CN101590775A - Surface treatment method of plastic components - Google Patents
Surface treatment method of plastic components Download PDFInfo
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- CN101590775A CN101590775A CNA2008101107443A CN200810110744A CN101590775A CN 101590775 A CN101590775 A CN 101590775A CN A2008101107443 A CNA2008101107443 A CN A2008101107443A CN 200810110744 A CN200810110744 A CN 200810110744A CN 101590775 A CN101590775 A CN 101590775A
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- plastic components
- etching solution
- surface treatment
- treatment method
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Abstract
The present invention relates to a kind of surface treatment method of plastic components, this method comprises: an ink discharge device is provided, contains etching solution in this ink discharge device; Utilize this ink discharge device that this etching solution is sprayed at the plastic components face according to predetermined pattern, to form predetermined pattern in this plastic components face.
Description
Technical field
The present invention relates to a kind of method of utilizing ink-jet printing process that the plastic components face is handled.
Background technology
Generally adopt serigraphy (to see also document: yellow day Pu, wire mark industry, serigraphy, 2000 02 phases, page or leaf: 36-38 to the processing of plastic components face.) with method such as transfer printing.
So-called serigraphy belongs to the porous printing class, and its half tone is netted, and the space of a whole page forms through hole and entity two parts, and the printing ink during printing on the half tone is bitten on various stocks in the throughhole portions from the space of a whole page under the extruding of sdueegee, and the formation pattern.
So-called bat printing is a method of the pattern of required printing being utilized the plate-making of taking pictures earlier, the steel version made intaglio plate prints a transfer printing on printed material via special silica gel again, and can be according to the material difference of product, the printing ink that modulation is special-purpose is so that quality is guaranteed.The flow process of bat printing comprises: 1. by hairbrush printing ink is evenly covered on the steel version; 2. by the wiping steel knife unnecessary printing ink is struck off; 3. dropping to the steel version by the seal head has been stained with the printing ink in the pattern; 4. dropping to product by seal head displacement unit covers pattern.
But, more than two kinds of printing processes in the accurate contraposition of needs, in the high printing of printed dimensions required precision, then be difficult to reach the requirement of precision.The bat printing tube of half tone of this serigraphy and transfer printing needs regularly to change for using consumptive material, the waste cost of manufacture.In addition, the pattern that forms difference on the surface of plastic cement element needs the half tone and the steel version of difference, can't realize printing at random.
Summary of the invention
In view of this, be necessary to provide a kind of method of utilizing ink-jet printing process that the plastic components face is handled.
A kind of surface treatment method of plastic components, this method comprises:
One ink discharge device is provided, contains etching solution in this ink discharge device;
Utilize this ink discharge device that this etching solution is sprayed at the plastic components face according to predetermined pattern;
Remove the etching solution of this plastic components face, to form predetermined pattern in this plastic components face.
Compared to prior art, the described method of utilizing ink-jet printing process that the plastic components face is handled, owing to adopt ink discharge device, can spray etching solution according to predetermined pattern at the plastic components face by this ink discharge device, via the etching action of etching solution to this plastic cement element, form predetermined pattern on the surface of this plastic cement element, need not to change ink discharge device and can form different patterns in the surface of plastic cement element, can realize printing at random.In addition, the ink gun of this ink discharge device can be with respect to the accurate contraposition of plastic cement element, so, can form pattern accurately in the plastic components face.Further, the ink gun of this ink discharge device has erosion-resisting effect to this etching solution, so, need not to change often ink gun, production process is simple, and cost of manufacture is lower.
Description of drawings
The flow chart that utilizes the method that ink-jet printing process handles the plastic components face that Fig. 1 provides for the embodiment of the invention.
The specific embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
See also Fig. 1, be the method for utilizing ink-jet printing process that the plastic components face is handled that the embodiment of the invention provides, this method may further comprise the steps:
The first step: this plastic components face is carried out preliminary treatment, be attached to the dirty of this plastic components face to remove.In the present embodiment, the material of this plastic cement element is a Merlon, is not limited to present embodiment, and the material of this plastic cement element also can be lucite.This plastic components face is carried out preliminary treatment can pass through methods such as cleaning, microetch, to remove the dirt that is attached to this plastic components face, oxide, grease etc.
Second step a: ink discharge device is provided, contains etching solution in this ink discharge device.
