CN101632091A - 用于rfid***、尤其用于rfid标签的自粘天线及其制造方法 - Google Patents

用于rfid***、尤其用于rfid标签的自粘天线及其制造方法 Download PDF

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CN101632091A
CN101632091A CN200880008190A CN200880008190A CN101632091A CN 101632091 A CN101632091 A CN 101632091A CN 200880008190 A CN200880008190 A CN 200880008190A CN 200880008190 A CN200880008190 A CN 200880008190A CN 101632091 A CN101632091 A CN 101632091A
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M·博恩
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Abstract

一种用于RFID***、尤其是用于RFID标签的自粘贴的天线，其中按照本发明，所述天线(1)由厚度在1μm和20μm之间、尤其大约是10μm的铝箔膜(7)制成，粘贴并冲压在粘附材料(3)的正面，其中所述粘附材料(3)在其背面具有粘附层(4)。

Description

用于RFID***、尤其用于RFID标签的自粘天线及其制造方法
技术领域
本发明涉及一种用于RFID***、尤其用于RFID标签的自粘(selbstklebend)天线以及这种自粘天线的制造方法。
背景技术
公知的RFID***包含应答器，该应答器由RFID芯片和RFID天线组成。RFID标签以公知的方式被制造，使得具有应答器的所谓RFID嵌入物(RFID-Inlay)设置在带状(bahnfoermig)的、在底面上具有粘贴层(Haftkleberschicht)的覆盖材料与同样是带状的载体材料之间，其中该载体材料能够从粘贴层剥落。其中，RFID嵌入物包含固定在扁平天线上并且与该扁平天线电连接的RFID芯片，其中RFID天线设置在天线薄膜(Anttennenfolie)上。
已知用于制造RFID天线的多种方法：根据一种方法，从薄膜中腐蚀出天线轮廓。该方法缓慢、昂贵并且对环境有害。可替换地，可以直接通过金属化到相应构成的轨道材料(Bahnmaterial)上而敷设天线轮廓。同样已经提出：通过用导电涂料(例如银导电涂料)进行印刷来制造天线。这种方法也很昂贵，并且只要涂料包含重金属，该方法就是对环境有害的。大多采用PET作为带状衬底，其中扁平天线被敷设在该衬底上。这种衬底无法回收利用。
发明内容
因此，本发明要解决的技术问题是提供一种用于RFID***的天线，这种天线能够以更低的成本由可良好回收利用的材料制造。
该技术问题利用权利要求1的特征来解决。根据本发明，由厚度很小的铝箔膜制造天线，该厚度在1μm和20μm之间，优选大约是10μm。这种厚度的铝箔膜被制造为日用品(Massenware)，例如用于家用薄膜(Haushaltsfolien)。优选采用同样能够良好的回收利用的纸张作为载体材料。
卷绕成卷的铝箔膜可以在用于制造RFID标签的RFID机器中利用旋转工作的工具简单地被进一步加工。从而可以简单地制造电气优化的UHF天线。权利要求3包含用于制造根据本发明的自粘RFID标签的基本方法。权利要求4至8限定针对不同使用目的的制造方法的不同有利变形。
附图说明
附图用于借助简单示出的实施例来解释本发明。
图1示出自粘天线的剖面。
图2至图6示出用于制造天线的不同方法。
图7示出具有一行粘贴的天线的带状载体材料的截面图。
具体实施方式
在图1中用剖面示出以及在图7中用俯视图示出的天线被设置用于RFID***中，尤其用于RFID标签。自粘RFID标签例如包含RFID嵌入物，其中在该嵌入物中，RFID芯片和RFID天线粘贴在带状或弧形的材料上。这种RFID标签以及用于制造该RFID标签的方法例如描述在WO2005/076206A1中。
