CN101604618B - Ball-planting device of semiconductor packaging equipment - Google Patents
Ball-planting device of semiconductor packaging equipment Download PDFInfo
- Publication number
- CN101604618B CN101604618B CN2009100527786A CN200910052778A CN101604618B CN 101604618 B CN101604618 B CN 101604618B CN 2009100527786 A CN2009100527786 A CN 2009100527786A CN 200910052778 A CN200910052778 A CN 200910052778A CN 101604618 B CN101604618 B CN 101604618B
- Authority
- CN
- China
- Prior art keywords
- ball
- tin
- fixed
- container
- tin ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100527786A CN101604618B (en) | 2009-06-09 | 2009-06-09 | Ball-planting device of semiconductor packaging equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100527786A CN101604618B (en) | 2009-06-09 | 2009-06-09 | Ball-planting device of semiconductor packaging equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101604618A CN101604618A (en) | 2009-12-16 |
CN101604618B true CN101604618B (en) | 2011-02-09 |
Family
ID=41470291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009100527786A Active CN101604618B (en) | 2009-06-09 | 2009-06-09 | Ball-planting device of semiconductor packaging equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101604618B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103311137A (en) * | 2012-03-06 | 2013-09-18 | 上海微松工业自动化有限公司 | Automatic supply equipment for solder ball positioning in high-density chip packaging |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103871915B (en) * | 2014-03-24 | 2016-08-17 | 上海微松工业自动化有限公司 | Manually BGA ball attachment machine |
CN105789095B (en) * | 2016-04-12 | 2018-06-29 | 上海微松工业自动化有限公司 | A kind of full-automatic ball attachment machine and its ball-establishing method |
CN105873378B (en) * | 2016-06-01 | 2018-12-21 | 全讯射频科技(无锡)有限公司 | The height adjustment device of a plant ball steel mesh |
CN106112182B (en) * | 2016-07-12 | 2018-09-04 | 上海微松工业自动化有限公司 | A kind of full-automatic ball attachment device and its application |
HK1248462A2 (en) * | 2018-07-12 | 2018-10-12 | Newchamp Tech Limited | A ball mounter |
CN112259478A (en) * | 2020-10-23 | 2021-01-22 | 技感半导体设备(南通)有限公司 | Ball scraping and spreading device and method |
CN114597146B (en) * | 2022-05-07 | 2022-07-22 | 深圳市立可自动化设备有限公司 | BGA ball mounting machine |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6253992B1 (en) * | 1998-03-18 | 2001-07-03 | Tessera, Inc. | Solder ball placement fixtures and methods |
CN1444261A (en) * | 2003-04-11 | 2003-09-24 | 华中科技大学 | Soldered ball embedding device |
CN1581441A (en) * | 2003-08-14 | 2005-02-16 | 宏达国际电子股份有限公司 | Ball-planting device for making several tin balls stick to chip |
CN1632934A (en) * | 2004-12-29 | 2005-06-29 | 上海交通大学 | Multi-diameter solder ball automatic releasing device |
CN101097874A (en) * | 2007-06-21 | 2008-01-02 | 华为技术有限公司 | Ball planting device and method for ball grid array packaging chip |
CN101140889A (en) * | 2007-10-16 | 2008-03-12 | 天津大学 | Automatic welding ball packaging metal ball embedding method and apparatus |
-
2009
- 2009-06-09 CN CN2009100527786A patent/CN101604618B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6253992B1 (en) * | 1998-03-18 | 2001-07-03 | Tessera, Inc. | Solder ball placement fixtures and methods |
CN1444261A (en) * | 2003-04-11 | 2003-09-24 | 华中科技大学 | Soldered ball embedding device |
CN1581441A (en) * | 2003-08-14 | 2005-02-16 | 宏达国际电子股份有限公司 | Ball-planting device for making several tin balls stick to chip |
CN1632934A (en) * | 2004-12-29 | 2005-06-29 | 上海交通大学 | Multi-diameter solder ball automatic releasing device |
CN101097874A (en) * | 2007-06-21 | 2008-01-02 | 华为技术有限公司 | Ball planting device and method for ball grid array packaging chip |
CN101140889A (en) * | 2007-10-16 | 2008-03-12 | 天津大学 | Automatic welding ball packaging metal ball embedding method and apparatus |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103311137A (en) * | 2012-03-06 | 2013-09-18 | 上海微松工业自动化有限公司 | Automatic supply equipment for solder ball positioning in high-density chip packaging |