In this step, the etching solution that a piezoelectric ink jet printing equipment is provided and is contained in this inkjet-printing device.This etching solution generally uses organic solution.In the present embodiment, this etching solution is the mixed solvent of cyclohexanone and diethylene glycol-butyl ether acetic acid esters, and the weight ratio of this cyclohexanone and diethylene glycol-butyl ether acetic acid esters is 1: 4.Adopt this kind solvent etching speed very fast, and etching is more even.
In addition, be not limited to present embodiment, this etching solution also can be diethylene glycol, 2-methyl isophthalic acid, and is at least a in ammediol, 1-Methoxy-2-propyl acetate, cyclohexanone, diethylene glycol butyl ether, diethylene glycol-butyl ether acetic acid esters and the methoxyl group triethylene glycol.
The 3rd step: utilize this ink discharge device that this etching solution is sprayed at the plastic components face according to predetermined pattern, to form predetermined pattern in this plastic components face.
This inkjet-printing device is sprayed onto this plastic components face with etching solution from the nozzle pointwise according to predetermined pattern under the control of controller.By this predetermined pattern, to what and spray time of the etching solution of this plastic components face spraying by this controller control.This etching solution that is sprayed at the plastic components face produces etching action to this plastic cement element, forms predetermined pattern in the surface of this plastic cement element behind etching action.
The 4th step: the etching solution of removing this plastic components face.
Concrete, this plastic cement element that is coated with etching solution is heated to 60 ℃ to 100 ℃, preferably about 80 ℃, make the etching solution volatilization that is sprayed at this plastic cement element, form predetermined pattern on the surface of this plastic cement element.In addition, be not limited to present embodiment, also can adopt the method for cleaning that the etching solution of this plastic components face is removed, can adopt different solvents to clean for different etching solutions.
The method that present embodiment utilizes ink-jet printing process that the plastic components face is handled, owing to adopt ink discharge device, controller by this ink discharge device can spray etching solution according to predetermined pattern at the plastic components face, via the etching action of etching solution to this plastic cement element, form predetermined pattern on the surface of this plastic cement element, need not to change ink discharge device and can form different patterns on the surface of plastic cement element, can realize printing at random.In addition, the ink gun of this ink discharge device can be with respect to the accurate contraposition of plastic cement element, so, can form pattern accurately in the plastic components face.Further, the ink gun of this ink discharge device has erosion-resisting effect to this etching solution, so, need not to change often ink gun, production process is simple, and cost of manufacture is lower.
Be appreciated that to the pattern that makes this plastic components face Paint Glossly, can in this etching solution, add the wax solvent, as ethylene waxes.For the pattern that makes this plastic components face has metallic luster, can in this etching solution, add metal particle, as silver particles or copper particle.
Be appreciated that, make plastic components face roughening also can adopt the ink-jet printing process that utilizes of present embodiment that the surface of plastic cement element is handled, at this moment, the method for plastic components face roughening should be contained in the scope of surface treatment method of plastic components of the present invention.Utilize surface treatment method of plastic components can form spout of biochip etc. in conjunction with little shadow technology.
In addition, those skilled in the art can also do other variation in spirit of the present invention, and certainly, the variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (13)
1. surface treatment method of plastic components, this method comprises:
One ink discharge device is provided, contains etching solution in this ink discharge device;
Utilize this ink discharge device that this etching solution is sprayed at the plastic components face according to predetermined pattern, to form predetermined pattern in this plastic components face.
2. surface treatment method of plastic components as claimed in claim 1 is characterized in that, after this plastic components face forms predetermined pattern step, removes the etching solution of this plastic components face.
3. surface treatment method of plastic components as claimed in claim 1, it is characterized in that, utilizing before this ink discharge device is sprayed at plastic components face step with this etching solution according to predetermined pattern, this plastic cement element is carried out surface preparation, be attached to the dirty of this plastic components face to remove.
4. surface treatment method of plastic components as claimed in claim 2 is characterized in that, utilizes the method that heats or clean to remove the etching solution of this plastic components face.
5. surface treatment method of plastic components as claimed in claim 4, it is characterized in that, these heating means are: this plastic cement element is heated to 60 ℃ to 100 ℃, makes the etching solution volatilization that is sprayed at this plastic cement element, to remove the etching solution of this plastic components face.
6. surface treatment method of plastic components as claimed in claim 4 is characterized in that, these heating means are: this plastic cement element is heated to 80 ℃, makes the etching solution volatilization that is sprayed at this plastic cement element, to remove the etching solution of this plastic components face.
