CN101678500B - Joining method - Google Patents

Joining method Download PDF

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Publication number
CN101678500B
CN101678500B CN200880020211.4A CN200880020211A CN101678500B CN 101678500 B CN101678500 B CN 101678500B CN 200880020211 A CN200880020211 A CN 200880020211A CN 101678500 B CN101678500 B CN 101678500B
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CN
China
Prior art keywords
bonding process
hardware
formal bonding
throw
stirring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200880020211.4A
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Chinese (zh)
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CN101678500A (en
Inventor
佐藤勇人
堀久司
河本知广
青木一男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Light Metal Co Ltd
Original Assignee
Nippon Light Metal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007157471A external-priority patent/JP5092561B2/en
Priority claimed from JP2007313075A external-priority patent/JP2009136883A/en
Application filed by Nippon Light Metal Co Ltd filed Critical Nippon Light Metal Co Ltd
Priority to CN201310680824.3A priority Critical patent/CN103722288B/en
Priority to CN201310165879.0A priority patent/CN103273189B/en
Publication of CN101678500A publication Critical patent/CN101678500A/en
Application granted granted Critical
Publication of CN101678500B publication Critical patent/CN101678500B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
    • B23K20/123—Controlling or monitoring the welding process
    • B23K20/124—Controlling or monitoring the welding process at the beginning or at the end of a weld
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/06—Tubes

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

A joining method for joining metal members (1), which are a first metal member (1a) and a second metal member (1b) butted on each other, by friction stir welding by moving a rotation tool (G) relative to the metal members. The method includes a first final welding step for applying friction stir welding from the front surface (A) side of the metal members (1) to a butted section (J1) between the first metal member (1a) and the second metal member (1b), a second final welding step for applying friction stir welding from the rear surface (B) side, a third final welding step for applying friction stir welding from one side surface side (C), and a fourth final welding step for applying friction stir welding from the other side surface side (D). A front surface-side plasticized region (W1) and a rear surface-side plasticized region (W2), and a first side surface-side plasticized region (W3) and a second side surface-side plasticized region (W4) are superposed on each other.

Description

Joint method
Technical field
The present invention relates to a kind of joint method that utilizes the hardware of friction stirring.
Background technology
Joint (FSW=Friction StirWelding) is stirred in the known friction that has of method that hardware is engaged with each other.Friction stir to engage and to make throw rotation and to move along hardware docking section each other, and the frictional heat by throw and hardware makes the metal of docking section do Plastic Flow, makes by this hardware do each other solidstate bonding.And throw generally can project in the lower surface of cylindrical shoulder and stir pin (probe).
In this, Figure 29 and Figure 30 implement to pair of metal member the stereogram that the existing joint method engaging is stirred in friction for representing.As shown in figure 29, in the situation that the length of the stirring pin of the not shown throw of the Thickness Ratio of the hardware 101,101 that should engage is also large, surface 102 sides from hardware 101 rub and stir, the 103 sides stirring that rubs from the back side.
; in existing joint method; stirrings that rub along the docking section 104 (double dot dash line) of hardware 101,101 from the both sides at surface 102 and the back side 103, is contacted and is engaged by the middle body of the thickness direction in friction stirring formed plastification region 105,106.By this, 104 places in docking section, can seamlessly engage.This kind of joint method has exposure in following document 1.
Document 1: Japanese Patent Laid-Open 2005-131666 communique (with reference to Fig. 7)
Yet as shown in figure 30, in the situation that the thickness of the hardware 111,111 that need engage is large, even from surface 102 and the back side 103 stirring that rubs, the central portion of docking section 104 (double dot dash line) also may produce not junction surface.; length with respect to the stirring pin of not shown throw; in the sizable situation of thickness of hardware 111; even from the surface 102 of hardware 111 and the back side 103 stirring that rubs; also cannot contact the middle body of the thickness direction in plastification region 105,106, therefore in docking section, 104 central portion can produce gap (not junction surface) 119.So, when the side 107 from one side to the side 108 of another side produces gap 119 continuously, have the problem that watertightness between 107Ji side, side 108 and air-tightness reduce.
In this, corresponding to the thickness of hardware 111, make the length of the stirring pin of throw become large, by from surface 102 and the back side 103 stirring that rubs, seamlessly jointing metal member 111 is each other.But, throw is owing to stirring pin being buried in hardware 111 and move on High Rotation Speed limit, limit, so when stirring the length of pin and become large, the load that acts on the drive unit of friction agitating device and stir pin becomes large, can cause the problem of the short life of device.
As shown in Figure 29 and Figure 30, in plastification region 105,106, may produce continuous cavity blemish 109 in the side 108 from side 107 on one side to another side again.Above-mentioned cavity blemish 109 for causing one of reason of watertightness and air-tightness reduction between the 107Ji side, side 108 of hardware 101,111.
Summary of the invention
From then on viewpoint, the invention provides a kind of joint method, and hardware docking section is each other rubbed when stirring from the face side of hardware and rear side, can improve air-tightness and watertightness between the two sides of hardware.
For head it off, joint method of the present invention moves throw to rub stirring for dock the hardware that is engaged forming with the second hardware with respect to the first hardware, comprise: the first formal bonding process, with respect to the docking section of described the first hardware and described the second hardware, from the stirring that rubs of the described face side that is engaged hardware; The second formal bonding process, with respect to described docking section and from the stirring that rubs of the described rear side that is engaged hardware; The formal bonding process in side, with respect to described docking section and from the stirring that rubs of the described side that is engaged hardware, the described first formal bonding process and the second formed plastification of formal bonding process region with in the formed plastification region of the formal bonding process in described side for repeating.
According to above-mentioned joint method, with respect to docking section, from being engaged face side and the rear side of hardware, rub stirring, with respect to docking section, from being engaged the side of hardware, rubbing stirring and plastification region is repeated, therefore, between side, can not produce continuous gap.By this, can promote air-tightness and the watertightness between two sides.
Again, the formal bonding process in described side preferably includes from rub the 3rd formal bonding process that stirs and from rub the 4th formal bonding process of stirring of the described side that is engaged the another side of hardware of the described side that is engaged one side of hardware.
According to above-mentioned joint method, due to respect to docking section from being engaged the stirring that rubs of the two sides side of hardware, therefore can more positively improve air-tightness and watertightness.
Again, in described first to fourth formal bonding process, the direction of rotation of described throw is in equidirectional situation, and the starting position that the friction in the described second formal bonding process is stirred is set as the end position side that the friction in the described first formal bonding process is stirred; The starting position that friction in the described the 3rd formal bonding process is stirred is set as one of them of the starting position side of the friction stirring in the described first formal bonding process and the starting position side of the stirring of the friction in the described second formal bonding process; The starting position that friction in the described the 4th formal bonding process is stirred is set as wherein another of the starting position side of starting position side that the friction in the described first formal bonding process stirs and the stirring of the friction in the described second formal bonding process.
In this, when issuable cavity blemish is in throw right rotation when the stirring that rubs, be formed at the left side of direct of travel, when anticlockwise, be formed at the right side of direct of travel, but by the starting position of the 3rd bonding process and the 4th bonding process is set in to above-mentioned position, even if produce continuous cavity blemish between side, also can positively disconnect this cavity blemish.By this, can promote air-tightness and the watertightness between two sides.Again, due to the direction of rotation of throw, set for equidirectionally, when carrying out each formal bonding process, needn't change one by one the direction of rotation of throw, can improve workability.
Again, in the described first formal bonding process, when making described throw right rotation, set starting position and end position that friction is stirred, make described the first hardware be positioned at the right side of the direct of travel of described throw, in the described second formal bonding process, when making described throw anticlockwise, set starting position and end position that friction is stirred, make described the first hardware be positioned at the left side of the direct of travel of described throw, now, in the described the 3rd formal bonding process and the 4th formal bonding process, if described throw right rotation, set starting position and the end position that friction is stirred, make described the first hardware be positioned at the left side of the direct of travel of described throw, if described throw anticlockwise, set starting position and the end position that friction is stirred, make described the first hardware be positioned at the right side of the direct of travel of described throw.
In the described first formal bonding process, when making described throw anticlockwise, set starting position and end position that friction is stirred, make described the first hardware be positioned at the right side of the direct of travel of described throw, in the described second formal bonding process, when making described throw right rotation, set starting position and end position that friction is stirred, make described the first hardware be positioned at the left side of the direct of travel of described throw, now, in the described the 3rd formal bonding process and the 4th formal bonding process, if described throw right rotation, set starting position and the end position that friction is stirred, make described the first hardware be positioned at the right side of the direct of travel of described throw, if described throw anticlockwise, set starting position and the end position that friction is stirred, make described the first hardware be positioned at the left side of the direct of travel of described throw.
According to above-mentioned joint method, in the first formal bonding process and the second formed plastification of formal bonding process region, even if produce continuous cavity blemish between side, also can positively disconnect this cavity blemish.By this, can promote air-tightness and the watertightness between two sides.
Carrying out the described first formal bonding process, the formal bonding process of the described second formal bonding process and described side at least before one of them, carry out the interim interim bonding process engaging in described docking section again.
When carrying out the first and even the 4th formal bonding process, because throw is pressed into the docking section of the first hardware and the second hardware, so the power generation effect that wish is pulled away from the first hardware and the second hardware, docking section can produce perforate.But according to above-mentioned joint method, before carrying out first to fourth bonding process, docking section is engaged temporarily, thereby can suitably carry out first to fourth formal bonding process.
Again, preferably also comprise a front travel, a pair of outstanding (tab) material of both sides configurations in described docking section, described outstanding material with described in be engaged hardware docking section preparation property the stirring that rubs.
According to above-mentioned bonding process, by using outstanding material, can promptly carry out interim bonding process and formal bonding process and modify and obtain joint attractive in appearance.
Be preferably in and on the insertion precalculated position of described throw, form predetermined lower hole again.According to above-mentioned joint method, can lower when throw is pressed into the insertion impedance producing when insertion precalculated position, because throw is led to lower hole, stirring can accurately and promptly rub.
Again, also larger than the gauge of described docking section in the prolongation distance in the formed plastification of formal bonding process region, described side.According to above-mentioned joint method, owing to can guaranteeing to be formed at, the prolongation distance in plastification region of the side that is engaged hardware is also longer than the gauge that is engaged hardware, can make to act on the stress dispersion of bonding part.By this, can improve the bond strength of bonding part.
Again, in the formal bonding process in described side, cross the total length of described docking section of the side that is engaged hardware described in coming across and the stirring that rubs, in formal bonding process formed plastification region, described side and the described first formal bonding process and the described second formal bonding process, repeat in formed plastification region.According to above-mentioned joint method, can further improve the air-tightness and the watertightness that are engaged hardware.
Again, the horizontal alignment of described docking section that is engaged the side of hardware described in coming across is preferably the combination of straight line or straight line.According to above-mentioned joint method, about the horizontal alignment of docking section, although also can comprise curve, if the combination of straight line or straight line, the shaping of interface is easy, can omit the program of processing.
Again, the present invention, in the horizontal alignment of described docking section of side that is engaged hardware described in coming across, be provided with 1 above flex points, and in this flex points, straight line each other (interface each other) crossing angle can be 90 degree.According to above-mentioned joint method, during the joint that stirs in friction, the throw moving along the horizontal alignment of docking section is owing to stopping in flex points temporarily, so the friction of carrying out the longer time than other parts in flex points is stirred.Therefore, in flex points, by carrying out friction for a long time, stir, owing to can implementing processing, do not produce joint defect, so continuous joint defect can not produce along junction surface, can improve air-tightness and watertightness at junction surface.
According to joint method of the present invention, from the face side of hardware and rear side, hardware docking section is each other rubbed when stirring, can promote air-tightness and watertightness between the two sides of hardware.
Accompanying drawing explanation
Fig. 1 means the figure of the joint method of the first example, is (a) stereogram, is (b) amplification stereogram of N part in (a).
Fig. 2 means the figure of the first preparatory process of the first example, (a) is stereogram, is (b) plane.
Fig. 3 means the figure of the first preparatory process of the first example, is (a) the I-I line cutaway view of Fig. 2 (b), is (b) the II-II line cutaway view of Fig. 2 (b).
Fig. 4 means the figure of the throw of the first example, is (a) the interim side view engaging with throw, is (b) the formal side view engaging with throw.
Fig. 5 means the figure of the use state of throw for the interim joint of the first example, is (a) the interim figure that is connected to the second outstanding material with throw that engages, and (b) is the interim figure that is pressed into the second outstanding material with throw that engages.
Fig. 6 gives prominence to the plane of material bonding process for representing the second outstanding material bonding process, the interim bonding process and first of the first front travel of the first example.
Fig. 7 is the cutaway view that the III-III direction from Fig. 6 of the first formal bonding process of the first example is watched, (a) friction that represents starting position is stirred, (b) friction that represents centre position is stirred, and (c) represents that the friction of end position is stirred.
Fig. 8 (a) be the first example the second preparatory process again operation is set after, cutaway view from docking section J1 towards the first hardware 1a side, Fig. 8 (b) is that the first outstanding material bonding process, the interim bonding process and second of the second preparatory process of the first example given prominence to the plane of material bonding process.
