CN101624471A - Heat curing in-situ forming high-conductivity silicon rubber composition and application thereof - Google Patents
Heat curing in-situ forming high-conductivity silicon rubber composition and application thereof Download PDFInfo
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Abstract
The invention relates to a heat curing in-situ forming high-conductivity silicon rubber composition and application thereof. The composition is composed of the following components: (1) 60-90 parts by weight of mixture of ethylene end-blocked polyorganosiloxane in the same or different viscosities; (2) 10-35 parts by weight of silicone oil containing hydrogen; (3) 1-25 parts by weight of one or multiple R<6>cSiX4-c or partial hydrolytic condensation product thereof; (4) 100-500 parts by weight of metal base conductive filler with the average particle size of 10-150 Mum; (5) 0.01-10 parts by weight of organic metal compound or chelate which contains chloroplatinic acid or contains platinum or palladium and is used as metal base catalyst of heat curing; (6) 1-30 parts by weight of reinforcing filler or functional filler. The invention is applied to the shielding case part of RF equipment requiring electromagnetic shielding and sealed environment. The invention reduces material consumption, simplifies production technology and improves production efficiency and cost performance of product.
Description
Technical field
The present invention relates to chemical material technical field, particularly disclose a kind of heat curing in-situ forming high-conductivity silicon rubber composition.
Background technology
The next-generation mobile communications base station of operating frequency range in 110MHz～40GHz is accompanied by quick deployment and the commercialization of 3G in the whole world, become the main product in field, base station.
In order to support high-speed data service, heavy body will become one of principal character of base station of new generation, and processing power must be improved in the base station simultaneously; Because densely distributed, the base station will more be tending towards miniaturization, integrated.Open interface, modular structure become the up-to-date trend of base station development.
The performance characteristics of a new generation's base station high integration has satisfied the base station and has realized more high-performance, the demand for development of small volume more.Following base station will have higher integrated level, higher performance.High-speed and high integration increases the weight of the electromagnetic radiation of electronic system, and the electromagnetic interference that electromagnetic radiation produces, can have a strong impact on the routing Design of the inner normal signal of electronic system on the one hand, can produce electromagnetic pollution again on the other hand, disturb the works better of sensor in the inside and outside environment of electronic system, cause the leakage of information of information technological equipment, and outside ecotope is threatened.
Consideration is for peripheral resident's radiation effect, and the base station will reduce total transmitted power, and carries out indoor covering.In order to realize above-mentioned target, base station performance must promote comprehensively.Must effectively reduce and eliminate electromagnetic interference, the electromagnetic compatibility of each separate unit or sub-system in the realization electronic system.
In the prior art, the normal employing at the place, junction surface of electronic circuit package shell loads conductive elastomer, as conductive rubber, realizes the electromagnetic sealing and the shielding of shell, and then suppresses the electromagnetic interference that electronics produces effectively.
Traditional solid conduction rubber plate, India-rubber strip section bar can't adapt to the rapid growth requirement that conductive elastomer is used in automatization, the production in enormous quantities in narrow wall shell.
Summary of the invention
The objective of the invention is in order to overcome the deficiencies in the prior art, a kind of heat curing in-situ forming high-conductivity silicon rubber composition of design.
For achieving the above object, a kind of heat curing in-situ forming high-conductivity silicon rubber composition of design has following composition: the mixture of the ethenyl blocking polysiloxane of a kind of viscosity of 60～90 weight parts or different viscositys; The containing hydrogen silicone oil of 10～35 weight parts; One or more R of 1～25 weight part
6 cSiX
4-cOr its partial hydrolysis condensation product, wherein R
6For replacing or unsubstituted monovalence alkyl; X is a hydrolysable group, comprises methoxy or ethoxy or butoxy in the alkoxy base, or different propenyloxy group in the alkenyloxy group or iso-butylene oxygen base; C is 0 or 1; R
6Preferred 1～8 carbon atom replaces or unsubstituted monovalence hydrocarbon group, and methyl or ethyl or propyl group or vinyl or phenyl or epoxy group(ing) are arranged; The average particle size particle size of 100～500 weight parts is the metal matrix conductive filler material of 10 μ m～150 μ m; 0.01 the catalyzer as thermofixation of～10 weight parts has the organometallic compound or the organic metal chelate complex of Platinic chloride or platiniferous or palladium; The reinforcing filler of 1-10 weight part or functional stuffing.Described metallic conduction sill has silver powder or silver plated glass powder or silver plated aluminium powder or nickel powder or copper powder or precious metal platinum powder or precious metal bronze or graphite nickel plating powder for one or more the difform following powder that has.Described metal-based catalyst has H2PtCl66H2O or 1,3-divinyl-1,1,3,3-tetramethyl disiloxane platinum (0).Described reinforcing filler or functional stuffing comprise thermal silica at thermal silica, and modified dimethyl polysiloxane thixotroping control agent is selected one or more in the silylation adhesion promoters.Be applied to require the radio-frequency apparatus shielding case position of electromagnetic shielding and environmental sealing.
