional view of capacitor unit of the 2nd execution mode of expression electronic component unit involved in the present invention.
Embodiment
Followingly be elaborated with reference to the preferred forms of accompanying drawing to electronic component unit involved in the present invention.
(the 1st execution mode)
Fig. 1～Fig. 3 is the surface-mount capacitor unit 1 of expression as the 1st execution mode of electronic component unit involved in the present invention.Capacitor unit 1 is a kind of resin cast mesohigh capacitor unit of annotating the type type, and the outer packaging container 30 that possesses capacitor department (electronic unit) 10 and hold capacitor department 10.This capacitor unit 1 is a kind ofly to be contained in capacitor department 10 in the outer packaging container 30 and to carrying out the electronic component unit that resin cast forms in this outer packaging container 30 by the state that is exposed to outer packaging container 30 outsides with its lead frame (metal terminal) 15a, 15b.Below capacitor unit 1 is elaborated.
2 lead frames (metal terminal) 15a, 15b that capacitor department 10 possesses the capacitor main body (article body) 13 of circular plate shape and is electrically connected on capacitor main body 13.Capacitor main body 13 has the ceramic component 17 that the ceramic formation body by circular plate shape constitutes.And, on two the circular end surface up and down of the subtend of this ceramic component 17, with surface electrode 19a, the 19b that roughly approaches the mode that whole face is expanded, be formed with respectively to form by Cu or Ag.Like this, surface electrode 19a, 19b by subtend and the ceramic component 17 that is held in the dielectric between this surface electrode 19a, the 19b constitute capacitor.Capacitor main body 13 so that up and down circular end surface be roughly parallel to outer dress cup 60 bottom surface 63 posture and be in the position that is housed inside the substantial middle of outer dress cup 60 than the lower locational mode of contact-making surface 60a of outer dress cup 60 with the surface electrode 19a of upper end.
Also have, on the position that lead frame 15a, 15b are passed through, 2 places of the upper end of dress cup 60 are equipped with respectively from outside wall surface to the diametric outside outstanding brim part (terminal junction surface) 62a, 62b outside.And, on this brim part 62a, 62b, be formed with gathering sill 61a, the 61b that on diametric(al), extends respectively.Equally, with this brim part 62a, 62b respectively the mode of subtend adorn 2 places covering 40 bottom (with reference to Fig. 4) outside and also be equipped with brim part (terminal junction surface) 42a, 42b.And, on this brim part 42a, 42b, also be respectively formed at gathering sill 41a, the 41b that extends on the diametric(al).
By gathering sill as described above, forming thickness outside on packaging container 30 sidewalls is the perforation seam of the thickness of lead frame 15a, 15b, and can make lead frame 15a, 15b connect outer packaging container 30 respectively and draw.Respectively the derivative part of lead frame 15a, 15b is called terminal lead division 33a, 33b like this, in the following description.Also have, in order packaging container 30 outsides outside to avoid 2 lead frame 15a, 15b as far as possible and to avoid surface leakage and terminal lead division 33a, 33b are equipped on each other the opposition side of outer packaging container 30.
Then, detouring in the packaging container outside 30 of lead frame 15b further described.Lead frame 15b extends in the mode of the bottom surface 63 of dress cup 60 outside approaching below capacitor main body 13, thus and then the upper end of front end dress cup 60 outside bottom surface 63 and the 65 extension arrival of inwall side.And then lead frame 15b is with the outside curve of the outside packaging container 30 of its front end, and by led to the outside of outer packaging container 30 by gathering sill 61a and the formed perforation seam of gathering sill 41a.As previously discussed, lead frame 15b is detouring from the position that capacitor main body 13 departs from as far as possible along the bottom surface 63 and inwall side 65.
By such formation, separate with the distance of the surface electrode 19a of lead frame 15b heteropole and this lead frame 15b, its result has reduced the possibility of the insulation breakdown that causes owing to the discharge between lead frame 15b and the surface electrode 19a.Also have, lead frame 15a just detours with relatively shorter distance to terminal lead division 33a above capacitor main body 13.Therefore, for lead frame 15a, there is no need by heteropole surface electrode 19b etc. near, the worry of the insulation breakdown of relevant lead frame 15a is smaller.