Fig. 9 represents the IV-IV line cutaway view of Fig. 8 (b) of the second formal bonding process of the first example, (a) represents that the friction of starting position is stirred, and (b) represents that the friction in centre position is stirred.
Figure 10 is that the outstanding material of the first example excises the stereogram that is engaged hardware after operation.
Figure 11 is the stereogram of the 3rd preparatory process of the first example.
Figure 12 is the stereogram of the 3rd formal bonding process of the first example.
Figure 13 is the V-V line cutaway view of the Figure 12 after the 3rd formal bonding process of the first example.
Figure 14 (a) is the arranging again after operation of the 4th preparatory process of the first example, cutaway view from docking section J1 towards the second hardware 1b side, Figure 14 (b) is the figure of the 4th formal bonding process of the first example, the cutaway view from docking section J1 towards the second hardware 1b side.
Figure 15 is the figure of the joint method of the second example, (a) is stereogram, is (b) amplification stereogram of H part.
Figure 16 is the figure of the joint method of the 3rd example, (a) is stereogram, is (b) amplification stereogram of I part.
Figure 17 is the stereogram that is engaged hardware of the 4th example.
Figure 18 is the figure that is engaged hardware of the 4th example, (a) is three-dimensional exploded view, is (b) side view.
Figure 19 is the stereogram of the outstanding material arrangement step of the 4th example.
Figure 20 is the plane of the interim bonding process of the 4th example.
Figure 21 is the plane of the first formal bonding process of the 4th example.
Figure 22 is the second interim bonding process of the 4th example and the plane of the second formal bonding process.
Figure 23 is the plane of the 3rd front travel of the 4th example.
Figure 24 is the plane of the 3rd formal bonding process of the 4th example.
Figure 25 is the 4th front travel of the 4th example and the plane of the 4th formal bonding process.
Figure 26 is the plane of the first side C that is engaged hardware of the variation of example of the present invention, (a) is the first variation, is (b) the second variation, is (c) the 3rd variation.
Figure 27 is the plane of the first side C that is engaged hardware of the variation of example of the present invention, (a) is the 4th variation, is (b) the 5th variation, (c) is the 6th variation, is (d) the 7th variation.
Figure 28 is the plane of the first side C that is engaged hardware of the variation of example of the present invention, and it represents the 8th variation.
Figure 29 is the stereogram of existing joint method.
Figure 30 is the stereogram of existing joint method.
(symbol description)
1 is engaged hardware; 1a the first hardware;
1b the second hardware; 2 first outstanding materials;
3 second outstanding materials; 201 are engaged hardware;
201a the first hardware; 201b the second hardware;
202 first outstanding materials; 203 second outstanding materials;
A surface; The B back side;
C the first side; D the second side;
F engages with throw temporarily; G formally engages with throw;
J docking section; L horizontal alignment;
Hole under P1;
V 1～V 4the direct of travel of throw;
W plastification region;
S mthe starting position of formal bonding process;
E mthe end position of formal bonding process.
The specific embodiment
[the first example]
Joint method of the present invention, be characterised in that: as shown in Figure 1, outer Thursday of the limit that is engaged hardware 1 forming the first hardware 1a is docked with the second hardware 1b is done friction and is stirred and when engaging, suitably set respectively formal direction of rotation and the direct of travel engaging with throw G.
First, in the time of to being engaged hardware 1 and elaborating of the joint method of this example, for giving prominence to material and be described in detail engaging the first outstanding material and second using when this is engaged hardware 1.
Be engaged hardware 1, as shown in Figure 2, in this example, by the first rectangular hardware 1a of section and the second hardware 1b, formed, by making end face docking separately form docking section J1.The first hardware 1a and the second hardware 1b, in this example, consisted of the metal material of same composition, and such as being rubbed by aluminium, aluminium alloy, copper, copper alloy, titanium, titanium alloy, magnesium, magnesium alloy etc., the metal material stirring is formed.Although there is no particular restriction for shape, the size of the first hardware 1a and the second hardware 1b, preferably at least the gauge at docking section J1 place is identical.
And as shown in Figure 1, the surface that is engaged hardware 1 is that surface A, the back side are that back surface B, side are on one side that the side of the first side C, another side is the second side D.Again, the front and back up and down in this example are according to the arrow of Fig. 1.
As shown in Fig. 2 (a) and Fig. 2 (b), the first outstanding material 2 and the second outstanding material 3 are configured to the docking section J1 that clamping is engaged hardware 1, add respectively in being engaged hardware 1, and cover the seam (boundary line) of hiding the first hardware 1a and the second hardware 1b that are presented in the first side C and the second side D.Although the material of the first outstanding material 2 and the second outstanding material 3 is also unrestricted, in this example, uses with the metal material that is engaged hardware 1 same composition and form.Again, although there is no particular restriction for shape, the size of the first outstanding material 2 and the second outstanding material 3, in this example, its gauge is identical with the gauge that is engaged hardware 1 at J1 place, docking section.
Then,, with reference to Fig. 4, for the throw F for interim bonding process (hereinafter referred to as " interim joint use throw F ") and for the throw G (hereinafter referred to as " formal joint throw G ") of formal bonding process, elaborate.
Interim joint shown in Fig. 4 (a) has with throw F: by tool steel geometric ratio, be engaged that hardware 1 goes back that the metal material of hard is formed and cylindrical shoulder F1 and stirring pin (probe) F2 that is based in the lower surface F11 of this shoulder F1.Although interim, engaging size with throw F, shape can set corresponding to being engaged the material of hardware 1 and thickness etc., and the formal joint use throw G (with reference to Fig. 4 (b)) at least using than the described later first formal bonding process is also small-sized.So, owing to can use the load also less than formal joint to engage temporarily, the required load of agitating device rubs in the time of can lowering interim joint, and because interim joint by the translational speed (transporting velocity) of throw F engages by the translational speed of throw G also at a high speed than formal, can lower needed activity duration of interim joint and cost.
The lower surface F11 of shoulder F1 is the metal of pushing Plastic Flow and preventing towards the position of around dispersing, and in this example, forms concave shape.Although the external diameter X of shoulder F1 1size there is no particular restriction, but in this example, the external diameter Y than formal joint with the shoulder G1 of throw G 1also little.
Stir pin F2 and hang down from the central authorities of the lower surface F11 of shoulder F1, in this example, form the thin circular cone shape of front end.At the side face that stirs pin F2, form and be arranged to spiral helicine agitator again.Although there is no particular restriction for the external diameter size of stirring pin F2, in this example, maximum outside diameter (upper end diameter) X 2than formal maximum outside diameter (upper end diameter) Y engaging with the stirring pin G2 of throw G 2also little, and minimum outer diameter (lower end diameter) X 3than minimum outer diameter (lower end diameter) Y that stirs pin G2 3also little.Stir the length L of pin F2 2can be compared to most the formal length L engaging with the stirring pin G2 of throw G 1(with reference to Fig. 4 (b)) is also little.
As shown in Fig. 4 (b), formal joint has with throw G: by tool steel geometric ratio, be engaged that hardware 1 goes back that the metal material of hard forms and cylindrical shoulder G1 and stirring pin (probe) G2 that is based in the lower surface G11 of this shoulder G1.
The lower surface G11 of shoulder G1 with interim engage with throw F identical and form concave shape.Stir pin G2 and hang down from the central authorities of the lower surface G11 of shoulder G1, in this example, form the thin circular cone shape of front end.At the side face that stirs pin G2, form and be arranged to spiral helicine agitator again.
Below, describe the joint method of this example in detail.The joint method of this example comprises: (1) first preparatory process, (2) first front travels, (3) first formal bonding processs, (4) second preparatory process, (5) second front travels, (6) second formal bonding processs, (7) outstanding material excision operation, (8) the 3rd preparatory process, (9) the 3rd front travels, (10) the 3rd formal bonding processs, (11) the 4th preparatory process, (12) the 4th front travels, (13) the 4th formal bonding processs, (14) outstanding material excision operation.
And, as shown in Figure 1, (2) first front travels and (3) first formal bonding processs are operations of implementing from surface A side, (5) second front travels and (6) second formal bonding processs are operations of implementing from back surface B side, (9) the 3rd front travels and (10) the 3rd formal bonding processs are operations of implementing from the first side C side, and (12) the 4th front travels and (13) the 4th formal bonding processs are operations of implementing from the second side D side.In this example, interim engage with throw F and formally to engage be all to right rotation by the direction of rotation of throw G.So, throw F and the formal direction of rotation unification engaging with throw G for interim joint, can save operation procedure.
(1) first preparatory process
With reference to Fig. 2 and Fig. 3, the first preparatory process is described.The be as the criterion operation of allowance connection member (the first outstanding material 2 and the second outstanding material 3) of the first preparatory process, abutting member is provided with starting position and the end position that the friction in first and second formal bonding process is stirred.The first preparatory process comprises at this example: (1-1) docking operation that makes the first hardware 1a and the second hardware 1b docking, the first outstanding material 2 and second is given prominence to (1-2) outstanding material arrangement step that material 3 is disposed at the both sides of the docking section J1 that is engaged hardware 1, the first outstanding material 2 and the second outstanding material 3 are engaged in to (1-3) welding operation that is engaged hardware 1 temporarily by welding, (1-4) that be engaged hardware 1 and be arranged on the stand of not shown friction agitating device arranged to operation.
(1-1) docking operation
In docking operation, as shown in Figures 2 and 3, the end face 11b of the second hardware 1b is connected airtight in the end face 11a of the first hardware 1a.Again, the surperficial 12a of the first hardware 1a flushes with the surperficial 12b of the second hardware 1b, and the back side 13a of the first hardware 1a flushes with the back side 13b of the second hardware 1b.Again, similarly, the first side 14a of the first hardware 1a flushes with the first side 14b of the second hardware 1b, and the second side 15a of the first hardware 1a flushes with the second side 15b of the second hardware 1b.
And, surface A is formed by the surperficial 12a of the first hardware 1a and the surperficial 12b of the second hardware 1b, back surface B is formed by the back side 13a of the first hardware 1a and the back side 13b of the second hardware 1b, the first side C is formed by the first side 14a of the first hardware 1a and the first side 14b of the second hardware 1b, and the second side D is formed by the second side 15a of the first hardware 1a and the second side 15b of the second hardware 1b.
(1-2) outstanding material arrangement step
In outstanding material arrangement step, as shown in Fig. 2 (b), first side C side configuration the first outstanding material 2 at docking section J1, makes its bearing surface 21 be connected to the first side C.And, the second outstanding material 3 is disposed to the second side D of docking section J1, make its bearing surface 31 be connected to the second side D.Now, as shown in Fig. 3 (b), the surface 32 of the surface 22 of the first outstanding material 2 and the second outstanding material 3 flushes with the surface A that is engaged hardware 1, and the back side 33 of the back side 23 of the first outstanding material 2 and the second outstanding material 3 flushes with the back surface B that is engaged hardware 1 simultaneously.
(1-3) welding operation
In welding operation, as shown in Fig. 2 (a) and Fig. 2 (b), by being engaged hardware 1 and the first outstanding material 2 formed inner side bight 2a, 2b is fused and make to be engaged hardware 1 and engage with the first outstanding material 2 works temporarily.And, by being engaged hardware 1 and the second outstanding material 3 formed inner side bight 3a, 3b is fused and make to be engaged hardware 1 and engage with the second outstanding material 3 works temporarily.And, can cross over the total length of inner side bight 2a, 2b and bight, inner side 3a, 3b and implement continuously welding, implement intermittently welding and also can.
(1-4) operation is set
In operation is set, the hardware 1 that is engaged after the outstanding material 2 of interim welding first and the second outstanding material 3 is loaded on the stand of not shown friction agitating device, for example use fixture (clamp) and be constrained to and can not move.The described friction agitating device of this example is for rubbing and stir the device set from being engaged the top of hardware 1.
And, in the first preparatory process, in the situation that omitting welding operation, also can on the stand of not shown friction agitating device, implement docking operation and outstanding material arrangement step.
(2) first front travels
The in advance operation of the first front travel for carrying out before the first formal bonding process, in this example, comprising: formation operation in hole under (2-4) of the starting position of the friction stirring that make to be engaged in surface A side (2-1) second outstanding material bonding process, (2-2) the interim bonding process that engages the docking section J1 that is engaged hardware 1 that hardware 1 engages with the docking section J3 of the second outstanding material 3, make to be engaged (2-3) first outstanding material bonding process that hardware 1 engages with the docking section J2 of the first outstanding material 2, lower hole is formed to the first formal bonding process.
In the first front travel, as shown in Figure 6, make interim a joint with throw F move and form continuous motion track, for docking section J3, J1, the J2 stirring that rubs continuously.That is, make to insert the starting position S that friction is stirred p1interim joint with the stirring pin F2 (with reference to Fig. 4 (a)) of throw F, do not depart from halfway and move to end position E p1till.And, in this example, although the starting position S that friction is stirred p1be located at the second outstanding material 3, by end position E p1be located at the first outstanding material 2, but starting position S p1with end position E p1position indefinite.
The program that friction in first front travel of this example is stirred is described in more detail with reference to Fig. 5 and Fig. 6.
