CN101624467B - Poly (phenylene ether) resin composition, prepreg, and laminated sheet - Google Patents
Poly (phenylene ether) resin composition, prepreg, and laminated sheet Download PDFInfo
- Publication number
- CN101624467B CN101624467B CN2009101673192A CN200910167319A CN101624467B CN 101624467 B CN101624467 B CN 101624467B CN 2009101673192 A CN2009101673192 A CN 2009101673192A CN 200910167319 A CN200910167319 A CN 200910167319A CN 101624467 B CN101624467 B CN 101624467B
- Authority
- CN
- China
- Prior art keywords
- ppe
- resin composition
- ether resin
- polyphenyl ether
- molecular weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 26
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 title abstract 2
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 43
- 238000004132 cross linking Methods 0.000 claims abstract description 41
- -1 poly(phenylene ether) Polymers 0.000 claims abstract description 39
- 125000003118 aryl group Chemical group 0.000 claims abstract description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 6
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims description 189
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 188
- 239000000463 material Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 239000011889 copper foil Substances 0.000 claims description 24
- 239000003063 flame retardant Substances 0.000 claims description 22
- 239000000945 filler Substances 0.000 claims description 19
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 17
- 238000002360 preparation method Methods 0.000 claims description 14
- 238000007731 hot pressing Methods 0.000 claims description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 7
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052794 bromium Inorganic materials 0.000 claims description 6
- 239000012766 organic filler Substances 0.000 claims description 6
- 125000002769 thiazolinyl group Chemical group 0.000 claims description 5
- 150000002430 hydrocarbons Chemical group 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 3
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims description 3
- 239000011256 inorganic filler Substances 0.000 claims description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 abstract 1
- 229920001955 polyphenylene ether Polymers 0.000 description 171
- 239000011347 resin Substances 0.000 description 86
- 229920005989 resin Polymers 0.000 description 86
- 238000006243 chemical reaction Methods 0.000 description 29
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 24
- 239000002904 solvent Substances 0.000 description 21
- 239000002585 base Substances 0.000 description 19
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 18
- 238000012545 processing Methods 0.000 description 18
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 239000002966 varnish Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 239000003999 initiator Substances 0.000 description 12
- 230000009477 glass transition Effects 0.000 description 11
- 150000002989 phenols Chemical class 0.000 description 11
- NPDACUSDTOMAMK-UHFFFAOYSA-N 4-Chlorotoluene Chemical compound CC1=CC=C(Cl)C=C1 NPDACUSDTOMAMK-UHFFFAOYSA-N 0.000 description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 9
- 230000031709 bromination Effects 0.000 description 8
- 238000005893 bromination reaction Methods 0.000 description 8
- 238000005227 gel permeation chromatography Methods 0.000 description 8
- 150000002894 organic compounds Chemical class 0.000 description 8
- 239000012764 mineral filler Substances 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 125000000304 alkynyl group Chemical group 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 238000011049 filling Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000011120 plywood Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 229910001297 Zn alloy Inorganic materials 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 230000006837 decompression Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- WQJOSEVSASFCPR-UHFFFAOYSA-N (1-bromo-1-phenylethyl)benzene Chemical class C=1C=CC=CC=1C(Br)(C)C1=CC=CC=C1 WQJOSEVSASFCPR-UHFFFAOYSA-N 0.000 description 3
- ZRZHXNCATOYMJH-UHFFFAOYSA-N 1-(chloromethyl)-4-ethenylbenzene Chemical compound ClCC1=CC=C(C=C)C=C1 ZRZHXNCATOYMJH-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004727 Noryl Substances 0.000 description 3
- 229920001207 Noryl Polymers 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 description 3
- XZKRXPZXQLARHH-UHFFFAOYSA-N buta-1,3-dienylbenzene Chemical compound C=CC=CC1=CC=CC=C1 XZKRXPZXQLARHH-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 description 2
- IYSVFZBXZVPIFA-UHFFFAOYSA-N 1-ethenyl-4-(4-ethenylphenyl)benzene Chemical group C1=CC(C=C)=CC=C1C1=CC=C(C=C)C=C1 IYSVFZBXZVPIFA-UHFFFAOYSA-N 0.000 description 2
- IBXNCJKFFQIKKY-UHFFFAOYSA-N 1-pentyne Chemical compound CCCC#C IBXNCJKFFQIKKY-UHFFFAOYSA-N 0.000 description 2
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 208000003351 Melanosis Diseases 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical group CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- GTTSNKDQDACYLV-UHFFFAOYSA-N Trihydroxybutane Chemical compound CCCC(O)(O)O GTTSNKDQDACYLV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000007942 carboxylates Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 125000001153 fluoro group Chemical class F* 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- VVWRJUBEIPHGQF-UHFFFAOYSA-N propan-2-yl n-propan-2-yloxycarbonyliminocarbamate Chemical compound CC(C)OC(=O)N=NC(=O)OC(C)C VVWRJUBEIPHGQF-UHFFFAOYSA-N 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229960001866 silicon dioxide Drugs 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 2
- UGNWTBMOAKPKBL-UHFFFAOYSA-N tetrachloro-1,4-benzoquinone Chemical compound ClC1=C(Cl)C(=O)C(Cl)=C(Cl)C1=O UGNWTBMOAKPKBL-UHFFFAOYSA-N 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- 125000006650 (C2-C4) alkynyl group Chemical group 0.000 description 1
- NNNLYDWXTKOQQX-UHFFFAOYSA-N 1,1-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OC(CC)(OC(=O)C=C)OC(=O)C=C NNNLYDWXTKOQQX-UHFFFAOYSA-N 0.000 description 1
- QLLUAUADIMPKIH-UHFFFAOYSA-N 1,2-bis(ethenyl)naphthalene Chemical compound C1=CC=CC2=C(C=C)C(C=C)=CC=C21 QLLUAUADIMPKIH-UHFFFAOYSA-N 0.000 description 1
- OTEKOJQFKOIXMU-UHFFFAOYSA-N 1,4-bis(trichloromethyl)benzene Chemical compound ClC(Cl)(Cl)C1=CC=C(C(Cl)(Cl)Cl)C=C1 OTEKOJQFKOIXMU-UHFFFAOYSA-N 0.000 description 1
- HQJQYILBCQPYBI-UHFFFAOYSA-N 1-bromo-4-(4-bromophenyl)benzene Chemical group C1=CC(Br)=CC=C1C1=CC=C(Br)C=C1 HQJQYILBCQPYBI-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Natural products C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical group CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 description 1
- MILSYCKGLDDVLM-UHFFFAOYSA-N 2-phenylpropan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 MILSYCKGLDDVLM-UHFFFAOYSA-N 0.000 description 1
- REEBWSYYNPPSKV-UHFFFAOYSA-N 3-[(4-formylphenoxy)methyl]thiophene-2-carbonitrile Chemical compound C1=CC(C=O)=CC=C1OCC1=C(C#N)SC=C1 REEBWSYYNPPSKV-UHFFFAOYSA-N 0.000 description 1
- DYIZJUDNMOIZQO-UHFFFAOYSA-N 4,5,6,7-tetrabromo-2-[2-(4,5,6,7-tetrabromo-1,3-dioxoisoindol-2-yl)ethyl]isoindole-1,3-dione Chemical compound O=C1C(C(=C(Br)C(Br)=C2Br)Br)=C2C(=O)N1CCN1C(=O)C2=C(Br)C(Br)=C(Br)C(Br)=C2C1=O DYIZJUDNMOIZQO-UHFFFAOYSA-N 0.000 description 1
- QRFTXHFUNIFHST-UHFFFAOYSA-N 4,5,6,7-tetrabromoisoindole-1,3-dione Chemical compound BrC1=C(Br)C(Br)=C2C(=O)NC(=O)C2=C1Br QRFTXHFUNIFHST-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical group ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- MJBPUQUGJNAPAZ-UHFFFAOYSA-N Butine Natural products O1C2=CC(O)=CC=C2C(=O)CC1C1=CC=C(O)C(O)=C1 MJBPUQUGJNAPAZ-UHFFFAOYSA-N 0.000 description 1
- 125000005865 C2-C10alkynyl group Chemical group 0.000 description 1
- 125000003601 C2-C6 alkynyl group Chemical group 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
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- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- IUHFWCGCSVTMPG-UHFFFAOYSA-N [C].[C] Chemical class [C].[C] IUHFWCGCSVTMPG-UHFFFAOYSA-N 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- BYOAQLJVXKAQJQ-UHFFFAOYSA-N chloromethane styrene Chemical compound C=CC1=CC=CC=C1.CCl BYOAQLJVXKAQJQ-UHFFFAOYSA-N 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical compound FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000000975 co-precipitation Methods 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
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- 238000004821 distillation Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
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- 150000002170 ethers Chemical class 0.000 description 1
- 238000007046 ethoxylation reaction Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
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- 125000005843 halogen group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
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- 238000002844 melting Methods 0.000 description 1
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- 238000010295 mobile communication Methods 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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Abstract
An object of the present invention is to provide a poly(phenylene ether) resin composition that allows production of laminated sheets excellent in heat resistance and processability, even in case of using a low molecular weight PPE for convenience in prepreg manufacturing without the sacrifice of dielectric characteristics. The poly(phenylene ether) resin composition according to the present invention comprises poly(phenylene ether) and a crosslinking curing agent, wherein the poly(phenylene ether) is represented by the following formula (I) and the number averaged molecular weight thereof is in the range of 1,000 to 7,000, wherein, X is an aryl group; (Y)m is a poly(phenylene ether) moiety; Z is a phenylene group and the like; R<1>to R<3>each independently is a hydrogen atom, and the like; n is an integer of 1 to 6; and q is an integer of 1 to 4.
