CN101598315B - Illumination device and radiation structure thereof - Google Patents
Illumination device and radiation structure thereof Download PDFInfo
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- CN101598315B CN101598315B CN200810108800XA CN200810108800A CN101598315B CN 101598315 B CN101598315 B CN 101598315B CN 200810108800X A CN200810108800X A CN 200810108800XA CN 200810108800 A CN200810108800 A CN 200810108800A CN 101598315 B CN101598315 B CN 101598315B
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Abstract
The invention provides an illumination device and a radiation structure thereof. The radiation structure comprises at least one heat-conducting element and a plurality of radiation units, wherein each radiation unit comprises a conical fin structure and a plurality of protruding parts; the conical fin structure is provided with an opening and connected with the protruding parts, and a plurality of protruding parts of a radiation unit and a plurality of protruding parts of adjacent radiation units are mutually coupled to form one or more ribbon surfaces so that one end of the heat-conducting element can be attached to the ribbon surfaces, and the other end of the heat-conducting element is connected with a heat source to form the illumination device.
Description
Technical field
The present invention is about a kind of lighting device and radiator structure thereof, particularly about a kind of lighting device that combines taper radiator structure and heat conducting element.
Background technology
Mostly existing radiator production method is that modes such as aluminium extrusion, die cast metal or metal forging make, but make with said method often have that cost is too high, preponderance, making are difficult for, volume is excessive, free convection efficient difference or the like shortcoming.Based on above problem; Another kind is designed to utilize mechanical press to make the radiator of fin stack manner; But being all, major part utilize the fin of plane formula to pile up; The radiator of this kind mode is subject to its shape, so that the direction of air current flow must be parallel with the fin stacking direction, can't reach the design of multi-direction Natural Heat Convection.
Summary of the invention
Because above-mentioned problem, the object of the invention is for providing a kind of lighting device and radiator structure thereof.
Edge is, for reaching above-mentioned purpose, and a kind of radiator structure of the present invention, it comprises at least one heat conducting element and a plurality of heat-sink unit, respectively this heat-sink unit comprises a taper fin structure, has a perforate; And a plurality of protuberances; Be connected in this taper fin structure; Wherein a plurality of protuberances of a plurality of protuberances of this heat-sink unit and adjacent heat-sink unit are coupled each other and form one or more banded plane; End for this heat conducting element is fitted on it, and the perforate of these a plurality of heat-sink units is contacted each other and formed a gas channel.
This heat conducting element directly connects a thermal source, or connects a carrier, and this carrier has a plane supplying heat source and fits on it.That the cross section of this heat conducting element can be is square, circular, oval, rectangle or polygon, and inside can be solid or hollow, and it is preferably a heat pipe or a heat conductive rod, and this heat conducting element and this carrier are that a metal or nonmetallic high heat conducting material are made.
These a plurality of heat-sink unit stack are synthesized a beveled structure; This beveled structure has a nose and a recessed end; This thermal source can cooperate heat conducting element to be arranged at the nose or the recessed end of beveled structure; This radiator structure has a fan in addition, and this fan and thermal source are arranged at the two ends of beveled structure respectively, and the gas channel that perforate was concatenated into that fan sees through heat-sink unit is sent to thermal source with air-flow.
This heat-sink unit utilizes the moulding of metal stamping mode, is preferably the umbellate form ramp structure or an asymmetry cone of one jiao of centrum or cone.
This protuberance has a buckling piece, for location and winding.The surface of this protuberance has a hole, flow to quicken thermal current, but having or not of this buckling piece and hole can be decided according to actual needs.This protuberance is preferably a stepped or plane folding pin.These a plurality of protuberances are disposed at the periphery of this taper fin structure with symmetry or asymmetric manner.
The surface of this heat-sink unit is through physics or chemical treatment, and to increase thermoradiation efficiency, for example the surface of this heat-sink unit is through anode treatment, or plates the material of a high-heating radiation rate on its surface.The surface of this heat-sink unit also can have a micro-structural.
This heat-sink unit also comprises a plurality of holes.This taper fin structure is combined by a plurality of fin, or is made up of single annular fin.
This thermal source is a light emitting diode (LED), laser diode or organic electric exciting light-emitting diode (OLED) or semiconductor thermal source.