First, as shown in Fig. 5 (a), make the interim starting position S that is positioned at the suitable position that is arranged on the second outstanding material 3 with throw F that engages p1directly over, then make interim engage to decline and stirring is sold to F2 with right rotation limit, throw F limit be pressed on starting position S p1on.Although interim, engaging by the rotary speed of throw F and set corresponding to stirring the material that is engaged hardware 1 etc. of size, the shape of pin F2, the stirring that rubs and thickness etc., is to be set in the scope of 500～2000 (rpm) in most situation.
When stirring pin F2 and contact with the surface 32 of the second outstanding material 3, by frictional heat, make to stir pin F2 plastic deformation liquidation around, as shown in Fig. 5 (b), stir and sell F2 and be inserted into second and give prominence to material 3.
Stir the comprehensive engagement of lower surface F11 that pin F2 all enters the second outstanding material 3 and shoulder F1 behind the surface 32 of the second outstanding material 3, as shown in Figure 6, interim joint with throw F rotation and to the second starting point s2 that gives prominence to material bonding process relatively moved.
Interim joint by the translational speed (transporting velocity) of throw F although set corresponding to stirring the material that is engaged hardware 1 etc. of size, the shape of pin F2, the stirring that rubs and thickness etc. is to be set in the scope of 100～1000 (mm/ divides) in most situation.Rotary speed when engaging rotary speed while moving with throw F temporarily and inserting is identical or lower than it.And, when making to engage temporarily and moving with throw F, although the axis of shoulder F1 with respect to plumb line and tilt a little towards the rear of direct of travel, is vertical if do not tilt, interim joint by the direction of throw F changed easily, can do complicated action.Make to engage while moving with throw F, the metal of the surrounding of its stirring pin F2 is Plastic Flow successively temporarily, and on the position from stirring pin F2 separation, the metal of Plastic Flow hardens once again simultaneously.
Make to engage with throw F temporarily and relatively move and rub continuously and stir until the starting point s2 of the second outstanding material bonding process makes interim joint not depart from throw F and travels to the second outstanding material bonding process at starting point s2.
(2-1) the second outstanding material bonding process
In the second outstanding material bonding process, for the second outstanding material 3 and the docking section J3 that is engaged hardware 1 stirring that rubs.Particularly, the path (route) that friction is stirred is set in the seam (boundary line) that is engaged hardware 1 and the second outstanding material 3, by make interim joint relatively move with throw F along this path, for the docking section J3 stirring that rubs.And, in this example, interim joint with throw F do not departed from and from the first starting point s2 that gives prominence to material bonding process e2 stirring that rubs continuously to terminal on the way.
And, interim joint done in the situation of right rotation with throw F, because interim joint has with the left side of the direct of travel of throw F the possibility that produces fine cavity blemish, therefore preferably set the second outstanding starting point s2 of material bonding process and position of terminal e2, make to be engaged hardware 1 and be positioned at the right side that interim joint is used the direct of travel of throw F.So, because cavity blemish is difficult to result from, be engaged hardware 1 side, and can obtain high-quality conjugant.
In addition, when making interim joint with throw F anticlockwise, because interim joint has with the right side of the direct of travel of throw F the possibility that produces fine cavity blemish, therefore preferably set the position of the Origin And Destination of the second outstanding material bonding process, make to be engaged hardware 1 and be positioned at the left side that interim joint is used the direct of travel of throw F.Particularly, although not shown, the terminal e2 in the time of starting point can being arranged to interim joint and doing right rotation with throw F, the position of starting point s2 when terminal is arranged to interim joint and does right rotation with throw F.
And, when interim joint enters docking section J3 with the stirring pin F2 of throw F, although wish gives prominence to by being engaged hardware 1 and second the power generation effect that material 3 is pulled away from, but owing to being engaged hardware 1, by welding, do interim joint with the second outstanding material 3 formed inner side bight 3a, 3b (with reference to Fig. 2), so be engaged between hardware 1 and the second outstanding material 3, can not produce perforate.
(2-2) interim bonding process
Interim engage with throw F, arrive the terminal e2 of the second outstanding material bonding process after, in terminal e2 friction, stir and do not finish and rub continuously and stir until the starting point s1 of bonding process temporarily, and travel to interim bonding process with this state.; till from the terminal e2 of the second outstanding material bonding process to the starting point s1 of interim bonding process; interim joint do not depart from and the stirring that continues rub with throw F, and at starting point s1, and joint does not depart from throw F and travels to interim bonding process temporarily.So, at the terminal e2 of the second outstanding material bonding process, do not need to carry out the interim separating operation engaging with throw F, and because the starting point s1 in interim bonding process does not need to carry out the interim insertion operation engaging with throw F, so can make preparatory joint operating efficiency, fast.
In this example, the outstanding material 3 of path setting to the second that will stir to the friction of the starting point s1 of interim bonding process from the terminal e2 of the second outstanding material bonding process, gives prominence to material 3 by making the interim motion track engaging while moving to the starting point s1 of interim bonding process with throw F from the terminal e2 of the second outstanding material bonding process be formed at second.So, the operation of starting point s1 that moves to interim bonding process from the second terminal e2 that gives prominence to material bonding process, owing to being engaged hardware 1, be difficult to produce cavity blemish, can obtain high-quality conjugant.
In interim bonding process, for the docking section J1 (with reference to Fig. 6) that is engaged hardware 1 stirring that rubs.Particularly, set the path that friction is stirred the seam (boundary line) that is engaged hardware 1 is upper, by make interim joint relatively move with throw F along this path, cross the total length of docking section J1 and the stirring that rubs continuously.And in this example, interim joint with throw F do not depart from and halfway from the starting point s1 of the interim bonding process e1 stirring that rubs continuously to terminal.
After engaging temporarily and arriving the terminal e1 of interim bonding process with throw F, in terminal e1 friction, stir and do not finish and rub continuously and be stirred to the terminal s3 of the first outstanding material bonding process, state travels to first and gives prominence to material bonding process according to this.; interim joint with throw F do not depart from and stirrings that rub continuously from the starting point s3 of the outstanding material bonding process of terminal e1 to the first of interim bonding process, and joint does not depart from and travels to first and give prominence to material bonding process at starting point s3 with throw F temporarily.
In this example, the outstanding material 2 of path setting to the first that the friction of the starting point s3 of the outstanding material bonding process of the terminal e1 to the first of interim bonding process is stirred, gives prominence to material 2 by making the interim motion track engaging while moving to the starting point s3 of the first outstanding material bonding process with throw F from the terminal e1 of interim bonding process be formed at first.So, at the terminal e1 from interim bonding process, move to the operation of starting point s3 of the first outstanding material bonding process, owing to being engaged hardware 1, be difficult to produce cavity blemish, can obtain high-quality conjugant.
(2-3) the first outstanding material bonding process
In the first outstanding material bonding process, for being engaged hardware 1 and the first docking section J2 that gives prominence to material 2 stirring that rubs.Particularly, set the path that friction is stirred the seam (boundary line) that is engaged hardware 1 and the first outstanding material 2 is upper, by make interim joint relatively move with throw F along this path, for the docking section J2 stirring that rubs.And in this example, interim joint with throw F on the way do not depart from and from the first starting point s3 that gives prominence to material bonding process e3 stirring that rubs continuously to terminal.
And, owing to making interim joint do right rotation with throw F, so set the first outstanding starting point s3 of material bonding process and position of terminal e3, make to be engaged hardware 1 and be positioned at the right side that interim joint is used the direct of travel of throw F.So, owing to being difficult to produce cavity blemish being engaged hardware 1 side, can obtain high-quality conjugant.In addition, engaging do anticlockwise with throw F in the situation that temporarily, preferably setting the position of the Origin And Destination of the first outstanding material bonding process, making to be engaged hardware 1 and be positioned at interim joint with the left side of the direct of travel of throw F.Particularly, although not shown, the position of the terminal e3 in the time of starting point can being arranged to interim joint and doing right rotation with throw F, the position of starting point s3 when terminal is arranged to interim joint and does right rotation with throw F.
And, when interim joint enters docking section J2 with the stirring pin F2 of throw F, although wish gives prominence to by being engaged hardware 1 and first the power generation effect that material 2 is pulled away from, but owing to being engaged hardware 1, by welding, do interim joint with the first outstanding material 2 formed inner side bight 2a, 2b (with reference to Fig. 2), so be engaged between hardware 1 and the first outstanding material 2, can not produce perforate.
After interim joint arrives the terminal e3 of the first outstanding material bonding process with throw F, in terminal e3 friction stirring, do not finish and rub continuously and stir until be located at the end position E of the first outstanding material 2 p1till.And, in this example, on the extended line of the seam (boundary line) presenting in the surface A side that is engaged hardware 1, end position E is set p1.In addition, end position E p1also be the starting position S that the friction in the described later first formal bonding process is stirred m1.
Interim joint with throw F, arrive end position E p1afterwards, make interim joint with rising on rotation limit, throw F limit make to stir pin F2 from end position E p1depart from.
(2-4) lower hole forms operation
Then, implement lower hole and form operation.Lower hole forms operation as shown in Fig. 4 (b), and its starting position of stirring for the friction in the first formal bonding process forms the operation of lower hole P1.Lower hole in the first front travel forms in operation, at the S that is set in the surface 22 of the first outstanding material 2 m1form lower hole P1.
The object that lower hole P1 arranges is in order to lower the insertion impedance (being pressed into impedance) of the stirring pin G2 of throw G for formal joint, in this example, formed punching H1 when interim stirring pin F2 (with reference to Fig. 4 (a)) disengaging engaging with throw F is done to reaming with not shown drilling tool etc. and form.If utilize punching H1,, owing to can simplifying the formation operation of lower hole P1, the activity duration can be shortened.Although there is no particular restriction for the form of lower hole P1, in this example, be cylindric.And in this example, although hole P1 under the first outstanding material 2 forms, but there is no particular restriction in the position of lower hole P1, being formed at the second outstanding material 3 also can, although can be formed on docking section J2, J3, but preferably, as this example is formed on the extended line that is engaged the seam that is engaged hardware 1 (boundary line) that the surface A side of hardware 1 occurs.
And, in this example, although be to take will to engage that punching H1 with the stirring pin F2 (with reference to Fig. 4 (a)) of throw F does reaming and the situation that forms lower hole P1 is example temporarily, stirring the maximum outside diameter X that sells F2 2than the formal minimum outer diameter Y engaging with the stirring pin G2 of throw G 3also large, and stir the maximum outside diameter X that sells F2 2than the formal maximum outside diameter Y engaging with the stirring pin G2 of throw G 2also little (Y 3< X 2< Y 2) time etc. situation under, also the punching H1 that stirs pin F2 directly can be formed to lower hole P1.
(3) first formal bonding processs
The first formal bonding process is to make to be engaged the operation that the docking section J1 of the surface A side of hardware 1 engages veritably.In the first formal bonding process of this example, use the formal joint throw G as shown in Fig. 4 (b), to the docking section J1 under interim engagement state from being engaged the stirring that rubs of the surface A side of hardware 1.
In the first formal bonding process, as shown in Fig. 7 (a)～Fig. 7 (c), make formal joint with the stirring pin G2 insertion (being pressed into) of throw G be formed at starting position S m1lower hole P1, the stirring pin G2 of insertion does not depart from halfway and moves to end position E m1.That is, in the first formal bonding process, from lower hole P1, start friction and stir, and rub continuously, stir until end position E m1till.
In this, the time point finishing at the first front travel, owing to possessing the friction agitating device of interim joint with throw F and be positioned at the end position E of the first outstanding material 2 p1directly over (with reference to Fig. 6), so if the starting position of the first formal bonding process is S m1, mobile possess formal joint and can carry out the first formal bonding process with the friction agitating device of throw G, can omit operation.
And, in this example, although the starting position S that friction is stirred is set on the first outstanding material 2 m1, on the second outstanding material 3, end position E is set m1, but starting position S m1with end position E m1position indefinite.
With reference to Fig. 7 (a)～7 (c), illustrate in greater detail the first formal bonding process.
First, as shown in Fig. 7 (a), make formal joint be positioned at lower hole P1 (starting position S with throw G m1) directly over, then make formal engage with throw G limit do that right rotation limit declines and the front end that makes to stir pin G2 insert under hole P1.When stirring pin G2 enters lower hole P1, the side face (side) that stirs pin G2 is connected to the hole wall of lower hole P1, and metal starts plastification from hole wall and flows.During as state for this reason, the mobile metal of plastification is pressed and is moved back at the side face that stirs pin G2, because being pressed into lower, stirring pin G2 is being pressed into the impedance that is pressed into of initial stage simultaneously, again, the formal shoulder G1 engaging with throw G be connected to first give prominence to the surface 22 of material 2 before, stir pin G2 and be connected to lower hole P1 and produce frictional heat, therefore can foreshorten to the time of Plastic Flow.That is, the load of friction agitating device can be lowered, the needed activity duration of formal bonding process can be shortened in addition.
Stir pin G2 and all enter the first lower surface G11 comprehensive engagement of giving prominence to material 2 and shoulder G1 after the surface 22 of the first outstanding material 2, as shown in Fig. 7 (b), limit rubs and stirs limit formal joint relatively moved towards the one end that is engaged the docking section J1 of hardware 1 with throw G, and, crosscut docking section J2 and charge into docking section J1.When making formally to engage while moving with throw G, it stirs pin G2 metal around Plastic Flow successively, on the position from stirring pin G2 separation, the metal of Plastic Flow hardens once again and forms plastification region (hereinafter referred to as " face side plastification region W1 ") simultaneously.