Description
The application is based on dividing an application of following Chinese patent application:
The original bill applying date: on January 22nd, 2004
Original bill application number: 200480002980.3 (PCT/JP2004/000554)
Original bill application title: polyphenyl ether resin composition, prepreg and veneer sheet
Technical field
The present invention relates to be suitable as usefulness insulating material such as printed-wiring board (PWB) heat-resistant polyphenylene ether (to call PPE in the following text) resin combination, use the prepreg of this PPE resin combination and use the veneer sheet of this prepreg.
Background technology
In recent years, development along with integrated technology, joining technique and the mounting technology of the semiconducter device of using in electronics, high-density electronic package and the high density printed circuit board wiring, electronics has obtained continuous progress, and especially using on the electronics in broadbands such as the mobile communications device at those has had alarming development.
Printed-wiring board (PWB), it is as a formation of this electronics, towards the multilayer board wiring development of more accurate pitch simultaneously of higher degree.For signaling rate being brought up to the needed level of information processing of quickening, effectively way is to reduce the specific inductivity of institute's materials used, and in order to reduce transmission loss, effectively way is to use the material than the low-dielectric loss factor (dielectric loss).
Therefore, the PPE resin is the material that is suitable for the printed-wiring board (PWB) in the electronics that uses the broadband, because the PPE resin has good high frequency characteristics (dielectric characteristics), as specific inductivity, dielectric loss etc.Yet the PPE resin does not still possess sufficiently high thermotolerance and dimensional stability.In addition, a shortcoming of PPE resin is that it has high-melting-point usually, use this PPE resin to be used to produce common multilayer printed circuit board often causes the prepreg melt viscosity with prepreg increase, cause in the multi-ply wood production process manufacturing deficiency such as hole and scratch take place, cause the multi-ply wood quality of being supplied reliable inadequately.
The open communique of Japanese Patent is put down into and has been disclosed a kind of be intended to improve the PPE resin combination of thermotolerance and dimensional stability, the veneer sheet that uses the prepreg of this PPE resin combination and use this prepreg for 8-231847 number.They are respectively to contain PPE, triallyl isocyanurate and inert through the PPE of the compound of bromination resin combination; Use the prepreg of this PPE resin combination; With the veneer sheet that uses this prepreg.
Yet, when using the open communique of Japanese Patent to put down into 8-231847 number described resin combination, be difficult to produce multi-ply wood, be because the fusing point height of this PPE resin itself, under common hot pressing temperature, the melt viscosity of this resin combination is too high so that interior condactive pattern layer can not be inserted in the multilayer printed circuit board.
In addition, Japanese Patent is open have been proposed for communique 2002-265777 number a kind ofly to contain than the PPE of small molecular weight thereby have the PPE resin combination that molten resin preferably flows property and have better processing characteristics under common hot pressing temperature in the course of processing, uses the prepreg of this PPE resin combination and uses the veneer sheet of this prepreg.This PPE resin combination is effective in and improves multiple-plate production efficiency.
Also have United States Patent (USP) the 6th, 352, the PPE that discloses its terminal hydroxyl by the represented group end capping of following formula No. 782.Although in the embodiment molecular weight of employed PPE is clearly described at all, the number-average molecular weight of this PPE is described to be had preferably less than 10,000, especially in approximately from 300 to 5,000 (further preferably approximately from 500 to 5,000).
As mentioned above, for improve fusion PPE resin flow and thereby improve the production efficiency of prepreg, effectively way is to reduce the molecular weight of PPE.
Yet, the problem that the thermotolerance of the resulting veneer sheet of reduction simultaneous of PPE molecular weight descends.Though can prevent to fall stable on heating decline, can cause the reduction of the relative content of the PPE with outstanding dielectric characteristics simultaneously again, the feasible product that is difficult to produce than low-k by the amount that increases crosslinking and curing agent, triallyl isocyanurate.Incidentally, for using for the above-mentioned Japanese Patent veneer sheet that openly composition of communique 2002-265777 number description makes, then specific inductivity is 3.5 to 3.7 (1MHz) when combining with E type woven fiber glass, and then specific inductivity is 3.3 to 3.5 (1MHz) when combining with NE type woven fiber glass.
Plant situation for this reason, the product that need have low-k more is to deal with the sharp increase of the information processing capacity in broadband device in recent years.
Summary of the invention
The present invention considers under the above-mentioned situation and finishes, the purpose of this invention is to provide and a kind ofly used low-molecular-weight PPE but still keep good dielectric characteristics and the polyphenyl ether resin composition of veneer sheet oblatio high heat resistance, and the prepreg that uses this polyphenyl ether resin composition.Another object of the present invention provides a kind of have simultaneously excellent dielectric characteristics and stable on heating veneer sheet.
In order to address the above problem, the inventor has carried out a large amount of research by synthetic various PPE to the structure and the relation between the dielectric characteristics of these materials.Found that, use a kind of special group that the PPE terminal hydroxyl is made amendment and to improve reaction efficiency between PPE and the crosslinking and curing agent, even for the purpose that increases the flowability under its molten state, when using lower molecular weight PPE, also can make dielectric characteristics good, have higher glass transition temperature, do not damage the PPE resin combination of PPE natural characteristics again.Use this PPE resin combination can produce colory prepreg and veneer sheet.
That is, polyphenyl ether resin composition according to the present invention is the composition that comprises polyphenylene oxide and crosslinking and curing agent, wherein, described polyphenylene oxide by following formula (0) expression and its number-average molecular weight in 1,000 to 7,000 scope.
[in the formula (0), X is an aryl; (Y)
mIt is the polyphenylene oxide part; Z is penylene base, Sauerstoffatom or sulphur atom; R
1To R
3Be hydrogen atom, alkyl, alkenyl or alkynyl independently of one another; N is 1 to 6 integer; Q is 1 to 4 integer.]
Polyphenyl ether resin composition of the present invention for example is the composition that comprises polyphenylene oxide and crosslinking and curing agent, and wherein, described polyphenylene oxide is by following formula (I) expression, and its number-average molecular weight is in 1,000 to 7,000 scope,
In the formula (I), X is an aryl; (Y)
mIt is the polyphenylene oxide part; R
1To R
3Be hydrogen atom, alkyl, alkenyl or alkynyl independently of one another; N is 1 to 6 integer; Q is 1 to 4 integer.
" aryl " of the present invention is meant aromatic hydrocarbon group.These aryl comprise, for example phenyl, xenyl, indenyl and naphthyl, and aryl phenyl preferably.In addition, the group that a plurality of aryl are bonded together, for example, those be situated between by oxygen be bonded to as the hexichol ether etc.; Those are situated between by ketonic linkage synthetic such as benzophenone base etc.; And those be situated between by alkylene base (alkylene group) be bonded to as 2,2-diphenyl propane bases etc. are included in the defined aryl of the present invention.And these aryl can be further replace by one or more substituting groups, for example alkyl (preferred C
1-C
6Alkyl; Especially methyl), thiazolinyl, alkynyl, halogen atom or other common substituting group.Because aryl is to be situated between to be bonded to the polyphenylene oxide part by Sauerstoffatom, therefore substituent upper limit number depends on the number of polyphenylene oxide part.
