CN101590730A - The binary electro-deposition processing method of metal inkjet plate - Google Patents
The binary electro-deposition processing method of metal inkjet plate Download PDFInfo
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- CN101590730A CN101590730A CNA2009100334660A CN200910033466A CN101590730A CN 101590730 A CN101590730 A CN 101590730A CN A2009100334660 A CNA2009100334660 A CN A2009100334660A CN 200910033466 A CN200910033466 A CN 200910033466A CN 101590730 A CN101590730 A CN 101590730A
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Abstract
The present invention relates to a kind of binary electro-deposition processing method of metal inkjet plate, it is characterized in that adopting photoelectricity processing and binary electro-deposition technology, comprising: the graphic file of design metal inkjet plate; Adopt stainless steel substrate, place baking oven to toast substrate; With photoresist hot pressing or be printed on the substrate; According to the graphic file of the metal inkjet plate that designs, make the negative film light shield film, carry out the high accuracy exposure; Substrate after the exposure is cleaned in developing machine; Substrate is put into nickel gold electrotyping bath carry out binary electroforming deposition process; After the electroforming deposition reaches needed thickness, the metal inkjet plate on the substrate is taken off, put into supersonic wave cleaning machine and clean; Sampling check.The present invention can make the aperture of metal inkjet plate reach the aperture requirement of 1～3um, and error is little, and satisfies the resolution ratio precision that ink-jet printer reaches 600DPI, makes inkjet plate reach the following diameter level of 5um by the ink-jet liquid particles, has reduced use cost.
Description
Technical field
The present invention relates to the processing method of the inkjet plate of a kind of ink-jet printer or printing machine use, specifically relate to a kind of binary electro-deposition processing method of metal inkjet plate, belong to the accurate manufacturing technology of superelevation field.
Background technology
Along with ink-jet printer requires to improve gradually to graphics resolution, device fabrication manufacturer has proposed higher specification requirement to the performance of inkjet plate.The conventional laser processing technology can not satisfy the technical specification of requirements at the higher level, and the stainless steel inkjet plate micro-pore diameter of its processing is not less than 20um, and the Laser Processing ability has arrived the limit, can not satisfy the more processing request of micro hole.Therefore industry is needed the inkjet plate that a kind of micropore reaches 1～3um badly, satisfies the domestic high resolution printed demand of expanding, and breaks away from the high price supply general layout by external supply high-precision micropore inkjet plate.
Summary of the invention
For solving the deficiency of existing laser processing technology, the object of the present invention is to provide a kind of binary electro-deposition processing method of metal inkjet plate, satisfy of the manufacturing requirement of high-performance ink-jet device to the microporous inkjet sheet, reduce use cost, improve print resolution.
For addressing the above problem, the present invention is achieved by the following technical solutions:
A kind of binary electro-deposition processing method of metal inkjet plate is characterized in that adopting photoelectricity processing and binary electro-deposition technology, specifically may further comprise the steps:
(1), the graphic file of design metal inkjet plate;
(2), adopt 304 stainless steel substrates, after surface grinding processing, visual examination meet the requirements, substrate is placed baking oven baking 30 minutes, baking temperature is 70～80 degree;
(3), with photoresist hot pressing or be printed on the substrate;
(4), according to the graphic file of the metal inkjet plate that designs, make the negative film light shield film of 2000DPI, on parallel ray machine, carry out the high accuracy exposure;
(5), the substrate after will exposing cleans in 1% developer solution, figure is rested on the substrate, and does figure size and visual examination;
(6), electroforming solution that substrate is put into nickel gold electrotyping bath carries out binary electroforming deposition process, described binary electroforming deposition process is to utilize certain electric current deposit thickness, respectively around photoresist and above deposit twice and form;
(7), after electroforming deposition reaches needed thickness, the metal inkjet plate on the substrate is taken off, put into supersonic wave cleaning machine and clean;
(8), sampling check, packing.
The binary electro-deposition processing method of aforesaid metal inkjet plate is characterized in that described photoresist is dry film, photoresist.
The binary electro-deposition processing method of aforesaid metal inkjet plate is characterized in that described dry film, photoresist, after penetrating via the illumination of 300～400nm curing reaction can take place.
The binary electro-deposition processing method of aforesaid metal inkjet plate, it is characterized in that in described step (3), with photoresist hot pressing or be printed on the substrate, be utilize drying film machine at temperature 110～130 degree, pressure under 1.2KG～1.5KG, the condition of speed at 0.8～1.0m/S, the dry film hot pressing of 25um on 304 stainless steel substrates, is guaranteed that outward appearance reaches requirement; Or employing is printed, the method for spin coating, under 100～200 order serigraphys, photoresist on average is coated on 304 stainless steel substrates certain thickness photoresist, and thickness is 20～50um.