In addition, at this, as shown in Figure 4, dress covers and is formed with the projection 47 of giving prominence to from contact-making surface 40a in the inboard of gathering sill 41b on 40 downwards outside.As shown in Figure 3, cup 60 sides extend to the below to this projection 47 from contact-making surface 40a towards outer dress, until bottom surface 63 sides of the contact-making surface 60a of outer dress cup 60, and are inserted into along inwall side 65.Near the upper end of dress cup 60, lead frame 15b is pressed against on the inwall side 65 by this projection 47, and is clamped between the lateral surface of inwall side 65 and projection 47 outside.Projection 47 is a rectangular plate shape, and extends with inwall side 65 with paralleling, approaches the position of bottom surface 63 more until the position of specific surface electrode 19a, and the width of projection 47 is bigger than the width of lead frame 15b.Also have, at this, projection 47 is connected in chimeric guide part 43 and is formed one, but the formation that projection 47 is connected in chimeric guide part 43 and is formed one is not necessary.In addition, the chimeric guide part as chimeric guide part 43 also can be formed at outer dress cup 60 sides.
By the formation of such a projection 47, as shown in Figure 3,19a observes from surface electrode, and projection 47 is present between the proximal most position 16 and this surface electrode 19a of lead frame 15b.That is, 19a observes from surface electrode, and the proximal most position 16 of lead frame 15b is hidden by projection 47 and can't be in sight.
As previously discussed, under the state outside capacitor department 10 is disposed in the packaging container 30, by carrying out resin cast in the casting resin 80 external packaging containers 30.As previously discussed, cover 40 and be made into drum by adorning outward, thereby outer packaging container 30 has the cup-shape of opening 31 as a whole above becoming, so can easily aqueous casting resin be injected by opening 31 and be filled in the outer packaging container 30.As the aqueous casting resin that is injected, use as the heat-resistance epoxy resin of coatings etc.At this, owing to the surface tension of the aqueous casting resin that injects from opening 31, liquid level becomes the shape that bends to concavity, forms the notes profile 81 that bends to concavity through the hot curing casting resin afterwards.So this notes profile 81 has become the surface of the capacitor unit 1 after finishing like this.Like this, the notes profile 81 by casting resin 80 bends, thus elongated between lead frame 15a and the lead frame 15b at capacitor unit 1 lip-deep surface distance, and can reduce the possibility of surface leakage.
In addition, before casting resin is injected into, because base coating is coated on the surface of the part in the outer packaging container 30 in the capacitor department 10, so around capacitor department 10 and lead frame 15a, 15b, be formed with dope layer 11.Also have, in Fig. 2, omit the diagram of casting resin 80 and dope layer 11.
Then, with reference to Fig. 5～Figure 12 the manufacture method of this capacitor unit 1 is described.
(assembling of capacitor department)
At first, as shown in Figure 5, bend to the shape of regulation, make lead frame 15a, 15b by the metallic plate that lead frame is used.Then, as shown in Figure 6, prepare the capacitor main body 13 of circular plate shape, and the end of lead frame 15a is welded in the surface electrode 19a of capacitor main body 13, same, the end of lead frame 15b is welded in the surface electrode 19b of capacitor main body 13.According to the above, finished the capacitor department 10 that capacitor main body 13 and lead frame 15a, 15b become one.Then, as shown in Figure 7, base coating is coated on the part that is housed inside in the capacitor department 10 in the outer packaging container 30, thereby formed dope layer 11.
Also have, become metal tabular lead frame 15a, 15b and have enough big rigidity with respect to weight of capacitor main body 13 etc., external force (for example, acting on the power of capacitor department 10 outside casting resin is injected in the packaging container 30) degree that acts on capacitor department 10 in each following operation can be seen the degree of the distortion of bending that lead frame 15a, 15b do not take place etc. as.