Should " polyphenylene oxide part " be made of multiple phenoxy group unit, its phenyl can be replaced by common substituting group.Such polyphenylene oxide partly comprises, for example, and by the compound of following formula (II) expression.
[in the formula (II), R
4To R
7Be respectively hydrogen atom, alkyl, thiazolinyl, alkynyl or alkene carbonyl independently; M is 1 to 100 integer.]
Here; the unsaturated alkyl that contains as polyphenylene oxide side chain appearance partly; for example vinyl, 2-propenyl (allyl group), methacryloyl, acryl, 2-propynyl groups such as (propargyls) can further improve the effect and the effect of crosslinking and curing agent effectively.
Here, m should adjust to and make the number-average molecular weight of PPE (0) drop in 1,000 to 7,000 the scope.
Should " alkyl " be meant the stable hydrocarbon group, be preferably C
1-C
10Alkyl, more preferably C
1-C
6Alkyl, more preferably C
1-C
4Alkyl most preferably is C
1-C
2Alkyl.Such alkyl for example comprises, methyl, ethyl, propyl group, sec.-propyl, butyl, isobutyl-, sec-butyl, the tertiary butyl, amyl group and hexyl.
Should " thiazolinyl " be meant the unsaturated hydrocarbon group that contains at least one carbon-to-carbon double bond in its structure, be preferably C
2-C
10Thiazolinyl, more preferably C
2-C
6Thiazolinyl most preferably is C
2-C
4Thiazolinyl.These thiazolinyls for example comprise, ethene, 1-propylene, 2-propylene, different propylene, butylene, iso-butylene, amylene and hexene.
Should " alkynyl " be meant the unsaturated hydrocarbon group that contains at least one carbon-to-carbon triple bond in its structure, be preferably C
2-C
10Alkynyl, more preferably C
2-C
6Alkynyl most preferably is C
2-C
4Alkynyl.These alkynyls for example comprise, acetylene, 1-propine, 2-propine, different propine, butine, isobutyl alkynes, pentyne and hexin.
Should " alkene carbonyl " be carbonyl with above-mentioned alkenyl substituted, for example, acryl or methacryloyl.
In PPE (0), n is preferably 1 to 4 integer; More preferably 1 or 2; And most preferably be 1.In addition, q is preferably 1 to 3 integer; More preferably 1 or 2; And most preferably be 1.Though m can be 1 to 100 integer, because the number-average molecular weight of PPE of the present invention (0) should be 1,000 to 7,000 at least, so m should adjust according to the number-average molecular weight of desirable PPE (0).That is to say, though value according to m, the molecular weight of certain PPE (0) may be less than 1,000 or greater than 7,000, but the number-average molecular weight of the entire PP E (0) that is contained in the PPE resin combination of the present invention should be 1,000 to 7,000, so m needn't be certain definite value, and can in a certain scope, change.
In the lower part structure of PPE (0), preferred Z be penylene base and n be 1 group (promptly, the phenmethyl derivative), perhaps, Z is that Sauerstoffatom and n are 2 group, more preferably to Ethenylbenzene methyl (p-ethenybenzyl group), an Ethenylbenzene methyl (m-ethenybenzyl group) or oxidation of ethylene ethyl (ethenyloxyethyl group).
Lower part at PPE (I) for example is at least a group that is selected from an Ethenylbenzene methyl and the Ethenylbenzene methyl.
The PPE (0) that has these groups endways has good especially interaction with crosslinking and curing agent, and is not needing to add the product that can produce low-k under the situation of a large amount of crosslinking and curing agents.Especially, the PPE that has endways an Ethenylbenzene methyl and an Ethenylbenzene methyl both sides has low melting point and low softening point, and those PPE that only have endways the Ethenylbenzene methyl then have high-melting-point and high softening-point.Therefore, by adjusting fusing point and the softening temperature that to regulate PPE to the ratio of an Ethenylbenzene methyl and an Ethenylbenzene methyl arbitrarily.
The number-average molecular weight of PPE (0) is 1,000 to 7,000.This is because when using molecular weight to surpass 7, during 000 PPE, then mobile decline makes multilayer processing difficult more in the course of processing of PPE, and when using molecular weight less than 1, during 000 PPE, then resulting prepreg and veneer sheet not necessarily always present good dielectric characteristics of PPE resin inherent and thermotolerance.Be the PPE resin that manufacturing has good flowability, thermotolerance and dielectric characteristics, its number-average molecular weight is preferably 1,200 or bigger, and 5,000 or littler, more preferably 1,500 or bigger, 4,500 or littler.
In addition, when mixing, have PPE (0) and can greatly improve consistency with crosslinking and curing agent than small molecular weight with crosslinking and curing agent.That is to say that the molecular weight of PPE (0) is more little, the consistency between blending ingredients is just good more.Therefore, this low-molecular-weight PPE stops the viscosity that causes by being separated to become big, suppresses the volatilization of lower molecular weight crosslinking and curing agent, thereby has improved the resin filling perforation performance to internal through-hole (to call IVH in the following text) especially.Especially, PPE (0) is preferably 30/70 to 90/10 (mass parts) with the blending ratio of crosslinking and curing agent.That is, if the content of PPE (0) less than 30 mass parts, the veneer sheet that makes is frangible, and if the content of PPE (0) greater than 90 mass parts (content of crosslinking and curing agent is less than 10 mass parts), the thermotolerance of veneer sheet may descend.
The method of making PPE (0) below will be described.
So far, PPE, for example, by United States Patent (USP) the 4th, 059, No. 568 disclosed method is made, and its number-average molecular weight (Mn) is generally 13,000 to 25,000.Yet PPE institute inherent high resin fusing point and melt viscosity make the problem that occurs manufacturing deficiency as the material of multilayer printed circuit board the time.So, can reduce resin viscosity and improve processing characteristics by the molecular weight that reduces PPE.
According to the public table of Japanese Patent communique 2002-536476 number, lower molecular weight PPE can make in all sorts of ways and separate and obtain, and separates acquisition but adopt with the reagent coprecipitation that is fit to usually.As the method for the molecular weight that reduces PPE, can use the described method of organic chemistry magazine the 34th volume 297-303 page or leaf (1969).This method adopts the method for phenols and PPE reaction to reduce the molecular weight of PPE.The phenols that uses in this reaction comprise phenol, cresols, xylenol, Resorcinol, dihydroxyphenyl propane, 2,4,4 '-dihydroxy diphenyl ether etc., but preferred the use has 2 or more a plurality of functional phenols and improves thermotolerance after product solidifies.In addition, the initiator of reaction preferably uses oxygenant such as benzoyl peroxide, 3,3 ', 5,5 '-tetramethyl--1,4-hexichol oxygen quinone, chloranil, 2,4,6-three (tertiary butyl phenoxy group), single tert-butyl peroxy isopropyl carbonate and Diisopropyl azodicarboxylate also can add metal carboxylate if desired to promote reaction.In addition, the generation of reaction back more preferably increases to suppress specific inductivity as initiator as the compound of the volatile constituent of low-molecular-weight alcohol.
The reaction that is used to obtain lower molecular weight PPE is by joining high molecular PPE (number-average molecular weight surpasses 10,000 common PPE), phenols and initiator in the solvent and heating this mixture and finish.Cobalt naphthenates etc. can be used as catalyzer and are added in this mixture.The solvent that here uses is not particularly limited, as long as this solvent can dissolve these components to appropriateness and can disturbance reponse, it for example can be, aromatic solvent such as benzene, toluene etc. all can be used as solvent and use.Temperature of reaction and reaction times can decide according to number-average molecular weight of required PPE etc., and it for example can be, carries out under 60 to 100 ℃ 30 minutes to 6 hours.These reaction conditionss can be determined by preliminary experiment.After reaction finishes, in the reaction process below under decompression state, being directly used in the solvent distillation and with lower molecular weight PPE.Perhaps, can in reaction mixture, add the Weak solvent (as methyl alcohol) of PPE, and the needed PPE of postprecipitation, so that its thick purification.
The PPE that obtains by above-mentioned reaction has suitable low molecular weight because of the fracture of main polymer chain between the reaction period, and the one end has from used phenols derives and the aromatic yl group that comes, and the other end has the oh group that is expressed from the next.In the formula, the number q of the polyphenylene oxide of each phenols part depends on the number of hydroxyl in the used phenols.That is to say that when phenols had only a hydroxyl, then q was 1, when multivalence phenol during as phenols, then q is 2 or bigger.
[wherein, X, (Y)
mSame as described above with the implication of q.]