The invention has the beneficial effects as follows: heat curing in-situ forming high-conductivity silicon rubber, its major function are low resistance is provided between conductive surface, flexibly connects and the environmental sealing performance, are directly used in the shielding position of module in the base station.With conventional conductive rubber phase ratio,, incomparable advantage is arranged reducing materials consumption, simplify production technique, cut down the consumption of energy, reduce manufacturing and assembly cost, satisfy harsh assembly space restriction, enhancing productivity and aspect such as cost performance of product.
The present invention compares with existing conductive silicon rubber section bar technology, and the shielding properties height can be saved material, shortens man-hour, reduces cost, and saves assembling space, has the market practical value.
Embodiment
The present invention is further illustrated below in conjunction with specific embodiment.The present invention says the embodiment that exemplifies usefulness only of the present invention as an illustration, and protection of the present invention is described with claims and is as the criterion.
Embodiment 1:
The following component of uniform mixing in dry, clean environment: the dimethyl polysiloxane of 70 weight part 50000mPa.S viscosity ethenyl blocking dimethyl polysiloxanes, 15 weight part structural formulas, the copper silvering powder that 400 weight part mean particle sizes are 50 microns are as metal matrix conductive filler material, 13 parts by weight of ethylene base hydrogen containing siloxanes, 0.1 weight part catalyzer 1,3-divinyl-1,1,3,3-tetramethyl disiloxane platinum (0).Add enhancing property filler as required: 3 weight part ratio surface-area are 130m
2The hydrophobic fumed white carbon black of/g, obtain tensile strength greater than 1.7MPa, Shore A hardness is 65, elongation is greater than 100%, electric conductivity is the heat curing in-situ forming high-conductivity silicon rubber composition of 0.008Ohm.cm, and composition is kept in the cartridge container of SEMCO, when need using described composition, take out from container, under 150 celsius temperatures, be solidified into the target conductive silicon rubber composition.
Embodiment 2:
In drying, the following component of uniform mixing in the clean environment: 60 weight part 20000mPa.S viscosity ethenyl blocking dimethyl polysiloxanes, 10 weight part 3600mPa.S viscosity Methyl Hydrogen Polysiloxane Fluid mixtures, 5 weight part dimethyl polysiloxanes, 300 weight part mean particle sizes are 20 microns flake silver powder, 0.1 weight part H2PtCl66H2O, 3 weight part ratio surface-area are hydrophobic fumed white carbon black and 2～5 weight part dimethylbenzene of 130m2/g, obtain tension slightly greater than 1.5MPa, Shore A hardness is 70, elongation is greater than 100%, electric conductivity is the heat curing in-situ forming high-conductivity silicon rubber composition of 0.005Ohm.cm, composition is kept in the cartridge container of SEMCO, when need using described composition, take out from container, under 150 celsius temperatures, be solidified into the target conductive silicon rubber composition.