(the 1st operation)
Then, as shown in Figure 8, prepare outer dress cup 60, and capacitor department 10 is contained in the outer dress cup 60.At this moment, lead frame 15a, 15b are disposed at respectively on gathering sill 61a, the 61b, and the front end of lead frame 15a, 15b becomes from outer dress cup 60 levels and exposes state to the outside.In addition, at this moment, the surface electrode 19a of capacitor department 10 is in the position of the contact-making surface 60a equal height of outer dress cup 60 upper ends or is in the position lower than contact-making surface 60a.
(the 2nd operation)
Then, as Fig. 9 and shown in Figure 10, with dress outward cover 40 be embedded in outer dress cup 60 above, thereby the outer packaging container 30 of formation.At this moment, the front end of lead frame 15a, 15b respectively on terminal lead division 33a, the 33b from outer dress cup 60 with adorn the outside of covering the outside packaging container 30 in gap between 40 outward and give prominence to.In addition, in the packaging container 30, lead frame 15b is pressed against on the inwall side 65 of outer dress cup 60 by the projection 47 of outer dress lid 40 outside, and lead frame 15b is sandwiched by inwall side 65 and projection 47.
(the 3rd operation)
Then, same in thermo-compressed lead frame 15a and brim part 62a, 42a on terminal lead division 33a, on terminal lead division 33b, thermo-compressed lead frame 15b and brim part 62b, 42b.Handle by this, can inaccessible lead frame 15a, 15b in terminal lead division 33a, 33b with outer packaging container 30 between the slit, also can bonding outer dress cup 60 and adorn outward and cover 40.At this, brim part 42a, 42b, 62a, 62b extend along the derivative direction of lead frame 15a, 15b from container 30 outside wall surface, so on terminal lead division 33a, 33b, the bonding area that can guarantee lead frame 15a, 15b and container 30 is enough big, and obtains engagement state more reliably.Also have, from carrying out the viewpoint of reliable joint, the joint of lead frame 15a, 15b and brim part is not limited to thermo-compressed, can use ultrasonic wave crimping method to carry out, and also can carry out by the bonding of bonding agent.
(the 4th operation)
Then, as shown in figure 11, the opening 31 by outer packaging container 30 is injected into aqueous casting resin in the outer packaging container 30.At this moment, in above-mentioned the 3rd operation, because leak from terminal lead division 33a, 33b so prevented aqueous casting resin in the slit between inaccessible lead frame 15a, 15b and the outer packaging container 30.Then, by making the aqueous casting resin hot curing of injection, thereby form the interior casting resin 80 of the outer packaging container of mold sealing 30, capacitor main body 13 is sealed in the outer packaging container 30 by mold.At this moment, the top notes profile 81 that bends to concavity that under the state that bends owing to surface tension, forms of the casting resin 80 of curing.
(the 5th operation)
Then, as shown in figure 12, on metal die A11 is depressed into by lead frame 15a, the 15b in the outside of packaging container outside leading to 30 in, with metal die A13 be depressed into lead frame 15a, 15b below, thereby make lead frame 15a, 15b bending.At this moment, metal die A11 is configured to not contact brim part 42a, 42b, and is being depressed into lead frame 15a, 15b on the position of front more than brim part 42a, 42b.Therefore, in the bending machining of lead frame 15a, 15b, the stress that acts on brim part 42a, 42b relaxes, thereby can prevent chapping and isolating or the brim part 42a that causes owing to metal die A11, A13, the breakage of 42b of brim part 42a, 42b, and can prevent the bad order of capacitor unit 1.In addition,, preferably shorten brim part 42a, 42b, perhaps also can cancel brim part 42a, 42b in order to realize preventing the effect of such a brim part 42a, 42b breakage more effectively.Afterwards, further lead frame 15a, 15b are bent to the regulation shape, and through the processing of the length etc. that is cut into regulation, thereby capacitor unit 1 finished.
Then, action effect that is produced by above-mentioned capacitor unit 1 and the action effect that is produced by above-mentioned manufacture method are described.
As shown in Figure 3, in capacitor unit 1, by be called outer dress cover 40 and 2 accessories of cutting apart of outer dress glasss 60 constitute outer packaging container 30.Then, under the state outside capacitor department 10 is contained in the packaging container 30, cover projection 47 on 40 by being equipped on outer dress, and lead frame 15b is crimped on the inwall side 65 of outer dress cup 60, thus can enough projections 47 and inwall side 65 sandwich lead frame 15b and fix reliably.So, thereby by anchor leg frame 15b capacitor department 10 integral body are fixed outside in the packaging container 30 with respect to this outer packaging container 30.
