CN101655529A - Chip testing classifier capable of simulating system test - Google Patents
Chip testing classifier capable of simulating system test Download PDFInfo
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- CN101655529A CN101655529A CN200810213606A CN200810213606A CN101655529A CN 101655529 A CN101655529 A CN 101655529A CN 200810213606 A CN200810213606 A CN 200810213606A CN 200810213606 A CN200810213606 A CN 200810213606A CN 101655529 A CN101655529 A CN 101655529A
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- simulation system
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Abstract
The invention relates to a chip testing classifier capable of simulating a system test. A temperature control chamber is arranged on a machine platform; a baseplate of the temperature control chamberis provided with a test block; a vacuum suction nozzle is assembled under a down pressing rod of a mechanical arm and is used for sucking a chip to be tested; the down pressing rod is pressed down into the temperature control chamber, so that the chip to be tested is correspondingly pressed against the test block and is electrically connected with a simulation system circuit board; simultaneously,a cover plate in the middle section of the down pressing rod covers and seals an upper opening of the temperature control chamber, and the temperature control chamber forms an enclosed accommodatingchamber. At the moment, the temperature control chamber is introduced with high temperature or low temperature gas, and the chip to be tested is subjected to a system simulation test respectively in high temperature or low temperature environment. If a delivery hose is arranged in the temperature control chamber to quickly extract the gas in the temperature control chamber, the time course of thesystem test in the changing of different temperatures can be shortened.
Description
Technical field
The invention relates to a kind of chip testing classifier, but refer in particular to a kind of chip testing classifier that is applicable to the simulation system test.
Background technology
Seeing also Fig. 1, is the stereographic map of known CD-ROM system test box.As shown in the figure, known chip system grade low-temperature test mode (system level test, SLT), be chip to be measured 91 that assembling is finished, system testing circuit board 92, CD-ROM drive 93, and power module together put into the low-temperature test casing 9 of similar refrigerator, again with-20 ℃ cryogenic freezing.
Thereafter, again chip 91 to be measured, system testing circuit board 92, CD-ROM drive 93 are taken out outer with the outside computer interconnection of casing and carry out system testing, whether qualified to judge chip to be measured 91, with manual type chip 91 to be measured is taken out in system testing circuit board 92 again, and make the quality sub-material of chip 91 to be measured according to the differentiation result of computing machine.
Be to carry out under the room temperature outside leaving low-temperature test casing 9 when testing owing to chip 91 to be measured, chip 91 to be measured and system testing circuit board 92 thereof have been risen again gradually, they are different with the low temperature environment in the low-temperature test casing 9, therefore the result that comes out of system testing be not expect, it only can learn whether chip to be measured 91 is freezing by the low temperature environment of low-temperature test casing 9 institute, and can not actually record the test result of chip 91 to be measured under low temperature environment.
If desire to carry out high temperature test, again must with chip 91 to be measured, system testing circuit board 92, CD-ROM drive 93, and power module again row put in the casing of another special high temperature test, and repeat above-mentioned steps to finish the high temperature test of chip 91 to be measured.
Thus, known test mode is to test with different high and low temperature casings, and it increases equipment cost, manually carrying out sub-material, its labor intensive, and time cost, finally its test result still has doubt, what should consider is the prestige cost of company.
Summary of the invention
But the object of the present invention is to provide the chip testing classifier of a kind of simulation system test, to improve the defective that exists in known.
For achieving the above object, but the chip testing classifier of simulation system test provided by the invention comprises a board, a temperature controlled compartment (temperature controlled room), a simulation system circuit board (simulated system PCB), reaches a mechanical arm (Robot arm).
Board includes at least one gas supply device, temperature controlled compartment is arranged on the board, temperature controlled compartment is an airtight chamber (closed chamber), it includes a base plate, a upper shed, reaches at least one ingress pipe, base plate is provided with at least one test bench (testing socket), the upper shed correspondence is positioned at least one test bench top, and at least one ingress pipe is communicated between temperature controlled compartment and at least one gas supply device, enters in the temperature controlled compartment with the gas that imports low temperature or high temperature;
The simulation system circuit board is electrically connected at least one test bench of temperature controlled compartment, and group is provided with at least one peripheral assembly on the simulation system circuit board, and it can accept the control operation of chip to be measured.