The binary electro-deposition processing method of aforesaid metal inkjet plate is characterized in that the high accuracy exposure in the described step (4), and the UV light energy is controlled at 3～5KW during exposure.
The binary electro-deposition processing method of aforesaid metal inkjet plate is characterized in that described electroforming solution is nickel and cobalt solution or nickel phosphorus solution.
The binary electro-deposition processing method of aforesaid metal inkjet plate is characterized in that the main component of described nickel and cobalt solution and content are as follows:
Nickel sulfamic acid solution: 350～550g/L;
Sulfamic acid cobalt liquor: 50～300g/L;
Nickel chloride solution: 10～30g/L;
Boric acid: 20～45g/L;
Brightener XS-L:1～5ml/L;
Additive P900:2～10ml/L.
The invention has the beneficial effects as follows: adopt binary electro-deposition processing method of the present invention to make the micropore metal inkjet plate, can make the aperture of micropore metal inkjet plate reach the aperture requirement of 1～3um, and satisfy the print resolution precision that the inkjet plate printer reaches 600DPI, make inkjet plate reach the following diameter level of 5um by the ink-jet liquid particles, reduced use cost.And the nickel alloy material hardness of electroforming deposition reaches 450～550hv, and thickness reaches 0.020～0.060mm, and deviation from circular from reaches 0.5um.
Description of drawings
Fig. 1 is a process chart of the present invention.
The specific embodiment
Specifically introduce method of the present invention below in conjunction with accompanying drawing.
The binary electro-deposition processing method of the metal inkjet plate among the present invention adopts photoelectricity processing and binary electroforming deposition technique, and photoresist adopts dry film or photoresist, and the electroforming deposition substrate adopts 304 stainless steel substrates, and electroforming solution adopts nickel phosphorus or nickel and cobalt solution.Curing reaction can take place after penetrating via the UV illumination of wavelength 300～400nm in dry film that is adopted or photoresist.
Technical process of the present invention is (as Fig. 1):
The graphic file of design metal inkjet plate; Adopt 304 stainless steel substrates, handle, after the inspection outward appearance meets the requirements, substrate is placed baking oven baking 30 minutes, temperature 70～80 degree through surface grinding; Utilize drying film machine at temperature 110～130 degree, pressure is at 1.2KG～1.5KG, and speed on stainless steel substrate, guarantees that outward appearance reaches requirement with the dry film hot pressing of 25um under the parameter of 0.8～1.0m/S; Or employing is printed, the method for spin coating, under 100～200 order serigraphys, photoresist on average is coated on 304 stainless steel substrates certain thickness photoresist, and thickness is 20～50um.According to the graphic file of the metal inkjet plate that designs, make the negative film light shield film of 2000DPI, on parallel ray machine, carry out the high accuracy exposure, the UV light energy is controlled at 3～5KW and gets final product.Substrate after the exposure cleans in 1% developer solution, and figure is rested on the substrate, and does figure size and visual examination.The electroforming solution of then substrate being put into nickel gold electrotyping bath carries out binary electroforming deposition process, metal inkjet plate on the substrate can be taken off after reaching needed thickness, put on the supersonic wave cleaning machine and clean, need check every size of metal inkjet plate at last according to sampling frequency.
Binary electro-deposition processing method is to utilize certain electric current deposit thickness, and deposition forms for twice above reaching around photoresist respectively.
When adopting nickel cobalt electroforming solution, the nickel cobalt electroforming solution main component and the content that are adopted are as follows:
Nickel sulfamic acid solution: 350～550g/L;
Sulfamic acid cobalt liquor: 50～300g/L;
Nickel chloride solution: 10～30g/L;
Boric acid: 20～45g/L;
Brightener XS-L:1～5ml/L;
Additive P900:2～10ml/L.
The nickel alloy material hardness of electroforming deposition reaches 450～550hv, and thickness is 0.020～0.060mm, and micro-pore diameter can reach 1～3um, and deviation from circular from is 0.5um.The aperture is little, the precision height, and long service life satisfies the print resolution precision that the metal inkjet printer reaches 600DPI, make metal inkjet plate reach the following diameter level of 5um by the ink-jet liquid particles, and price is lower, has reduced use cost.
The foregoing description does not limit the present invention in any form, and all technical schemes that mode obtained of taking to be equal to replacement or equivalent transformation all drop in protection scope of the present invention.
