CN101597135A - Laser cutting method of alkali-free glass rectangular plates - Google Patents
Laser cutting method of alkali-free glass rectangular plates Download PDFInfo
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- CN101597135A CN101597135A CNA2008100384203A CN200810038420A CN101597135A CN 101597135 A CN101597135 A CN 101597135A CN A2008100384203 A CNA2008100384203 A CN A2008100384203A CN 200810038420 A CN200810038420 A CN 200810038420A CN 101597135 A CN101597135 A CN 101597135A
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Abstract
The invention discloses a kind of laser cutting method of alkali-free glass rectangular plates, characteristics are, the initial crackle that brings out by machinery at first, utilize the laser beam of given power density and the pressure of following cooling point to move on non-alkali glass plate surface and form precut for the first time, on the precut line, adopt the laser beam of new power density then and follow the direct cut-out of cooling point motion formation glass substrate along path in advance.The invention has the beneficial effects as follows: the guiding crackle that cutting for the first time produces only acts on the glass substrate upper surface, and thickness direction does not have stress influence.The direct cut-out of glass that cutting for the second time produces mainly occurs in the thickness of glass substrate direction, though on section, still can produce " quenching " effect, but because the existence of the guiding crackle that cutting for the first time produces can destroy this " quenching " effect to a certain extent, thereby can be with good yield rate according to predetermined size cutting rectangular plate.Can satisfy the new demand of LCD production to laser cutting.
Description
Technical field
The present invention relates to a kind of non-alkali glass rectangular substrate laser cutting method, is applicable to the new manufacture craft requirement of LCD (liquid-crystal display), belongs to technical field of laser processing.
Background technology
At present, traditional glass-cutting substrate method is to adopt the cut mechanically mode of diamond wheel sheet or Wimet wheel line cutting.This method is to rule at glass surface with Knife flywheel blade earlier, again by the mode of mechanical stress with the glass disjunction.This method cutting inevitably can produce chip at glass surface, needs to increase flow processs such as cleaning, polishing, owing to be the mechanical type contact can produce irregularity on cutting section and seamed edge fracture, cross section quality is poor simultaneously.In addition, in the substrate surface matting, small particle bits also may cause the damage to the glass surface apparent mass, adopt this method cutting, the yield rate of alkali-free glass substrate only four, fifty percent.
After this, in order to substitute mechanical system, in European patent No.82301675.3, the molten disconnected mode of laser has been carried.This method is meant that material surface begins to dissolve when the finished surface temperature surpasses the annealing temperature of material.And utilize the laser blown ability preferably characteristics material is directly cut off.Though the disconnected method of this hot melt is the noncontact cutting, but can be on cutting section residual have a ripple sample material, and cross section quality is bad, also can dissolve material and can produce unrelieved stress the inboard residual of cut surface, still need clean after the cutting, flow process such as polishing, cutting effect is not good.
In order to solve the problem that above processing mode exists, United States Patent (USP) (US5209284) proposes the control fracture laser cutting mode based on the thermal stresses principle.But this method is to utilize the good focusing of laser, good power controlled and beam shaping very easily, produces thermal stresses and combines with exterior cooling thereby carry out local heating, brings out the rupture strength that cold and hot stress effect surpasses glass material.This method has been proved to be effectively and has obtained implementing at present.
But this method inevitably can produce cold and hot stress effect on the non-alkali glass surface, makes the glass cutting section produce similar " quenching " effect, and the intensity of cutting section can increase greatly.When the cutting rectangular plate, on four summits of rectangular plate (promptly cutting the point of crossing), can produce burr and crackle even chipping, thereby reduce the yield rate of rectangular plate like this.
For addressing this is that, Japanese Patent JP215760 proposes a kind of turn-over cutting method, promptly after certain direction of rectangular plate adopts laser cutting with the glass substrate turn-over, carry out the cutting of other direction at the back side of glass substrate, this method has been lost cutting efficiency, and has increased the breakage rate of alkali-free glass substrate.
The new manufacture craft of the application LCD (liquid-crystal display) of non-alkali glass has also proposed requirements at the higher level to laser cutting.The liquid crystal injection mode of traditional LC D is with the capillary principle liquid crystal slowly to be sucked after last lower-glass is to group, and the shortcoming of this filling liquid crystal method is very consuming time and the waste liquid crystal.And the new formula of dripping liquid crystal inject rule be earlier liquid crystal is directly dropped on glass, and then go up lower-glass to organizing.Liquid crystal injects the change of processing procedure, also make the panel processing procedure and then change, the cutting process of glass substrate wherein, do not inject the space base plate of liquid crystal from cutting earlier originally, cutting again after becoming liquid crystal and having filled, substrate overturn can cause the brightness and the color non-uniform phenomenon in liquid crystal gap like this, and the probability that improves the substrate breakage.