Formal joint by the translational speed (transporting velocity) of throw G although be to set corresponding to the material that is engaged hardware 1 etc. of the size that stirs pin G2, shape, the stirring that rubbed and thickness etc., but most in the situation that, be set in the scope of 30～300 (mm/ divides).
In the situation that enter the heat that is engaged hardware 1 have excessive possible, preferably alignment type engage surrounding with throw G from surface A side for feedwater etc. and carry out cooling.And, when cooling water enters between the first hardware 1a and the second hardware 1b, although (with reference to end face 11a, 11b and Fig. 2 (b)) has the possibility that produces oxidation overlay film on composition surface, but in this example, the inaccessible hole that is engaged 1 of hardware owing to implementing interim bonding process, so cooling water is difficult to flow into, be engaged between hardware 1, the quality at junction surface does not have deteriorated possibility.
Be engaged the docking section J1 of hardware 1, the path setting that friction is stirred is (on the motion track in interim bonding process) in the seam that is engaged hardware 1, by make formal joint relatively move with throw G along this path, from the stirring that rubs continuously of one end to the other end of docking section J1.Make the formal other end that relatively moves to docking section J1 with throw G that engages, docking section J3 is crossed in the stirring crosscut simultaneously that rubs, and state is towards end position E according to this m1relatively move.
And, in this example, due to the starting position S that friction is stirred m1be set on the extended line that is engaged the seam that is engaged hardware 1 (boundary line) that the surface A side of hardware 1 occurs, so the path of the friction stirring in the first formal bonding process can become a straight line.If the path that friction is stirred becomes a straight line, owing to can will formally engaging and be suppressed to Min. by the displacement of throw G, thus can effectively carry out the first formal bonding process, and, can lower the abrasion loss of throw G for formal joint.
Formal joint with throw G, arrive end position E m1time, as shown in Fig. 7 (c), make formally to engage with rising on rotation limit, throw G limit, and make to stir pin G2 from end position E m1(with reference to Fig. 7 (b)) departs from.And, at end position E m1upper, if stir pin G2, depart to top, although inevitably form the punching Q1 approximately identical shaped with stirring pin G2, in this example, still retain.
Formal joint with the stirring pin G2 of throw G from end position E m1the rotary speed that formal joint when disengaging uses the rotary speed (rotary speed during disengaging) of throw G to can be compared to while moving is most also high.So, the rotary speed when departing from and the identical situation of rotary speed when mobile are compared, owing to stirring the disengaging impedance of pin G2 little, can promptly carry out end position E m1the separating operation of the stirring pin G2 at place.
And, in this example, be to carry out the first front travel before the first formal bonding process, yet, also can omit the first front travel and after the first preparatory process, directly carry out the first formal bonding process.
(4) second preparatory process
The preparatory process of the second preparatory process for carrying out before the second front travel.In this example, possess operation is set again, the back surface B side that is engaged hardware 1, towards top, and is arranged to not shown friction agitating device once again.
(4-1) operation is set again
Arranging again in operation, in releasing, completing after the constraint that is engaged hardware 1 of the first formal bonding process, by being engaged surface and the back side reversion of hardware 1, making back surface B side towards top, and be arranged at once again on the stand of friction agitating device.In this example, as shown in Figure 1, make to be engaged hardware 1 and do half rotation around antero posterior axis, make to be engaged surface and the back side reversion of hardware 1.
In this, Fig. 8 (a) arranges after operation for the second preparatory process at the first example again, the cutaway view from docking section J1 towards the first hardware 1a side.As shown in Fig. 8 (a), in arranging again in operation, be engaged hardware 1 above become back surface B time, when from J1 side, docking section to the first hardware 1a, the first outstanding material 2 is positioned at the left side that is engaged hardware 1, and the second outstanding material 3 is positioned at the right side that is engaged hardware 1.
And, according to the form of friction agitating device, also can not remove and be engaged the constraint of hardware 1 and surface of revolution and the back side.
(5) second front travels
The second front travel is the operation of carrying out before the second formal bonding process, comprising: B side makes to be engaged (5-1) first outstanding material bonding process, (5-2) the interim bonding process that engages the docking section J1 that is engaged hardware 1 that hardware 1 engages with the docking section J2 of the first outstanding material 2, makes to be engaged (5-3) second that hardware 1 engages with the docking section J3 of the second outstanding material 3 and give prominence to material bonding process, lower hole be formed to formation operation in hole under (5-4) of starting position of friction stirring of the second formal bonding process overleaf.And, in (5-1) first outstanding material bonding process, (5-2) interim bonding process and (5-3) in the second outstanding material bonding process, use the interim throw F that engages.
(5-1) the first outstanding material bonding process, (5-2) interim bonding process and (5-3) the second outstanding material bonding process
(5-1) the first outstanding material bonding process, (5-2) interim bonding process and (5-3) the second outstanding material bonding process be and (2-3) first outstanding material bonding process, (2-2) interim bonding process of the first above-mentioned front travel and the operation that (2-1) the second outstanding material bonding process is rough identical.As shown in Fig. 8 (b), make interim a joint with throw F move and form continuous motion track, with the stirring that rubs continuously of the order of docking section J2, J1, J3.That is, insert the starting position S that friction is stirred p2interim joint with the stirring pin F2 (with reference to Fig. 4 (a)) of throw F, do not depart from halfway and move to end position E p2, and implement continuously (5-1) first outstanding material bonding process, (5-2) interim bonding process and (5-3) the second outstanding material bonding process.And, end position E p2the starting position S of the second formal bonding process of implementing after becoming m2.
In this, in the first front travel, as shown in Figure 6, from the second outstanding material 3 sides, carry out successively (2-1) second outstanding material bonding process, (2-2) interim bonding process and (2-3) the first outstanding material bonding process.On the other hand, in the second front travel, when from docking section J1 during towards hardware 1a side, when the first outstanding material 2 is positioned at the left side that is engaged hardware 1, the time point finishing in the first formal bonding process, owing to possessing the friction agitating device of formal joint with throw G and be positioned at the top of the first outstanding material 2, so carry out successively (5-1) first outstanding material bonding process, (5-2) interim bonding process and (5-3) the second outstanding material bonding process from the first outstanding material 2 sides.So, owing to possessing interim joint, by the displacement of the friction agitating device of throw F, diminish, can make operation laborsaving.
And, (5-1) the first outstanding material bonding process, (5-2) interim bonding process and (5-3) the second outstanding material bonding process detailed description due to the first front travel identical omission generally.
(5-4) lower hole forms operation
Lower hole forms operation as shown in Fig. 9 (a), and it is the starting position S that the friction in the second formal bonding process is stirred m2form the operation of lower hole P2.That is, lower hole forms operation for forming the operation of lower hole P2 with the insertion precalculated position of the stirring pin G2 of throw G at formal joint.Can lower by this insertion impedance (being pressed into impedance) of the stirring pin G2 of throw G for formal joint.
And, because forming operation, (5-4) lower hole generally equates with (2-4) lower hole formation operation of the first front travel, therefore describing in detail, it omits.
(6) second formal bonding processs
The second formal bonding process is the operation that the docking section J1 that is engaged the back surface B side of hardware 1 makees real joint.In the second formal bonding process of this example, use formal joint to use throw G, and to the docking section J2 of interim engagement state from being engaged the stirring that rubs of the back surface B side of hardware 1.
The second formal bonding process, as shown in Fig. 9 (a) and Fig. 9 (b), inserts by the stirring pin G2 formally engaging with throw G the S that (being pressed into) is set in the back side 33 of the second outstanding material 3 m2, the stirring pin G2 of insertion does not depart from halfway and moves to end position E m2.In the second formal bonding process, from the lower hole P2 stirring that starts to rub, rub continuously and stir until end position E m2.That is, the starting position S of the second formal bonding process m2be positioned at the end position E of the first formal bonding process m1the top of side.When making formally to engage while moving with throw G, it stirs pin G2 metal around successively when Plastic Flow, on the position departing from from stirring pin G2, the metal of Plastic Flow hardens once again and forms plastification region (hereinafter referred to as " rear side plastification region W2 ").
In this, the time point finishing at the second front travel, owing to possessing the friction agitating device of interim joint with throw F and be positioned at the end position E of the second outstanding material 3 p2directly over (with reference to Fig. 8 (b)), so as the starting position S of the second formal bonding process m2while being set in the top of the second outstanding material 3, mobile possess formal joint and can carry out the first formal bonding process with the friction agitating device of throw G, can omit operation.
About the second formal bonding process, due to generally identical with the first formal bonding process, omit detailed explanation.And, although carry out the second front travel in this example, also can omit the second front travel and after the first formal bonding process, directly carry out the second formal bonding process.
(7) outstanding material excision operation
In outstanding material excision operation, the first outstanding material 2 and the second outstanding material 3 are excised from being engaged hardware 1.In this example, the hardware 1 that is engaged that completes the second formal bonding process is removed from the stand of friction agitating device temporarily, use not shown cutting instrument and along docking section J2, J3 excision the first outstanding material 2 and the second outstanding material 3.Now, preferably remove the burr that are formed at the surface A and the back surface B that are engaged hardware 1.By this, when carrying out (8-1) described later outstanding material arrangement step, can make the first outstanding material 2 ' and the second outstanding material 3 ' connect airtight in being engaged hardware 1.
Figure 10 is the stereogram that is engaged hardware 1 of giving prominence to after material excision operation.As shown in figure 10, face side plastification region W1 and rear side plastification region W2 cross the second side D side and form continuously from the first side C side.On the other hand, between face side plastification region W1 and rear side plastification region W2, form from the first side C side and be across to the second side D side and the continuous small gap (not junction surface) forming.
In this, on face side plastification region W1 and rear side plastification region W2, at formal direct of travel (the reference arrow V engaging with throw G 1, V 2) left side,, on the second hardware 1b, from the first side C side, be across to the second side D side and produce continuously cavity blemish R 1, R 2.
(8) the 3rd preparatory process
The 3rd preparatory process is when the first side C side rubs stirring, the preparatory process of preparing abutting member (the first outstanding material 2 ', the second outstanding material 3 '), the starting position and the end position that are engaged the friction stirring of hardware 1 are located in abutting member.The 3rd preparatory process, in this example, comprising: be engaged the outstanding material 2 ' of both sides configuration first of docking section J1 of hardware 1 and (8-1) outstanding material arrangement step of the second outstanding material 3 ', by the first outstanding material 2 ' and second give prominence to material 3 ' by welding, be engaged in be temporarily engaged (8-2) welding operation of hardware 1, (8-3) of the first side C on the stand that is arranged at not shown friction agitating device above that is engaged hardware 1 arranges operation again.
(8-1) outstanding material arrangement step
In outstanding material arrangement step, as shown in figure 11, complete being engaged in hardware 1 of the second formal bonding process, at the outstanding material 3 ' of surface A configuration second and cover docking section J1, make its bearing surface 31 ' be connected to surface A.And, the first outstanding material 2 ' is disposed to back surface B side and covers docking section J1, make its bearing surface 21 ' be connected to back surface B.Now, identical with (1-2) outstanding material arrangement step, the first outstanding material 2 ' flushes with the first side C and the second side D with surface and the back side of the second outstanding material 3 '.
(8-2) welding operation
In welding operation, as shown in figure 11, will be engaged hardware 1 and the first outstanding material 2 ' formed inner side bight 2a ', 2b ' welding and engage and be engaged hardware 1 and give prominence to material 2 ' with first.And, will be engaged hardware 1 and the second outstanding material 3 ' formed inner side bight 3a ', 3b ' welding and engage and be engaged hardware 1 and give prominence to material 3 ' with second.
(8-3) operation is set again
In arranging again in operation, as shown in figure 11, made the first side C that is engaged hardware 1 of welding operation towards above time, during from docking section J1 towards the first hardware 1a, to be engaged hardware 1 constraint and be arranged at once again on the stand of friction agitating device, making the second outstanding material 3 ' be positioned at left side.
(9) the 3rd front travels
The 3rd front travel possesses (9-1) lower hole and forms operation, and it is before the 3rd formal bonding process, and the starting position of stirring in friction forms lower hole.
(9-1) lower hole forms operation
Lower hole forms operation, and as shown in figure 11, it is the starting position S that the friction in the 3rd formal bonding process is stirred m3form the operation of lower hole P3.That is, it is identical with above-mentioned lower hole formation operation that lower hole forms operation, is that lower hole P3 is formed to the operation in the insertion precalculated position of the stirring pin G2 of throw G for formal joint.By this, can reduce the insertion impedance (being pressed into impedance) of the stirring pin G2 of throw G for formal joint.(9-1) lower hole forms operation because (2-4) with the first front travel lower hole formation operation is generally identical, and description is omitted.
(10) the 3rd formal bonding processs
The 3rd formal bonding process is for engaging the operation of the docking section J1 at the first C side place, side that is engaged hardware 1.In the 3rd formal bonding process of this example, as shown in FIG. 11 and 12, use formal joint to use throw G, will be formally engage stirring pin G2 with throw G and insert (being pressed into) and be formed at second and give prominence to the lower hole P3 on the surface 32 ' of material 3 ', the stirring pin G2 of insertion does not on the way depart from and moves to end position E m3(with reference to direct of travel V 3).That is, the starting position S of the 3rd formal bonding process m3be positioned at the starting position side of the first formal bonding process (with reference to direct of travel V 1).