能够被用作UHF天线的天线1从薄的铝箔膜中腐蚀出，其中该铝箔膜具有1μm到20μm的厚度、尤其是大约10μm的厚度。借助粘贴层2，天线1粘贴到带状或弧形的粘附材料3的正面上，其中粘附材料优选由纸张制成。在粘附材料的背面上，粘附材料3具有粘贴层4。粘贴层4被带状或弧形的载体材料5覆盖，其中载体材料以能够剥离的方式粘贴。优选采用渗硅的(silikonisiert)纸张作为载体材料5。与粘附在载体材料5上相比，粘贴层4更强地粘附在粘附材料3上，从而在剥离载体材料5之后，粘贴层仍然在粘附材料3的背面上。借助该粘贴层，粘贴在粘附材料3上的天线1可以被粘牢在材料上，例如在嵌入物材料上。
在图2至图4中示出了用于制造自粘天线1的制造方法，其中作为天线材料，从卷6抽出带状的厚度在10μm至20μm之间、优选为大约10μm的铝箔膜。然后，为所抽出的铝箔膜7的背面设置粘贴层2。在根据图2的方法中，以转移粘合剂(Transferkleber)的形式敷设粘贴层2。对于转移粘合剂，粘贴层覆盖在覆盖材料8以及载体材料9的两面上。转移粘合剂被从卷10抽出并引导到铝箔膜7的背面上，其中在与铝箔膜7接触之前剥离覆盖材料8。在与铝箔膜7接触时，转移粘合剂将其粘贴层2转移到箔膜7上，随后同样剥离转移粘合剂的载体材料9并卷绕到卷11。现在就有了具有粘贴层2的铝箔膜7。然后，在粘贴层2上粘贴带状或弧形的自粘材料12，为此将该自粘贴材料从卷13中抽出。自粘材料12由作为保护层的粘附材料3制成，其中粘附材料3在其背面具有粘附层4，粘附层4又被载体材料5覆盖。
随后，通过旋转冲模(Rotationsstanze)14引导由载体材料5、粘附材料3和铝箔膜1组成的复合材料，其中在载体材料5、粘附材料3和铝箔膜1之间设置有粘贴层2、4。由旋转冲模14将具有粘附材料13的铝箔膜7冲压成各个天线1。由剩余的铝箔膜7和剩余的粘附材料3组成的冲裁废料(Stanzgitter)15然后被剥落并作为可回收的废料卷绕到卷16。天线1以及位于天线下方、同样被冲压成天线形式的粘附材料3留在带状的载体材料5上，并且随后与载体材料5一起卷绕到卷17。卷17因此包含图6中所示的一行单个天线1，这些天线与粘附材料3粘在一起，并且用该粘附材料以能够剥离的方式粘贴在载体材料5上。
由于薄的铝箔膜7被粘贴在背面的粘附材料3加厚了，因此可以冲压出各个天线1而且剥离冲裁废料5，而铝箔膜不断裂。因此可以使用特别薄的、便宜的铝箔膜作为天线材料。同时，可以使用卷状的天线材料作为原材料并在公知的用于加工带状材料的机器上用旋转工作的工具加工。作为天线材料的铝是可以用于食品和药品的，并且对于用作UHF天线是导电性良好的。
图3中所示的方法对应于前面根据图1描述的方法，区别在于：在铝箔膜7的背面上不同地提供粘贴层。为此，由硅纸(Silikonpapier)制成的载体材料从卷18抽出，并首先在其上侧面上借助由宽缝隙式喷嘴19敷设的热熔胶(Hot-Melts)来设置粘贴层2。然后，粘贴层2按照上面描述的方式被转移到铝箔膜7的背面上。其中，载体材料9又从铝箔膜7剥离出并卷绕到卷11。
在根据图4的方法中，在自粘材料12与铝箔膜7连接之前，首先在自粘材料12的保护层的上侧面上敷设粘贴层2。该敷设同样借助于宽缝隙式喷嘴19作为热熔胶敷设(Hot-Melt-Auftrag)进行。在该变形方式中，自粘材料12的保护层同时用作粘附材料层3。
在图5中示出一种变形方式，其中使用由铝箔膜7和硅载体材料20制成的复合材料作为原材料，其中载体材料20可剥离地粘贴在铝箔膜7的背面上。在剥离载体材料20时，粘贴层2留在铝箔膜的背面上。复合材料7、20从卷21抽出，然后载体材料20被去除并卷绕到卷22。现在有了在背面具有粘贴层2的铝箔膜7，其中该背面按照在上述实施例中描述的方式在冲压出天线1之前首先与自粘材料12连接。
在图6中示出一种变形方式，其中由铝箔膜7、粘附材料3和硅载体材料5制成的带状复合材料被用作为原材料。铝箔膜粘贴在粘附材料3的正面上，并且载体材料5可剥离地粘贴在铝箔膜7的背面上。在剥离载体材料5时，粘贴层2留在粘附材料3的背面上。复合材料7、3、5从卷23抽出，随后冲压出天线1。优选地，该冲压也通过粘附材料3进行。从而制造用粘附材料3加厚的天线结构以及相应加厚的冲裁废料15。在冲压之后，具有剩余的铝箔膜7以及在可能的情况下还具有剩余的粘附材料3的剩余的冲裁废料15被剥离，并卷绕到卷16。然后，粘贴有被粘附材料3加厚的天线1的硅载体5被卷绕到卷17。