Mechanical arm includes a down-pressed pole, reaches a fetching device, down-pressed pole below group is provided with fetching device, the down-pressed pole stage casing is also organized and is provided with a cover plate, down-pressed pole stretches in the upper shed downwards, the cover plate correspondence covers the airtight firmly upper shed of temperature controlled compartment, makes and forms an airtight room in the temperature controlled compartment, therefore, at the test phase of chip to be measured, no matter be that the neither meeting of high temperature or cryogenic gas is overflowed from temperature controlled compartment.
By the present invention, mechanical arm can be placed in chip to be measured in the temperature controlled compartment, under the environment of high temperature of setting or low temperature, makes chip to be measured can make the simulation test of system-level to the simulation system circuit board, can shorten the test duration and improve the efficient of test.
Wherein, at least one gas supply device can include a gas pump, reach an electric heater.At least one gas supply device can include a cryogenic nitrogen gas cylinder.Therefore can provide a low temperature nitrogen to enter in the temperature controlled compartment by cryogenic catheter.Because temperature controlled compartment can provide the high temperature of chip to be measured, the test environment of low temperature respectively; Needn't be limited by the difference of high and low temperature when therefore, testing same chip to be measured and the conversion testing board.
Temperature controlled compartment can include at least one delivery line, and at least one delivery line is the outside that is communicated to temperature controlled compartment.So can pass through a vacuum source, in present embodiment, vacuum source is meant that a vacuum pump and this at least one delivery line detach out temperature controlled compartment fast with high temperature or cryogenic gas, can reduce the time of waiting for when the different probe temperature of conversion.
In addition, temperature controlled compartment can comprise at least one temperature sensor, and it is in order to the indoor temperature of sensing temperature controlled compartment, and the temperature controlled compartment periphery is coated with a thermofin.Thermofin is to be made by the glass fibre material.The cover plate of mechanical arm is coated with a thermofin, and thermofin is to be made by the glass fibre material.
The simulation system circuit board can be selected from following group one at least: CD-ROM drive, Winchester disk drive, sound card, GPS chip, electric power control chip.
Moreover, but the chip testing classifier of simulation system test, it can comprise a feed unit, feed unit can comprise at least one supply disk, at least one transhipment shuttle platform, a transhipment interface, reach another mechanical arm.But the chip testing classifier of simulation system test, it can comprise that one goes out material unit, goes out material unit and can comprise at least two material separating discs.The fetching device of mechanical arm can include a vacuum slot.
Description of drawings
Fig. 1 is the stereographic map of known test casing.
Fig. 2 is the stereographic map of a preferred embodiment of the present invention chip testing classifier.
Fig. 3 is the exploded view of a preferred embodiment of the present invention moist closet.
Fig. 4 is the partial perspective view of a preferred embodiment of the present invention board.
Primary clustering symbol description in the accompanying drawing
Board 1 gas supply device 11 gas pumps 111
Electric heater 112 cryogenic nitrogen gas cylinders 113 vacuum pumps 114
Temperature controlled compartment 2 base plates 21 test benches 211
Vacuum slot 421 feed units 5 supply disks 51,52
Chip 511,521 transhipment shuttle platforms 55 chip putting grooves 551 to be measured
Go out material unit 7 material separating discs 71,72 low-temperature test casings 9
Embodiment
See also Fig. 2 and Fig. 3, Fig. 2 is the stereographic map of a preferred embodiment of the present invention chip testing classifier, and Fig. 3 is the exploded view of a preferred embodiment of the present invention moist closet.
As shown in the figure, but present embodiment is the chip testing classifier about a kind of simulation system test, comprises a board 1, a temperature controlled compartment 2, a simulation system circuit board 3, reaches a mechanical arm 4.
Board 1 includes at least one gas supply device 11.Temperature controlled compartment 2 is arranged on the board 1, temperature controlled compartment 2 includes a base plate 21, a top board 22, a upper shed 221, reaches an ingress pipe 23, base plate 21 is provided with a test bench 211, upper shed 221 is opened in top board 22 places, and upper shed 221 correspondences are positioned at test bench 211 tops, ingress pipe 23 comprises a cryogenic catheter 231, reaches a high temperature conduit 232, and ingress pipe 23 is communicated between temperature controlled compartment 2 and the gas supply device 11, enters in the temperature controlled compartment 2 with the gas that imports low temperature or high temperature.
In Fig. 2, and Fig. 3 in, gas supply device 11 includes a gas pump 111, an and electric heater 112, therefore can provide a high-temperature gas to enter in the temperature controlled compartment 2 by cryogenic catheter 231.