Then, according to following reaction with the terminal hydroxyl group end-blocking.
[wherein, X, (Y)
m, Z, R
1To R
3, m, n and q implication same as described above; Hal represents chlorine atom or bromine atoms.]
In above-mentioned reaction, make under the PPE that obtains by the reaction of the above-mentioned reduction molecular weight situation that alkali exists in solvent with reaction such as halogenated compound such as 1-chloro-4-methyl-benzene the terminal hydroxyl group end-blocking.Alkali metal hydroxide as sodium hydroxide etc. can as described in alkali.In this case, join alkali such as aqueous sodium hydroxide solution with for example toluene etc. and be in the lower molecular weight PPE solution of solvent, quaternary ammonium salt (for example tetra-n-butyl ammonium bromide) can also be added wherein to promote reaction as phase-transfer catalyst again.Temperature of reaction and reaction times are depended on the kind of compound used therefor to a great extent, for example, and can be room temperature to 100 ℃ following reaction 30 minutes to 10 hours.After reaction finished, required product can obtain by following step: the Weak solvent by adding required product for example water, lower alcohol such as methyl alcohol etc. precipitates product, filter, and with identical solvent wash, and drying.
The PPE of the present invention of Huo Deing is owing to its lower molecular weight gives the PPE resin combination good flowability like this.In addition,, therefore use the PPE of the present invention of institute's allowance can improve the dielectric characteristics of resulting PPE resin combination, and keep the natural characteristics of this PPE such as thermotolerance etc. because this PPE can the very easy curing of enough less crosslinking and curing agents.
In addition, in PPE resin combination of the present invention,, can further improve the flowability control and the thermotolerance of PPE resin combination related to the present invention by being that 9,000 to 18,000 unmodified PPE is used in combination with above-mentioned PPE and number-average molecular weight.In addition, it can also composite inhibiting in the precipitation of additive component such as filler etc.Incidentally, this unmodified PPE is the polyphenylene oxide that does not contain unsaturated carbon-carbon-based group in the molecule, and its combined amount is preferably 3 to 70 mass parts with respect to the total amount of PPE and crosslinking and curing agent.
In addition, for improving thermotolerance, cohesiveness and dimensional stability, except that PPE, if desired, also can use at least one to be selected from following compatilizer: styrene-butadiene block copolymer, styrene-isoprene block copolymer, 1,2-polyhutadiene, 1, toxilic acid modified polybutadiene, acrylic acid modified polyhutadiene and epoxide modified polyhutadiene.
The crosslinking and curing agent that joins in the PPE resin combination of the present invention mainly is crosslinked on three-dimensional space to the polyphenylene oxide of the invention described above.Even add in the PPE resin combination in order to increase mobile low-molecular polyphenylene ether, crosslinking and curing agent still can keep the thermotolerance of PPE resin etc.The crosslinking and curing agent that has excellent compatibility with PPE especially is used as crosslinking and curing agent of the present invention, preferably includes, for example: as the polyfunctional group vinyl compound of Vinylstyrene, divinyl naphthalene, divinyl biphenyl etc.; The vinyl benzene methyl ether compound that phenol and the reaction of Ethenylbenzene methyl chloride make; The allyl ether compound that styrene monomer, phenol and chlorallylene reaction make; With trialkenyl isocyanuric acid ester (trialkenylisocyanurate).Particularly, preferably have the trialkenyl isocyanuric acid ester of excellent compatibility, wherein, more preferably triallyl isocyanurate (to call TAIC in the following text) and triallyl cyanurate (to call TAC in the following text).This is because these two crosslinking and curing agents make veneer sheet have low-k and good thermotolerance and reliability.
Perhaps, using (methyl) acrylic compound (methacrylic ester or acrylic compound) also is preferred as crosslinking and curing agent of the present invention.Especially, more preferably use three to five functional (methyl) acrylic compound with respect to 3～20 quality % of PPE resin combination total amount.As this three to five functional methacrylate compound, can use trihydroxy methyl propane trimethyl acrylate (TMPT) etc., and three to five functional acrylic compound can use trimethyol propane triacrylate etc.The thermotolerance of the veneer sheet that the further raising of the adding of these crosslinking and curing agents finally obtains.
Also can use though functional group's number is lower than or surpass (methyl) acrylic compound of 3 to 5, use three to five functional (methyl) acrylic compound can farthest improve the thermotolerance of gained veneer sheet.Promptly use three to five functional (methyl) acrylic compound, if its consumption is less than 3 quality % of PPE resin combination total amount, then might be difficult to give the veneer sheet that finally obtains with enough thermotolerances, might reduce the dielectric characteristics and the wet fastness of final veneer sheet if its consumption surpasses 20 quality %.
The blending ratio of PPE and crosslinking and curing agent is preferably 30/70 to 90/10 (mass parts).When PPE then may cause veneer sheet more frangible during less than 30 mass parts, when surpassing 90 mass parts, PPE then may reduce its thermotolerance.Promptly, for fear of the filling perforation performance decrease (difficulty) that causes resin to IVH because of consistency, this consistency depends on the molecular weight of PPE or depends on PPE and the blending ratio of crosslinking and curing agent solidifying agent such as triallyl isocyanurate that the blending ratio of PPE and crosslinking and curing agent solidifying agent can be determined by above-mentioned in the present invention.In addition, be set in the specific scope, can improve the flowability and the consistency of PPE resin combination, can improve the dielectric characteristics of PPE resin simultaneously by blending ratio with PPE and crosslinking and curing agent.The blending ratio of PPE and crosslinking and curing agent is preferably 50/50 to 90/10, more preferably 60/40 to 90/10 (mass parts).
If needed, PPE resin combination of the present invention can further comprise inorganic or organic filler.Mineral filler can be used to suppress the thermal expansivity of the veneer sheet that made by PPE resin combination of the present invention and improve its rigidity.The mineral filler of using is not particularly limited, can list metal oxide, nitrite, silicide, boride etc., for example silicon-dioxide, boron nitride, wollastonite, talcum, kaolin, clay, mica, alumina, zirconium white, titanium dioxide, or the like.PPE resin combination of the present invention can effectively reduce specific inductivity, therefore preferably uses filler such as the silicon-dioxide and the boron nitride of low-k as mineral filler.
On the other hand, organic filler is mainly used to reduce the specific inductivity of the veneer sheet that is made by PPE resin combination of the present invention.Particularly, can list fluorine class, polystyrene type, Vinylstyrene class, polyimide filler etc., these fillers can be used singly or in combination.Fluorine class filler (filler that is made by fluorochemicals) comprises, for example: polytetrafluoroethylene (PTFE), poly-perfluoroalkoxy resin, poly-ethylene fluoride-acrylic resin, tetrafluoroethylene-polyethylene and ethylene copolymers, poly(vinylidene fluoride), daiflon etc.These mineral fillers and organic filler can be used singly or in combination separately.
Above-mentioned filler should be ground into the particle of reduced size, and purpose is to improve its insulation characterisitic and reliability to satisfy in recent years the trend that requires to lighter, thinner, shorter and littler product and high-density assembling.More particularly, the mean diameter of filler particles is preferably and is no more than 10 μ m.Use such filler can produce the veneer sheet of excellent uniformity coefficient and reliability.Should " mean diameter " can determine, but can decide according to the description of this filler.At present the mean diameter of obtainable most of filler particles be 0.05 μ m or more than, so in fact the lower limit of filler mean diameter is exactly this value.
The mineral filler and the organic filler that are used for PPE resin combination of the present invention can be hollow or porous particles, or by the particle that fluorochemicals is made, its objective is the specific inductivity of further reduction product.This is because use these fillers can produce the veneer sheet with excellent specific inductivity.
With regard to the inorganic hollow particle, its sintering temperature is important, is preferably 600 ℃ or higher.When hollow bead is during with preparation such as sol-gel method, the dielectric characteristics of this hollow bead can worsen, and particularly dielectric loss factor can increase because of silanol residual on it, and may cause the rapid deterioration of broadband character.
With regard to organic filler, can use the open communique 2002-80503 number disclosed hollow polymer micropowder of Japanese Patent.The shell of hollow bead is made by advanced low-k materials such as Vinylstyrene or divinyl biphenyl, and it helps producing the veneer sheet with low-k.