Claims (9)

1.一种用于RFID***、尤其用于RFID标签的自粘天线，其特征在于，由厚度在1μm和20μm之间、尤其为大约10μm的铝箔膜(7)制成的天线(1)粘贴并冲压在粘附材料(3)的正面上，其中所述粘附材料(3)在背面上具有粘附层(4)。
2.根据权利要求1所述的天线，其特征在于，所述粘附材料(3)的背面上的所述粘附层(4)被能剥离的载体材料(5)覆盖。
3.一种用于制造如权利要求1或2所述的自粘天线的方法，其特征在于，从粘贴在带状的粘附材料(3)的正面上的铝箔膜(7)冲压出各个天线(1)，其中所述粘附材料(3)在背面具有粘附层(4)，并且在所述冲压之后剥离具有剩余的铝箔膜的剩余的冲裁废料(15)。
4.根据权利要求3所述的方法，具有以下步骤：
1)从卷(6，21)抽出带状的铝箔膜(7)，
2)所述铝箔膜(7)在背面具有粘贴层(2)，
3)在所述粘贴层(2)上粘贴带状的粘附材料(3)，其中所述粘附材料在背面具有粘附层(4)，
4)然后从所述铝箔膜(7)冲压出各个天线(1)，以及
5)从所述铝箔膜(7)剥离剩余的冲裁废料(15)。
5.根据权利要求3或4所述的方法，其特征在于，粘附材料(3)粘贴在所述铝箔膜(7)的背面上，其中所述粘附材料在相反的背面上被以能剥离的方式粘贴的载体材料(5)覆盖，并且在冲压时对铝箔膜(7)与粘附材料(3)一起冲压，从而天线(1)和以天线形式冲压的粘附材料(2)留在载体材料(5)上。
6.根据权利要求3至5中任一项所述的方法，其特征在于，所述粘贴层(2)以转移粘合剂的形式敷设在所述铝箔膜(7)的背面上。
7.根据权利要求3至6中任一项所述的方法，其特征在于，所述粘贴层(2)首先敷设在带状的载体材料(18)上，然后被从该载体材料转移到所述铝箔膜(7)的背面。
8.根据权利要求3至7中任一项所述的方法，其特征在于，在所述冲压之前在所述铝箔膜的背面上敷设自粘材料(12)，其中粘贴层(2)在与所述铝箔膜(7)连结之前被敷设在自粘材料(12)的用作粘附材料(3)的保护层上。
9.根据权利要求3至5中任一项所述的方法，其特征在于，使用由铝箔膜(7)和载体材料(20)制成的复合材料作为原材料，其中所述复合材料可剥离地粘贴在铝箔膜(7)的背面上，其中在剥离之后，所述粘贴层(2)留在铝箔膜(7)上。
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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8786510B2 (en) 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
DE102007041752A1 (de) 2007-09-04 2009-03-05 Bielomatik Leuze Gmbh + Co Kg Chipmodul für ein RFID-System
DE102007041751B4 (de) 2007-09-04 2018-04-19 Bielomatik Leuze Gmbh + Co. Kg Verfahren und Vorrrichtung zur Herstellung eines RFID-Etiketts
KR101106040B1 (ko) * 2010-06-14 2012-01-18 주식회사 에이스테크놀로지 내장형 안테나의 제조방법
BR112012032009B8 (pt) 2010-06-14 2023-01-24 Avery Dennison Corp Método para produzir um dispositivo de rfid, aparelho para a produção de um dispositivo de rfid, conjunto intermediário de dispositivos de rfid, intermediário e sistema para a produção de dispositivos de rfid
CN101950631B (zh) * 2010-08-12 2013-04-17 士丰电子科技(昆山)有限公司 天线线缆加工工艺
EP2432074A1 (de) 2010-09-21 2012-03-21 Printechnologics GmbH Baugruppe mit wenigstens einer UHF-Dipol-Antenne
US8947319B2 (en) 2011-05-17 2015-02-03 3M Innovative Properties Company Antenna assembly for converged in-building network
TWI453677B (zh) * 2011-12-01 2014-09-21 Mutual Pak Technology Co Ltd 射頻識別標籤與具有其之衣物
DE102014102519A1 (de) 2014-02-26 2015-08-27 Schreiner Group Gmbh & Co. Kg Folienverbund mit elektrischer Funktionalität zum Aufbringen auf ein Substrat
USD791744S1 (en) * 2015-11-19 2017-07-11 Avery Dennison Retail Information Services, Llc Antenna
RO132616B1 (ro) 2016-11-07 2020-09-30 Promar Textil Industries S.R.L. Transponder de identificare prin radiofrecvenţă pentru medii agresive
RO133013B1 (ro) 2017-06-16 2020-09-30 Promar Textil Industries S.R.L. Etichetă rfid pentru medii agresive cu cuplaj inductiv în buclă dublă
IT202200003290A1 (it) * 2022-02-22 2023-08-22 Pearfid Soc A Responsabilita Limitata Semplificata Metodo di realizzazione di dispositivi a radiofrequenza