In addition, gas supply device 11 includes a cryogenic nitrogen gas cylinder 113.Therefore can provide a low temperature nitrogen to enter in the temperature controlled compartment 2 by cryogenic catheter 231.Because temperature controlled compartment 2 can provide the high temperature of chip 511 to be measured, the test environment of low temperature respectively; Needn't be limited by the difference of high and low temperature when therefore, testing same chip 511 to be measured and the conversion testing board.
Simulation system circuit board 3 is electrically connected to the test bench 211 of temperature controlled compartment 2, and group is provided with at least one peripheral assembly 31 on the simulation system circuit board 3, and it can accept the control operation of chip 511 to be measured.
Mechanical arm 4 includes a down-pressed pole 41, reaches a fetching device 42, and down-pressed pole 41 below groups are provided with fetching device 42, and fetching device 42 is in order to draw or to place chip 511 to be measured.
The fetching device 42 of mechanical arm 4 includes a vacuum slot 421.In this example, vacuum slot 421 is in order to draw a chip 511 to be measured, down-pressed pole 41 stage casings are also organized and are provided with a cover plate 411, therefore cover plate 411 is tops that fetching device 42 is located in the position, down-pressed pole 41 stretches into downwards in the upper shed 221, and the just in time corresponding electric contact that is resisted against in this test bench 211 of the chip to be measured 511 that the vacuum slot 421 that makes fetching device 42 is drawn, with chip 511 to be measured is pressed put push against in test bench 211 in and wherein electric contact be electrically connected to each other to test.
At this moment, cover plate 411 correspondences cover the airtight firmly upper shed 221 of temperature controlled compartment 2, and make and form airtight rooms in the temperature controlled compartment 2, therefore, at the test phase of chip 511 to be measured, no matter be that the neither meeting of high temperature or cryogenic gas is overflowed from temperature controlled compartment 2.
By the present invention, mechanical arm 4 can be placed in chip 511 to be measured in the temperature controlled compartment 2, under the environment of high temperature of setting or low temperature, make chip 511 to be measured can make the simulation test of system-level to simulation system circuit board 3, can shorten the test duration and improve the efficient of test.
In addition, as shown in Figure 2 controller 6 its respectively with mechanical arm 4, and simulation system circuit board 3 electrically connect.
Please see Figure 2, reach Fig. 3, temperature controlled compartment 2 also comprises at least one temperature sensor 25, wherein, temperature sensor 25 is to electrically connect with controller 6, it is in order to the indoor temperature of sensing temperature controlled compartment 2, and when carrying out high temperature test, controller 6 control high-temperature solenoid valves are opened, make high temperature hot gas in high temperature conduit 232 imports temperature controlled compartments 2, chip 511 to be measured was in the following of high temperature test environment and tested this moment; Otherwise, when carrying out low-temperature test, controller 6 control low-temperature solenoid valves are opened, cryogenic gas imports in the temperature controlled compartment 2 from cryogenic catheter 231, chip 511 to be measured was in the following of low-temperature test environment and tested this moment, wherein, high-temperature gas is meant the hot-air after the heating, and cryogenic gas is meant the liquid nitrogen of gasification.
In addition, temperature controlled compartment 2 also includes a delivery line 24, and delivery line 24 is the outsides that are communicated to temperature controlled compartment 2.So can high temperature or cryogenic gas be detached out temperature controlled compartment 2 fast by a vacuum source and delivery line 24, can when the different probe temperature of conversion, reduce the time of waiting for, wherein, in this example, vacuum source is meant a vacuum pump 114.
As shown in Figure 3, temperature controlled compartment 2 peripheries are coated with a thermofin 26, and thermofin 26 is to be made by the glass fibre material, and the cover plate 411 of mechanical arm 4 is coated with a thermofin 412, and thermofin 412 is to be made by the glass fibre material.
Seeing also Fig. 4, is the partial perspective view of a preferred embodiment of the present invention board.Wherein, but the chip testing classifier of simulation system test comprises a feed unit 5, and it comprises supply disk 51,52, a transhipment shuttle platform 55, a transhipment interface 56, reaches another mechanical arm 57.
In addition, but the chip testing classifier of simulation system test comprises that one goes out material unit 7, goes out material unit 7 and comprises at least two material separating discs 71,72.