Claims (7)
1, a kind of binary electro-deposition processing method of metal inkjet plate is characterized in that adopting photoelectricity processing and binary electro-deposition technology, specifically may further comprise the steps:
(1), the graphic file of design metal inkjet plate;
(2), adopt 304 stainless steel substrates, after surface grinding processing, visual examination meet the requirements, substrate is placed baking oven baking 30 minutes, baking temperature is 70～80 degree;
(3), with photoresist hot pressing or be printed on the substrate;
(4), according to the graphic file of the metal inkjet plate that designs, make the negative film light shield film of 2000DPI, on parallel ray machine, carry out the high accuracy exposure;
(5), the substrate after will exposing cleans in 1% developing machine, figure is rested on the substrate, and does figure size and visual examination;
(6), electroforming solution that substrate is put into nickel gold electrotyping bath carries out binary electroforming deposition process, described binary electroforming deposition process is to utilize certain electric current deposit thickness, respectively around photoresist and above deposit twice and form;
(7), after electroforming deposition reaches needed thickness, the metal inkjet plate on the substrate is taken off, put into supersonic wave cleaning machine and clean;
(8), sampling check, packing.
2, the binary electro-deposition processing method of metal inkjet plate according to claim 1 is characterized in that described photoresist is dry film or photoresist.
3, the binary electro-deposition processing method of metal inkjet plate according to claim 2 is characterized in that described dry film or photoresist, after penetrating via the illumination of 300～400nm curing reaction can take place.
4, the binary electro-deposition processing method of metal inkjet plate according to claim 1, it is characterized in that in described step (3), with photoresist hot pressing or be printed on the substrate, be utilize drying film machine at temperature 110～130 degree, pressure under 1.2KG～1.5KG, the condition of speed at 0.8～1.0m/S, the dry film hot pressing of 25um on 304 stainless steel substrates, is guaranteed that outward appearance reaches requirement; Or employing is printed, the method for spin coating, under 100～200 order serigraphys, photoresist on average is coated on 304 stainless steel substrates certain thickness photoresist, and thickness is 20～50um.
5, the binary electro-deposition processing method of metal inkjet plate according to claim 1 is characterized in that the high accuracy exposure in the described step (4), and the UV light energy is controlled at 3～5KW during exposure.
6, the binary electro-deposition processing method of metal inkjet plate according to claim 1 is characterized in that described electroforming solution is nickel and cobalt solution or nickel phosphorus solution.
7, the binary electro-deposition processing method of metal inkjet plate according to claim 6 is characterized in that the main component of described nickel and cobalt solution and content are as follows:
Nickel sulfamic acid solution: 350～550g/L;
Sulfamic acid cobalt liquor: 50～300g/L;
Nickel chloride solution: 10～30g/L;
Boric acid: 20～45g/L;
Brightener XS-L:1～5ml/L;
Additive P900:2～10ml/L.
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| CN2009100334660A CN101590730B (en) | 2009-06-22 | 2009-06-22 | Binary electro-deposition processing method for metal inkjet plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102033425A (en) * | 2010-10-26 | 2011-04-27 | 中国航天科技集团公司第五研究院第五一○研究所 | Method for manufacturing micromechanical shutter |
| CN102618899A (en) * | 2012-04-23 | 2012-08-01 | 中国矿业大学 | Method and device for preparing microtexture through laser photoetching assisted electrochemical deposition |
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2009
- 2009-06-22 CN CN2009100334660A patent/CN101590730B/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102033425A (en) * | 2010-10-26 | 2011-04-27 | 中国航天科技集团公司第五研究院第五一○研究所 | Method for manufacturing micromechanical shutter |
| CN102033425B (en) * | 2010-10-26 | 2012-07-11 | 中国航天科技集团公司第五研究院第五一○研究所 | Method for manufacturing micromechanical shutter |
| CN102618899A (en) * | 2012-04-23 | 2012-08-01 | 中国矿业大学 | Method and device for preparing microtexture through laser photoetching assisted electrochemical deposition |
| CN102618899B (en) * | 2012-04-23 | 2015-01-21 | 中国矿业大学 | Method and device for preparing microtexture through laser photoetching assisted electrochemical deposition |
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| CN101590730B (en) | 2011-06-29 |
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Effective date of registration: 20181105 Address after: 226001 room 3473, building 3, Jiangcheng Rd Park, 1088 Jiangting Road, Sutong science and Technology Industrial Park, Nantong, Jiangsu Patentee after: Nantong Mei Jing Wei Electronics Co., Ltd. Address before: 215300 161 Qingyang South Road, Kunshan Development Zone, Jiangsu Patentee before: Kunshan Micro EF Co., Ltd. |