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900386A (en) * 1987-05-22 1990-02-13 Durgo Ag Method of producing labels each having a circuit forming an oscillating circuit

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3497410A (en) * 1965-02-05 1970-02-24 Rogers Corp Method of die-stamping a printed metal circuit
US4846922A (en) * 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
ATE440480T1 (de) * 1993-12-30 2009-09-15 Miyake Kk Verbundfolie mit schaltungsfírmiger metallfolie oder dergleichen und verfahren zur herstellung
US6458465B1 (en) * 1994-12-30 2002-10-01 Kabushiki Kaisha Miyake Circuit-like metallic foil sheet and the like and process for producing them
TNSN97123A1 (fr) * 1996-07-18 1999-12-31 Droz Francois Procede de fabrication de transpondeurs et transpondeur fabrique selon ce procede
DE29804579U1 (de) * 1998-03-18 1998-11-26 Georg Siegel GmbH, 59174 Kamen Radiofrequenzetikett mit kupferbeschichteter Ferrit-Folie
DE10016037B4 (de) * 2000-03-31 2005-01-05 Interlock Ag Verfahren zur Herstellung eines Etiketts oder einer Chipkarte
KR20030076274A (ko) * 2002-03-18 2003-09-26 도레 엔지니아린구 가부시키가이샤 비접촉 아이디 카드류 및 그 제조방법
DE60322528D1 (de) * 2002-04-24 2008-09-11 Mineral Lassen Llc Herstellungsverfahren für eine drahtlose kommunikationseinrichtung und herstellungsvorrichtung
JP4121450B2 (ja) * 2003-11-27 2008-07-23 大阪シーリング印刷株式会社 アンテナパターンおよび電磁シールドパターンのシート状基材への形成方法
DE102004006457A1 (de) 2004-02-04 2005-08-25 Bielomatik Leuze Gmbh + Co Kg Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile
JP2006295485A (ja) * 2005-04-08 2006-10-26 Maruai:Kk 無線タグ用アンテナの製造方法及びその方法に用いる型抜切断接着具
US7233296B2 (en) * 2005-08-19 2007-06-19 Gm Global Technology Operations, Inc. Transparent thin film antenna
US8786510B2 (en) * 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
DE102007041751B4 (de) * 2007-09-04 2018-04-19 Bielomatik Leuze Gmbh + Co. Kg Verfahren und Vorrrichtung zur Herstellung eines RFID-Etiketts
DE102007041752A1 (de) * 2007-09-04 2009-03-05 Bielomatik Leuze Gmbh + Co Kg Chipmodul für ein RFID-System

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900386A (en) * 1987-05-22 1990-02-13 Durgo Ag Method of producing labels each having a circuit forming an oscillating circuit

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