Therefore, in the 1st operation, after the position of the hope outside capacitor department 10 (particularly capacitor main body 13) is positioned reliably in the packaging container 30 is also fixed, in the 2nd operation, can inject aqueous casting resin and make it and solidify.Therefore, in the capacitor unit 1 after finishing, capacitor department 10 is disposed at the position of hope reliably, and can be suppressed at the position component skew in the outer packaging container 30.
In addition, in this capacitor unit, exist insulation breakdown between each one to become the situation of problem.Particularly under the situation of this capacitor unit 1, the lead frame 15b that extends below capacitor main body 13 is necessary to detour with long path until terminal lead division 33b below capacitor main body 13.Therefore, can't avoid making the close proximity of the surface electrode 19a of lead frame 15b and heteropole fully.In addition, also there is the situation that results from the defective part that produced etc. and reduce insulating reliability when solidifying in casting resin 80.Therefore, the insulation breakdown that may exist generation to cause owing to the discharge between lead frame 15b and the surface electrode 19a.
With respect to this, in capacitor unit 1, as previously discussed, the position that above-mentioned projection 47 extends to specific surface electrode 19a is approached the position (with reference to Fig. 3) of bottom surface 63 more.Therefore, 19a observes from surface electrode, has projection 47 between the nearest position 16 of lead frame 15b and this surface electrode 19a.Like this, the projection 47 that is considered to have more than casting resin 80 high insulating reliability is present between position 16 and this surface electrode 19a, thus can improve the insulating reliability between projection 47 and the lead frame 15b, and can reduce the possibility of insulation breakdown.
In addition, as other the resin cast mesohigh capacitor unit of notes type type, as shown in figure 13, also considered to draw lead frame 215a, the 215b of capacitor department 210 and inject the capacitor unit 201 of the type of aqueous casting resin from this opening 231 from the opening 231 of the outer packaging container 203 of cup-shaped.But, in this case, around the lead frame 215a, the 215b that draw from the notes profile 281 of casting resin, formed protrusion 216a, the 216b of resin owing to surface tension.Like this, if have irregularly shaped as protrusion 216a, 216b on the profile 281 annotating, so for example in the thermal shock test of capacitor unit 201, thermal stress can concentrate on protrusion 216a, 216b, thereby has the worry that crackle takes place on casting resin 280.
With respect to this, according to capacitor unit 1 (Fig. 3), be divided into 2 parts up and down by outer packaging container 30 with cup-shape, draw lead frame 15a, 15b thereby can cover between 40 from the sidewall of outer packaging container 30 by outer dress cup 60 and outer dress.Like this because there is no need to draw lead frame 15a, 15b from annotating profile 81, and annotate can not produce on the profile 81 irregularly shaped, so it is low that the possibility of crackle takes place on casting resin 80.
(the 2nd execution mode)
As shown in figure 14, outer dress cup (the 1st accessory) 160 and outer dress lid (the 2nd accessory) 140 these 2 accessories of 2 parts constitute the outer packaging container 103 of capacitor unit 101 by being separated into up and down.Outer dress cup 160 for the circle of top opening have the cup-shape at the end, outer dress cover 140 for and the outer drum of adorning glass 160 roughly the same diameters.
Like this, by projection 167 being equipped on the capacitor unit 101 of outer dress cup 160, can access the action effect identical with foregoing capacitor unit 1.Also have, in this capacitor unit 101, the identical symbol of component part mark for identical or suitable with foregoing capacitor unit 1 omits repeat specification.
The present invention is not limited to the 1st, 2 above-mentioned execution modes.For example, in the 1st, 2 execution modes, as outer dress lid 40,140 and outer dress cup 60,160, though adopting is circular shape in plan view, but outer dress lid and outer dress cup also can be to be the shape of polygon (for example quadrangle) in plan view, perhaps also can be other shapes.