When formal joint moves with throw G, it stirs in turn Plastic Flow of pin G2 metal around, on the position from stirring pin G2 separation, the metal of Plastic Flow hardens once again and forms plastification region (hereinafter referred to as " the first plastification region, side W3 ") simultaneously.When rubbing, be stirred to end position E m3time, as shown in figure 13, although form punching Q3 on the surface of the first outstanding material 2 ', in this example, still retain.
In this, the time point finishing in the second formal bonding process, as shown in Fig. 9 (b), possesses interim joint and with the friction agitating device of throw F, is positioned at the top of the first outstanding material 2.Therefore, as shown in figure 12, when the starting position of the 3rd formal bonding process is set in the top of the second outstanding material 3 ', can move and possess formal joint and carry out the 3rd formal bonding process with the friction agitating device of throw G, can omit operation.The detailed description of the 3rd formal bonding process and the first formal bonding process are generally identical and omit.
As shown in figure 13, when carrying out the 3rd formal bonding process, a part for the first side C side of face side plastification region W1 and rear side plastification region W2 and the first side plastification region W3 repeat.That is, the stirring that rubs once again of the part by face side plastification region W1 and rear side plastification region W2, the cavity blemish R of the first side C side 1and cavity blemish R 2at least a portion by the first side plastification region W3, disconnected.By this, respectively at cavity blemish R 1and cavity blemish R 2upper formation filling part S 1, S 2.
And, in this example, before carrying out the 3rd formal bonding process, although carry out the 3rd preparatory process and the 3rd front travel, but omit the 3rd preparatory process and the 3rd front travel (but arranging except operation again), after the second formal bonding process, directly carry out the 3rd formal bonding process and also can.
Before the 3rd formal bonding process, carry out the first above-mentioned outstanding material bonding process, interim bonding process and the second outstanding material operation and also can again.
(11) the 4th preparatory process
The 4th preparatory process is the operation of carrying out before the 4th formal bonding process, in this example, it possess be engaged hardware 1 the second side D side towards top, (11-1) that be arranged at once again on not shown fixture arranges operation again.
(11-1) operation is set again
In arranging again in operation, in releasing, complete after the constraint that is engaged hardware 1 of the 3rd formal bonding process, by being engaged surface and the back side reversion of hardware 1, make the second side D side towards top, and be arranged at once again not shown friction, stir on the stand of dress.In this example, as shown in figure 12, make to be engaged hardware 1 and do half rotation around Y-axis, make to be engaged surface and the back side reversion of hardware 1.By this, as shown in figure 14, be engaged hardware 1 above become the second side D time, if from docking section J1 towards the second hardware 1b, the first outstanding material 2 ' is positioned at right side.
And, according to the difference of friction agitating device, also can not remove being engaged the constraint of hardware 1 and surface and the back side are rotated.
(12) the 4th front travels
The operation of the 4th front travel for carrying out before the 4th formal bonding process, possesses in the second side D side, and (12-1) lower hole that the starting position of stirring in the friction of the 4th formal bonding process forms lower hole forms operation.
(12-1) lower hole forms operation
Lower hole forms operation, and as shown in Figure 14 (a), it is the starting position S that the friction in the 4th formal bonding process is stirred m4form the operation of lower hole P4.By this, can lower the insertion impedance (being pressed into impedance) of the stirring pin G2 of throw G for formal joint.
And, because (2-4) lower hole formation operation of (12-1) lower hole formation operation and the first front travel is generally identical, omit detailed explanation.
(13) the 4th formal bonding processs
The 4th formal bonding process is for engaging the operation of the docking section J1 at the second D side place, side that is engaged hardware 1.In the 4th formal bonding process of this example, use formal joint to use throw G, from being engaged the stirring that rubs of the second side D side of hardware 1.
The 4th formal bonding process, as shown in Figure 14 (a), inserts by the stirring pin G2 formally engaging with throw G the starting position S that (being pressed into) is set in the first outstanding material 2 ' m4, the stirring pin G2 of insertion does not depart from halfway and moves to end position E m4.In the 4th formal bonding process, from the lower hole P4 stirring that starts to rub, rub continuously and stir until end position E m4.That is, the starting position S of the 4th formal bonding process m4be positioned at the starting position E of the second formal bonding process m1side is (with reference to direct of travel V 2).When making formally to engage while moving with throw G, as shown in Figure 14 (b), it stirs pin G2 metal around successively when Plastic Flow, on the position departing from from stirring pin G2, the metal of Plastic Flow hardens once again and forms plastification region (hereinafter referred to as " the second side plastification region W4 ").
The time point finishing in the 3rd formal bonding process, as shown in figure 13, possesses formal joint and with the friction agitating device of throw G, is positioned at the top of the first outstanding material 2 '.Then, in (11-1), arrange after operation, by rotating around Y-axis half, this friction agitating device is positioned at the top of the first outstanding material 2 ' again.Therefore, when the starting position of the 4th formal bonding process is set in the top of the first outstanding material 2 ', can move and possess formal joint and carry out the 4th formal bonding process with the friction agitating device of throw G, can omit operation.
As shown in Figure 14 (b), when carrying out the 4th formal bonding process, a part for the second side D side of face side plastification region W1 and rear side plastification region W2 and the second side plastification region W4 repeat.That is, the stirring that rubs once again of the part by face side plastification region W1 and rear side plastification region W2, the cavity blemish R of the second side D side 1and cavity blemish R 2at least a portion by the second side plastification region W4, disconnected.By this, respectively at cavity blemish R 1and cavity blemish R 2upper formation filling part S 3, S 4.
And, also can before carry out the 4th formal bonding process, omit lower hole and form operation (12-1), after the 3rd formal bonding process, just directly carry out the 3rd formal bonding process.Also can, before the 4th formal bonding process, carry out the first above-mentioned outstanding material bonding process, interim bonding process, the second outstanding material bonding process again.
(14) outstanding material excision operation
In outstanding material excision operation, after the 4th formal bonding process finishes, the first outstanding material 2 ' and the second outstanding material 3 ' are excised to (with reference to Fig. 1) from being engaged hardware 1.Now, preferably remove to be formed at and be engaged the first side C of hardware 1 and the burr of the second side D.
According to the joint method of described above example, as shown in Figure 1, even if the thickness of the first hardware 1a and the second hardware 1b is large, by the stirring that rubs in the first side C and the second side D, also can bury continuous gap (with reference to the gap 119 of Figure 30) underground from the first C to the second side, side D.
Again, in the situation that formal, engage and set above-mentioned state for direction of rotation and the direct of travel of throw G, on face side plastification region W1 and rear side plastification region W2, even cross to the second side D and form continuous cavity blemish R from the first side C 1, R 2, by by the starting position S of the 3rd formal bonding process m3be located at the starting position S of the first formal bonding process m1side, by the starting position S of the 4th formal bonding process m4be set in the starting position S of the second formal bonding process m2side and the stirring that rubs also can form cavity blemish R 1, R 2the filling part S disconnecting respectively 1to S 4.
; in this example; formally engage by the direction of rotation of throw G owing to all setting right rotation for; the possibility that cavity blemish R results from the direct of travel left side of face side plastification region W1 and rear side plastification region W2 uprises, and the right side of direct of travel forms the higher plastification region of density.Utilize the characteristic that so friction is stirred, as shown in Fig. 1 (a) and Fig. 1 (b), at cavity blemish R 1, R 2be formed in the situation that the possibility of the second hardware 1b uprises, the formal joint of the 3rd formal bonding process and the 4th formal bonding process is set foregoing state for the starting position of throw G, by this cavity blemish R 1, R 2two ends can be disconnected by the higher plastification region of density.By this, can manufacture watertightness between the first side C and the second side D and air-tightness higher be engaged hardware 1.
In this, when throw G crosscut docking section J1, J2 for formal joint, plastification region W 1and even W 4may form oxidation overlay film.For example, as shown in Fig. 7 (b), when being engaged hardware 1 and rub and stir to the second outstanding material 3, when docking section J3 is crossed in crosscut, give prominence to formed oxidation overlay film between material 2 and can be involved in face side plastification region W1 side being engaged hardware 1 and first.If formal, engage and do right rotation with throw G, being oxidized overlay film, to be formed at the possibility on direct of travel right side of face side plastification region W1 high, if anticlockwise, the possibility being formed on the left of the direct of travel of face side plastification region W1 is high.
But, according to this example, due to plastification region W 1and even W 4both ends repeat, disconnect oxidation overlay film, can manufacture high-quality goods.
And, in this example, although carry out as previously mentioned the second outstanding material bonding process, interim bonding process and the first outstanding material bonding process, be not limited thereto.For example, needn't carry out continuously the stirring that also can rub intermittently of each operation.In this example, although use a pair of outstanding material to carry out interim bonding process and formal bonding process, do not use outstanding material and the stirring that rub also can again.Again, in this example, although directly carry out the first formal bonding process after the first front travel, after the first front travel, carry out after the second front travel, carry out continuously the first formal bonding process and the second formal bonding process also can.
As previously mentioned, the invention is characterized in: when stirring by friction and engage on outer Thursday of the limit that is engaged hardware 1, suitably set respectively formal direction of rotation and the direct of travel engaging with throw G.That is,, when the stirring that rubs, preferably consider to produce the high position of possibility of cavity blemish R and set direction of rotation and the direct of travel of throw G for formal joint.In the first example, although explain by the situation that throw G all does right rotation for formal joint, be not limited to this, the variation that can consider various joints with direction of rotation and the direct of travel of throw G according to formal joint.
[the second example]
For example, in the first example, although formal, engage and set for and all do right rotation by the direction of rotation of throw G, also can, as the second example, all be set as anticlockwise.
As shown in figure 15, by formally engage with the direction of rotation of throw G set for left to, be engaged the surface A of hardware 1 in direct of travel V 1on while carrying out the first formal bonding process, the second formal bonding process is end position side direction starting position side (the travel direction V from the first formal bonding process 2) and the stirring that rubs.Now, owing to formally engaging, with throw G, be anticlockwise, the possibility that cavity blemish R is formed at the direct of travel right side of face side plastification region W1 and rear side plastification region W2 uprises, and direct of travel left side forms the higher plastification region of density.That is, now easily at the first hardware 1a, form cavity blemish R 1, R 2.
Therefore, the 3rd formal bonding process is from the starting position side of the first bonding process in direct of travel V 3on the stirring that rubs.Then, the 4th formal bonding process is from the starting position side of the second bonding process in direct of travel V 4on the stirring that rubs.According to the described the 3rd formal bonding process and the 4th formal bonding process, cavity blemish R 1, R 2two ends by the stirring that rubs once again, the plastification region higher in density is disconnected.By this, owing to forming filling part S 1to S 4, air-tightness and watertightness between the first side C and the second side D can improve more.
, as shown in the first example and the second example, formally engaging is in whole equidirectional situations by the direction of rotation of throw G, the starting position that friction in the second formal bonding process is stirred is set as the end position side that the friction in the first formal bonding process is stirred, the starting position that simultaneously friction in the 3rd formal bonding process is stirred is set one of them of starting position side of the starting position side of the friction stirring in the first formal bonding process and the friction stirring of the second formal bonding process for, the starting position that friction in the 4th formal bonding process is stirred is set wherein another of starting position side of the friction stirring of starting position side that the friction in the first formal bonding process stirs and the second formal bonding process for.
[the 3rd example]
Again, for example, the joint method of the 3rd example shown in Figure 16 is with the difference of the first example: formally engaging by the direction of rotation of throw G is different directions.
The joint method of the 3rd example, in the first formal bonding process, will be formally engages and sets anticlockwise for by the direction of rotation of throw G, from first side C side direction the second side D side (with reference to direct of travel V 1') stirring rubs.
On the other hand, in the second formal bonding process, will formally engage when setting right rotation for by the direction of rotation of throw G, the starting position that friction is stirred is set in the starting position side of the first formal bonding process, from first side C side direction the second side D side (with reference to direct of travel V 2') stirring rubs.Now, be formed at the cavity blemish R of face side plastification region W1 1and the cavity blemish R that is formed at rear side plastification region W2 2easily jointly be formed on the first hardware 1a.
Therefore, the 3rd formal bonding process will formally engage and set in the situation of anticlockwise by the direction of rotation of throw G, as shown in figure 16, the starting position that friction is stirred is set the starting position side of the first formal bonding process for, from surface A side direction back surface B side (with reference to direct of travel V 3') stirring rubs.On the other hand, the 4th formal bonding process is for will formally engaging and set in the situation of right rotation by the direction of rotation of throw G, the starting position that friction is stirred is set the end position side of the first formal bonding process for, from surface A side direction back surface B side (with reference to direct of travel V 4') stirring rubs.According to the 3rd above-mentioned formal bonding process and the 4th formal bonding process, cavity blemish R 1, R 2two ends by the stirring that rubs once again, the plastification region higher in density is disconnected.By this, owing to forming filling part S 1to S 4, air-tightness and the watertightness of the first side C and the second side D side can improve more.