Then, transhipment shuttle platform 55 is positioned the lateral location of temperature controlled compartment 2, mechanical arm 4 optionally is positioned to transport chip putting groove 551 positions of shuttle platform 55 or optionally is positioned temperature controlled compartment 2 its test bench 211 positions, mechanical arm 4 is drawn chip 511 to be measured from the chip putting groove 551 of transporting shuttle platform 55, and chip 511 to be measured is inserted on the test bench 211 in order to test.
After chip 511 tests to be measured are finished, transhipment shuttle platform 55 is positioned to transport interface 56 once more, mechanical arm 57 is optionally divided a word with a hyphen at the end of a line in transhipment shuttle platform 55 and material separating disc 71, between 72 will transport the chip 511 that testing on the chip putting groove 551 on the shuttle platform 55 finished, 521 are positioned over respectively in the material separating disc 71,72.
In this example, controller 6 can be categorized into acceptance or rejection two classes with the chip to be measured 511,521 after the test, and is positioned over material separating disc 71 respectively with mechanical arm 57, in 72, wherein, material separating disc 71 is the chip material separating disc of test passes, and material separating disc 72 is the chip material separating disc of test failure, since tester table after test finishes immediately with the chip sub-material, therefore, can significantly shorten the test duration, promote test output.
The foregoing description is only given an example for convenience of description, and the interest field that the present invention advocated is from should but not only limiting to the foregoing description with described being as the criterion of claim scope of application.
Claims (10)
- But 1, a kind of chip testing classifier of simulation system test comprises:One board includes at least one gas supply device;One temperature controlled compartment, be arranged on this board, this temperature controlled compartment includes a base plate, a upper shed, reaches at least one ingress pipe, this base plate is provided with at least one test bench, this upper shed correspondence is positioned at this at least one test bench top, and this at least one ingress pipe is communicated between this temperature controlled compartment and this at least one gas supply device;One simulation system circuit board is electrically connected to this at least one test bench of this temperature controlled compartment, and group is provided with at least one peripheral assembly on this simulation system circuit board; AndOne mechanical arm includes a down-pressed pole, reaches a fetching device, and this down-pressed pole below group is provided with this fetching device, and this down-pressed pole stage casing group is provided with a cover plate, and this down-pressed pole stretches into downwards in this upper shed, and this cover plate correspondence covers airtight firmly this upper shed of this temperature controlled compartment.
- But 2, the chip testing classifier of simulation system test according to claim 1, wherein, this at least one gas supply device includes a gas pump, an and electric heater.
- But 3, the chip testing classifier of simulation system test according to claim 1, wherein, this at least one gas supply device includes a cryogenic nitrogen gas cylinder.
- But 4, the chip testing classifier of simulation system test according to claim 1, wherein, this temperature controlled compartment includes at least one delivery line, and this at least one delivery line is the outside that is communicated to this temperature controlled compartment.
- But 5, the chip testing classifier of simulation system test according to claim 1, wherein, this temperature controlled compartment comprises at least one temperature sensor, in order to the indoor temperature of this temperature controlled compartment of sensing.
- But 6, the chip testing classifier of simulation system test according to claim 1, wherein, this temperature controlled compartment periphery includes a thermofin.
- But 7, the chip testing classifier of simulation system test according to claim 1, wherein, this cover plate of this mechanical arm includes a thermofin.
- But 8, the chip testing classifier of simulation system test according to claim 1 wherein, comprises a feed unit, and this feed unit comprises at least one supply disk, at least one transhipment shuttle platform, a transhipment interface, and another mechanical arm.
- But 9, the chip testing classifier of simulation system test according to claim 1 wherein, comprises that one goes out material unit, and this discharging unit comprises at least two material separating discs.