7. surface treatment method of plastic components as claimed in claim 1 is characterized in that, this etching solution is an organic solution.
8. surface treatment method of plastic components as claimed in claim 1, it is characterized in that, this etching solution comprises diethylene glycol, 2-methyl isophthalic acid, and is at least a in ammediol, 1-Methoxy-2-propyl acetate, cyclohexanone, diethylene glycol butyl ether, diethylene glycol-butyl ether acetic acid esters and the methoxyl group triethylene glycol.
9. surface treatment method of plastic components as claimed in claim 1 is characterized in that, this etching solution is the mixed solvent of cyclohexanone and diethylene glycol-butyl ether acetic acid esters.
10. surface treatment method of plastic components as claimed in claim 9 is characterized in that, the weight ratio of this cyclohexanone and diethylene glycol-butyl ether acetic acid esters is 1: 4.
11. surface treatment method of plastic components as claimed in claim 8 is characterized in that, this etching solution can further add the wax solvent.
12. surface treatment method of plastic components as claimed in claim 8 is characterized in that, this etching solution can further add metal particle.
13. surface treatment method of plastic components as claimed in claim 1 is characterized in that, this ink discharge device is the piezoelectric ink jet device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101107443A CN101590775A (en) | 2008-05-28 | 2008-05-28 | Surface treatment method of plastic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101107443A CN101590775A (en) | 2008-05-28 | 2008-05-28 | Surface treatment method of plastic components |
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| Publication Number | Publication Date |
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| CN101590775A true CN101590775A (en) | 2009-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2008101107443A Pending CN101590775A (en) | 2008-05-28 | 2008-05-28 | Surface treatment method of plastic components |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973515A (en) * | 2017-03-31 | 2017-07-21 | 江门崇达电路技术有限公司 | A kind of processing method unnet for circuit board etching |
| CN108281467A (en) * | 2018-01-22 | 2018-07-13 | 京东方科技集团股份有限公司 | Pixel defining layer, display base plate and preparation method thereof, display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307524A (en) * | 1998-04-29 | 2001-08-08 | 3M创新有限公司 | Receptor sheet for inkjet printing having an embossed surface |
| CN1404625A (en) * | 2000-10-16 | 2003-03-19 | 精工爱普生株式会社 | Etching process |
| CN101002515A (en) * | 2004-07-28 | 2007-07-18 | 埃托特克德国有限公司 | Method of manufacturing an electronic circuit assembly using direct write techniques |
-
2008
- 2008-05-28 CN CNA2008101107443A patent/CN101590775A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307524A (en) * | 1998-04-29 | 2001-08-08 | 3M创新有限公司 | Receptor sheet for inkjet printing having an embossed surface |
| CN1404625A (en) * | 2000-10-16 | 2003-03-19 | 精工爱普生株式会社 | Etching process |
| CN101002515A (en) * | 2004-07-28 | 2007-07-18 | 埃托特克德国有限公司 | Method of manufacturing an electronic circuit assembly using direct write techniques |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973515A (en) * | 2017-03-31 | 2017-07-21 | 江门崇达电路技术有限公司 | A kind of processing method unnet for circuit board etching |
| CN108281467A (en) * | 2018-01-22 | 2018-07-13 | 京东方科技集团股份有限公司 | Pixel defining layer, display base plate and preparation method thereof, display device |
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Owner name: HONGFUJIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. Free format text: FORMER OWNER: ICF TECHNOLOGY CO., LTD. Effective date: 20100421 Owner name: HON HAI PRECISION INDUSTRY CO., LTD. |
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Free format text: CORRECT: ADDRESS; FROM: NO.33, SCOTT AVENUE, SANTA CLARA CITY, CALIFORNIA, U.S.A. TO: NO.2, EAST RING 2ND ROAD, YOUSONG 10TH INDUSTRY DISTRICT, LONGHUA TOWN, BAO AN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE |
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Effective date of registration: 20100421 Address after: Guangdong province Shenzhen city Baoan District town Longhua tenth Industrial Zone tabulaeformis East Ring Road No. 2 two Applicant after: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Applicant after: Hon Hai Precision Industry Co., Ltd. Address before: 33 Stott Avenue, Santa, Santa Barbara, California Applicant before: ICF Technology Co., Ltd. |
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Application publication date: 20091202 |