, as shown in figure 16, when in the first formal bonding process, make formally joint with throw G, do left-handed then set the direct of travel right side that makes the first hardware 1a be positioned at formal joint use throw G for, on the other hand, in the second formal bonding process, make formal engage to do dextrorotation then set for throw G make the first hardware 1a be positioned at formal joint with on the left of the direct of travel of throw G time, in the 3rd formal bonding process and the 4th formal bonding process, if formal, engage and do right rotation with throw G, set formal joint and use throw G, make the first hardware 1a be positioned at direct of travel right side, if formal, engage and do anticlockwise with throw G, set the formal direct of travel engaging with throw G, make the first hardware 1a be positioned at direct of travel left side, so can more improve air-tightness and the watertightness of the first side C and the second side D side.
Again, although do not illustrate particularly, but when in the first formal bonding process, make formal joint do right rotation with throw G, set for and make the first hardware 1a be positioned at the direct of travel right side that formal joint is used throw G, on the other hand, in the second formal bonding process, make formal joint with throw G, do left-handed then set for and make the first hardware 1a be positioned at formal joint with on the left of the direct of travel of throw G time, in the 3rd formal bonding process and the 4th formal bonding process, if formal, engage and do right rotation with throw G, set the formal direct of travel engaging with throw G, make the first hardware 1a be positioned at direct of travel left side, if formal, engage and do anticlockwise with throw G, set the formal direct of travel engaging with throw G, make the first hardware 1a be positioned at direct of travel right side, so can more improve air-tightness and the watertightness of the first side C and the second side D side.
In other words, at the cavity blemish R that is formed at face side plastification region W1 and rear side plastification region W2 1, R 2while being formed on the first hardware 1a, in the 3rd formal bonding process and the 4th formal bonding process, preferably set formal engage with the direction of rotation of throw G and direct of travel, make the first hardware 1a side than the second hardware 1b side with the stirring that rubs of high density more.
On the other hand, the cavity blemish R1, the R2 that are formed at face side plastification region W1 and rear side plastification region W2 are formed in the situation of the second hardware 1b, in the 3rd formal bonding process and the 4th formal bonding process, preferably set formal engage with the direction of rotation of throw G and direct of travel, make the second hardware 1b side than the first hardware 1a side with the stirring that rubs of high density more.
And the present invention can do suitable change without departing from the spirit and scope of the invention.For example,, although the friction agitating device of this example is also can from being engaged the stirring that rubs of the top of hardware, being not limited to this, be engaged hardware around, formally engaging to rub while moving with throw to stir.Again, the first hardware 1a and the second hardware 1b can be the member of hollow.
Again, in this example, as the formal bonding process in side that rubs and stir from being engaged the side of hardware 1, although be with respect to the first side C that is engaged hardware 1 rub the 3rd formal bonding process stirring, the 4th formal bonding process that rub stirring with respect to the second side D, only with respect to the stirring that rubs of the side on arbitrary limit, also can.
[the 4th example]
The joint method of the 4th example of the present invention, as shown in figure 17, the docking section J21 that is engaged hardware 201 forming with respect to the first hardware 201a is docked with the second hardware 201b is from surface A, back surface B, the first side C and the second side D stirring that rubs, the first hardware 201a and the second hardware 201b possess body with than body thin stage portion also.Then, be formed at the prolongation distance in plastification region of the first side C and the second side D also larger than the thickness of docking section J21 that is engaged hardware 201.
The first hardware 201a and the second hardware 201b, as shown in figure 18, be rough identical shaped member, possesses the stage portion R of the body Q that thickness is large and the thin thickness forming in the end of body Q.The first hardware 201a and the second hardware 201b consist of the metal material stirring that can rub such as aluminium, aluminium alloy, copper, copper alloy, titanium, titanium alloy, magnesium, magnesium alloy.
In the following description, the surface of the first hardware 201a is that surperficial 212a, the back side are that back side 213a, side are on one side that the side of side 214a and another side is side 215a.Again, the face that the surface of stage portion R is stage portion surface 217a, the end face of the stage portion R that is vertically formed with respect to stage portion surface 217a is stage portion end face 218a, stand vertically from stage portion surface 217a is vertical plane 216a.The height of stage portion end face 218a forms with p1, and the width of stage portion surface 217a forms with p2, and the height of vertical plane 216a forms with p3.
On the other hand, the surface of the second hardware 201b is that surperficial 212b, the back side are that back side 213b, side are on one side that the side of side 214b and another side is side 215b.Again, the surface of stage portion R is for stage portion surface 217b, the end face that forms vertical stage portion R with respect to stage portion surface 217b are stage portion end face 218b, the face that vertically forms from stage portion surface 217b in body Q side is vertical plane 216b.The height of stage portion end face 218b forms with q1, and the width of stage portion surface 217b forms with q2, and the height of vertical plane 216b forms with q3.
Length between the side of the first hardware 201a and the second hardware 201b forms generally equal time, and stage portion R in opposite directions forms respectively
Then, the joint method for the 4th example explains.The joint method of the 4th example comprises: (1) preparatory process, (2) first front travels, (3) first formal bonding processs, (4) second front travels, (5) second formal bonding processs, (6) the 3rd preparatory process, (7) the 3rd front travels, (8) the 3rd formal bonding processs, (9) the 4th front travels, (10) the 4th formal bonding processs.And, by the 3rd formal bonding process and the 4th formal bonding process in conjunction with and be called the formal bonding process in side.Again, the description thereof will be omitted for the part repeating with the first example.
(1) preparatory process
In preparatory process, possess: the first hardware 201a is docked with the second hardware 201b and form be engaged hardware 201 docking operation, by the first outstanding material 202 and the second outstanding material 203 be disposed at the two sides that are engaged hardware 201 outstanding material arrangement step, by the first outstanding material 202 and the second outstanding material 203 be engaged hardware 201 by welding the interim welding operation engaging, by the operation that arranges that is engaged hardware 201 and is arranged on the stand of not shown friction agitating device.
Docking operation, as shown in Figure 18 (a) and Figure 18 (b), it makes vertical plane 216a, the stage portion surface 217a of the first hardware 201a and stage portion end face 218a in opposite directions both be docked with stage portion end face 218b, stage portion surface 217b and the vertical plane 216b of the second hardware 201b respectively.Again, the surperficial 212a of the first hardware 201a flushes with the surperficial 212b of the second hardware 201b, and the back side 213a of the first hardware 201a flushes with the surperficial 213b of the second hardware 201b.Again, the side 214a on one side of the first hardware 201a flushes with the side 214b on one side of the second hardware 201b, and the side 215a of the another side of the first hardware 201a flushes with the side 215b of the another side of the second hardware 201b.As shown in Figure 17 and Figure 18 (b), by docking operation, on the interface of the first hardware 201a and the second hardware 201b, form docking section J21.
And the surface that is engaged hardware 201 is that surface A, the back side are that back surface B, side are on one side that the side of the first side C and another side is the second side D.Again, in the first side C and the second side D, each horizontal alignment that forms docking section J21 is L1, L2 and L3.Horizontal alignment L2 forms vertically with respect to horizontal alignment L1 and horizontal alignment L3 respectively.
In outstanding material arrangement step, a pair of outstanding material is disposed at the two sides that are engaged hardware 201.The first outstanding material 202 and the second outstanding material 203, as shown in FIG. 19 and 20, clamping docking section J21 and configuring, possesses size and the shape that can cover respectively the first side C and the upper docking section J21 occurring of the second side D.The first outstanding material 202 and the second outstanding material 203 possess respectively and the measure-alike gauge that is engaged hardware 201, and surface and the back side of the first outstanding material 202 and the second outstanding material 203 flush with the surface A and the back surface B that are engaged hardware 201.Although the material of the first outstanding material 202 and the second outstanding material 203 is also unrestricted, in this example by be engaged hardware 201 and form for the metal material of same composition.
In welding operation, as shown in figure 19, will be engaged hardware 201 and the first outstanding material 202 formed inner side bight 202a, 202b welding and will be engaged hardware 201 and engage with the first outstanding material 202 works temporarily.And, will be engaged hardware 201 and the second outstanding material 203 formed inner side bight 203a, 203b welding and will be engaged hardware 201 and engage with the second outstanding material 203 works temporarily.And, can cross over the total length of inner side bight 202a, 202b and bight, inner side 203a, 203b and implement continuously welding, also can implement intermittently welding.
In operation is set, the hardware 201 that is engaged after the first outstanding material 202 and the second outstanding interim welding of material 203 is loaded on the stand of not shown friction agitating device, for example use fixture and be constrained to and cannot move.The described friction agitating device of this example is to set the device that rubs and stir from being engaged the top of hardware 201 for.
(2) first front travels
In the first front travel, for the docking section J21 appearing in the surface A that is engaged hardware 201, use small-sized throw F to engage temporarily.First front travel of this example comprises: make to be engaged the second outstanding material bonding process, the bonding process that engages the docking section J21 that is engaged hardware 201 that hardware 201 engages with the docking section J23 of the second outstanding material 203, make to be engaged the lower hole formation operation that the first starting position of giving prominence to material bonding process and the stirring of the friction in the first formal bonding process that hardware 201 engages with the docking section J22 of the second outstanding material 202 forms lower hole.
In the first front travel, as shown in figure 20, make interim a joint with throw move and form the motion track of (Japanese: mono-Pen Books I) continuously, for docking section J23, J21, the J22 stirring that rubs continuously.That is, make to insert the starting position S that friction is stirred p1interim joint with the stirring pin F2 (with reference to Figure 20) of throw F, do not depart from halfway and move to end position E p1.And, in this example, although the starting position S that friction is stirred p1be located on the second outstanding material 203 the end position E that friction is stirred p1be located on the first outstanding material 202, but starting position S p1with end position E p1position indefinite.
As shown in figure 20, small rotary instrument F is positioned at be located at the starting position S of the appropriate location of the second outstanding material 203 p1directly over, then, rotation limit, small rotary instrument F limit is declined and stirrings is sold to F2 to be attached to starting position S p1.That stirs pin F2 all enters the second outstanding material 203, and after the whole face of the lower surface F11 of shoulder F1 is contacted with the surface of the second outstanding material 203, rotation limit, small rotary instrument F limit is relatively moved towards the starting point s3 of the second outstanding material bonding process.Small rotary instrument F is relatively moved and rubs continuously and stir until the starting point s3 of the second outstanding material bonding process, afterwards small rotary instrument F starting point s3 do not depart from and according to this state travel to the second outstanding material bonding process.
In the second outstanding material bonding process, for the second outstanding material 203 and the docking section J23 that is engaged hardware 201 stirring that rubs.Particularly, set the path that friction is stirred the seam (boundary line) that is engaged hardware 201 and the second outstanding material 203 is upper, along this path, make small rotary instrument F relatively move, for the docking section J23 stirring that rubs.And in this example, small rotary instrument F does not depart from and halfway from the starting point s3 of the second outstanding material bonding process e3 stirring that rubs continuously to terminal.
And, when the stirring pin F2 of small rotary instrument F enters docking section J23, wish gives prominence to by being engaged hardware 201 and second the power generation effect that material 203 is pulled away from, but owing to will be engaged hardware 201 and the second outstanding material 203 formed inner side bight 203a, 203b (with reference to Figure 21) engages by welding temporarily, can prevent from being engaged hardware 201 and second and give prominence between material 203 and form perforate.
After small rotary instrument F arrives the terminal e3 of the second outstanding material bonding process, at terminal e3, do not finish friction and stir and rub continuously and stir until the starting point s1 of bonding process temporarily, state travels to interim bonding process according to this.That is, the starting point s1 from the terminal e3 of the second outstanding material bonding process to interim bonding process, small rotary instrument F does not depart from and proceeds friction and stir, and small rotary instrument F does not depart from and travels to interim bonding process at starting point s1.So, at the terminal e3 of the second outstanding material bonding process, do not need to carry out the separating operation of small rotary instrument F, and, starting point s1 in interim bonding process, does not need to carry out the insertion operation of small rotary instrument F, therefore can reach efficient activity, the fast of preparatory joint operation.
In interim bonding process, for the docking section J21 that is engaged hardware 201 stirring that rubs.Particularly, set the path that friction is stirred the seam (boundary line) that is engaged hardware 201 is upper, by make small rotary instrument F relatively move along this path, and the total length of the crossing over docking section J21 stirring that rubs continuously.And in this example, small rotary instrument F does not depart from and halfway from the starting point s1 of the interim bonding process e1 stirring that rubs continuously to terminal.
After small rotary instrument F arrives the terminal e1 of interim bonding process, in terminal e1 friction, stir and do not finish and rub continuously and stir until the starting point s2 of the first outstanding material bonding process, state travels to first and gives prominence to material bonding process according to this.That is, from the starting point s2 of the outstanding material bonding process of the terminal e1 to the first of interim bonding process, small rotary instrument F does not depart from and proceeds friction and stir, and at starting point s2, small rotary instrument F does not depart from and travels to the first outstanding material bonding process.
In the first outstanding material bonding process, to being engaged hardware 201 and the first docking section J22 that gives prominence to material 202 stirring that rubs.Particularly, the path setting that friction is stirred is gone up with the seam (boundary line) of the first outstanding material 202 in being engaged hardware 201, makes small rotary instrument F relatively move along this path, and to the docking section J22 stirring that rubs.And in this example, small rotary instrument F does not depart from and halfway from the starting point s2 of the first outstanding material bonding process e2 stirring that rubs continuously to terminal.