Summary of the invention
The objective of the invention is to cut into rectangular plate by predetermined size in order be under the prerequisite of the alkali-free glass substrate that do not overturn liquid crystal to be filled the double glazing substrate box that finish.
Technical scheme of the present invention is, a kind of laser cutting method of alkali-free glass rectangular plates is characterized in, it mainly is divided into cutting process twice laser cutting:
Cutting is the initial crackle that brings out by machinery for the first time, utilize the laser beam of given power density and the pressure of following cooling point to move on non-alkali glass plate surface and form the precut that does not cut off glass substrate along path in advance, form the guiding crackle of thickness of glass substrate 1/7 to 1/10 degree of depth at glass baseplate surface, this precut does not cut off glass substrate, be the guiding crackle that forms certain depth at glass baseplate surface, the guiding crack depth that this cutting forms is by laser facula thermal pressure that produces and the pulling force acting in conjunction of forcing the cooling point to produce.The crackle of Chan Shenging is intravitreous stress cracking like this, can not produce chip and breach.
Cutting for the second time is to utilize the cold-thermal effect of coupling to change 4% or the laser beam of more power density and follow the motion of cooling point on the guiding fault line that the first time, precut produced, the final direct cut-out that forms glass substrate, cutting for the second time is expanding on the thickness of glass substrate direction of cutting for the first time, be Vitrea stress cracking, can not produce chip and breach, cross section quality is good.
The described initial crackle that brings out by machinery is the crackle that adopts a kind of hard metal cutting steamboat contact delineation generation＜1mm on the glass baseplate surface in predetermined position or seamed edge, and laser cutting promptly is that controlled this initial crackle of guiding produces controlled fracture in essence.
The laser beam of described given power density is meant that the laser spot size and the laser apparatus that produce at beam shaping provide power, and laser facula is thin oval, and laser apparatus adopts CO
2Laser apparatus.
Described pressure cooling point is meant that the mixed gas that adopts under the certain pressure such as air or nitrogen are injected in the cooling point on the glass baseplate surface at laser facula rear portion by blowpipe.
Described path in advance is meant for large format non-alkali glass plate being cut into the predetermined cuts line of little rectangular plate.
This cutting method provided by the invention, the guiding crackle that produces in cutting for the first time can produce the precut effect on the XY twocouese, especially produce path and guiding crackle in advance on four summits of rectangular plate (promptly cutting the point of crossing).The crackle that this method produces is Vitrea fracture naturally, is seamless crackle, does not descend so can not form the section curved incline and the dimensional precision that occur when general laser means is cut the point of crossing.
General laser means is on the point of crossing of horizontal laser light path and vertical laser path, because burr and breach can appear in the section Strength Changes that " quenching " effect causes.And employing the inventive method can prevent from horizontal resection and vertically cut to crack and burr on the point of crossing, thereby finishes the predetermined size cutting." quenching " effect here is meant that object cools off the intensity that causes fast and increases after heating.Vitreum be heated but after not reaching fusing point fast cooling can cause hardness and intensity significantly to increase.
The invention has the beneficial effects as follows: the guiding crackle that cutting for the first time produces substantially only acts on the glass substrate upper surface, does not have stress influence in the thickness of glass substrate direction.The direct cut-out of glass that cutting for the second time produces mainly occurs in the thickness of glass substrate direction, though on section, still can produce " quenching " effect, but because the existence of the guiding crackle that cutting for the first time produces can destroy this " quenching " effect to a certain extent, thereby can be with good yield rate according to predetermined size cutting rectangular plate.Therefore, according to the present invention, can satisfy the new demand of LCD production, and can improve the quality in glass substrate laser cutting point of crossing to a certain extent laser cutting.
Description of drawings
Fig. 1 is for cutting into a large format alkali-free glass substrate in the synoptic diagram of polylith rectangular plate;
Fig. 2 is a laser facula and a pressure cooling point synoptic diagram;
Fig. 3 is the synoptic diagram that cutting for the first time produces the guiding crackle;
Fig. 4 is guiding crackle sectional schematic diagram;
Fig. 5 is the synoptic diagram that laterally vertically cuts the point of crossing.
Embodiment
Fig. 1 is for cutting into a large format alkali-free glass substrate in the synoptic diagram of polylith rectangular plate, and the large format alkali-free glass substrate is by laser facula shown in Figure 2 and forces the cooling point to finish cutting twice.X1, X2 etc. are horizontal direction among Fig. 1, and Y1, Y2 etc. is a longitudinal direction; Q is a laser facula among Fig. 2, and H is for forcing the cooling point, and BC is the guiding crackle, and b is a laser ellipse light spot major axis, and a is a laser ellipse light spot minor axis, and x is a cut direction.