Claims (9)
1. an electronic component unit is characterized in that,
Possess: the container that has article body and be fixed in the electronic unit of the metal terminal on this article body and hold described electronic unit,
And described electronic component unit is exposed to by the front end at described metal terminal under the state in the outside of described container and forms carrying out resin cast in the described container,
Described container has the 1st accessory and the 2nd accessory,
Described the 1st accessory has the projection of extending to described the 2nd accessory side in described container,
The front end of described metal terminal is drawn to the outside of described container between described the 1st accessory and described the 2nd accessory,
Described metal terminal is sandwiched by the described projection of the internal face of described the 2nd accessory and described the 1st accessory in described container.
2. electronic component unit as claimed in claim 1 is characterized in that,
Described the 2nd accessory is the cup-shape that the end is arranged,
Described projection is inserted into the side of bottom surface of the opening surface of described the 2nd accessory.
3. as claim 1 or 2 described electronic component units, it is characterized in that,
Described article body have be equipped on the surface and with the surface electrode of described metal terminal different poles,
Described projection is between described surface electrode and described metal terminal.
4. as any described electronic component unit in the claim 1～3, it is characterized in that,
Described the 2nd accessory is the cup-shape that the end is arranged,
Described metal terminal is along the bottom surface of described the 2nd accessory and inwall side and forming.
5. as any described electronic component unit in the claim 1～4, it is characterized in that,
Described the 2nd accessory is the cup-shape that the end is arranged, and described the 1st accessory is a tubular, by make the described the 1st and the opening of the 2nd accessory overlap each other, thereby form described container.
6. as any described electronic component unit in the claim 1～5, it is characterized in that,
Notes profile bending to the casting resin that carries out resin cast in the described container.
7. the manufacture method of an electronic component unit is characterized in that,
Be the manufacture method of making the electronic component unit of electronic component unit,
Described electronic component unit possesses: the container that has article body and be fixed in the electronic unit of the metal terminal on this article body and hold electronic unit,
And described electronic component unit is exposed to by the front end at described metal terminal under the state in the outside of described container and forms carrying out resin cast in the described container,
Described container has the 1st accessory and the 2nd accessory, and described the 1st accessory has the projection of extending to described the 2nd accessory side in described container,
The manufacture method of described electronic component unit possesses following operation:
The 1st operation is contained in the described article body of described electronic unit the inboard of described the 2nd accessory;
The 2nd operation, the described metal terminal of described electronic unit is sandwiched by the described projection of the internal face of described the 2nd accessory and described the 1st accessory, and with the front end of this metal terminal from being led to the mode in the outside of described container between described the 1st accessory and described the 2nd accessory, described the 1st accessory and the combination of described the 2nd accessory are formed described container;
The 3rd operation, inaccessible described metal terminal are led to the slit of terminal extension in the outside of described container;
The 4th operation is injected into casting resin in the described container and makes it to solidify and to carrying out resin cast in the described container;
The 5th operation, the described metal terminal that will be led to the outside of described container bends to the shape of regulation.
8. the manufacture method of electronic component unit as claimed in claim 7 is characterized in that,
In described the 3rd operation, on described terminal extension, engage described metal terminal and the described the 1st and the 2nd accessory by thermo-compressed, ultrasonic wave crimping or binding agent, thus inaccessible described slit.
