CN101610637B - 用于优化散热的布置电路板的组件的方法及电路设备 - Google Patents
用于优化散热的布置电路板的组件的方法及电路设备 Download PDFInfo
- Publication number
- CN101610637B CN101610637B CN200910147410.8A CN200910147410A CN101610637B CN 101610637 B CN101610637 B CN 101610637B CN 200910147410 A CN200910147410 A CN 200910147410A CN 101610637 B CN101610637 B CN 101610637B
- Authority
- CN
- China
- Prior art keywords
- unit
- outlet slit
- air intake
- heat dissipation
- air outlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000000712 assembly Effects 0.000 claims description 47
- 238000000429 assembly Methods 0.000 claims description 47
- 239000011469 building brick Substances 0.000 claims description 45
- 230000005855 radiation Effects 0.000 claims description 15
- 239000003990 capacitor Substances 0.000 description 20
- 238000004513 sizing Methods 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0058360 | 2008-06-20 | ||
KR1020080058360A KR101238370B1 (ko) | 2008-06-20 | 2008-06-20 | 최적 방열을 위한 회로기판의 부품배치 방법 및 그 부품배치 방법에 의해 부품이 배치된 회로 장치 |
KR1020080058360 | 2008-06-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101610637A CN101610637A (zh) | 2009-12-23 |
CN101610637B true CN101610637B (zh) | 2014-08-06 |
Family
ID=41431051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910147410.8A Expired - Fee Related CN101610637B (zh) | 2008-06-20 | 2009-06-10 | 用于优化散热的布置电路板的组件的方法及电路设备 |
Country Status (3)
Country | Link |
---|---|
US (2) | US8130493B2 (zh) |
KR (1) | KR101238370B1 (zh) |
CN (1) | CN101610637B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101238370B1 (ko) * | 2008-06-20 | 2013-03-08 | 삼성전자주식회사 | 최적 방열을 위한 회로기판의 부품배치 방법 및 그 부품배치 방법에 의해 부품이 배치된 회로 장치 |
TW201230939A (en) * | 2010-11-08 | 2012-07-16 | Compal Electronics Inc | Electronic apparatus |
TWI518285B (zh) * | 2013-06-17 | 2016-01-21 | 瑞軒科技股份有限公司 | 燈條與背光模組 |
JP6165571B2 (ja) * | 2013-09-19 | 2017-07-19 | 日立オートモティブシステムズ株式会社 | ブレーキ制御装置 |
WO2020062253A1 (zh) * | 2018-09-30 | 2020-04-02 | 北京比特大陆科技有限公司 | 电路板、计算设备及散热机箱 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6377459B1 (en) * | 2000-08-04 | 2002-04-23 | Sun Microsystems, Inc. | Chip cooling management |
CN101164164A (zh) * | 2005-04-15 | 2008-04-16 | 富士通株式会社 | 散热器、电路基板、电子设备 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2760829B2 (ja) * | 1989-01-13 | 1998-06-04 | 株式会社日立製作所 | 電子基板 |
JP2724033B2 (ja) * | 1990-07-11 | 1998-03-09 | 株式会社日立製作所 | 半導体モジユール |
JPH0697623A (ja) * | 1992-09-17 | 1994-04-08 | Fujitsu Ltd | 回路モジュールの放熱実装構造 |
JPH10233590A (ja) | 1997-02-20 | 1998-09-02 | Nec Corp | 小型電子機器の冷却構造 |
US6359782B1 (en) * | 2000-05-09 | 2002-03-19 | Lucent Technologies, Inc. | Enhanced thermal dissipation device for circuit boards and method to use the same |
US6445591B1 (en) * | 2000-08-10 | 2002-09-03 | Nortel Networks Limited | Multilayer circuit board |
EP1343204B1 (en) * | 2000-12-11 | 2016-11-23 | Fujitsu Limited | Electronic device unit |
US7061761B2 (en) * | 2004-07-30 | 2006-06-13 | Hewlett-Packard Development Company, L.P. | System and method for cooling components in an electronic device |
US7391618B2 (en) * | 2006-03-24 | 2008-06-24 | Fujitsu Limited | Electronic component unit |
US20070230118A1 (en) * | 2006-03-31 | 2007-10-04 | Javier Leija | Circuit board including components aligned with a predominant air flow path through a chassis |
JP4435125B2 (ja) | 2006-08-28 | 2010-03-17 | 株式会社東芝 | 液冷装置 |
KR101238370B1 (ko) * | 2008-06-20 | 2013-03-08 | 삼성전자주식회사 | 최적 방열을 위한 회로기판의 부품배치 방법 및 그 부품배치 방법에 의해 부품이 배치된 회로 장치 |
-
2008
- 2008-06-20 KR KR1020080058360A patent/KR101238370B1/ko active IP Right Grant
-
2009
- 2009-02-20 US US12/389,723 patent/US8130493B2/en not_active Expired - Fee Related
- 2009-06-10 CN CN200910147410.8A patent/CN101610637B/zh not_active Expired - Fee Related
-
2012
- 2012-01-19 US US13/353,931 patent/US9049780B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6377459B1 (en) * | 2000-08-04 | 2002-04-23 | Sun Microsystems, Inc. | Chip cooling management |
CN101164164A (zh) * | 2005-04-15 | 2008-04-16 | 富士通株式会社 | 散热器、电路基板、电子设备 |
Also Published As
Publication number | Publication date |
---|---|
KR20090132207A (ko) | 2009-12-30 |
US9049780B2 (en) | 2015-06-02 |
KR101238370B1 (ko) | 2013-03-08 |
CN101610637A (zh) | 2009-12-23 |
US20090316357A1 (en) | 2009-12-24 |
US8130493B2 (en) | 2012-03-06 |
US20120117798A1 (en) | 2012-05-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170223 Address after: Gyeonggi Do Korea Suwon Patentee after: Aisi Printing Solutions Co.,Ltd. Address before: Gyeonggi Do Korea Suwon Patentee before: Samsung Electronics Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Gyeonggi Do Korea Suwon Patentee after: S-PRINTING SOLUTION Co.,Ltd. Address before: Gyeonggi Do Korea Suwon Patentee before: Aisi Printing Solutions Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191118 Address after: Texas, USA Patentee after: HEWLETT-PACKARD DEVELOPMENT Co.,L.P. Address before: Gyeonggi Do Korea Suwon Patentee before: S-PRINTING SOLUTION Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140806 |