If needed, PPE resin combination of the present invention can further comprise fire retardant, and purpose is to improve water resisting property, moistureproofness, hygroscopic thermotolerance and the glass transition point of veneer sheet.In this case, by the PPE resin combination that contains PPE, crosslinking and curing agent and fire retardant; And in the varnish formed of solvent (organic solvent), it is inert, insoluble but be scattered in bromine compounds in the varnish solvent for use that above-mentioned fire retardant is preferably PPE and crosslinking and curing agent.Promptly, when fire retardant is when having the reactive flame retardant of unsaturated link(age) or being dissolved in the fire retardant of above-mentioned solvent, then this fire retardant is admixed in the reaction system of producing matrix resin, thereby has reduced prepreg that uses these resin combinations and water resisting property, moistureproofness, hygroscopic thermotolerance and the glass transition point (to call Tg in the following text) that uses the veneer sheet of this prepreg.Therefore, when fire retardant does not react on PPE and crosslinking and curing agent and insoluble but when being scattered in bromination organic compound in the solvent, then this fire retardant seems as filler retention in resin, in order to water resisting property, moistureproofness, hygroscopic thermotolerance and the Tg that improves product.In addition, the true specific gravity of bromination organic compound is preferably in 2.0 to 3.5 scope.When the true specific gravity of flame retardant brominated organic compound less than 2.0 the time, then make this fire retardant be difficult to disperse, and when this proportion surpassed 3.5, then this fire retardant trended towards being deposited in the varnish of PPE resin combination, need constantly stir to keep the homogeneous of varnish, cause reducing operation efficiency.
As this bromination organic compound, the optimization aromatic bromine compounds, what it was fit to comprises, for example: ten bromo diphenylethanes, 4,4-'-dibromobiphenyl, ethene two (tetrabromo phthalimide) (ethylene bistetrabromophthalimide), or the like.The content of bromination organic compound is preferably, and with respect to the total amount of resin combination, bromine content drops in the scope of 8 to 20 quality %.When bromine content with respect to the total amount of resin combination during less than 8 quality %, then the resistivity against fire of veneer sheet descends and is difficult to keep the level of fire resistance of UL standard 94V-0, and when this content surpassed 20 quality %, then the thermotolerance of veneer sheet descended and is heated Shi Huigeng and discharges bromine (Br) easily.
In addition, PPE resin combination of the present invention can further comprise initiator, and purpose is to strengthen the effect of crosslinking and curing agent.Though only use PPE (0) and crosslinking and curing agent also can promote curing under the high temperature, add initiator and be advisable, because be difficult to maintenance high temperature curing is finished before sometimes according to processing condition.Should " reaction initiator " be not particularly limited, as long as it can reach the curing that promotes the PPE resin combination in suitable period under suitable temperature, and improve the character of PPE resin such as thermotolerance etc., for example comprise oxygenant, if any α, α '-two (sec.-propyl between tert-butyl hydroperoxide) benzene, 2,5-dimethyl-2,5-two (tert-butyl hydroperoxide)-3-hexin, benzoyl peroxide, 3,3 ', 5,5 '-tetramethyl--1,4-hexichol oxygen quinone, chloranil, 2,4,6-three (tertiary butyl phenoxy group), single carbonic acid tert-butyl hydroperoxide isopropyl ester and Diisopropyl azodicarboxylate.If desired, can further add metal carboxylate with further promotion curing reaction.In the middle of them, as the preferred especially α of initiator, α '-two (sec.-propyl between tert-butyl hydroperoxide) benzene.This is because this compound has: higher reacting initial temperature, therefore when not needing to solidify, as when prepreg is dry, can not cause curing, and can not weaken the stability in storage of PPE resin combination; Low volatility, the dry and anti-devaporation of memory period at prepreg; And excellent stability.
As mentioned above, require PPE (0) and crosslinking and curing agent as main ingredient according to PPE resin combination of the present invention; Preferably contain one or more components that are selected from unmodified PPE, filler, fire retardant and the initiator; Can further contain for electronics (particularly printed-wiring board (PWB)) production and use PPE resin combination, additive commonly used.
PPE resin combination of the present invention is, for infiltrate varnish in the base material to make prepreg, at first prepare varnish by toward organic solvent in, adding PPE, crosslinking and curing agent and other interpolation components (if needed).Organic solvent is not particularly limited, the energy dissolving resin component as long as it can not dissolve above-mentioned bromination organic compound, and can not weaken reaction; The solvent that is fit to for example comprises ketone such as methylethylketone etc., ethers such as dibutyl ether etc., ester class such as ethyl acetate etc., amides such as dimethyl formamide etc., arene such as benzene,toluene,xylene etc., and chlorinated hydrocarbon such as trieline etc.; Every kind of solvent can use use also capable of being combined separately.The concentration of resin solid matter can be according to making varnish be infiltrated up to the technology of base material and appropriate change in the varnish, and for example its suitable concentration is 40～90 quality %.
By making the above-mentioned varnish that makes be infiltrated up to base material, then it is carried out heat drying to remove the resin in organic solvent and the partly solidified base material, make prepreg.As base material, any yarn fabric or nonwoven fabric that is made by known organic fibre or glass fibre all can use, but the preferred NE type of base material glasscloth, and the prepreg made from its and veneer sheet have lower specific inductivity and dielectric loss factor and better high frequency characteristics.At this, " NE type glass fabric " is meant the glass fiber with low dielectric constant fabric.That is, (ε: 4.4) (ε: 6.5) glasscloth that gets of low NE type glass is known as " NE type glasscloth " than the specific inductivity of common E type glass by specific inductivity.Term " NE " expression " new E type glass ".
Be used for the infiltrating varnish amount of above-mentioned base material is preferably and makes that the mass content of resin solid thing is 35 quality % or more in the prepreg.The specific inductivity of base material is usually above the specific inductivity of resin, and therefore in order to reduce the specific inductivity of the veneer sheet that is made by these prepregs, the content of resin Composition in prepreg preferably is higher than above-mentioned mass content.For example, using resin Composition content is the prepreg that 37 quality % or more E type glasscloth (base material) make, its specific inductivity oblatio 3.5 or lower, and those use resin Composition content are the prepreg that 45 quality % or more NE type glasscloth make, its specific inductivity oblatio 3.3 or lower.In addition, it is for example to descend 1～10 minute at 80～150 ℃ that infiltration has the heating condition of the base material of varnish, but does not limit to therewith.
In the present invention, can use above-mentioned prepreg to make veneer sheet.More particularly, on one or both sides, all have the multilayer of tinsel and the veneer sheet of integration, can be by piling up a slice or several pieces prepregs of the present invention, on its one or both sides, shelve tinsel such as Copper Foil etc., then the stacked body that obtains being carried out making after the hot pressing.On the tinsel of laminate surface, carry out etching formation wiring diagram and obtain printed-wiring board (PWB).In addition, can prepare multilayer printed circuit board by following step: use printed-wiring board (PWB) as the internal layer printed-wiring board (PWB), tinsel on it is carried out surface treatment, between them, insert prepreg of the present invention when piling up several pieces plates toward above, outmost surface at stacked body is laid tinsel, then whole stacked body is carried out hot pressing.Hot pressing condition can be decided with the blending ratio of raw material according to the production of PPE resin combination of the present invention, and this is not particularly limited, and the hot pressing condition of described stacked body is preferably at the temperature of 170～230 ℃ of scopes and 1.0～6.0MPa (10～60kg/cm
2) hot pressing for some time under the pressure of scope.Veneer sheet of Huo Deing and printed-wiring board (PWB) have excellent high frequency characteristics such as dielectric characteristics etc. and do not sacrifice PPE inherent characteristic in this way, and its processing characteristics, water resisting property, moistureproofness, hygroscopic thermotolerance and glass transition point all make moderate progress simultaneously.
In addition, in laminated board production of the present invention, to use surface roughness be the Copper Foil of 0～2 μ m and this copper foil surface (surface that contacts with prepreg) of resin layer one side that will form prepreg executed anti-corrosive treatment to improve the close-burning of itself and resin layer with zinc or zinc alloy, bestow processing by coupling agent as containing vinyl silicane coupling agent in addition, just can guarantee printed-wiring board (PWB) produce in higher bonding strength and better high frequency characteristics between resin layer (insulation layer) and the circuit (Copper Foil).For using zinc or zinc alloy that Copper Foil is handled, zinc or zinc alloy can deposit on the surface of this Copper Foil by for example plating.