Fig. 3 is the synoptic diagram that cutting for the first time produces the guiding crackle, and wherein 1A is meant the alkali-free glass substrate upper surface, and 1B is a lower surface, and 3A, 3B refer to the horizontal and vertical cutting section of rectangular plate respectively.2A, 2B are meant the guiding crackle of generation, and d1, d2 are meant the guiding crack depth that cutting for the first time produces.Fig. 4 is a guiding crackle sectional schematic diagram, and the guiding crack depth of cutting generation for the first time is 1/7 to 1/10 of a thickness of glass substrate usually.
Fig. 5 is the synoptic diagram that laterally vertically cuts the point of crossing.A is the point of crossing.11,12 represented burr that can occur for general laser cutting method and sections are not put in order.13,14 represented point of crossing design sketchs for adopting the present invention to realize
The laser cutting method of cutting alkali-free glass substrate is described below:
At first, according to X, Y dotted line direction among Fig. 1, carry out laser radiation and force to cool off the big plate 10 of cutting non-alkali glass with laser facula shown in Fig. 2 and pressure cooling point, producing as Fig. 3, the degree of depth shown in Figure 2 is d1, the guiding crackle BC of d2, thereby finish the cutting first time of the present invention, form 2 tiny crack as shown in Figure 4 on big plate surface.
Then, the XY path direction according to Fig. 1 carries out the cutting second time.This cutting path overlaps with cutting for the first time, at thickness of glass substrate, promptly forms the cutting section of 3A3B among Fig. 3 under the influence of the guiding crackle BC that cutting for the first time produces.Locate section shown among Fig. 5 13,14 by the transverse and longitudinal point of crossing that the inventive method forms.
Claims (5)
1. a laser cutting method of alkali-free glass rectangular plates is characterized in that, it mainly is divided into cutting process twice laser cutting:
Cutting is the initial crackle that brings out by machinery for the first time, utilize the laser beam of given power density and the pressure of following cooling point to move on non-alkali glass plate surface and form the precut that does not cut off glass substrate, form the guiding crackle of thickness of glass substrate 1/7 to 1/10 degree of depth at glass baseplate surface along path in advance;
Cutting for the second time is to utilize the cold-thermal effect of coupling to change 4% or the laser beam of more power density and follow the motion of cooling point on the guiding fault line that the first time, precut produced, be on the thickness of glass substrate direction, expanding of cutting for the first time, finally form the direct cut-out of glass substrate.
2. laser cutting method of alkali-free glass rectangular plates according to claim 1, it is characterized in that the described initial crackle that brings out by machinery is the crackle that adopts a kind of hard metal cutting steamboat contact delineation generation＜1mm on the glass baseplate surface in predetermined position or seamed edge.
3. laser cutting method of alkali-free glass rectangular plates according to claim 1, it is characterized in that, the laser beam of described given power density is meant that the laser spot size and the laser apparatus that produce at beam shaping provide power, and laser facula is thin oval, and laser apparatus adopts CO
2Laser apparatus.
4. laser cutting method of alkali-free glass rectangular plates according to claim 1, it is characterized in that described pressure cooling point is meant that the mixed gas that adopts under the certain pressure such as air or nitrogen are injected in the cooling point on the glass baseplate surface at laser facula rear portion by blowpipe.
5. laser cutting method of alkali-free glass rectangular plates according to claim 1 is characterized in that, described path in advance is meant for large format non-alkali glass plate being cut into the predetermined cuts line of little rectangular plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100384203A CN101597135A (en) | 2008-06-02 | 2008-06-02 | Laser cutting method of alkali-free glass rectangular plates |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100384203A CN101597135A (en) | 2008-06-02 | 2008-06-02 | Laser cutting method of alkali-free glass rectangular plates |
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| CN101597135A true CN101597135A (en) | 2009-12-09 |
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| CNA2008100384203A Pending CN101597135A (en) | 2008-06-02 | 2008-06-02 | Laser cutting method of alkali-free glass rectangular plates |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102898013A (en) * | 2012-09-07 | 2013-01-30 | 东莞光谷茂和激光技术有限公司 | Method for cutting glass substrate by using ultraviolet laser |
| CN104551413A (en) * | 2013-10-23 | 2015-04-29 | 北大方正集团有限公司 | Method for forming conductive films |
| CN104736489A (en) * | 2012-06-05 | 2015-06-24 | 康宁股份有限公司 | Methods of cutting glass using a laser |
-
2008
- 2008-06-02 CN CNA2008100384203A patent/CN101597135A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104736489A (en) * | 2012-06-05 | 2015-06-24 | 康宁股份有限公司 | Methods of cutting glass using a laser |
| CN104736489B (en) * | 2012-06-05 | 2017-11-28 | 康宁股份有限公司 | Use the method for cutting glass by laser |
| US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| CN102898013A (en) * | 2012-09-07 | 2013-01-30 | 东莞光谷茂和激光技术有限公司 | Method for cutting glass substrate by using ultraviolet laser |
| CN104551413A (en) * | 2013-10-23 | 2015-04-29 | 北大方正集团有限公司 | Method for forming conductive films |
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Open date: 20091209 |