9. as the manufacture method of claim 7 or 8 described electronic component units, it is characterized in that,
On described the 1st accessory and described the 2nd accessory, has the terminal junction surface respectively, this terminal junction surface direction of drawing along described metal terminal on described terminal extension sets from outside wall surface is outstanding, and is engaged in described metal terminal in described the 3rd operation
In described the 5th operation, be depressed into than the described terminal junction surface of described metal terminal metal die more on the position of front and make this metal terminal bending.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008246535 | 2008-09-25 | ||
| JP2008246535A JP4780166B2 (en) | 2008-09-25 | 2008-09-25 | Electronic component unit and method of manufacturing electronic component unit |
| JP2008-246535 | 2008-09-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101685706A true CN101685706A (en) | 2010-03-31 |
| CN101685706B CN101685706B (en) | 2012-06-06 |
Family
ID=42048802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101777628A Active CN101685706B (en) | 2008-09-25 | 2009-09-25 | Electronic component unit and method for manufacturing same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4780166B2 (en) |
| KR (1) | KR101043196B1 (en) |
| CN (1) | CN101685706B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106024385A (en) * | 2016-07-15 | 2016-10-12 | 吴江佳亿电子科技有限公司 | Chip high voltage ceramic dielectric capacitor |
| CN104464557B (en) * | 2013-09-24 | 2019-07-12 | 夏展敏 | A kind of edge shows the scheme integrated with liquid crystal display |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6031996B2 (en) | 2012-12-21 | 2016-11-24 | Tdk株式会社 | High voltage capacitor |
| JP7492395B2 (en) * | 2020-07-22 | 2024-05-29 | Tdk株式会社 | Manufacturing method of resin molded electronic component, and resin molded electronic component |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0293825U (en) * | 1989-01-12 | 1990-07-25 | ||
| JPH0572101U (en) * | 1992-03-05 | 1993-09-28 | ティーディーケイ株式会社 | PTC thermistor device |
| JPH0855703A (en) * | 1994-08-11 | 1996-02-27 | Murata Mfg Co Ltd | Surface mount thermistor |
| JP3606672B2 (en) * | 1996-02-27 | 2005-01-05 | ニチコン株式会社 | Chip-type overcurrent protection device |
| JP2001217136A (en) * | 2000-02-01 | 2001-08-10 | Murata Mfg Co Ltd | Laminated ceramic capacitor |
| JP2005085880A (en) * | 2003-09-05 | 2005-03-31 | Shizuki Electric Co Inc | Electrical component |
-
2008
- 2008-09-25 JP JP2008246535A patent/JP4780166B2/en active Active
-
2009
- 2009-07-02 KR KR1020090060039A patent/KR101043196B1/en active IP Right Grant
- 2009-09-25 CN CN2009101777628A patent/CN101685706B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104464557B (en) * | 2013-09-24 | 2019-07-12 | 夏展敏 | A kind of edge shows the scheme integrated with liquid crystal display |
| CN106024385A (en) * | 2016-07-15 | 2016-10-12 | 吴江佳亿电子科技有限公司 | Chip high voltage ceramic dielectric capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101043196B1 (en) | 2011-06-22 |
| JP2010080639A (en) | 2010-04-08 |
| JP4780166B2 (en) | 2011-09-28 |
| KR20100035091A (en) | 2010-04-02 |
| CN101685706B (en) | 2012-06-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8305181B2 (en) | Chip inductor and manufacturing method thereof | |
| TWI434309B (en) | Solid electrolytic capacitor, lead frame and manufacturing methods thereof | |
| US20090147448A1 (en) | Solid electrolytic capacitor | |
| CN101685706B (en) | Electronic component unit and method for manufacturing same | |
| JPS63157649A (en) | Induction generator and manufacture of the same | |
| TWI419188B (en) | Solid electrolytic capacitor | |
| JP2017139379A (en) | Coil component | |
| JP6750416B2 (en) | Semiconductor module and method of manufacturing semiconductor module | |
| JP5369294B2 (en) | Chip inductor and manufacturing method thereof | |
| JPWO2019004038A1 (en) | Inductor component and manufacturing method thereof | |
| KR101233615B1 (en) | Battery pack | |
| US20100033268A1 (en) | Piezoelectric resonator device | |
| JP4940665B2 (en) | Case mold type capacitor | |
| CN101728080B (en) | Electronic component unit | |
| JP2009164240A (en) | Semiconductor device | |
| JP5369293B2 (en) | Chip inductor and manufacturing method thereof | |
| KR101722424B1 (en) | Temperature sensor assembly | |
| JP3549653B2 (en) | Chip type electronic components | |
| JP2018133403A (en) | Inductor component and method of manufacturing the same | |
| JP2018133402A (en) | Inductor component | |
| JP5780175B2 (en) | Mold package and manufacturing method thereof | |
| CN219066583U (en) | Patch type inductor | |
| JP5362424B2 (en) | Battery pack | |
| CN113889327A (en) | Inductance element and manufacturing method thereof | |
| JPS62105456A (en) | Resin sealed integrated circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |