CN101657938B - Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device, and their manufacturing methods - Google Patents
Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device, and their manufacturing methods Download PDFInfo
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- CN101657938B CN101657938B CN200880011674.4A CN200880011674A CN101657938B CN 101657938 B CN101657938 B CN 101657938B CN 200880011674 A CN200880011674 A CN 200880011674A CN 101657938 B CN101657938 B CN 101657938B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
- H01Q7/08—Ferrite rod or like elongated core
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
Disclosed is a magnetic field coupling type antenna comprising an insulating layer (110) and a magnetic core (112) embedded in the insulating layer (110). A coil having a coil axis parallel to the upper surface of the insulating layer is formed by an upper conductor (116) formed on the upper surface of the insulating layer (110), a lower conductor (118) formed on the lower surface of the insulating layer (110), a lateral conductor (120) for electrically connecting the upper conductor (116) and the lower conductor (118), and a via (122). This magnetic field coupling type antenna can be manufactured by a simple process and has high antenna sensitivity without deteriorating impact resistance.
Description
Technical field
The present invention relates to the magnetic field coupling type antenna, magnetic field coupling type antenna module and the magnetic field coupling type antenna device that in RFID (Radio FrequencyIdentificaiton) system via electromagnetic field signal and external device communication, use and these manufacture method.
Background technology
In recent years, utilizing in the rfid system expanding, carry respectively information communication antenna at the portable electric appts such as mobile phone and read write line, mutually transceiving data.As RFID antenna, be generally at the reeled magnetic field coupling type antenna of structure of coil of magnetic core.Further, wherein, even the magnetic field coupling type antenna carrying on portable electric appts is especially required to the raising of the resistance to impact that antenna performance does not also change due to impacts such as whereabouts.As the impact owing to applying from outside, an essential factor of antenna performance variation, can enumerate the breakage of impacting the magnetic core causing.
The countermeasure of the variation of the antenna performance causing as the breakage that prevents magnetic core has proposed the shape of magnetic field coupling type antenna as described below (following, magnetic field coupling type antenna is simply recited as to antenna) in patent documentation 1.Figure 15-A, Figure 15-B are the figure that represents in patent documentation 1 structure of the antenna of recording, and Figure 15-A is vertical view, and Figure 15-B is the profile in the A-A profile of Figure 15-A.
In the antenna 1000 of recording, between two insulating barrier 1010a, 1010b, be folded with magnetic core component 1012 in Figure 15-A, Figure 15-B.In addition, antenna 1000 possesses: the upper surface conductor 1016 forming at the insulating barrier 1010a of upside upper surface, the lower surface conductor 1018 forming at the insulating barrier 1010b of downside lower surface and the bonding conductor 1020 that connects upper surface conductor 1016 and lower surface conductor 1018.Utilize upper surface conductor 1016, lower surface conductor 1018, bonding conductor 1020, formation coil 1014 around insulating barrier 1010a, 1010b.Further, bonding conductor 1020 is to the through hole forming the insulating barrier 1010b lower surface of downside at the insulating barrier 1010a upper surface from upside.Utilize the plating layer forming at the inwall of through hole, make upper surface conductor 1016 and 1018 conductings of lower surface conductor.
By magnetic core component 1012 is clipped in to the structure between insulating barrier 1010a, 1010b, the impact that puts on antenna 1000 entirety can directly not put on magnetic core component 1012.Thereby magnetic core component 1012 is difficult to breakage, the variation of the antenna performance that the breakage of magnetic core component 1012 causes is difficult to occur.
Patent documentation 1: TOHKEMY 2005-184094 communique.
Summary of the invention
In antenna 1000, magnetic core component 1012 is to form containing the coating of magnetic material by the insulating barrier 1010b coating at downside.Then, to cover the mode of magnetic core component 1012, at the insulating barrier 1010a of the bonding upside of the insulating barrier 1010b of downside.
With in antenna, by the coil axes of coil, produce induced voltage from outside magnetic flux at RFID, communicate thus.Now, magnetic core is that the magnetic core component in patent documentation 1 guides magnetic flux in the mode by coil axes, therefore, in order to realize high antenna sensitivity, need to have certain above thickness.But the method that forms magnetic core component 1012 according to the coating that utilizes coating is known, existence can only form the problem of very thin magnetic core component.In addition, there is wish thickening thickness, need the problem repeatedly applying.
In addition, the antenna 1000 of recording in patent documentation 1 is also disclosed to the method that uses tabular magnetic core component 1012.Specifically, attaching insulating element around tabular magnetic core component 1012, utilizes tabular magnetic core component 1012 to form the cross sectional shape identical with insulating barrier 1010a, 1010b with insulating element.But also there is the method for utilizing insulating barrier 1010a, 1010b to sandwich magnetic core component 1012.Known according to the method, need to attach redundantly the operation of insulating element, thereby be difficult to manufacture easily antenna 1000.
Therefore, the object of the invention is to realize having maintained under the original state of resistance to impact, easy to manufacture, and the high magnetic field coupling type antenna of antenna sensitivity.
In order to address the above problem, the present invention is formed as the structure of the following stated.
Magnetic field coupling type antenna of the present invention, possesses: insulating barrier; Be embedded in the magnetic core of described insulating barrier; Be formed at the upper surface conductor of the upper surface of described insulating barrier; Be formed at the lower surface conductor of the lower surface of described insulating barrier; Be electrically connected the bonding conductor of described upper surface conductor and described lower surface conductor, wherein, utilize described upper surface conductor, described lower surface conductor and described bonding conductor to form the coil with the coil axes parallel with the upper surface of described insulating barrier.
Also can be in magnetic field coupling type antenna of the present invention, magnetic core comprises multiple magnetic cores.The direction that preferred the plurality of magnetic core is arranged is the direction orthogonal with the coil axes of described coil.
Preferably in magnetic field coupling type antenna of the present invention, the area with the orthogonal cross section arbitrarily of coil axes of the Area Ratio magnetic core of the face at least one party's who is arranged in the axial two ends of coil of magnetic core face is large.
Also can, in magnetic field coupling type antenna of the present invention, in the side of the insulating barrier that is positioned at coil axes direction, magnetic core be set.
Also can be in magnetic field coupling type antenna of the present invention, coil is divided into the first coil portion and the second coil portion and forms to have the state of non-winder in centre.
Also can be in magnetic field coupling type antenna of the present invention, the through hole that utilization is electrically connected with upper surface conductor or/and the lower surface conductor of insulating barrier or path form at least a portion of bonding conductor.In addition, utilize at least a portion that forms bonding conductor at the preformed pattern in the side of magnetic core, pattern is electrically connected and also can with through hole or path.
In magnetic field coupling type antenna module of the present invention, it is characterized in that possessing: magnetic field coupling type antenna; Be embedded in the electronic unit of insulating barrier.Electronic unit preferred capacitor.In addition, electronic unit is arranged between magnetic core and bonding conductor and also can.
Also can in magnetic field coupling type antenna module of the present invention, possess: magnetic field coupling type antenna; Be embedded in the capacitor of insulating barrier, capacitor is arranged at described non-winder.
Also can, in magnetic field coupling type antenna module of the present invention, also be provided with lower insulation layer at the lower surface of insulating barrier, be formed with bucking electrode layer at the lower surface of lower insulation layer.
Magnetic field coupling type antenna device of the present invention possesses: magnetic field coupling type antenna module; Be embedded in the integrated circuit of insulating barrier.In addition, also can be in magnetic field coupling type antenna device, form screen at the position that does not form upper surface conductor of the upper surface of insulating barrier.
The manufacture method of magnetic field coupling type antenna of the present invention, comprising: the operation that forms lower surface conductor on support plate or substrate; On described support plate or substrate, carry the operation of magnetic core; To described support plate or substrate and described magnetic core, the insulating barrier of the semi-harden state that pressurizes, and described magnetic core is embedded in to the operation of described insulating barrier; Make the operation of the described insulating barrier sclerosis that is embedded with described magnetic core; Form the operation of the bonding conductor being electrically connected with described lower surface conductor at described insulating barrier; On opposed of the face joining with described lower surface conductor of described insulating barrier, form the operation of the upper surface conductor being electrically connected with described bonding conductor.
The manufacture method of magnetic field coupling type antenna module of the present invention, comprising: the operation that forms lower surface conductor on support plate or substrate; On described support plate or substrate, carry the operation of magnetic core and capacitor; To described support plate or substrate and described magnetic core and described capacitor, the insulating barrier of the semi-harden state that pressurizes, and described magnetic core is embedded in to the operation of described insulating barrier; Make the operation of the described insulating barrier sclerosis that is embedded with described magnetic core and described capacitor; Form the operation of the bonding conductor being electrically connected with described lower surface conductor at described insulating barrier; On opposed of the face joining with described lower surface conductor of described insulating barrier, form the operation of the upper surface conductor being electrically connected with described bonding conductor.
The manufacture method of magnetic field coupling type antenna device of the present invention, comprising: the operation that forms lower surface conductor on support plate or substrate; On described support plate or substrate, carry the operation of magnetic core, capacitor and integrated circuit component; To described support plate or substrate and described magnetic core, described capacitor and described integrated circuit component, the insulating barrier of the semi-harden state that pressurizes, and described magnetic core is embedded in to the operation of described insulating barrier; Make the operation of the described insulating barrier sclerosis that is embedded with described magnetic core, described capacitor and described integrated circuit component; Form the operation of the bonding conductor being electrically connected with described lower surface conductor at described insulating barrier; On opposed of the face joining with described lower surface conductor of described insulating barrier, form the operation of the upper surface conductor being electrically connected with described bonding conductor.
Invention effect
Known according to the present invention, magnetic core is arranged at insulating barrier, and therefore, resistance to impact improves.In addition, bury underground and there is the magnetic core of certain thickness and form, therefore, can easily manufacture, and can realize the magnetic field coupling type antenna that antenna sensitivity is high.
Accompanying drawing explanation
Fig. 1 is the stereogram that represents the structure of the magnetic field coupling type antenna of the first execution mode of the present invention.
Fig. 2-A is the stereogram that represents the manufacture method of the magnetic field coupling type antenna of the first execution mode of the present invention.
Fig. 2-B is the stereogram that represents the manufacture method of the magnetic field coupling type antenna of the first execution mode of the present invention.
Fig. 2-C is the profile that represents the manufacture method of the magnetic field coupling type antenna of the first execution mode of the present invention.
Fig. 2-D is the profile that represents the manufacture method of the magnetic field coupling type antenna of the first execution mode of the present invention.
Fig. 2-E is the profile that represents the manufacture method of the magnetic field coupling type antenna of the first execution mode of the present invention.
Fig. 2-F is the profile that represents the manufacture method of the magnetic field coupling type antenna of the first execution mode of the present invention.
Fig. 3 is the stereogram that represents the variation of the magnetic field coupling type antenna of the first execution mode of the present invention.
Fig. 4 is the figure that represents the structure of the magnetic field coupling type antenna of the second execution mode of the present invention.
Fig. 5-A is the stereogram that represents the structure of the magnetic field coupling type antenna of the 3rd execution mode of the present invention.
Fig. 5-B is the profile that represents the structure of the magnetic field coupling type antenna of the 3rd execution mode of the present invention.
Fig. 6 is the stereogram that represents the structure of the magnetic field coupling type antenna of the 4th execution mode of the present invention.
Fig. 7 is the stereogram that represents the structure of the magnetic field coupling type antenna of the 5th execution mode of the present invention.
Fig. 8 is the mobile schematic diagram that represents the magnetic flux in the magnetic field coupling type antenna of the 5th execution mode of the present invention.
Fig. 9 is the stereogram that represents the structure of the magnetic field coupling type antenna module of the 6th execution mode of the present invention.
Figure 10 is the stereogram that represents the variation of the magnetic field coupling type antenna module of the 6th execution mode of the present invention.
Figure 11 is the stereogram that represents the structure of the magnetic field coupling type antenna device of the 7th execution mode of the present invention.
Figure 12-A is the stereogram that represents the structure of the magnetic field coupling type antenna device of the 8th execution mode of the present invention.
Figure 12-B is the profile that represents the structure of the magnetic field coupling type antenna device of the 8th execution mode of the present invention.
Figure 13-A is the stereogram that represents the variation of the magnetic field coupling type antenna device of the 8th execution mode of the present invention.
Figure 13-B is the profile that represents the variation of the magnetic field coupling type antenna device of the 8th execution mode of the present invention.
Figure 14 is the stereogram that represents the structure of the magnetic field coupling type antenna device of the 9th execution mode of the present invention.
Figure 15-A is the vertical view that represents the structure of conventional example.
Figure 15-B is the profile that represents the structure of conventional example.
100,200,300,400,500,600-magnetic field coupling type antenna in figure:; 601,602-magnetic field coupling type antenna module; 703,803,903-magnetic field coupling type antenna device; 110-insulating barrier; 112-magnetic core; 114-coil; 116-upper surface conductor; 118-lower surface conductor; 120-side conductor; 122-path.
Embodiment
" the first execution mode "
With reference to Fig. 1, the first execution mode of the present invention is described.Fig. 1 is the stereogram that represents the structure of the magnetic field coupling type antenna of the first execution mode.In the following description, by magnetic field coupling type antenna referred to as antenna.
The antenna 100 of the first execution mode possesses: insulating barrier 110; With the state simultaneously exposing from the lower surface of insulating barrier 110, be embedded in the magnetic core 112 of insulating barrier 110.Burying underground is by the insulating barrier 110 of semi-harden state that magnetic core 112 is pressurizeed, and utilizes insulating barrier 110 to surround the state of magnetic core 112.As in the embodiment described in, also comprise the state that the part of magnetic core 112 is exposed from insulating barrier 110.
Insulating barrier 110 comprises: the mixture of thermosetting resin or thermosetting resin and inorganic filler.As the preferred ferrite sheet of magnetic core 112, be shaped to cuboid.The Thickness Design of magnetic core 112 is to realize the optimum thickness of the antenna sensitivity of expectation.In addition, be formed with upper surface conductor 116 at the upper surface of insulating barrier 110, be formed with lower surface conductor 118 at lower surface, be formed with side conductor 120 in side, be formed with path (PVC ア) 122 in inside.Utilize side conductor 120 to form with path 122 bonding conductor that is connected upper surface conductor 116 and lower surface conductor 118.At this, path refers to the state being filled to the through hole of lower surface formation from the upper surface of insulating barrier 110.More particularly, refer to and be filled with conductive paste, or form after plating layer at the inwall of through hole, be filled with conductive paste or non-conductive paste, thus the state of electrical connection upper surface conductor 116 and lower surface conductor 118.The side conductor 120 and the path 122 that utilize upper surface conductor 116, lower surface conductor 118, formation bonding conductor form the coil 114 with the coil axes parallel with the upper surface of insulating barrier 110 around insulating barrier 110.Draw in the side of insulating barrier 110 end of coil 114, easily to connect, and is formed with connecting portion 126.
In addition, to the impact of imbedding the thickness that is not subject to magnetic core 112 of the magnetic core 112 of insulating barrier 110., in the case of having used the insulating barrier 110 that thickness is thick, also the single operation of the insulating barrier 110 by semi-harden state that magnetic core 110 is pressurizeed, is embedded in insulating barrier 110 by magnetic core 110.Thereby, by the antenna sensitivity corresponding to expecting, select the thickness of magnetic core, can easily improve antenna sensitivity.
In addition, antenna 100 is the coil axess that pass through coil 114 by magnetic flux, thereby causes the magnetic field coupling type antenna of induced voltage at coil 114.Magnetic flux enters magnetic core 112 from side one side who is arranged in the axial insulating barrier 110 of coil, radiates from the opposing party.In the case of mobile being obstructed of this magnetic flux, the magnetic flux of the coil axes by coil 114 reduces, and the antenna sensitivity of antenna 100 reduces.Thereby, preferably do not configure in the axial two sides of coil that are positioned at of magnetic core 112 the mobile object that hinders magnetic flux.
The manufacture method of antenna 100 is described with reference to Fig. 2-A～Fig. 2-F below.Fig. 2-A～Fig. 2-F is the stereogram that represents each manufacturing process of antenna 100.
Fig. 2-A represents that lower surface conductor forms operation.Lower surface conductor 118 is formed on support plate or substrate 130.Lower surface conductor 118 can be by utilizing electrolysis plating to form plating layer on support plate or substrate 130, and plating layer is carried out to the known methods such as etching and form.Below, the situation that has used the transfer plate that contains SUS as support plate is described.
Fig. 2-B represents that magnetic core carries operation.By magnetic core 112 to be equipped on support plate 130 with the overlapping mode of lower surface conductor 118.Utilize adhesive sheet or bonding agent etc. that magnetic core 112 is fixed on support plate 130.
Fig. 2-C represents that insulating barrier forms operation, represents the cross section vertical with the upper surface of insulating barrier 110.Prepare to be pasted with in advance at upper surface the insulating barrier 110 of the state of Copper Foil 150.Insulating barrier 110 comprises the mixture of thermosetting resin or thermosetting resin and inorganic filler, and it is semi-harden state (preforming material).This insulating barrier 110 is carried to the works pressurized, heated that operation obtains from magnetic core 112 side direction by above-mentioned magnetic core.Thus, in insulating barrier 110, bury magnetic core 112 underground.The lower surface of magnetic core 112 and support plate 130 join, and therefore, the lower surface of magnetic core 112 is not insulated layer 110 and covers.Then, further heating is hardened insulating barrier 110.
Fig. 2-D represents that path forms operation, represents the cross section vertical with the upper surface of insulating barrier 110.First, the Copper Foil 150 of the upper surface of etching isolation layer 110, forms opening at the position that should form path.Further, start, by above-mentioned opening ground irradiating laser, to form the through hole using lower surface conductor 118 as bottom surface from the upper surface direction of insulating barrier 110.Then, form after plating layer 140 by the inwall of through hole being carried out to electroless plating and electrolysis plating, fill non-conductive paste 142.The path 122 forming by this operation forms a part for bonding conductor.
Fig. 2-E represents that upper surface conductor forms operation, represents the cross section vertical with the upper surface of insulating barrier 110.On the Copper Foil 150 attaching in advance on insulating barrier 110, utilize electrolysis plating to form plating layer 152.By while etching plating layer 152 and Copper Foil 150, can form upper surface conductor 116.Upper surface conductor 116 is overlapping with path 122, and is formed at the position overlapping with magnetic core 112 situation of observing from the upper surface direction of insulating barrier 110.
Fig. 2-F represents that side conductor forms operation.For side conductor 120, utilize pattern printing to form in the side of insulating barrier 110.Side conductor 120 is electrically connected with upper surface conductor 116 and lower surface conductor 118.The side conductor 120 forming by this operation forms a part for bonding conductor.
Through above operation, upper surface conductor 116 and lower surface conductor 118 utilize side conductor 120 and path 122 to be electrically connected, formation coil 114 around insulating barrier 110.Finally, peel off support plate 130 from lower surface conductor 118 and insulating barrier 110 and form antenna 100.
In the present embodiment, utilize the side conductor 120 forming in the side of insulating barrier 110 and the path 122 forming in the inside of insulating barrier 110 to form bonding conductor.But the present invention is not limited to this.First, also can replace path 122 to use through hole.At this, through hole refers at the upper surface of insulating barrier 110 to the state not being filled in the through hole forming between lower surface.Form plating layer by the inwall at through hole, electrical connection upper surface conductor 116 and lower surface conductor 118.In addition, also can only form bonding conductor by side conductor, or only form bonding conductor by path or through hole.
In addition, in this embodiment, as shown in Figure 1, form the coil 114 of three patterns.But the present invention is not limited to this.By increasing the quantity of upper surface conductor 116, lower surface conductor 118, side conductor 120 and path 122, can easily form the coil that number of patterns is many.Thus, can realize the coil that inductance value is high.
In addition, in this embodiment, magnetic core 112 is made as to cuboid, but preferably chamfering is carried out in the angle of cuboid, be formed as the shape with circularity.After insulating barrier 110 sclerosis after magnetic core 112 is buried underground, and then apply to insulating barrier 110 in the situation of heat, the moisture vapor comprising in insulating barrier 110, the volume of moisture increases, thus at the interior generation stress of insulating barrier 110.Because this stress easily concentrates on the angle of the magnetic core 112 of burying underground at insulating barrier 110, may be take angle as basic point cracks.Carry out chamfering by diagonal angle, make it have circularity, can dispersive stress, can prevent the generation of crackle.
In addition, the cavity connecting to lower surface from the upper surface of magnetic core 112 in the central part setting of magnetic core 112, is formed as toroidal also effective.By magnetic core 112 is formed as to toroidal, when insulating barrier 110 magnetropism body cores 112 are pressurizeed, the resin that forms insulating barrier 110 also flows into the cavity arranging at the central part of magnetic core 112.Thus, the area that magnetic core 112 and insulating barrier 110 join increases, and therefore, the bond strength of magnetic core 112 and insulating barrier 110 improves.Thereby, can form more firmly antenna 100.But cavity does not preferably hinder by the size of the mobile degree of the magnetic flux of the inside of magnetic core 112.
(variation)
The variation of the antenna 100 of the first execution mode is described with reference to Fig. 3 below.Fig. 3 is the stereogram that represents the variation of the antenna of the first execution mode.
In Fig. 3, magnetic core 112 is embedded in insulating barrier 110.A side at magnetic core 112 is formed with pattern 160.In addition, on insulating barrier 110, be formed with path 123 at the upper surface of insulating barrier 110 between the upper surface of magnetic core 112.Path 123 and pattern 160 are formed at the position overlapping the situation of observing from the upper surface by insulating barrier 110, and these are electrically connected.Bonding conductor comprises: the bonding conductor 120a, path 123 and the pattern 160 that form in the side of insulating barrier 110.
In insulating barrier 110, bury the magnetic core 112 that forms in advance the state of pattern 160 in side underground.In insulating barrier 110, be embedded with after magnetic core 112, make insulating barrier 110 sclerosis form path 123.Path 123 forms to the upper surface of magnetic core 112 at the upper surface from insulating barrier 112, therefore, and the depth as shallow of the path 122 in depth ratio Fig. 1 of the path 123 in Fig. 3.
Utilize laser etc. to be formed with bottom outlet, form plating layer at the inwall that has bottom outlet, must consider that with respect to the ratio of the degree of depth of the bore that has bottom outlet be depth ratio.In Fig. 1, form path 120b using lower surface conductor 118 as bottom surface, therefore, need to consider depth ratio, be set with bore and the degree of depth of bottom outlet.Conventionally, depth ratio is in more than 2 situations, is difficult to plating layer to be formed to the bottom surface of bottom outlet.Thereby, in the case of have the degree of depth of bottom outlet dark, for plating layer being formed to the bottom surface of bottom outlet, need to increase the bore that has bottom outlet.
As mentioned above, in this variation, the path 123 that forms depth as shallow also can, therefore, have that the bore of bottom outlet is little also can.Thereby, can form path 123 with high density more.The pattern 160 that forms in the side of magnetic core 112, upper surface conductor 116, lower surface conductor 118, the side conductor 120 forming in the side of insulating barrier 110 also can form with high density, therefore, by increasing the quantity of formation of path 123, can increase the winding number of coil 114.
" the second execution mode "
With reference to Fig. 4, the second execution mode of the present invention is described.Fig. 4 is the stereogram that represents the structure of the magnetic field coupling type antenna of the second execution mode.Mark identical symbol for the structure identical with the first execution mode, description thereof is omitted.In the following description, by magnetic field coupling type antenna referred to as antenna.
In Fig. 4, antenna 200 for burying two magnetic core 212a, 212b underground in insulating barrier 110. Magnetic core 212a, 212b are respectively that the cumulative volume that two magnetic core 212a, 212b are added up equates with the first execution mode by binary the magnetic core using in the first embodiment.The direction that magnetic core 212a, 212b arrange is the direction orthogonal with the coil axes of coil 114, and the magnetic flux of the coil axes by coil 114 is by the either party's of magnetic core 212a, 212b inside.Thereby the gap between magnetic core 212a, 212b can not hinder flowing by the magnetic flux of the coil axes of antenna 200.
By the magnetic core using is in the first embodiment halved and is used, can be under the original state that maintains antenna sensitivity, reduce the size of magnetic core separately.Stress in bending etc. puts on antenna 200, and stress also puts on magnetic core 212a, 212b via insulating barrier 110.By reducing the size of each magnetic core 212a, 212b, even if stress puts on magnetic core 212a, 212b, the breakage such as break does not also easily occur.
Each magnetic core 212a, 212b are together fixed on support plate, and the insulating barrier 110 of the semi-harden state of pressurized, heated (preforming material) can be embedded in insulating barrier 110 thus simultaneously.Thereby the antenna 200 of two magnetic core 212a, 212b is buried in very easy manufacture underground.
In the present embodiment, the orthogonal mode of the direction of arranging with magnetic core 212a, 212b and the coil axes of coil 114 is provided with magnetic core 212a, 212b, but the present invention is not limited to this execution mode, also magnetic core 212a, 212b can be arranged along the coil axes of coil 114.In addition, can also bury three above magnetic cores underground.
" the 3rd execution mode "
With reference to Fig. 5-A, Fig. 5-B, the 3rd execution mode of the present invention is described.Fig. 5 represents the structure of the magnetic field coupling type antenna of the 3rd execution mode, and Fig. 5-A is stereogram, the profile in the A-A cross section that Fig. 5-B is Fig. 5-A.Mark identical symbol for the structure identical with the first execution mode, description thereof is omitted.In the following description, by magnetic field coupling type antenna referred to as antenna.
In Fig. 5-A, Fig. 5-B, three rectangular-shaped magnetic core 312a, 312b, 312c are embedded in insulating barrier 110.Three magnetic core 312a, 312b, 312c arrange along the coil axes direction of coil 114.Fig. 5-B represents vertical with the upper surface of insulating barrier 110, and along the cross section of the coil axes of coil 114.In this cross section, the height that the aspect ratio that is positioned at two magnetic core 312a, the 312c at the two ends of coil axes direction in three magnetic core 312a, 312b, 312c is positioned at central magnetic core 312b is high., the area with the orthogonal cross section arbitrarily of coil axes of the Area Ratio magnetic core 312a of the face that is positioned at the axial two ends of coil of three magnetic core 312a, 312b, 312c, 312b, 312c is large.Enter the either party of two magnetic core 312a, 312c being positioned at the axial two ends of coil from the outside magnetic flux of antenna 300.The area that is positioned at axial of the coil of coil 114 in these magnetic cores 312a, 312c becomes large, therefore, greatly guarantees the entrance of magnetic flux, and magnetic flux more easily enters.In addition, the different magnetic core radiation magnetic flux of magnetic core entering from magnetic flux from magnetic core 312a, 312c.Also large owing to being positioned at the area of axial of coil herein, therefore, greatly guarantee the outlet of magnetic flux, magnetic flux more easily radiates to outside.So easily enter based on magnetic flux, and the easy structure of radiation, the amount of the magnetic flux of the coil axes by coil 114 increases, and the sensitivity of antenna 300 increases.
By three magnetic core 312a, 312b, 312c are all fixed on support plate, the insulating barrier 110 of double hardening state (preforming material) pressurizes, and is embedded in insulating barrier 110 simultaneously.By such manufacture method, magnetic core can be shaped to special shape, can form the structure that magnetic flux easily enters and radiates.
Further, in the present embodiment, configured the large magnetic core of area at the axial two ends of coil, but the present invention is not limited to this execution mode.Only, in the situation of one end in office configuration, also can obtain certain effect.In addition, by a magnetic core, be shaped in the situation that the area in the orthogonal cross section arbitrarily of the Area Ratio of the face that is positioned at the axial two ends of coil and the coil axes of magnetic core is large, also become that magnetic flux easily enters or the easy structure of radiation, improve antenna sensitivity.But, in this case, magnetic core need to be shaped to special shape.
" the 4th execution mode "
With reference to Fig. 6, the 4th execution mode of the present invention is described.Fig. 6 is the stereogram that represents the structure of the magnetic field coupling type antenna of the 4th execution mode.Mark identical symbol for the structure identical with the first execution mode, and description thereof is omitted.In the following description, by magnetic field coupling type antenna referred to as antenna.
In Fig. 6, magnetic core 412b is embedded in insulating barrier 110.And then other magnetic cores 412a, 412c are arranged at the axial side of coil of the coil 114 that is positioned at insulating barrier 110. Magnetic core 412a, 412c are crimped on the insulating barrier 110 of semi-harden state, make insulating barrier 110 harden under the state of crimping, can be arranged at thus the side of insulating barrier 110. Magnetic core 412a, 412c form in the mode of whole side that covers insulating barrier 110 respectively.
The magnetic core 412a, the 412c that are positioned at the axial end of coil of coil 114 form in the mode of the whole side of covering insulating barrier 110, and therefore, antenna 400 can make magnetic flux enter from the axial whole side of coil that is positioned at coil 114.In addition, can make equally from whole side radiation magnetic flux.Thereby, in the 3rd execution mode, increasing, the amount of the magnetic flux of the coil axes by coil 114 increases, and antenna sensitivity improves. Magnetic core 412a, 412c are not insulated layer 110 and cover, and therefore, have damaged possibility, are not insulated a layer coating but be positioned at central magnetic core 412b, therefore, even if magnetic core 412a, 412c breakage also can realize certain antenna sensitivity.
In the present embodiment, by magnetic core 412a, 412c being crimped on to the insulating barrier 110 of semi-harden state, be arranged at the side of insulating barrier 110, but also can utilize bonding agent magnetic core 412a, 412c to be adhered to the side of the insulating barrier 110 of sclerosis.
" the 5th execution mode "
With reference to Fig. 7, Fig. 8, the 5th execution mode of the present invention is described.Fig. 7 is the stereogram that represents the structure of the magnetic field coupling type antenna of the 5th execution mode.Fig. 8 is the schematic diagram of the route of the magnetic flux of explanation the 5th execution mode.Mark identical symbol for the structure identical with the first execution mode, description thereof is omitted.In the following description, by magnetic field coupling type antenna referred to as antenna.
In Fig. 7, bury two magnetic core 512a, 512b underground at insulating barrier 110.Coil 514 is divided into the first coil portion 515a and the second coil portion 515b and reels, and does not form the non-winder 570 of coil between the first coil portion 515a and the second coil portion 515b.The first coil portion 515a is formed at magnetic core 512a around, and the second coil portion 515b is formed at magnetic core 512b around.
In addition, to comprise on the coil 514 of the first coil portion 515a and the second coil portion 515b, do not cause the mode of induced voltage due to the magnetic flux of the equidirectional of the coil axes by each coil portion 515a, 515b, set the method for attachment of coiling direction and two coil portion 515a, the 515b of each coil portion 515a, 515b.More specifically explanation, in Fig. 7, the winding number of the first coil portion 515a and the second coil portion 515b equates mutually, the opposite direction of reeling the situation of observing from same direction.In addition, the situation of observing from same direction, the top of the terminal of the first coil portion 515a and the second coil portion 515b interconnects.If these form the first coil portion 515a and the second coil portion 515b, the coil axes that has passed through the first coil portion 515a and the second coil portion 515b at unidirectional magnetic flux, cause rightabout induced voltage at the first coil portion 515a and the second coil portion 515b.But because the first coil portion 515a and the second coil portion 515b interconnect, therefore, rightabout voltage is not cancelled each other, and does not cause induced voltage at coil 514.
The action of antenna 500 is described referring to Fig. 8.Fig. 8 is the schematic diagram of the route of the magnetic flux in the B-B cross section of presentation graphs 7.As shown in Figure 8, the magnetic flux φ arriving from the upper surface direction of antenna 500 enters the non-winder 570 arranging between two magnetic core 512a, 512b.Then, magnetic flux is divided into both direction, to two magnetic core 512a, 512b inductions burying underground at insulating barrier 110.So, rightabout magnetic flux is by the first coil portion 515a and the second coil portion 515b.As mentioned above, the coiling direction of the first coil portion 515a and the second coil portion 515b is contrary, therefore, by rightabout magnetic flux, is equidirectional at the voltage of the first coil portion 515a and the second coil portion 515b induction.Thereby, produce the voltage of adding up at the voltage of the first coil portion 515a and the second coil portion 515b induction at coil 514.
In the portable electric appts that requires slimming, be set to the upper surface of antenna 500 and the main surface parallel of portable electric appts.In addition, conventionally, use towards the mode of the direction of arrival of magnetic flux with the interarea of portable electric appts., the upper surface of antenna 500 is towards the direction of arrival of magnetic flux.The antenna 500 of the 5th execution mode is to catch the structure of magnetic flux with upper surface, therefore, becomes efficiency and catch most effectively the structure of magnetic flux in such occupation mode.Thereby antenna 500 plays contribution to the portable electric appts that possesses slimming and high antenna sensitivity simultaneously.
" the 6th execution mode "
With reference to Fig. 9, the 6th execution mode of the present invention is described.Fig. 9 is the stereogram that represents the structure of the magnetic field coupling type antenna module of the 6th execution mode.Mark identical symbol for the structure identical with the first execution mode, and description thereof is omitted.In the following description, by magnetic field coupling type antenna module referred to as Anneta module.
In Fig. 9, Anneta module 601 for burying magnetic core 112 underground and capacitor 680 forms in insulating barrier 110.The situation that the upper surface direction that capacitor 680 is insulating barrier 110 from the outside of coil 114 is observed, between the side and path 122 of insulating barrier 110.Capacitor 680 together forms resonant circuit with coil 114.The frequency of the magnetic flux catching with antenna 600 at the resonance frequency of this resonant circuit is consistent, can cause king-sized induced voltage.
In the present embodiment, the capacitor 680 of integrated formation resonant circuit and coil 114, be formed as Anneta module 601.Thereby after the making of antenna 600, resonance frequency can not change, can stablize and realize high antenna sensitivity.
In addition, capacitor 680 is embedded in insulating barrier 110 as element.Thereby, by burying the capacitor that characteristic is different underground, do not need to change shape and the forming part of the upper surface conductor 116, lower surface conductor 118, side conductor 120 and the path 122 that form at insulating barrier 110, can easily change the characteristic of Anneta module 601.In addition, as capacitor 680, select the large capacitors of electric capacity such as cascade capacitor, can significantly change thus the characteristic of Anneta module 601.
(variation)
Modified embodiment of the present embodiment shown in Figure 10.In Figure 10, capacitor 680 in the case of from the inner side of coil 114 be insulating barrier 110 upper surface direction observe between magnetic core 112 and path 122.In this variation, also by same operation, capacitor 680 and magnetic core 112 are embedded in insulating barrier 110 simultaneously, therefore, can easily manufacture.
In variation, capacitor 680 is surrounded by upper surface conductor 116, lower surface conductor 118, path 122.Upper surface conductor 116, lower surface conductor 118, path 122 not only form coil 114, also as the radome performance function of capacitor 680, can alleviate capacitor 680 and be subject to the situation of the impact of outside electromagnetic field.Thereby, in Anneta module 602, further suppressing the variation of the resonance frequency of the resonant circuit that coil 114 and capacitor 680 form, the antenna sensitivity of Anneta module 602 is further stable.
Further, in the present embodiment, in insulating barrier 110, buried capacitor 680 underground, but the electronic unit of burying underground is that capacitor parts are in addition also harmless.In addition, the capacitor 680 that is embedded in insulating barrier 110 is for multiple also harmless.
" the 7th execution mode "
With reference to Figure 11, the 7th execution mode of the present invention is described.Figure 11 is the stereogram that represents the structure of the magnetic field coupling type antenna device of the 7th execution mode.Mark identical symbol for the structure identical with the first execution mode, and description thereof is omitted.In the following description, by magnetic field coupling type antenna device referred to as antenna assembly.
In Figure 11, antenna assembly 703 forms for magnetic core 112, capacitor 780 and integrated circuit component 782 are embedded in insulating barrier 110.Integrated circuit component 782 is built-in with RFID treatment circuit.
By also bury integrated circuit component 782 underground in insulating barrier 110, the antenna 700 being made up of magnetic core 112 and coil 114 is all integrated as the required important document of RFID antenna performance function.Thereby, can install integratedly to portable electric appts.
In addition, can, in same operation, magnetic core 112, coil 114 and integrated circuit component 782 be embedded in to insulating barrier 110 simultaneously.Thereby, manufacture easily antenna assembly 703.
" the 8th execution mode "
With reference to Figure 12-A, Figure 12-B, the 8th execution mode of the present invention is described.Figure 12-A, Figure 12-B are the figure that represents the structure of the magnetic field coupling type antenna device of the 8th execution mode, and Figure 12-A is stereogram, and Figure 12-B is the profile in the C-C cross section of Figure 12-A.Mark identical symbol for the structure identical with the first execution mode, and description thereof is omitted.In the following description, by magnetic field coupling type antenna device referred to as antenna assembly.
In Figure 12-A, Figure 12-B, antenna assembly 803 forms for magnetic core 112, capacitor 880 and integrated circuit component 882 are embedded in insulating barrier 110.In integrated circuit component 882, be built-in with RFID treatment circuit.Lower surface at insulating barrier 110 is also provided with lower insulation layer 811, is formed with lower surface electrode layer 890 at the lower surface of lower insulation layer 811.
The lower surface of antenna assembly 803 is installed on the mother substrate of portable electric appts.In the present embodiment, be formed with lower surface electrode layer 890 at the lower surface of antenna assembly 803.Therefore, the magnetic field of the circuit forming at mother substrate is covered by lower surface electrode layer 890, and antenna assembly 803 is not subject to the impact of the circuit of mother substrate.Thereby, can suppress the inductance value of the coil 114 that forms antenna assembly 803 or the situation of the resonance frequency of the resonant circuit that formed by capacitor 880 and coil 114 variation.
(variation)
Modified embodiment of the present embodiment shown in Figure 13-A, Figure 13-B.Figure 13-A, Figure 13-B are the figure that represents the variation of the 8th execution mode, and Figure 13-A is stereogram, and Figure 13-B is the profile in the D-D cross section of Figure 13-A.
In Figure 13-A, Figure 13-B, the antenna assembly 800 of recording, be formed with upper surface electrode layer 892 at the position that does not form upper surface conductor 116 of the upper surface of insulating barrier 110 in Figure 12-A, Figure 12-B.Upper surface electrode layer 892 is connected with lower surface electrode layer 890 via path 894.Utilize upper surface electrode layer 892 not only to cover antenna assembly 800, but also cover upper surface, make its impact that is not subject to outside electromagnetic field, make the characteristic of antenna assembly 800 more stable.Further, for upper surface electrode layer 892, be not limited to lower surface electrode layer 890, also can with being connected of electrode as ground connection.
In the present embodiment, the lower surface of burying at insulating barrier 110 antenna assembly 803 that magnetic core 112, capacitor 880 and integrated circuit component 882 form underground has formed lower insulation layer 811 and lower surface electrode layer 890.But lower insulation layer 811 and lower surface electrode layer 890 also can be formed at the lower surface of only burying the Anneta module that magnetic core and capacitor form at insulating barrier 110 underground.In this case, be not subject to being arranged at from Anneta module the impact of the electromagnetic field of the circuit of mother substrate yet, can suppress the inductance value of coil or the situation of the resonance frequency of the resonant circuit that formed by capacitor and coil variation.
" the 9th execution mode "
With reference to Figure 14, the 9th execution mode of the present invention is described.Figure 14 is the stereogram that represents the structure of the magnetic field coupling type antenna device of the 9th execution mode.Mark identical symbol for the structure identical with the first execution mode, and description thereof is omitted.In the following description, by magnetic field coupling type antenna device referred to as antenna assembly.
In Figure 14, antenna assembly 903 is embedded with two magnetic core 912a, 912b, capacitor 980 and integrated circuit components 982 in insulating barrier 110.Integrated circuit component 982 is built-in with RFID treatment circuit.
The non-winder 970 that capacitor 980 and integrated circuit component 982 are arranged at respectively between the first coil portion 915a and the second coil portion 915b is between two magnetic core 912a, 912b.Make coil 914 bring into play the non-winder 970 of function and the setting area of capacitor 980 and integrated circuit component 982 is overlapping by upper surface for insulating barrier 110 being caught to magnetic flux, and realize the miniaturization of antenna assembly 903 entirety.Further, in the present embodiment, even have capacitor 980 or integrated circuit component 982 in non-winder 970, also can not hinder entering of magnetic flux due to capacitor 980 or integrated circuit component 982.
In the present embodiment, two magnetic core 912a, 912b have been buried underground at insulating barrier 110.But, also can bury a magnetic core underground.
In addition, in the present embodiment, bury underground in the antenna assembly that magnetic core 912a, 912b, capacitor 980 and integrated circuit component 982 form at insulating barrier 110, between the first coil portion 915a and the second coil portion 915b, formed non-winder 970.But, also non-winder 970 can be formed at insulating barrier 110 and only bury the Anneta module that magnetic core and capacitor form underground.In this case, also, by the setting area of overlapping non-winder and capacitor, can realize miniature antenna module.
Claims (17)
1. a magnetic field coupling type antenna, possesses:
The first insulating barrier;
Be embedded in the magnetic core of described the first insulating barrier;
Be formed at the upper surface conductor of the upper surface of described the first insulating barrier;
Be formed at the lower surface conductor of the lower surface of described the first insulating barrier;
Be formed at the second insulating barrier of the lower surface of described lower surface conductor;
Be formed at the lower surface electrode layer of the lower surface of described the second insulating barrier;
Be electrically connected the bonding conductor of described upper surface conductor and described lower surface conductor,
Wherein, utilize described upper surface conductor, described lower surface conductor and described bonding conductor to form the coil with the coil axes parallel with the upper surface of described the first insulating barrier, described magnetic core is to be mounted in described lower surface conductor side with the overlapping mode of described lower surface conductor.
2. magnetic field coupling type antenna according to claim 1, is characterized in that,
Described magnetic core comprises multiple magnetic cores.
3. magnetic field coupling type antenna according to claim 2, is characterized in that,
The direction that described multiple magnetic core is arranged is the direction orthogonal with the coil axes of described coil.