Again, when the stirring pin F2 of small rotary instrument F enters docking section J22, wish gives prominence to by being engaged hardware 201 and first the power generation effect that material 202 is pulled away from, but owing to will be engaged hardware 201 and the first outstanding material 202 formed inner side bight 202a, 202b engages by welding temporarily, can prevent from being engaged hardware 201 and first and give prominence between material 202 and form perforate.
After small rotary instrument F arrives the terminal e2 of the first outstanding material bonding process, in terminal e2 friction stirring, do not finish and rub continuously and stir until be located at the end position E of the first outstanding material 202 p1till.And in this example, end position E p1be located on the extended line of the seam (boundary line) that appears at the surface A side that is engaged hardware 201.In addition, end position E p1also be the starting position S that the friction in the described later first formal bonding process is stirred m1.
At small rotary instrument F, arrive end position E p1afterwards, make to rise on rotation limit, small rotary instrument F limit, and make to stir pin F2 from end position E p1depart from.
The starting position that lower hole formation operation stirs for the friction in the first formal bonding process forms the operation (with reference to Fig. 4 (b)) in lower hole.In the lower hole of this example, form in operation, lower hole (not shown) is formed at the surperficial S that is set in the first outstanding material 202 m1on.
(3) first formal bonding processs
The first formal bonding process is to make to be engaged the operation that the docking section J21 of the surface A side of hardware 201 engages veritably.In the first formal bonding process of this example, use large-scale throw G, to the docking section J21 under interim engagement state from being engaged the stirring that rubs of the surface A side of hardware 201.
In the first formal bonding process, as shown in figure 21, make the stirring pin G2 of the large-scale throw G of right rotation insert (being pressed into) starting position S m1, the stirring pin G2 of insertion does not depart from halfway and moves to end position E m1.That is, in the first formal bonding process, from lower hole P1, start friction and stir, and rub continuously, stir until end position E m1till.
And, in this example, although the starting position S that friction is stirred is set on the first outstanding material 202 m1, on the second outstanding material 203, end position E is set m1, but starting position S m1with end position E m1position indefinite.
With reference to Figure 21, illustrate in greater detail the first formal bonding process.
First, as shown in figure 21, make large-scale throw G be positioned at lower hole (starting position S m1) directly over, then make large-scale throw G limit do that right rotation limit declines and the front end that makes to stir pin G2 inserts lower hole.When stirring pin G2 and all enter after the whole face of the lower surface G11 of the first outstanding material 202 and shoulder G1 being contacted with the surface of the first outstanding material 202, stirring on one side rubs, on one side large-scale throw G is relatively moved to the one end that is engaged the docking section J21 of hardware 201, and crosscut docking section J22 and charge into docking section J21.When large-scale throw G is moved, in its stirring pin G2 metal around successively Plastic Flow, on the position from stirring pin G2 separation, the metal of Plastic Flow hardens once again and forms plastification region (hereinafter referred to as " face side plastification region W21 ").
Be engaged the docking section J21 of hardware 201, the path setting that friction is stirred is (on the motion track in interim bonding process) in the seam that is engaged hardware 201, by make large-scale throw G relatively move along this path, from the stirring that rubs continuously of one end to the other end of docking section J21.Large-scale throw G is relatively moved after the other end of docking section J21, rub and stir crosscut simultaneously and cross docking section J23, state is towards end position E according to this m1relatively move.
At large-scale throw G, arrive end position E m1afterwards, make liter on rotation limit, large-scale throw G limit and make to stir pin G2 from end position E m1depart from.
(4) second front travels
In the second front travel, to coming across the docking section J21 of the back surface B that is engaged hardware 201, use small rotary instrument F to engage temporarily.The second front travel comprises: make to be engaged the first outstanding material bonding process, the interim bonding process that engages the docking section J21 that is engaged hardware 201 that hardware 201 and the first outstanding material 202 engage, make to be engaged the lower hole formation operation that the second starting position of giving prominence to material bonding process, the friction stirring in the second formal bonding process that hardware 201 engages with the docking section J23 of the second outstanding material 202 forms lower hole.
The second front travel is except carrying out in the back surface B that is engaged hardware 201, and other is generally identical with the first front travel, and therefore the description thereof will be omitted.
(5) second formal bonding processs
The second formal bonding process is for doing the operation of real joint to being engaged the docking section J21 of the back surface B side of hardware 201.In the second formal bonding process of this example, use large-scale throw G, and to the docking section J21 of interim engagement state from being engaged the stirring that rubs of the back surface B side of hardware 201.
In the second formal bonding process, as shown in figure 22, the stirring pin G2 of the large-scale throw G of right rotation is inserted to (being pressed into) starting position S m2, the stirring pin G2 of insertion does not depart from halfway and moves to end position E m2.By the second formal bonding process, in the back surface B that is engaged hardware 201, form rear side plastification region W22.The second formal bonding process is except carrying out in the back surface B that is engaged hardware 201, and all the other are generally identical with the first above-mentioned formal bonding process, and detailed explanation is omitted.
And, after the second formal bonding process finishes, the first outstanding material 202 and the second outstanding material 203 are excised from being engaged hardware 201.
(6) the 3rd preparatory process
The 3rd preparatory process, in this example, comprising: by the first outstanding material 204 and the second outstanding material 205 be disposed at the both sides of the docking section J21 that is engaged hardware 201 outstanding material arrangement step, by the first outstanding material 204 and second give prominence to material 205 by welding, be engaged in be temporarily engaged the welding operation of hardware 201, by the operation that arranges that is engaged hardware 201 and is arranged on the stand of not shown friction agitating device.
Outstanding material arrangement step, as shown in figure 23, is disposed at a pair of outstanding material surface A and the back surface B that is engaged hardware 201.The first outstanding material 204 and the second outstanding material 205, as shown in figure 23, clamping docking section J21 and configuring, possesses size and the shape that can cover respectively the docking section J21 that is presented in surface A and back surface B.Surface and the back side of the first outstanding material 204 and the second outstanding material 205 flush with the first side C and the second side D that are engaged hardware 201 respectively.Although the material of the first outstanding material 204 and the second outstanding material 205 is also unrestricted, in this example by be engaged hardware 201 and form for the metal material of same composition.
In welding operation, will be engaged hardware 201 and the first outstanding material 204 and the second outstanding material 205 formed inner side bight welding and will be engaged hardware 201 and engage with the first outstanding material 204 and the second outstanding material 205 works temporarily.
In operation is set, the hardware 201 that is engaged after the first outstanding material 204 and the second outstanding interim welding of material 205 is loaded on the stand of not shown friction agitating device, for example use fixture and be constrained to and cannot move.
(7) the 3rd front travels
Comprise: make to be engaged the first outstanding material bonding process, the bonding process that engages the docking section J21 that is engaged hardware 201 that hardware 201 engages with the docking section J24 of the first outstanding material 204, make to be engaged the lower hole formation operation that the second starting position of giving prominence to material bonding process and the stirring of the friction in the 3rd formal bonding process that hardware 201 engages with the docking section J25 of the second outstanding material 205 forms lower hole.
In the first outstanding material bonding process, for the first outstanding material 204 and the docking section J24 that is engaged hardware 201 stirring that rubs.Particularly, set the path that friction is stirred the seam (boundary line) that is engaged hardware 201 and the first outstanding material 204 is upper, along this path, make small rotary instrument F relatively move, for the docking section J24 stirring that rubs.And in this example, small rotary instrument F does not depart from and halfway from the starting point n1 of the first outstanding material bonding process n2 stirring that rubs continuously to terminal.
Small rotary instrument F reaches home after n2, and small rotary instrument F enters the first outstanding material 204 sides temporarily, rub and stirs until the basic point n3 of bonding process temporarily.After small rotary instrument F arrives basic point n3, small rotary instrument F does not depart from and implements interim bonding process along docking section J21.The docking section J21 of this example, owing to being consisted of horizontal alignment L1, L2, L3, makes direction change 90 degree at each flex points C1, C2, makes small rotary instrument F move and the stirring that rubs simultaneously.
After small rotary instrument F arrives basic point n6, small rotary instrument F does not depart from and enters the second outstanding material 205 sides temporarily, moves to the starting point n7 of the second outstanding material bonding process.After small rotary instrument F arrives starting point n7, along docking section J205, rub and stir until terminal n8.After small rotary instrument F arrives n8, enter the second outstanding material 205 sides, at end position E p3small rotary instrument F is departed from.And, end position E p3become the starting position S of the described later the 3rd formal bonding process m3.
The starting position that lower hole formation operation stirs for the friction in the 3rd formal bonding process forms the operation in lower hole.In the lower hole of this example, form in operation, lower hole is formed at the surperficial S that is set in the second outstanding material 5 m3on.In lower hole, form in operation, because the form with above-mentioned is generally identical, therefore omit detailed explanation.
(8) the 3rd formal bonding processs
The 3rd formal bonding process is for doing the operation of real joint to being engaged the docking section J21 at the first C place, side of hardware 201.In the 3rd formal bonding process of this example, use large-scale throw G, and to the docking section J21 of interim engagement state from being engaged the first side C of hardware 201 stirring that rubs.
The 3rd formal bonding process, as shown in figure 24, inserts (being pressed into) starting position S by the stirring pin G2 of the large-scale throw G of anticlockwise m3, the stirring pin G2 of insertion does not depart from halfway and moves to end position E m3.That is, in the 3rd formal bonding process, from being set in the starting position S of the second outstanding material 5 m3lower hole (not shown) start friction and stir, until be set in the end position E of the first outstanding material 204 m3till the stirring that rubs continuously.
And, in this example, although the starting position S that friction is stirred m3be located at the second outstanding material 205, end position E m3be located at the first outstanding material 204, but starting position S m3with end position E m3position indefinite.
The 3rd formal bonding process, as shown in figure 24, makes large-scale throw G be positioned at starting position S m1directly over, then make large-scale throw G limit do that right rotation limit declines and the front end that makes to stir pin G2 inserts lower hole (not shown).When stirring pin G2 and all enter after the whole face of the lower surface G11 of the second outstanding material 205 and shoulder G1 being contacted with the surface of the second outstanding material 205, stirring on one side rubs, large-scale throw G is relatively moved on one side to the basic point n6 that is engaged the docking section J21 of hardware 201, and charge into docking section J21.When large-scale throw G is moved, in its stirring pin G2 metal around successively Plastic Flow, on the position from stirring pin G2 separation, the metal of Plastic Flow hardens once again and forms plastification region (hereinafter referred to as " the first side plastification region W23 ".
The docking section J21 of this example, owing to being formed by horizontal alignment L1, L2, L3, makes direction change 90 degree at each inflection point C2, C1, makes large-scale throw G move and the stirring that rubs simultaneously.Then, large-scale throw G arrives end position E by basic point n3 m3afterwards, at end position E m3large-scale throw G is departed from.According to the 3rd formal bonding process, when face side plastification region W21 and rear side plastification region W22 (with reference to Figure 17) repeat with the first side plastification region W3, can cross over and appear at the total length of the docking section J21 on the first side C and the stirring that rubs.
(9) the 4th front travels
The 4th front travel as shown in figure 25, is used small rotary instrument F to engage for the docking section J21 appearing on the second side D that is engaged hardware 201 temporarily.The 4th front travel comprises: the first outstanding material bonding process, the interim bonding process that engages the docking section J21 that is engaged hardware 201, the starting position that makes to be engaged the second outstanding material bonding process that hardware 201 engages with the docking section J25 of the second outstanding material 205 and the stirring of the friction in the 4th formal bonding process form the lower hole formation operation in lower hole.
And the 4th front travel is except carrying out at the second side D, due to generally identical with the 3rd front travel, description is omitted.
(10) the 4th formal bonding processs
The 4th formal bonding process, as shown in figure 25, it is for doing the operation of real joint to being engaged the docking section J21 at the second D place, side of hardware 201.In the 4th formal bonding process of this example, use large-scale throw G, and to the docking section J21 of interim engagement state from being engaged the second side D of hardware 201 stirring that rubs.
The 4th formal bonding process, as shown in figure 25, inserts (being pressed into) starting position S by the stirring pin G2 of the large-scale throw G of right rotation m4, the stirring pin G2 of insertion does not depart from halfway and moves to end position E m4.That is, in the 4th formal bonding process, from being set in the starting position S of the second outstanding material 205 m4lower hole (not shown) start friction and stir, along docking section J21 until be set in the end position E of the first outstanding material 204 m4till the stirring that rubs continuously.According to the 4th formal bonding process, the second side plastification region W24 is formed on the second side D that is engaged hardware 201.The 4th formal bonding process is except carrying out at the second side D, and all the other are generally identical with the 3rd formal bonding process, and description is omitted.And, after the 4th formal bonding process finishes, a pair of outstanding material is excised from being engaged hardware 201.