For reaching above-mentioned purpose, the present invention provides a kind of lighting device, and it comprises a heat conducting element; And a beveled structure, it is formed by one or more heat-sink unit institute stacked combination, and this heat-sink unit comprises a taper fin structure, has a perforate; And a plurality of protuberances that are connected in this taper fin structure, an end of this heat conducting element is arranged on the formed plane of protuberance; And a thermal source, connect this heat conducting element.
Wherein this thermal source directly connects this heat conducting element, or connects a carrier, and this carrier has a plane supplying heat source fits on it, and carrier is connected with heat conducting element.This beveled structure has a nose and a recessed end; This thermal source can cooperate heat conducting element to be arranged at the nose or the recessed end of beveled structure; This radiator structure has a fan in addition; This fan and thermal source are arranged at the two ends of beveled structure respectively, and fan is sent to thermal source through the gas channel that perforate was concatenated into of heat-sink unit with air-flow.
Wherein this thermal source can be one or more light-emitting component and forms, and this light-emitting component is a light emitting diode (LED), laser diode or organic electric exciting light-emitting diode (OLED) or semiconductor thermal source.
This lighting device also comprises a translucent cover, is arranged at outside this radiator structure and this thermal source, and this translucent cover has one or more hole, but having or not of this hole can be decided according to actual needs.
This lighting device also comprises a fixed structure, and is fixing on it for this radiator structure.This fixed structure is made up of one first fixture and one second fixture.
This lighting device also comprises an electronic component, is arranged at this first fixture and makes up in the formed accommodation space with this second fixture.Certainly, if thermal source does not then need this electronic component for exchanging the light emitting diode of energising.This first fixture has a plurality of holes, but having or not of this hole can be decided according to actual needs.
This lighting device also comprises a power connection, and this power connection can be the power connection of E10/E11, E26/E27 or E39/E40.
Description of drawings
Figure 1A and the stereogram of Figure 1B for the heat-sink unit of different aspects in the radiator structure of the present invention.
Fig. 2 A and the vertical view of Fig. 2 B for the heat-sink unit of another kind of different aspects in the radiator structure of the present invention.
Fig. 3 is a plurality of beveled structure stereograms that heat-sink unit combined shown in Figure 1A.
Fig. 4 A and Fig. 4 B are the different aspect sketch mapes of a plurality of folding pin stacked combination of beveled structure shown in Figure 3.
Fig. 5 A and Fig. 5 B are respectively the stereogram of the different heat sources compound mode of radiator structure of the present invention.
Fig. 6 A to Fig. 6 D is respectively the vertical view that radiator structure of the present invention comprises different number heat conducting elements.
Fig. 7 comprises the stereogram of carrier for radiator structure of the present invention.
Fig. 8 A and Fig. 8 C are respectively the sketch map of the different combination of fans modes of radiator structure of the present invention.
Fig. 8 B is the sketch map of Fig. 8 A and the air current flow of the different combination of fans modes of the radiator structure of the present invention shown in Fig. 8 C with Fig. 8 D.
Fig. 9 A and Fig. 9 B be respectively lighting device of the present invention before combination with the combination after stereogram.
Figure 10 A is the sketch map of the air current flow when upright placement of the lighting device of the present invention shown in Fig. 9 A and Fig. 9 B.
Figure 10 B is the sketch map of the air current flow when standing upside down placement of the lighting device of the present invention shown in Fig. 9 A and Fig. 9 B.
Figure 10 C is the sketch map of the lighting device of the present invention air current flow when horizontal positioned shown in Fig. 9 A and Fig. 9 B.
The main element symbol description
1: beveled structure 11: the taper fin structure
12: perforate 13: protuberance
14: holes 131: buckling piece
132,911,9211: hole 51: heat conducting element
52: thermal source 71: carrier
81: fan 91: translucent cover
920: 921: the first fixtures of accommodation space
Fixture 93 in 922: the second: electronic component
94: power connection P: gas channel
A: plane
The specific embodiment
To explain according to the preferred embodiments of the present invention that below wherein components identical will be explained with identical reference marks with reference to relevant drawings.
Radiator structure of the present invention can supply the stereochemical structure fin type heat-sink unit of multi-direction airflow convection to combine by at least one; And the heat conducting element of combination high thermal conductivity; This heat-sink unit utilizes the moulding of metal stamping mode, can select for use material different and thickness to be shaped according to various conditions.This heat-sink unit comprises a taper fin structure 11, has a perforate 12; And a plurality of protuberances 13 are connected to the periphery of this taper fin structure 11.This heat-sink unit can be the umbellate form ramp structure of angle centrum or cone, shown in Figure 1A and Figure 1B.This heat-sink unit also can be the asymmetry cone, shown in Fig. 2 A and Fig. 2 B.