Embodiment 3:
The following component of uniform mixing in dry, clean environment: the dimethyl polysiloxane of 70 weight part 50000mPa.S viscosity ethenyl blocking dimethyl polysiloxanes, 15 weight part structural formulas, the copper silvering powder that 400 weight part mean particle sizes are 50 microns are as metal matrix conductive filler material, 13 parts by weight of ethylene base hydrogen containing siloxanes and 0.1 weight part catalyzer 1,3-divinyl-1,1,3,3-tetramethyl disiloxane platinum (0).Add functional filler as required: 3 weight part polyether modified silicon oils and 1.5 parts by weight of ethylene base Trimethoxy silane coupling agents, obtaining electric conductivity is 0.008Ohm.cm, the aluminium base bonding force is greater than the heat curing in-situ forming high-conductivity silicon rubber composition of 12N/cm, composition is kept in the cartridge container of SEMCO, when need using described composition, take out from container, under 150 celsius temperatures, be solidified into the target conductive silicon rubber composition.
Claims (8)
1. a heat curing in-situ forming high-conductivity silicon rubber composition is characterized in that by following composition: the mixture mixture of the ethenyl blocking polysiloxane of a kind of viscosity of (1) 60～90 weight part or different viscositys; The containing hydrogen silicone oil of (2) 10～35 weight parts; One or more R of (3) 1～25 weight parts
6 cSiX
4-cOr its partial hydrolysis condensation product, wherein R
6For replacing or unsubstituted monovalence alkyl; X is a hydrolysable group, comprises methoxy or ethoxy or butoxy in the alkoxy base, or different propenyloxy group in the alkenyloxy group or iso-butylene oxygen base; C is 0 or 1; R
6Preferred 1～8 carbon atom replaces or unsubstituted monovalence hydrocarbon group, and methyl or ethyl or propyl group or vinyl or phenyl or epoxy group(ing) are arranged; The average particle size particle size of (4) 100～500 weight parts is the metal matrix conductive filler material of 10 μ m～150 μ m; The metal-based catalyst as thermofixation of (5) 0.01～10 weight parts has the organometallic compound or the organic metal chelate complex of Platinic chloride or platiniferous or palladium; (6) 1～30 weight part reinforcing filler or functional stuffings, at thermal silica, modified dimethyl polysiloxane thixotroping control agent is selected one or more in the silylation adhesion promoters.
2. a kind of heat curing in-situ forming high-conductivity silicon rubber composition according to claim 1, it is characterized in that: described metal matrix conductive filler material has silver powder or silver plated glass powder or silver plated aluminium powder or nickel powder or copper powder or precious metal platinum powder or precious metal bronze or graphite nickel plating for one or more the difform powder that has.
3. a kind of heat curing in-situ forming high-conductivity silicon rubber composition according to claim 1 is characterized in that: described metal-based catalyst has H2PtCl66H2O or 1,3-divinyl-1,1,3,3-tetramethyl disiloxane platinum (0).
4. a kind of heat curing in-situ forming high-conductivity silicon rubber composition according to claim 1 is characterized in that: described reinforcing filler or functional stuffing have thermal silica or modified dimethyl polysiloxane thixotropic agent or silylation adhesion promoters.
5. a kind of heat curing in-situ forming high-conductivity silicon rubber composition according to claim 1, it is characterized in that: described rubber composition component and proportioning are: the dimethyl polysiloxane of 70 weight part 50000mPa.S viscosity ethenyl blocking dimethyl polysiloxanes, 15 weight part structural formulas, copper silvering powder, 13 parts by weight of ethylene base hydrogen containing siloxanes, the 0.1 weight part catalyzer 1 that 400 weight part mean particle sizes are 50 microns, 3-divinyl-1,1,3,3-tetramethyl disiloxane platinum (0) and 3 weight part ratio surface-area are 130m
2The hydrophobic fumed white carbon black of/g.
6. a kind of heat curing in-situ forming high-conductivity silicon rubber composition according to claim 1 is characterized in that: described rubber composition component and proportioning are: 60 weight part 20000mPa.S viscosity ethenyl blocking dimethyl polysiloxanes, 10 weight part 3600mPa.S viscosity Methyl Hydrogen Polysiloxane Fluid mixtures, 5 weight part dimethyl polysiloxanes, 300 weight part mean particle sizes are that 20 microns flake silver powder, 0.1 weight part H2PtCl66H2O, 3 weight part ratio surface-area are hydrophobic fumed white carbon black and 2～5 weight part dimethylbenzene of 130m2/g.