Therefore, by the PPE resin combination of the present invention that infiltrates to base material and the base material after the infiltration is carried out heat drying and semicure handle the prepreg that obtains and, all have excellent processing characteristics, water resisting property, moistureproofness, hygroscopic thermotolerance and glass transition point by the veneer sheet that piles up and the prepreg of hot pressing some amount obtains; And when being used for the production of multilayer printed circuit board, this prepreg presents excellent processing characteristics.In addition, the veneer sheet that is used to produce printed-wiring board (PWB) of the present invention is given lower specific inductivity of printed-wiring board (PWB) and dielectric loss factor, higher water resisting property, moistureproofness, hygroscopic thermotolerance, higher glass transition point, good cohesive strength, and excellent high frequency characteristics.Perhaps, use prepreg of the present invention as the veneer sheet of producing multilayer printed circuit board, make multilayer printed circuit board in the multilayer processing process, not produce hole or scratch, and make it have excellent processing characteristics, lower specific inductivity and dielectric loss factor, excellent water resisting property, moistureproofness, hygroscopic thermotolerance, higher glass transition point, better cohesive strength, and high frequency characteristics made moderate progress.
Below, with reference to embodiment the present invention is described in more detail.
Embodiment
The preparation of lower molecular weight PPE (PPE-1)
At first, adjust the molecular weight of PPE.
Preparation also mixes the PPE (GE Plastics Japan Ltd of 36 mass parts, trade(brand)name " Noryl PX9701 ", number-average molecular weight 14,000), 1.54 mass parts is as the 2 of phenols, 1.06 mass parts are as the single carbonic acid tert-butyl hydroperoxide isopropyl ester (NOF Corp of initiator, trade(brand)name " Perbutyl I ") and the cobalt naphthenate of 0.0015 mass parts.In this mixture, add the toluene of 90 mass parts as solvent, in 80 ℃ of mixtures that obtain more than stirring down 1 hour to disperse or dissolve each component.After reaction is finished, make prepared PPE redeposition by adding a large amount of methyl alcohol, after removing impurity, under 80 ℃ decompression state, desolvated to remove fully in dry 3 hours.By gel permeation chromatography (GPS), determine that the number-average molecular weight of the PPE that obtains after this step finishes is about 2,400.
Then, with the terminal hydroxyl end-blocking of Ethenylbenzene methyl group (ethenylbenzyl group) with this lower molecular weight PPE (number-average molecular weight about 2,400).Lower molecular weight PPE (the number-average molecular weight about 2 that in 1 liter of three-necked flask that is equipped with temperature regulator, whipping device, cooling apparatus and dropping funnel, adds 200g, 400), 14.51g 1-chloro-4-methyl-benzene (p-chloromethyl styrene and a 1-chloro-4-methyl-benzene are 50/50 mixture, Tokyo HuaCheng Industry Co., Ltd), 0.818g tetra-n-butyl ammonium bromide and the toluene of 400g.Stirring this mixture dissolves fully and is heated to 75 ℃ up to it.In 20 minutes time in the mixture solution dropping sodium aqueous solution (water of sodium hydroxide/11g of 11g), and 75 ℃ of following restir 4 hours.Then, with the neutralization of the solution in the flask, add a large amount of methyl alcohol with 10% aqueous hydrochloric acid so that the PPE redeposition of this Ethenylbenzene methyl modification is then collected PPE with filtration method.The solution that the PPE that collects prepares with 80 to 20 ratio with the first alcohol and water washes three times, and drying is 3 hours under 80 ℃ decompression state, thereby is not contained the Ethenylbenzene methyl MODIFIED PP E of solvent or water.By gel permeation chromatography, determine that the number-average molecular weight of this MODIFIED PP E is about 2,700.Claim that hereinafter the above PPE that obtains is " PPE-1 ".
The preparation of lower molecular weight PPE (PPE-2)
At first, adjust the molecular weight of PPE.PPE (the GE Plastics Japan Ltd of mixing 36 mass parts respectively, trade(brand)name " NorylPX9701 ", number-average molecular weight 14,000), 1.44 mass parts is as the dihydroxyphenyl propane of phenols, with the benzoyl peroxide (NOF Corp, trade(brand)name " Nyper BW ") of 1.90 mass parts as initiator.In this mixture, add the toluene of 90 mass parts as solvent, in 80 ℃ of mixtures that obtain more than stirring down 1 hour to disperse or dissolve each component.After reaction is finished, make prepared PPE redeposition by adding a large amount of methyl alcohol, after removing impurity, under 80 ℃ decompression state, desolvated to remove fully in dry 3 hours.By gel permeation chromatography (GPS), determine that the number-average molecular weight of the PPE that obtains after this step finishes is about 2,400.
Then, the mode of above-mentioned to be similar to " preparation of PPE-1 " methylates (ethenylbenzylated) this lower molecular weight PPE (number-average molecular weight is about 2400) Ethenylbenzene and obtains MODIFIED PP E.The number-average molecular weight of this MODIFIED PP E is about 2,800 (by gel permeation chromatographies).Claim that hereinafter the above PPE that obtains is " PPE-2 ".
The preparation of lower molecular weight PPE (PPE-3)
Using the number-average molecular weight (Mn) of Asahi Kasei Corporation is 2,100 and the ratio (Mw/Mn) of weight average molecular weight (Mw) and number-average molecular weight (Mn) be 1.6 lower molecular weight PPE, the mode of above-mentioned to be similar to " preparation of PPE-1 " methylates its terminal hydroxyl group Ethenylbenzene, thereby obtains MODIFIED PP E.By gel permeation chromatography, determine that the number-average molecular weight of this MODIFIED PP E is about 2,500.Claim that hereinafter the above PPE that obtains is " PPE-3 ".
The preparation of lower molecular weight PPE (PPE-4)
Using the number-average molecular weight (Mn) of Asahi Kasei Corporation is 2,100 and the ratio (Mw/Mn) of weight average molecular weight (Mw) and number-average molecular weight (Mn) be 1.6 lower molecular weight PPE, use 2-chloroethyl vinyl ether to replace the 1-chloro-4-methyl-benzene in " preparation of PPE-1 " that its terminal hydroxyl group vinyl ethoxylation is obtained MODIFIED PP E.By gel permeation chromatography, determine that the number-average molecular weight of this MODIFIED PP E is about 2,500.Claim that hereinafter the above PPE that obtains is " PPE-4 ".
The preparation of lower molecular weight PPE (PPE-5)
Using the number-average molecular weight (Mn) of Asahi Kasei Corporation is 2,100 and the ratio (Mw/Mn) of weight average molecular weight (Mw) and number-average molecular weight (Mn) be 1.6 lower molecular weight PPE, use p-chloromethyl styrene (CMS-14, Seimi chemical company) replacing a p-chloromethyl styrene in above-mentioned " preparation of PPE-1 " and a 1-chloro-4-methyl-benzene is that 50/50 mixture methylates its terminal hydroxyl group to Ethenylbenzene, thereby obtains MODIFIED PP E.By gel permeation chromatography, determine that the number-average molecular weight of this MODIFIED PP E is about 2,500.Claim that hereinafter the above PPE that obtains is " PPE-5 ".
The preparation of lower molecular weight PPE (PPE-6)
Using the number-average molecular weight (Mn) of Asahi Kasei Corporation is 3,500 and the ratio (Mw/Mn) of weight average molecular weight (Mw) and number-average molecular weight (Mn) be 1.9 lower molecular weight PPE, the mode of above-mentioned to be similar to " preparation of PPE-1 " methylates its terminal hydroxyl group Ethenylbenzene, thereby obtains MODIFIED PP E.By gel permeation chromatography, determine that the number-average molecular weight of this MODIFIED PP E is about 4,200.Claim that hereinafter the above PPE that obtains is " PPE-6 ".
Embodiment 1
Methylate lower molecular weight PPE (" PPE-1 ") and 100 mass parts of the Ethenylbenzene of 70 mass parts are mixed as the toluene of solvent, and stir 30 minutes down up to dissolving fully at 80 ℃.In the PPE solution that is obtained, the TAIC (Nippon Kasei Chemical Company) that adds 30 mass parts is as crosslinking and curing agent, bromination organic compound ten bromo diphenylethanes (the Albemarle Asano company of 20 mass parts, trade(brand)name " SAYTEX 8010 ", bromine content: 82wt%) as fire retardant, with the α of 2.5 mass parts, α '-two (sec.-propyl between tert-butyl hydroperoxide) benzene (NOF Corp, trade(brand)name " Perbutyl P ") is as initiator.In addition, the preparing spherical SiO 2 (Deuki Kagaku Kogyo Co., Ltd, trade(brand)name " FB3SDC ") that adds 14 mass parts then mixes said mixture, disperses and dissolve to obtain resin combination, be i.e. varnish as mineral filler in solvent (toluene).Because fire retardant is and PPE and the nullvalent bromination organic compound of TAIC, so this fire retardant can fully not dissolve and is dispersed in this resin combination (varnish).