In the heat-sink unit shown in Figure 1A; The both sides of this protuberance 13 respectively have a buckling piece 131, and this protuberance 13 is the folding pin of stepped (difference in height is promptly arranged), and its surface has a hole 132; Can quicken thermal current and flow, but buckling piece and hole can be not essential according to actual needs.In addition, this folding pin can become symmetry or asymmetrical structure according to the Demand Design of using, as forms 2 folding pin, 3 folding pin or 6 multiaspect folding pin such as folding pin.The function of this folding pin connects the heat conducting element of thermal source for attaching, and the heat of utilizing the heat conducting characteristic of metal that thermal source is produced is delivered to the radiating surface of taper rapidly.And be merely a stepped folding pin in the protuberance 13 of the heat-sink unit shown in Figure 1B.
In addition, this heat-sink unit surface also can increase surface treatment and micro-structural.This micro-structural usable surface physics or chemical treatment mode are made, and for example anode treatment or surface plate the material of high-heating radiation rate, except increasing the area of dissipation, also can increase thermoradiation efficiency.
In addition, the surface of this heat-sink unit also can increase a plurality of holes 14, shown in Figure 1A, except that can increasing the area of dissipation, but and air-guiding flow to the perforate of central authorities.This taper fin structure 11 can be combined by a plurality of fin, shown in Figure 1A; Or constitute by single annular fin, shown in Figure 1B.
If with after the heat-sink unit stacked combination shown in a plurality of Figure 1A, can form the beveled structure 1 of chimney-like as shown in Figure 3.When piling up, the folding pin is formation one plane A adjacent to each other up and down, and shown in Fig. 4 A or Fig. 4 B, this plane can be used as the plane that supplies heat conducting element to fit, and also is heat conducting path.This folding pin can be designed to difference in height or stair-stepping folding pin, and this difference in height can be held another folding pin, shown in Fig. 4 A.The folding pin also can be simple plane, shown in Fig. 4 B.This folding pin also can be designed to have the buckling piece 131 of location and winding function, and is as shown in Figure 3, makes a plurality of heat-sink units when piling up, can locate mutually and snap together.
After a plurality of heat-sink units combine are formed combining structure according to said method, form the gas channel P of central authorities at the perforate polyphone of a plurality of heat-sink units, as shown in Figure 3.And two adjacent taper fin structures 11 between can form the gap, air feed stream passes through.Therefore, cold air will flow through the surface of heat-sink unit and thermal source will be taken away.This gas channel P is owing to the characteristic of structure, and the air that will speed up thermal convection current flows through the conicoid of heat-sink unit.
Other sees also Fig. 5 A and Fig. 5 B, and the beveled structure 1 that a plurality of heat-sink unit stacked combination form is by piling up time folding pin formation adjacent to each other plane up and down.A plurality of tool N edge break pin can form a plurality of banded planes; Can a plurality of heat conducting elements 51 be attached at respectively on formed each the banded plane of folding pin; And the other end of heat conducting element 51 connects thermal source 52; Wherein this thermal source 52 can directly be attached at this heat conducting element 51, or is connected in this heat conducting element 51 by a carrier platform.In addition, beveled structure 1 has a nose and a recessed end, and thermal source 52 can cooperate heat conducting element 51 to be arranged at the nose (shown in Fig. 5 A) or the recessed end (shown in Fig. 5 B) of beveled structure 1.This thermal source 52 can be the semiconductor thermal source; Like light emitting diode (LED), laser diode or organic electric exciting light-emitting diode (OLED); That the cross section of this heat conducting element 51 can be is square, circular, oval, rectangle or polygon; Inside can be solid or hollow, and it is preferably a heat pipe or a heat conductive rod.And the number of heat conducting element 51 must not be two; Seeing also 6A schemes to scheme to 6D; Show the vertical view of the different number heat conducting elements of radiator structure of the present invention, heat conducting element 51 can be designed to a plurality of, and the number of its number looks the actual product structure fully or function need and be decided.
See also Fig. 7; Radiator structure of the present invention can comprise a carrier 71; This carrier 71 has a plane supplying heat source 52 fits on it, and the beveled structure 1 that heat conducting element 51 is stacked in order to connection carrier 71 and heat-sink unit, heat conducting element 51 be metal with carrier 71 or nonmetallic high heat conducting material made; Can the heat that thermal source 52 is produced be conducted to heat-sink unit fast, dispel the heat via taper fin structure 11 surfaces again.
In addition, radiator structure of the present invention also can comprise a fan, sees also Fig. 8 A and Fig. 8 B; This radiator structure comprises a beveled structure 1, a plurality of heat conducting element 51 and a fan 81, and Fig. 8 B is the sketch map of the air current flow of Fig. 8 A, and its fan 81 and thermal source 52 are arranged at the two ends of beveled structure 1 respectively; Be arranged at the nose of beveled structure 1 when fan 81; And thermal source 52 is arranged at recessed end, and the air-flow that fan 81 is produced can pass the gas channel that perforate was concatenated into of heat-sink unit, dispels the heat and arrive thermal source 52; And air-flow also can pass the taper fin structure from inside to outside, takes the hot-air on surface out of radiator structure.Other sees also Fig. 8 C and Fig. 8 D; Show that fan 81 is arranged at the recessed end of beveled structure 1; And thermal source 52 is arranged at the sketch map of nose; The difference of itself and Fig. 8 A and Fig. 8 B is that the air-flow that produces except fan 81 can arrive the thermal source 52 via the central fluidizing gas passage, the entering central fluidizing gas passage that outside air-flow also can be from outside to inside, and the heat that taper fin structure surface is distributed sheds via gas channel.
Umbellate form centrum radiator structure of the present invention has bigger area of dissipation than conventional planar type radiator; The heat that thermal source produced can be passed to the radiating surface of taper by the heat conduction rapidly; Simultaneously can also multi-direction air-guiding; The physical principle of utilizing hot-air up to flow forms convection current, dissipates heat to the external world.
In addition; See also Fig. 9 A and Fig. 9 B; It is a kind of lighting device embodiment of the present invention, and it is combined by a heat conducting element 51, a beveled structure 1, a fan 81, a thermal source 52, a translucent cover 91, a fixed structure, an electronic component 93 and 94 of power connections.This thermal source 52 can be made up of one or more light-emitting component; This light-emitting component is the semiconductor thermal source; Like light emitting diode (LED), laser diode or organic electric exciting light-emitting diode (OLED); This power connection 94 can be the power connection of E10/E11 commonly used, E26/E27, E39/E40 etc., but is not limited thereto.Certainly, if thermal source 52 does not then need this electronic component 93 for exchanging the light emitting diode of energising.On this translucent cover 91, have make some around hole 911, these holes 911 can increase the air flow stream flux, effectively reduce the temperature of radiator structure, reach the effect of cooling, but having or not of this hole 911 can be decided according to actual needs.This fixed structure can be made up of one first fixture 921 and 922 of one second fixtures; This electronic component 93 can be arranged at this first fixture 921 and make up in the formed accommodation space 920 with this second fixture 922; The structure of this heat conducting element 51, fan 81, beveled structure 1 and thermal source 52 combinations can be fixed in the surface of this second fixture 922, and both can be by fastening or the equivalent way winding.This first fixture 921 also can have a plurality of holes 9211, but having or not of this hole 9211 can be decided according to actual needs.In addition, this heat conducting element can connect a carrier, and this carrier has the plane of an attaching thermal source, and in order to load thermal source, thermal source can see through carrier connection heat conducting element and dispel the heat.
When the lighting device shown in Fig. 9 B becomes when uprightly or up and down standing upside down up and down, this moment, central fluidizing gas passage P can form one similar " stack effect " effect, this effect will help to promote the effect of thermal convection current and heat radiation.See also Figure 10 A, the sketch map of its air current flow when to be that this lighting device is upright place.Cold air can pass through the hole of the translucent cover 91 and first fixture 921 earlier; Pass through the gap between the heat-sink unit again; Come together in the gas channel P of central authorities at last; Therefore air-flow can be through the conicoid of radiator structure, and will be passed to the heat of conicoid from thermal source can be simultaneously by heat conduction and the rapid dissipation of thermal convection current mode.Other sees also Figure 10 B, and the sketch map of air current flow was opposite shown in its airflow direction and Figure 10 A when it was placed for this lighting device stands upside down.When this lighting device horizontal positioned, air-flow also can be smoothly through the conicoid of radiator structure, and air-flow gets into central gas channel from the lower side of lighting device, is discharged by the upper side of lighting device, shown in Figure 10 C again.So the radiator structure in the lighting device of the present invention is applicable to the heat radiation of all directions.