According to the joint method of described above example, as shown in Figure 24 and Figure 25, the first side plastification region W23 and the second side plastification region W24 in the first side C and the second side D are formed by horizontal alignment L1, L2, L3.By this, due to length prolongation distance and that be greater than the thickness 1h that is engaged hardware 201 of horizontal alignment L1, L2 and L3, the stirring region of can guaranteeing to rub is elongated.Therefore, act on the stress dispersion at the junction surface that is engaged hardware 201 and can improve bond strength.Again, according to the 3rd formal bonding process and the 4th formal bonding process, when face side plastification region W21 and rear side plastification region W22 and the first side plastification region W23 and the second side plastification region W24 repeat, can cross over and appear at the total length of the docking section J21 on the first side C, the second side D and the stirring that rubs.By this, can improve air-tightness and the watertightness that is engaged hardware 201.
Again, the joint method of this example is owing to making docking section J21 become the combination of straight line, thus the shaping of interface become easily, the operation of the stirring that can easily rub simultaneously.Again, in this example, at flex points C1, when horizontal alignment L1 and horizontal alignment L2 form 90 degree, at flex points C2, horizontal alignment L2 and horizontal alignment L3 form 90 degree.Therefore,, during the joint that stirs in friction, the large-scale throw G moving along the horizontal alignment of docking section J21, owing to stopping at flex points C1, C2 temporarily, stirs so can carry out the friction of longer time than other parts at flex points C1, C2.By this, at flex points C1, C2, by carrying out friction for a long time, stir, can not produce joint defect and implement processing, at junction surface, can promote air-tightness and watertightness.
Again, in the 4th example, in the first formal bonding process and the second formal bonding process, owing to making formal joint do right rotation with throw G, so may form cavity blemish (not shown) in the second hardware 201b side of face side plastification region W21 and rear side plastification region W22.Therefore, in the 3rd formal bonding process, make formal joint do left-handed transferring with throw G and move to surface A from back surface B, the second hardware 201b side is carried out the friction stirring of higher density by this.Again, in the 4th formal bonding process, make formal joint do dextrorotation with throw G and transfer to move to surface A from back surface B, the second hardware 201b side is carried out the friction stirring of higher density by this.By this, the cavity blemish that may form in the first formal bonding process and the second formal bonding process positively can be disconnected.
By using outstanding material, can correctly and promptly carry out the first formal bonding process, the second formal bonding process, the 3rd formal bonding process and the 4th formal bonding process again.Again, by each outstanding material, do to engage with being engaged hardware 201, can prevent from carrying out producing perforate when the first formal bonding process, the second formal bonding process, the 3rd formal bonding process and the 4th formal bonding process temporarily.
And, in this example, although the formal bonding process in side is carried out at the first side C and the second D both sides, side, not necessarily to carry out on two sides, at least on one side.
Above, although explain with better example for the present invention, the invention is not restricted to described each example, without departing from the spirit and scope of the invention variable suitable design.
For example, appear at the horizontal alignment that docking section J21 on the first side C and the second side D is not limited to the 4th example, can suitably set.; in the 4th example; although utilize the formed docking section J21 of combination of the linear L1 of three rhizoplanes, L2, L3 and flex points C1, C2 at 2; the prolongation distance of the horizontal alignment of docking section J21 is also larger than the thickness 1h that is engaged hardware 201; but it is represented that the shape of docking section J21 is not limited to aforementioned example, can do suitable setting.
Figure 26 is the plane of the first side C of the variation of example of the present invention, (a) is the first variation, is (b) the second variation, is (c) the 3rd variation.
For example, as shown in Figure 26 (a), docking section J22 can be configured obliquely with respect to the thickness direction that is engaged hardware 201 ', docking section J22 does not arrange flex points and can guarantee the prolongation distance of large horizontal alignment L also than the thickness 1h that is engaged hardware 201 by this yet.According to above-mentioned docking section J22, the prolongation distance of the horizontal alignment L stirring owing to rubbing is also longer than the thickness 1h that is engaged hardware 201, can guarantee that the distance of friction stirring is elongated, and bond strength can uprise.
Again, docking section J23, J24 as shown in Figure 26 (b) or Figure 26 (c), also can be with the combination of the linear L1 of two rhizoplanes, L2 and a flex points C1.According to structure so, because the movement of large-scale throw G stops at flex points C1 temporarily, so represented with aforementioned example identical, stirring can positively rub.And in the case, the angle of the interior angle of flex points C1 indefinite, as long as suitably set.
Figure 27 is the plane of the first side C of the variation of example of the present invention.(a) be that the 4th variation, (b) are that the 5th variation, (c) are that the 6th variation, (d) are the 7th variation.
In the 4th example, although two positions that are right angle in horizontal alignment L1, L2 or the crossing angle of horizontal alignment L2, L3 arrange flex points C1, C2, the angle of flex points C1, C2 indefinite.For example, shown in docking section J25, J26 as shown in Figure 27 (a), 27 (b), the crossing angle of horizontal alignment L1, the L2 on two flex points C1 ', C2 ' or horizontal alignment L2, L3 is for example that 120 degree also can reach identical effect.
Again, the quantity of the flex points of the horizontal alignment of docking section also can form in more than two positions, suitably sets.For example, the docking section J28 shown in the docking section J27 as shown in Figure 27 (c) and Figure 27 (d), the quantity of flex points is four or six and also can.So, the quantity of flex points increases, and makes the translational speed of large-scale throw G slack-off, or the movement of large-scale throw G is repeatedly stopped, the joint that can more positively be engaged hardware 201 ', carries out the joint that bond strength, air-tightness and watertightness are good.
Figure 28 is the plane of the first side C of the variation of example of the present invention, is the 8th variation.
In the 4th example, although by the combination of the linear L1 of three rhizoplanes, L2, L3, form docking section J21, docking section J8 as shown in figure 28, the horizontal alignment of docking section J8 also can form curve-like.By docking section J8 is formed to this shape, can make the prolongation distance of horizontal alignment also longer than the thickness 1h that is engaged hardware 201.And when the horizontal alignment in docking section forms curve-like, the curve of formation is linear, and to be not limited to the curve of the docking section J28 shown in Figure 28 linear.
And in the friction of this example is stirred, the first outstanding material and the second outstanding material can configure as required, also can omit.Again, the fixing means of hardware when friction is stirred etc. indefinite, can select suitable known approaches.Again, in this example, although the formal bonding process in side is the stirring that rubs continuously, if also larger than the gauge that is engaged hardware by the prolongation distance in the formed plastification of formal bonding process region, side, can carry out by spells.

Claims (12)

1. a joint method, the hardware that is engaged forming with respect to the first hardware is docked with the second hardware makes the throw stirring of moving to rub, and it is characterized in that, comprising:
The first formal bonding process, with respect to the docking section of described the first hardware and described the second hardware, from the stirring that rubs of the described face side that is engaged hardware;
The second formal bonding process, with respect to described docking section from the stirring that rubs of the described rear side that is engaged hardware;
The formal bonding process in side, with respect to described docking section from the stirring that rubs of the described side that is engaged hardware;
Welding operation, before at least one formal bonding process in carrying out the described first formal bonding process, the formal bonding process of the described second formal bonding process and described side, the a pair of outstanding material of both sides configurations in described docking section, will by described outstanding material with described in be engaged the bight welding of the formed inner side of hardware and do interim joint; And
Front travel, described outstanding material with described in be engaged hardware docking section preparation property the stirring that rubs,
The described first formal bonding process and the second formed plastification of the formal bonding process in formal bonding process formed plastification region and described side region are repeated.
2. a joint method, the hardware that is engaged forming with respect to the first hardware is docked with the second hardware makes the throw stirring of moving to rub, and it is characterized in that, comprising:
The first formal bonding process, with respect to the docking section of described the first hardware and described the second hardware, from the stirring that rubs of the described face side that is engaged hardware;
The second formal bonding process, with respect to described docking section from the stirring that rubs of the described rear side that is engaged hardware; And
The formal bonding process in side, with respect to described docking section from the stirring that rubs of the described side that is engaged hardware,
The formal bonding process in described side comprises:
The 3rd formal bonding process, from the stirring that rubs of the described side that is engaged one side of hardware; And
The 4th formal bonding process, from the stirring that rubs of the described side that is engaged the another side of hardware,
When the direction of rotation at throw described in the formal bonding process of the described first formal bonding process to the four is while being equidirectional,
The starting position that friction in the described second formal bonding process is stirred is set as the end position side that the friction in the described first formal bonding process is stirred;
The starting position that friction in the described the 3rd formal bonding process is stirred is set as the side in the starting position side of the friction stirring in the described first formal bonding process and the starting position side of the stirring of the friction in the described second formal bonding process;
The starting position that friction in the described the 4th formal bonding process is stirred is set as the opposing party in the starting position side of the friction stirring in the described first formal bonding process and the starting position side of the stirring of the friction in the described second formal bonding process,
The described first formal bonding process and the second formed plastification of the formal bonding process in formal bonding process formed plastification region and described side region are repeated.
3. a joint method, the hardware that is engaged forming with respect to the first hardware is docked with the second hardware makes the throw stirring of moving to rub, and it is characterized in that, comprising:
The first formal bonding process, with respect to the docking section of described the first hardware and described the second hardware, from the stirring that rubs of the described face side that is engaged hardware;
The second formal bonding process, with respect to described docking section from the stirring that rubs of the described rear side that is engaged hardware; And
The formal bonding process in side, with respect to described docking section from the stirring that rubs of the described side that is engaged hardware,
The formal bonding process in described side comprises:
The 3rd formal bonding process, from the stirring that rubs of the described side that is engaged one side of hardware; And
The 4th formal bonding process, from the stirring that rubs of the described side that is engaged the another side of hardware,
When in the described first formal bonding process, make described throw right rotation, and set starting position and end position that friction is stirred, make described the first hardware be positioned at the direct of travel right side of described throw; In the described second formal bonding process, make described throw anticlockwise, and set starting position and end position that friction is stirred, while making described the first hardware be positioned at the direct of travel left side of described throw,
In the described the 3rd formal bonding process and the 4th formal bonding process, if starting position and the end position that friction is stirred set in described throw right rotation, make described the first hardware be positioned at the direct of travel left side of described throw; If described throw anticlockwise, sets starting position and end position that friction is stirred, make described the first hardware be positioned at the direct of travel right side of described throw,
The described first formal bonding process and the second formed plastification of the formal bonding process in formal bonding process formed plastification region and described side region are repeated.
4. a joint method, the hardware that is engaged forming with respect to the first hardware is docked with the second hardware makes the throw stirring of moving to rub, and it is characterized in that, comprising:
The first formal bonding process, with respect to the docking section of described the first hardware and described the second hardware, from the stirring that rubs of the described face side that is engaged hardware;
The second formal bonding process, with respect to described docking section from the stirring that rubs of the described rear side that is engaged hardware; And
The formal bonding process in side, with respect to described docking section from the stirring that rubs of the described side that is engaged hardware,
The formal bonding process in described side comprises:
The 3rd formal bonding process, from the stirring that rubs of the described side that is engaged one side of hardware; And
The 4th formal bonding process, from the stirring that rubs of the described side that is engaged the another side of hardware,
When in the described first formal bonding process, make described throw anticlockwise, and set starting position and end position that friction is stirred, make described the first hardware be positioned at the direct of travel right side of described throw; In the described second formal bonding process, make described throw right rotation, and set starting position and end position that friction is stirred, while making described the first hardware be positioned at the direct of travel left side of described throw,
In the described the 3rd formal bonding process and the 4th formal bonding process, if starting position and the end position that friction is stirred set in described throw right rotation, make described the first hardware be positioned at the direct of travel right side of described throw; If described throw anticlockwise, sets starting position and the end position that friction is stirred, described the first hardware is positioned on the left of the direct of travel of described throw,
The described first formal bonding process and the second formed plastification of the formal bonding process in formal bonding process formed plastification region and described side region are repeated.
5. joint method as claimed in claim 1, it is characterized in that, before at least one formal bonding process in carrying out the described first formal bonding process, the formal bonding process of the described second formal bonding process and described side, carry out described docking section to carry out the interim interim bonding process engaging.
6. joint method as claimed in claim 5, it is characterized in that, in a described formal bonding process, when the interim joint using in described interim bonding process is departed from throw, formed punching is directly used as and formally engages the lower hole of inserting use with the stirring pin of throw, or passes through to be used as the formal lower hole engaging by the stirring pin insertion use of throw after drilling tool reaming.
7. joint method as claimed in claim 1, is characterized in that, on the insertion precalculated position of described throw, is pre-formed lower hole.
8. joint method as claimed in claim 1, is characterized in that, the prolongation distance in the formed plastification of formal bonding process region, described side is larger than the gauge of described docking section.
9. joint method as claimed in claim 8, it is characterized in that, in the formal bonding process in described side, cross the total length of described docking section of the side that is engaged hardware described in coming across and the stirring that rubs, repeat in formal bonding process formed plastification region, described side and the described first formal bonding process and the described second formed plastification of formal bonding process region.
10. joint method as claimed in claim 8, is characterized in that, the horizontal alignment of described docking section that is engaged the side of hardware described in coming across is the combination of straight line or straight line.
11. joint methods as claimed in claim 8, is characterized in that, in the horizontal alignment of described docking section of side that is engaged hardware described in coming across, are provided with more than one flex points.
12. joint methods as claimed in claim 11, is characterized in that, forming the angle that the straight line of described flex points intersects each other is 90 degree.
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CN103722288B (en) 2016-03-16
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TWI477339B (en) 2015-03-21
TW200902203A (en) 2009-01-16

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