Then, this varnish is infiltrated up to NE type glasscloth (Nitto Boseiki Co., Ltd., trade(brand)name " NEA2116 "), in this quilt of 120 ℃ of following heat dryings infiltration fabric 3 minutes, obtain the prepreg that resin content is 55 quality % (sample (i)) to remove to desolvate.
On the two sides of prepreg, respectively shelve the Copper Foil that thickness is 35 μ m (ST paper tinsel), at 200 ℃ temperature and 3.0MPa (30kg/cm
2) pressure under hot pressing 180 minutes, obtain two-sided copper-clad laminate as the internal layer printed-wiring board (PWB).Then, form wiring diagram on as two faces of the copper-clad laminate of internal layer printed-wiring board (PWB) after, with the surperficial melanism of Copper Foil to obtain the core running board.Two core running boards are stacked, be respectively arranged with three prepregs on two surfaces separately with them between these two core running boards.In addition, with thickness be two outermost layers that respectively are arranged at the stacked body that finally obtains of Copper Foil (ST paper tinsel) of 35 μ m.Then at 200 ℃ temperature and 3.0Mpa (30kg/cm
2) pressure under resulting multiple-level stack body heat is pressed 180 minutes to obtain one 6 layers copper-clad laminate, be used as printed-wiring board (PWB).Then, prepared these 6 layers of copper-clad laminates are cut into the sheet of 50mm * 50mm, remove the outer copper foil layer by etching and obtain as the hygroscopic thermotolerance of estimating 6 laminates and the sample of processing characteristics.Described 6 laminates are cut into the sheet of 100mm * 10mm, with its sample (sample (ii)) as the cohesive strength of estimating the internal layer Copper Foil.
Respectively 7 prepregs being stacked, is two upper and lower surfaces that are held on stacked body of Copper Foil (ST paper tinsel) of 35 μ m with thickness.At 200 ℃ temperature and 3.0MPa (30kg/cm
2) pressure under with resulting stacked body hot pressing 180 minutes to obtain a two-sided copper-clad laminate, be used as printed-wiring board (PWB).Then, the two-sided copper-clad laminate that so obtains is cut into the sample of 100mm * 10mm, be used to estimate the cohesive strength of Copper Foil, and the sheet that cuts into 86mm * 86mm forms wiring diagram thereon, as the sample of measuring specific inductivity and dielectric loss factor.In addition, two lip-deep Copper Foil is removed, as estimating its glass transition point (Tg), thermal expansivity, flame retardant resistance and hygroscopic sample (sample (iii)) by etching.
On the thick FR-4 base material of 1.6mm, get out the through hole that bore is 0.25mm respectively.To through hole plating 20 μ m thick after, with prepreg, be that Copper Foil on its top respectively stacks on two surfaces of base material subsequently, then make stacked body at 200 ℃ temperature and 3.0MPa (30kg/cm
2) pressure under hot pressing 180 minutes.Resulting sample panel (sample (iv)) that is used as evaluation to the resin filling perforation performance of IVH.
After on preparing, forming wiring diagram as the one side of two-sided copper-clad laminate prepared in the sample step (ii) of internal layer printed-wiring board (PWB), with a slice prepreg be used for making the identical Copper Foil of two-sided copper-clad laminate and fold on the one side that is formed with wiring diagram, then under identical condition, carry out hot pressing, with the multilayer printed circuit board (sample (v)) that obtains having stripline.
Embodiment 2～9
Use the component in the composition shown in table 1 and the table 2, to prepare prepreg and sample (i) to (v) with the similar method of embodiment 1.Incidentally, to be about 9,000 unmodified PPE be that to adopt molecule cut-out technology be that 14,000 PPE (GE Plastics Japan Ltd, trade(brand)name " Noryl PX9701 ") prepares from above-mentioned number-average molecular weight to the number-average molecular weight that is added among the embodiment 9.
Reference examples 1 and 2
Use the component in the composition shown in the table 2, to prepare prepreg and sample (i) to (v) with the similar method of embodiment 1.
Material in table 1 and the table 2 is as follows:
Unmodified PPE: " Noryl PX9701 ", (Mn: about 14,000) of GE Plastics Japan Ltd
Crosslinking and curing agent 1: triallyl isocyanurate (TAIC)
Crosslinking and curing agent 2: trihydroxy methyl propane trimethyl acrylate (TMPT, Xin Zhong village chemical industry Co., Ltd.; " NKesterTMPT ")
Initiator: α, α '-two (sec.-propyl between tert-butyl hydroperoxide) benzene (NOF Corp; Trade(brand)name " Perbutyl P ")
Fire retardant: ten bromo diphenylethanes (Albemarle Asano company; Trade(brand)name: " SAYTEX 8010 ", bromine content: 82wt%)
Mineral filler (preparing spherical SiO 2): Deuki Kagaku Kogyo Co., Ltd, " FB3SDC "
The surface roughness of used Copper Foil is 6 μ m (Japan Energy companies; " JTW ").In addition, the surface of Copper Foil is coated with zinc or zinc alloy and the processing of process coupler.
EXPERIMENTAL EXAMPLE
Prepared sample (i) has been measured the resin content and the Resin Flow of prepreg in use embodiment 1 to 4 and reference examples 1 and 2; Use above-mentioned sample (iii) to measure glass transition point (Tg), specific inductivity, dielectric loss factor, thermal expansivity, flame retardant resistance, Copper Foil cohesive strength and water absorbability; Use above-mentioned sample (ii) to measure the solder heat resistance after suitability for secondary processing, the moisture absorption and the cohesive strength of internal layer Copper Foil; Use above-mentioned sample (iv) to measure resin filling perforation performance to IVH; And use above-mentioned sample (v) to measure transmission loss.
The resin content of prepreg and Resin Flow are measured according to JIS (C6521); The specific inductivity of veneer sheet, dielectric loss factor and Copper Foil cohesive strength are measured according to JIS (C6481); Thermal expansivity (Z axle) is measured with the TMA method; Flame retardant resistance adopts the UL94 standard test; And glass transition point (Tg) is used the visco-elasticity spectrometer, measure.Suitability for secondary processing, in advance secondary processing and the back is removed in the outer copper foil etching have imporosity and scratch to determine according to visual.Internal layer Copper Foil cohesive strength is the cohesive strength on melanism surface.
Water absorbability is to measure under the condition of E-24/50+C-24/60/95.That is to say, water absorbability be sample 50 ℃ dry 24 hours down, 23 ℃ of coolings 24 hours down, and after depositing 24 hours under the temperature of relative humidity 95% and 60 ℃, measure.The veneer sheet sample is removed its surface back, is cut into 50mm * 50mm size through etching, is used to measure water absorbability.
Solder heat resistance after the moisture absorption is definite in the following method: at first, 6 layers of copper-clad laminate sample of 50mm * 50mm are handled (seething with excitement 2 hours down at 100 ℃) and are gone forward side by side the enforcement sample respectively 135 ℃ and 2 air pressure (0.2MPa), 2 hours high pressure accelerated life test (PCT) of processing down under D-2/100; 5 samples were flooded 20 seconds in liquid solder under 260 ℃; The degree of visual definite living white point and foaming.Resin filling perforation performance to IVH is determined with the following methods: at first, sample stands the circulation of 300 heating and cooling in thermal cycling test (condition B); The cross section that is filled into the resin among the IVH by direct viewing is determined having or not of hole and scratch.Transmission loss is to determine by the transmission loss of measuring when the internal layer circuit to multilayer printed circuit board loads the 1.6GHz signal.
Above-mentioned measuring result sees Table 1 and table 2.
Table 1
Table 2
The above results can confirm, the glass transition point of the PPE resin combination of embodiment 1 to 4 within the scope of the present invention, than the PPE resin combination of number-average molecular weight outside institute of the present invention limited range of PPE in those reference examples (less than 1,000 or greater than 7,000) height, and this PPE resin combination is the material that is applicable to that multi-ply wood is produced, and can make multi-ply wood have excellent humidity resistance and the solder heat resistance after the moisture absorption.In addition, the veneer sheet of embodiment still maintains the identical dielectric characteristics with reference examples, has superior thermotolerance (solder heat resistance after the moisture absorption), and compares with reference examples, the resin combination of PPE described in the embodiment has the better processability energy, particularly to the resin filling perforation performance of IVH.In addition, the Shen of filler falls and can effectively be suppressed among the embodiment 8.