Comprehensive the above, the design of lighting device of the present invention and radiator structure thereof can make air-flow flow with any direction, so placement all can be dispelled the heat in any direction.Moreover because of having the central fluidizing gas passage, this passage can form similar " stack effect " effect, to quicken the air communication mistake, the thermal current discharging is quickened.In addition, radiator structure of the present invention is by the thin sheet of metal moulding and pile up and form, and the traditional heat-dissipating device of manufacturings such as comparable crowded type, forging, die casting more significantly increases area of dissipation under identical weight, and can reduce material and use, and saves the energy and price.Moreover this radiator structure also comprises fan and heat conducting element, more can significantly promote its radiating effect.
What is more; Radiator structure of the present invention is formed by a plurality of heat-sink unit institute stacked combination with folding pin; These multiaspect folding pin a plurality of planes that formation supplying heat source up and down adjacent to each other is fitted when piling up; Make a plurality of heat conducting elements be located on this radiator structure surface,, and reach multi-direction heat loss through convection effect with the connection thermal source.
The above is merely illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the scope of the present invention its equivalent modifications of carrying out or change.
Claims (38)
1. radiator structure, it comprises:
At least one heat conducting element; And
At least one heat-sink unit,
Wherein, this heat-sink unit comprises a taper fin structure, has a perforate; And a protuberance, be connected in this taper fin structure, and a plane is provided, fit on this plane for this heat conducting element, the perforate of this heat-sink unit can form a gas channel, and
Wherein, these heat conducting elements connect a thermal source, and the synthetic beveled structure of a plurality of heat-sink unit stack, have opposite two ends, i.e. a nose and a recessed end, and this thermal source cooperates this heat conducting element to be arranged at nose or this recessed end of this beveled structure.
2. radiator structure according to claim 1, wherein this thermal source directly is attached at this heat conducting element or is connected in this heat conducting element by a carrier, and this carrier has a plane, attaches on it for this thermal source.
3. radiator structure according to claim 2, wherein this heat conducting element and this carrier are that a metal or nonmetallic high heat conducting material are made.
4. radiator structure according to claim 1, it also comprises a fan, this fan and this thermal source are arranged at the opposite end of this beveled structure respectively, and this fan through the formed gas channel of the perforate of this heat-sink unit with air-flow this thermal source that leads.
5. radiator structure according to claim 1, wherein the cross section of this heat conducting element is a circle, an oval or polygon, and this heat conducting element is solid or hollow structure.
6. radiator structure according to claim 1, wherein this heat conducting element is a heat pipe or a heat conductive rod.
7. radiator structure according to claim 1, wherein this heat-sink unit utilizes the moulding of metal stamping mode, is the umbellate form ramp structure of one jiao of centrum or cone, or an asymmetry cone.
8. radiator structure according to claim 1, wherein this protuberance has a buckling piece, for location and winding.
9. radiator structure according to claim 1, wherein this protuberance is a stepped or plane folding pin.
10. radiator structure according to claim 1, wherein the surface of this protuberance has a hole, flows to quicken thermal current.
11. radiator structure according to claim 1, wherein this protuberance is disposed at the periphery of this taper fin structure with symmetry or asymmetric manner.
12. radiator structure according to claim 1, wherein the surface of this heat-sink unit promptly, plates the material of a high-heating radiation rate or forms a micro-structural through physics or chemical treatment on its surface.
13. radiator structure according to claim 1, wherein this heat-sink unit also comprises a plurality of holes.
14. radiator structure according to claim 1, wherein this taper fin structure is combined by a plurality of fin, or is made up of single annular fin.
15. radiator structure according to claim 1 wherein forms a gap between the two adjacent taper fin structures in the synthetic beveled structure of stack, for the air communication mistake.
16. a lighting device, it comprises:
One heat conducting element;
One beveled structure, it is formed by a plurality of heat-sink unit institute stacked combination, and this heat-sink unit comprises a taper fin structure, has a perforate; And a protuberance that is connected in this taper fin structure, and an end of this heat conducting element is arranged on the formed plane of this protuberance; And
One thermal source connects this heat conducting element.
17. lighting device according to claim 16, wherein this thermal source directly is attached at this heat conducting element or is connected in this heat conducting element by a carrier, and this carrier has a plane, attaches on it for this thermal source.
18. lighting device according to claim 17, wherein this heat conducting element and this carrier are that a metal or nonmetallic high heat conducting material are made.
19. lighting device according to claim 16, wherein the cross section of this heat conducting element is a circle, an oval or polygon, and this heat conducting element is solid or hollow structure.
20. lighting device according to claim 16, wherein this heat conducting element is a heat pipe or a heat conductive rod.
21. lighting device according to claim 16, wherein this beveled structure has opposite two ends, that is, a nose and a recessed end, this thermal source cooperate this heat conducting element to be arranged at nose or this recessed end of this beveled structure.
22. lighting device according to claim 21, it also comprises a fan, and this fan and this thermal source are arranged at the opposite end of this beveled structure respectively, and this fan through the formed gas channel of the perforate of this heat-sink unit with air-flow this thermal source that leads.
23. lighting device according to claim 16, wherein this thermal source is formed by one or more light-emitting component, and this light-emitting component is a light emitting diode (LED), laser diode or organic electric exciting light-emitting diode (OLED) or semiconductor thermal source.
24. lighting device according to claim 16, it also comprises a translucent cover, is arranged at outside this heat-sink unit and this thermal source.
25. according to claim 16 or 24 described lighting devices, it also comprises a fixed structure, and is fixing on it for this heat-sink unit.
26. lighting device according to claim 25, wherein this fixed structure is made up of one first fixture and one second fixture, and is provided with an electronic component in this first fixture and the formed accommodation space of this second fixture.
27. lighting device according to claim 25, wherein this fixed structure has one or more hole respectively with this translucent cover.
28. lighting device according to claim 16, it also comprises a power connection.
29. lighting device according to claim 28, wherein this power connection is the power connection of E10/E11, E26/E27 or E39/E40.
30. lighting device according to claim 16, wherein this heat-sink unit utilizes the moulding of metal stamping mode, is the umbellate form ramp structure of one jiao of centrum or cone, or an asymmetry cone.
31. lighting device according to claim 16, wherein this protuberance has a buckling piece, for location and winding.
32. lighting device according to claim 16, wherein this protuberance is a stepped or plane folding pin.
33. lighting device according to claim 16, wherein the surface of this protuberance has a hole, flows to quicken thermal current.
34. lighting device according to claim 16, wherein this protuberance is disposed at the periphery of this taper fin structure with symmetry or asymmetric manner.
35. lighting device according to claim 16, wherein the surface of this heat-sink unit promptly, plates the material of a high-heating radiation rate or forms a micro-structural through physics or chemical treatment on its surface.
36. lighting device according to claim 16, wherein this heat-sink unit also comprises a plurality of holes.
37. lighting device according to claim 16, wherein this taper fin structure is combined by a plurality of fin, or is made up of single annular fin.
38. lighting device according to claim 16 wherein forms a gap, for the air communication mistake between two adjacent these taper fin structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810108800XA CN101598315B (en) | 2008-06-02 | 2008-06-02 | Illumination device and radiation structure thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810108800XA CN101598315B (en) | 2008-06-02 | 2008-06-02 | Illumination device and radiation structure thereof |
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| Publication Number | Publication Date |
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| CN101598315A CN101598315A (en) | 2009-12-09 |
| CN101598315B true CN101598315B (en) | 2012-05-30 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102141235B (en) * | 2010-02-01 | 2012-09-05 | 中国科学院理化技术研究所 | High-power LED light source |
| CN102098903B (en) * | 2010-12-11 | 2013-07-03 | 四川飞碟光电科技有限公司 | Efficient heat radiating device |
| CN107726273B (en) * | 2017-09-26 | 2019-09-13 | 东莞市闻誉实业有限公司 | Luminous lighting external member |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2644878Y (en) * | 2003-08-14 | 2004-09-29 | 葛世潮 | Light emitting diode |
| CN1985125A (en) * | 2004-04-02 | 2007-06-20 | 马丁专业股份有限公司 | Light source module |
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2008
- 2008-06-02 CN CN200810108800XA patent/CN101598315B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2644878Y (en) * | 2003-08-14 | 2004-09-29 | 葛世潮 | Light emitting diode |
| CN1985125A (en) * | 2004-04-02 | 2007-06-20 | 马丁专业股份有限公司 | Light source module |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2006-308775A 2006.11.09 |
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| CN101598315A (en) | 2009-12-09 |
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