- But 10, the chip testing classifier of simulation system test according to claim 1, wherein, this fetching device of this mechanical arm includes a vacuum slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810213606A CN101655529A (en) | 2008-08-22 | 2008-08-22 | Chip testing classifier capable of simulating system test |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810213606A CN101655529A (en) | 2008-08-22 | 2008-08-22 | Chip testing classifier capable of simulating system test |
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| Publication Number | Publication Date |
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| CN101655529A true CN101655529A (en) | 2010-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200810213606A Pending CN101655529A (en) | 2008-08-22 | 2008-08-22 | Chip testing classifier capable of simulating system test |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102539969A (en) * | 2011-12-31 | 2012-07-04 | 渤海造船厂集团有限公司 | Marine electric valve electric property debugging device |
| CN103499751A (en) * | 2013-09-13 | 2014-01-08 | 塑能科技（苏州）有限公司 | Connection test machine |
| CN106180004A (en) * | 2016-08-08 | 2016-12-07 | 深圳市华宇半导体有限公司 | The control system of fingerprint separator and control method |
| CN106290991A (en) * | 2015-06-10 | 2017-01-04 | 鸿劲科技股份有限公司 | Electronic components test equipment |
| CN108037321A (en) * | 2016-10-25 | 2018-05-15 | 致茂电子股份有限公司 | Anti-dewing module of test socket and electronic element detection device with same |
| CN108663545A (en) * | 2017-03-31 | 2018-10-16 | 鸿劲精密股份有限公司 | Electronic component temperature control box unit and its testing classification equipment of application |
| CN108761236A (en) * | 2018-05-28 | 2018-11-06 | 北京智芯微电子科技有限公司 | Performance Test System and test method of the RFID tag under high/low temperature condition |
| CN110133469A (en) * | 2019-05-31 | 2019-08-16 | 德淮半导体有限公司 | Semiconductor testing apparatus and its working method |
| CN111443272A (en) * | 2020-05-12 | 2020-07-24 | 中南大学 | Laser bar testing method and device |
| CN111495770A (en) * | 2020-04-22 | 2020-08-07 | 长沙南道电子科技有限公司 | Chip detection device |
| CN111933551A (en) * | 2020-08-13 | 2020-11-13 | 技感半导体设备(南通)有限公司 | All-in-one is selected separately in image sensor chip test |
| CN112485645A (en) * | 2020-11-30 | 2021-03-12 | 海光信息技术股份有限公司 | Chip test temperature control method, control system, temperature control board card and test system |
| CN108931717B (en) * | 2017-05-25 | 2021-10-08 | 京元电子股份有限公司 | High-low temperature switching test module |
| CN113533928A (en) * | 2020-04-16 | 2021-10-22 | 第一检测有限公司 | System level test equipment and system level test system |
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2008
- 2008-08-22 CN CN200810213606A patent/CN101655529A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102539969B (en) * | 2011-12-31 | 2015-12-09 | 渤海造船厂集团有限公司 | Marine electric valve electric property debugging device |
| CN102539969A (en) * | 2011-12-31 | 2012-07-04 | 渤海造船厂集团有限公司 | Marine electric valve electric property debugging device |
| CN103499751A (en) * | 2013-09-13 | 2014-01-08 | 塑能科技（苏州）有限公司 | Connection test machine |
| CN106290991A (en) * | 2015-06-10 | 2017-01-04 | 鸿劲科技股份有限公司 | Electronic components test equipment |
| CN106180004A (en) * | 2016-08-08 | 2016-12-07 | 深圳市华宇半导体有限公司 | The control system of fingerprint separator and control method |
| CN108037321A (en) * | 2016-10-25 | 2018-05-15 | 致茂电子股份有限公司 | Anti-dewing module of test socket and electronic element detection device with same |
| CN108663545A (en) * | 2017-03-31 | 2018-10-16 | 鸿劲精密股份有限公司 | Electronic component temperature control box unit and its testing classification equipment of application |
| CN108663545B (en) * | 2017-03-31 | 2024-05-10 | 鸿劲精密股份有限公司 | Electronic component temperature control box unit and test classification equipment applied to same |
| CN108931717B (en) * | 2017-05-25 | 2021-10-08 | 京元电子股份有限公司 | High-low temperature switching test module |
| CN108761236A (en) * | 2018-05-28 | 2018-11-06 | 北京智芯微电子科技有限公司 | Performance Test System and test method of the RFID tag under high/low temperature condition |
| CN110133469A (en) * | 2019-05-31 | 2019-08-16 | 德淮半导体有限公司 | Semiconductor testing apparatus and its working method |
| CN113533928A (en) * | 2020-04-16 | 2021-10-22 | 第一检测有限公司 | System level test equipment and system level test system |
| CN111495770A (en) * | 2020-04-22 | 2020-08-07 | 长沙南道电子科技有限公司 | Chip detection device |
| CN111443272A (en) * | 2020-05-12 | 2020-07-24 | 中南大学 | Laser bar testing method and device |
| CN111933551A (en) * | 2020-08-13 | 2020-11-13 | 技感半导体设备(南通)有限公司 | All-in-one is selected separately in image sensor chip test |
| CN112485645A (en) * | 2020-11-30 | 2021-03-12 | 海光信息技术股份有限公司 | Chip test temperature control method, control system, temperature control board card and test system |
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Application publication date: 20100224 |