Though the present invention fully is described by way of example, it all is conspicuous being to be understood that the various changes in this area and revising.Therefore, unless these changes and modification have broken away from the following scope of the present invention that is limited, they all should be regarded as and comprise in the present invention.
Claims (16)
1. a polyphenyl ether resin composition is characterized in that, comprises polyphenylene oxide and crosslinking and curing agent, and wherein, described polyphenylene oxide is by following formula (I) expression, and its number-average molecular weight is in 1,000 to 7,000 scope,
In the formula (I), X is an aryl; (Y)
mIt is polyphenylene oxide part by following formula (II) expression; R
1To R
3It is respectively hydrogen atom; N is 1 to 6 integer; Q is 1 to 4 integer,
In the formula (II), R
4To R
7It is respectively hydrogen atom; M is 1 to 100 integer.
2. polyphenyl ether resin composition as claimed in claim 1 is characterized in that n is 1.
3. polyphenyl ether resin composition as claimed in claim 1 is characterized in that, the part that is expressed from the next is at least a group that is selected from an Ethenylbenzene methyl and the Ethenylbenzene methyl,
4. polyphenyl ether resin composition as claimed in claim 1 is characterized in that, is 30/70 to 90/10 by the mass ratio that described polyphenylene oxide/described crosslinking and curing agent is represented.
5. polyphenyl ether resin composition as claimed in claim 1 is characterized in that, also contains the polyphenylene oxide of number-average molecular weight in 9,000 to 18,000 scopes.
6. polyphenyl ether resin composition as claimed in claim 1 is characterized in that, described crosslinking and curing agent is the trialkenyl isocyanuric acid ester, and wherein, described thiazolinyl is for containing the unsaturated hydrocarbon group of at least one carbon-to-carbon double bond in structure.
7. polyphenyl ether resin composition as claimed in claim 1 is characterized in that, described crosslinking and curing agent is three to five functional (methyl) acrylic compound.
8. polyphenyl ether resin composition as claimed in claim 1 is characterized in that, also contains at least a organic or inorganic filler.
9. polyphenyl ether resin composition as claimed in claim 8 is characterized in that, the mean diameter of described filler is 10 μ m or littler.
10. polyphenyl ether resin composition as claimed in claim 8 is characterized in that, described filler is a hollow body.
11. polyphenyl ether resin composition as claimed in claim 8 is characterized in that, described filler is the material by the fluorochemicals preparation.
12. polyphenyl ether resin composition as claimed in claim 1 is characterized in that, also contains fire retardant.
13. polyphenyl ether resin composition as claimed in claim 12 is characterized in that, described fire retardant is that bromine content is with respect to the bromide of described total composition at 8 to 20 quality %.
14. a prepreg is characterized in that, is by being infiltrated up in the base material and this is formed by the base material semicure after infiltrating as any described polyphenyl ether resin composition in the claim 1 to 13.
15. prepreg as claimed in claim 14 is characterized in that, described base material is a NE type glasscloth.
16. a veneer sheet is characterized in that, by will next each and every one piles up and forms in hot pressing as claim 14 or 15 described prepregs and Copper Foil.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003019475 | 2003-01-28 | ||
| JP2003-019475 | 2003-01-28 | ||
| JP2003019475 | 2003-01-28 | ||
| JP2003136496 | 2003-05-14 | ||
| JP2003-136496 | 2003-05-14 | ||
| JP2003136496 | 2003-05-14 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800029803A Division CN100547033C (en) | 2003-01-28 | 2004-01-22 | Polyphenyl ether resin composition, prepreg and veneer sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101624467A CN101624467A (en) | 2010-01-13 |
| CN101624467B true CN101624467B (en) | 2011-09-14 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101673192A Expired - Lifetime CN101624467B (en) | 2003-01-28 | 2004-01-22 | Poly (phenylene ether) resin composition, prepreg, and laminated sheet |
| CNB2004800029803A Expired - Lifetime CN100547033C (en) | 2003-01-28 | 2004-01-22 | Polyphenyl ether resin composition, prepreg and veneer sheet |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800029803A Expired - Lifetime CN100547033C (en) | 2003-01-28 | 2004-01-22 | Polyphenyl ether resin composition, prepreg and veneer sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN101624467B (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8025926B2 (en) * | 2008-04-23 | 2011-09-27 | Sabic Innovative Plastics Ip B.V. | Varnish compositions for electrical insulation and method of using the same |
| CN101894902B (en) * | 2010-06-24 | 2012-12-12 | 浙江华正新材料股份有限公司 | LED substrate and manufacturing method thereof |
| WO2012081705A1 (en) | 2010-12-16 | 2012-06-21 | 旭化成イーマテリアルズ株式会社 | Curable resin composition |
| TWI506066B (en) * | 2012-03-19 | 2015-11-01 | Asahi Kasei E Materials Corp | Pre- impregnated polyphenylene ether particles |
| CN102807658B (en) * | 2012-08-09 | 2014-06-11 | 广东生益科技股份有限公司 | Polyphenyl ether resin composite and prepreg and copper clad laminate made of polyphenyl ether resin composite |
| WO2014034103A1 (en) * | 2012-08-29 | 2014-03-06 | パナソニック株式会社 | Modified polyphenylene ether, method for manufacturing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board |
| CN104744891A (en) * | 2013-12-27 | 2015-07-01 | 台燿科技股份有限公司 | Prepreg and application thereof |
| WO2016038878A1 (en) * | 2014-09-09 | 2016-03-17 | パナソニックＩｐマネジメント株式会社 | Curable composition, prepreg, metal foil with resin, metal-clad laminate and printed wiring board |
| CN105620000B (en) * | 2014-10-27 | 2019-10-25 | 深圳光启高等理工研究院 | A kind of composite plate and its manufacturing method |
| JP6504386B2 (en) * | 2014-12-16 | 2019-04-24 | パナソニックＩｐマネジメント株式会社 | Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board |
| TWI518136B (en) * | 2014-12-23 | 2016-01-21 | Nanya Plastics Corp | A thermosetting resin composition, and a prepreg and a hardened product using the composition |
| CN106609039B (en) * | 2015-10-21 | 2019-09-13 | 广东生益科技股份有限公司 | A kind of polyphenyl ether resin composition and its application in high-frequency circuit board |
| JP2020132716A (en) * | 2019-02-15 | 2020-08-31 | 旭化成株式会社 | Polyphenylene ether-containing resin composition |
| KR20220038378A (en) * | 2019-07-17 | 2022-03-28 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | Resin composition, prepreg, resin-added film, resin-added metal foil, metal clad laminate, and wiring board |
| CN113603883B (en) * | 2021-08-03 | 2023-01-10 | 珠海宏昌电子材料有限公司 | Modified polyphenyl ether, preparation method and application in high-frequency circuit board |
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| EP0529378A1 (en) * | 1991-08-24 | 1993-03-03 | BASF Aktiengesellschaft | Thermoplastic moulding based on polyamide and polyphenylene ether |
| US5214099A (en) * | 1992-02-25 | 1993-05-25 | General Electric Company | Epoxy-functionalized polyphenylene ethers of low gel content, method for their preparation, and copolymer-containing compositions prepared therefrom |
| US6352782B2 (en) * | 1999-12-01 | 2002-03-05 | General Electric Company | Poly(phenylene ether)-polyvinyl thermosetting resin |
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2004
- 2004-01-22 CN CN2009101673192A patent/CN101624467B/en not_active Expired - Lifetime
- 2004-01-22 CN CNB2004800029803A patent/CN100547033C/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0529378A1 (en) * | 1991-08-24 | 1993-03-03 | BASF Aktiengesellschaft | Thermoplastic moulding based on polyamide and polyphenylene ether |
| US5214099A (en) * | 1992-02-25 | 1993-05-25 | General Electric Company | Epoxy-functionalized polyphenylene ethers of low gel content, method for their preparation, and copolymer-containing compositions prepared therefrom |
| US6352782B2 (en) * | 1999-12-01 | 2002-03-05 | General Electric Company | Poly(phenylene ether)-polyvinyl thermosetting resin |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1745142A (en) | 2006-03-08 |
| CN100547033C (en) | 2009-10-07 |
| CN101624467A (en) | 2010-01-13 |
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