4. according to the magnetic field coupling type antenna described in any one in claim 1～3, it is characterized in that,
Described in the Area Ratio of the face at least one party's who is arranged in the axial two ends of described coil of described magnetic core face, the area with the orthogonal arbitrary section of described coil axes of magnetic core is large.
5. according to the magnetic field coupling type antenna described in any one in claim 1～3, it is characterized in that,
In the side that is positioned at axial described the first insulating barrier of described coil, described magnetic core is set.
6. according to the magnetic field coupling type antenna described in any one in claim 1～3, it is characterized in that,
Described coil is divided into the first coil portion and the second coil portion and forms to have the state of non-winder in centre.
7. according to the magnetic field coupling type antenna described in any one in claim 1～3, it is characterized in that,
The through hole that utilization is electrically connected with upper surface conductor or/and the lower surface conductor of described the first insulating barrier or path form at least a portion of described bonding conductor.
8. magnetic field coupling type antenna according to claim 7, is characterized in that,
Utilize at least a portion that forms described bonding conductor at the preformed pattern in the side of described magnetic core, described pattern is electrically connected with described through hole or path.
9. a magnetic field coupling type antenna module, is characterized in that, possesses:
Magnetic field coupling type antenna in claim 1～8 described in any one;
The electronic unit of burying underground at described the first insulating barrier.
10. magnetic field coupling type antenna module according to claim 9, is characterized in that,
Described electronic unit is capacitor.
11. according to the magnetic field coupling type antenna module described in claim 9 or 10, it is characterized in that,
Observe from the upper surface direction of described the first insulating barrier, described electronic unit is arranged between described magnetic core and described bonding conductor.
12. 1 kinds of magnetic field coupling type antenna modules, is characterized in that possessing:
Magnetic field coupling type antenna claimed in claim 6;
Be embedded in the capacitor of described the first insulating barrier,
Wherein, described capacitor is arranged at described non-winder.
13. 1 kinds of magnetic field coupling type antenna devices, possess:
Magnetic field coupling type antenna module in claim 9～12 described in any one;
Be embedded in the integrated circuit of described the first insulating barrier.
14. magnetic field coupling type antenna devices according to claim 13, is characterized in that,
The position that does not form described upper surface conductor at the upper surface of described the first insulating barrier is formed with upper surface electrode layer.
The manufacture method of 15. 1 kinds of magnetic field coupling type antennas, comprising:
On the second insulating barrier, form the operation of lower surface conductor;
The operation of carrying magnetic core on described the second insulating barrier;
To described the second insulating barrier and described magnetic core, the first insulating barrier of the semi-harden state that pressurizes, and described magnetic core is embedded in to the operation of described the first insulating barrier;
Make the operation of described the first insulating barrier sclerosis that is embedded with described magnetic core;
Form the operation of the bonding conductor being electrically connected with described lower surface conductor at described the first insulating barrier;
On opposed of the face joining with described lower surface conductor of described the first insulating barrier, form the operation of the upper surface conductor being electrically connected with described bonding conductor,
By described magnetic core to be mounted in described lower surface conductor side with the overlapping mode of described lower surface conductor.
The manufacture method of 16. 1 kinds of magnetic field coupling type antenna modules, comprising:
On the second insulating barrier, form the operation of lower surface conductor;
The operation of carrying magnetic core and capacitor on described the second insulating barrier;
To described the second insulating barrier and described magnetic core and described capacitor, the first insulating barrier of the semi-harden state that pressurizes, and described magnetic core is embedded in to the operation of described the first insulating barrier;
Make the operation of described the first insulating barrier sclerosis that is embedded with described magnetic core and described capacitor;
Form the operation of the bonding conductor being electrically connected with described lower surface conductor at described the first insulating barrier;
On opposed of the face joining with described lower surface conductor of described the first insulating barrier, form the operation of the upper surface conductor being electrically connected with described bonding conductor,
By described magnetic core to be mounted in described lower surface conductor side with the overlapping mode of described lower surface conductor.
The manufacture method of 17. 1 kinds of magnetic field coupling type antenna devices, comprising:
On the second insulating barrier, form the operation of lower surface conductor;
The operation of carrying magnetic core, capacitor and integrated circuit component on described the second insulating barrier;
To described the second insulating barrier and described magnetic core, described capacitor and described integrated circuit component, the first insulating barrier of the semi-harden state that pressurizes, and described magnetic core is embedded in to the operation of described the first insulating barrier;
Make the operation of described the first insulating barrier sclerosis that is embedded with described magnetic core, described capacitor and described integrated circuit component;
Form the operation of the bonding conductor being electrically connected with described lower surface conductor at described the first insulating barrier;
On opposed of the face joining with described lower surface conductor of described the first insulating barrier, form the operation of the upper surface conductor being electrically connected with described bonding conductor,
By described magnetic core to be mounted in described lower surface conductor side with the overlapping mode of described lower surface conductor.
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| JP105513/2007 | 2007-04-13 | ||
| JP2007105513 | 2007-04-13 | ||
| PCT/JP2008/057078 WO2008133018A1 (en) | 2007-04-13 | 2008-04-10 | Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device, and their manufacturing methods |
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| CN110011705A (en) * | 2014-12-19 | 2019-07-12 | 株式会社村田制作所 | Wireless IC device |
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| JP5267463B2 (en) | 2008-03-03 | 2013-08-21 | 株式会社村田製作所 | Wireless IC device and wireless communication system |
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Also Published As
| Publication number | Publication date |
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| GB2485318A (en) | 2012-05-09 |
| WO2008133018A1 (en) | 2008-11-06 |
| GB201202765D0 (en) | 2012-04-04 |
| CN101657938A (en) | 2010-02-24 |
| GB0917865D0 (en) | 2009-11-25 |
| GB2461443A (en) | 2010-01-06 |
| JP2013078144A (en) | 2013-04-25 |
| GB2485318B (en) | 2012-10-10 |
| GB2461443B (en) | 2012-06-06 |
| JPWO2008133018A1 (en) | 2010-07-22 |
| JP5170087B2 (en) | 2013-03-27 |
| JP5573937B2 (en) | 2014-08-20 |
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