7. a kind of heat curing in-situ forming high-conductivity silicon rubber composition according to claim 1, it is characterized in that: described rubber composition component and proportioning are: 70 weight part 50000mPa.S viscosity ethenyl blocking dimethyl polysiloxanes, the dimethyl polysiloxane of 15 weight part structural formulas, 400 weight part mean particle sizes are 50 microns copper silvering powder, 13 parts by weight of ethylene base hydrogen containing siloxanes, 0.1 weight part catalyzer 1,3-divinyl-1,1,3,3-tetramethyl disiloxane platinum (0), 3 weight part polyether modified silicon oils and 1.5 parts by weight of ethylene base Trimethoxy silane coupling agents.
8. the application of any described heat curing in-situ forming high-conductivity silicon rubber composition in the claim 1～7 is characterized in that: the radio-frequency apparatus shielding case position that is applied to require electromagnetic shielding and environmental sealing.
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| CN102153987A (en) * | 2011-05-18 | 2011-08-17 | 杨福河 | High-performance single-component high-temperature vulcanized conductive glue and preparation method thereof |
| CN102191012A (en) * | 2011-03-22 | 2011-09-21 | 上海本诺电子材料有限公司 | Solvent-free monocomponent organosilicon conducting resin used in LEDs and preparation method thereof |
| CN102220012A (en) * | 2011-06-08 | 2011-10-19 | 北京工业大学 | Single-component extrusion molding conductive rubber for electromagnetic shielding and preparation method of single-component extrusion molding conductive rubber |
| CN102276988A (en) * | 2011-06-08 | 2011-12-14 | 北京工业大学 | Mono-component Ni-C filled-type FIP (Form In Place) heat-curing highly-conductive silicone rubber and preparation method thereof |
| CN102408869A (en) * | 2011-08-04 | 2012-04-11 | 绵阳惠利电子材料有限公司 | Halogen-free flame-retardant addition type organosilicon potting compound for electronic appliances |
| CN102452125A (en) * | 2010-10-22 | 2012-05-16 | 比亚迪股份有限公司 | Gel casting method and preparation method of ceramic |
| CN102516929A (en) * | 2011-11-25 | 2012-06-27 | 上海锐朗光电材料有限公司 | Low-hardness glue-dispensing shaping shielding conductive adhesive as well as preparation method and application thereof |
| CN102775716A (en) * | 2012-07-05 | 2012-11-14 | 东莞市维美德电子材料有限公司 | Preparation method for polymer conductive shielding material and product |
| CN103265883A (en) * | 2013-05-15 | 2013-08-28 | 广东电网公司东莞供电局 | Repairing coating and method of silicone rubber mutual inductor |
| CN103540138A (en) * | 2013-10-18 | 2014-01-29 | 中国电子科技集团公司第三十三研究所 | Moisture-proof and salt-mist corrosion-resistant conductive rubber and preparation method thereof |
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| CN109929160A (en) * | 2017-12-15 | 2019-06-25 | 中国石油化工股份有限公司 | The application of organo silane coupling agent and rubber composition and vulcanized rubber and its preparation method and application |
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| CN102452125B (en) * | 2010-10-22 | 2014-02-12 | 比亚迪股份有限公司 | Gel casting method and preparation method of ceramic |
| CN102191012A (en) * | 2011-03-22 | 2011-09-21 | 上海本诺电子材料有限公司 | Solvent-free monocomponent organosilicon conducting resin used in LEDs and preparation method thereof |
| CN102153987A (en) * | 2011-05-18 | 2011-08-17 | 杨福河 | High-performance single-component high-temperature vulcanized conductive glue and preparation method thereof |
| CN102220012B (en) * | 2011-06-08 | 2012-10-31 | 北京工业大学 | Single-component extrusion molding conductive rubber for electromagnetic shielding and preparation method of single-component extrusion molding conductive rubber |
| CN102220012A (en) * | 2011-06-08 | 2011-10-19 | 北京工业大学 | Single-component extrusion molding conductive rubber for electromagnetic shielding and preparation method of single-component extrusion molding conductive rubber |
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