CN103311137B (en) * | 2012-03-06 | 2015-10-28 | 上海微松工业自动化有限公司 | A kind of superchip packaging solder ball location auto supply equipment |
Also Published As
Publication number | Publication date |
---|---|
CN101604618A (en) | 2009-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101604618B (en) | Ball-planting device of semiconductor packaging equipment | |
CN203002595U (en) | Synchronous aligning device of windshield glass gluing machine | |
CN207402161U (en) | Reciprocating drilling equipment | |
CN204172030U (en) | A kind of robot manipulator structure | |
CN204330887U (en) | A kind of resistance detection equipment for notebook computer | |
CN201770021U (en) | Grabbing and charging device for vibrating type tray charging machine | |
CN109406982A (en) | Silicon single crystal rod parameter automatic detection apparatus | |
CN110466767A (en) | A kind of topographic section mapping UAV system | |
CN202939245U (en) | Lithium battery protection board detection device | |
CN202343381U (en) | Glue spraying device for tire glue spraying machine | |
CN202522218U (en) | High-precision air-pressure-type cable meter counter | |
CN209148838U (en) | Pcb board detection device | |
CN209017434U (en) | A kind of accurate planting component suitable for mechanical flatly moving type seeding apparatus | |
CN106352752A (en) | Automatic detection device of no-go gauge | |
CN203919034U (en) | Intermediate zone measurement mechanism in drill pipe body upset end | |
CN103871915B (en) | Manually BGA ball attachment machine | |
CN206291805U (en) | Only drift automatic detection device | |
CN205657043U (en) | Two point gum machines construct | |
CN209356625U (en) | A kind of silicon single crystal rod parameter automatic detection apparatus | |
CN210816620U (en) | Inner cavity cleaning device for vertical cylinder barrel cleaning machine | |
CN203610857U (en) | Scaling powder supplying mechanism of substrate ball mounter | |
CN103612045B (en) | Soldering flux supply mechanism for substrate ball mounter | |
CN105784780A (en) | Novel soil humidity detecting equipment for agricultural production | |
CN208047167U (en) | A kind of high-speed paster mechanism | |
CN205720133U (en) | A kind of Multi probe moisture content detection device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Ball-planting device of semiconductor packaging equipment Effective date of registration: 20120629 Granted publication date: 20110209 Pledgee: Pudong Development Bank of Minhang Shanghai branch Pledgor: Shanghai Weisong Industry Automation Co., Ltd. Registration number: 2012990000338 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20140219 Granted publication date: 20110209 Pledgee: Pudong Development Bank of Minhang Shanghai branch Pledgor: Shanghai Weisong Industry Automation Co., Ltd. Registration number: 2012990000338 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Ball-planting device of semiconductor packaging equipment Effective date of registration: 20140219 Granted publication date: 20110209 Pledgee: Pudong Development Bank of Minhang Shanghai branch Pledgor: Shanghai Weisong Industry Automation Co., Ltd. Registration number: 2014990000108 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20150407 Granted publication date: 20110209 Pledgee: Pudong Development Bank of Minhang Shanghai branch Pledgor: Shanghai Weisong Industry Automation Co., Ltd. Registration number: 2014990000108 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
CB03 | Change of inventor or designer information |
Inventor after: Tang Xiaoshu Inventor after: Cai Tianshou Inventor after: Cai Huakun Inventor before: Xu Guangyu |
|
COR | Change of bibliographic data | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160622 Address after: 361100 Fujian province Xiamen city Xiangan district town house in Road No. 594 fourth floor Patentee after: Xiamen atom Electronic Technology Co., Ltd. Address before: 201114 Shanghai city Minhang District new Chun Road 188, 15-102 Patentee before: Shanghai Weisong Industry Automation Co., Ltd. |