CN101583264B - Grounding structure and monitor for preventing electromagnetic interference - Google Patents

Grounding structure and monitor for preventing electromagnetic interference Download PDF

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Publication number
CN101583264B
CN101583264B CN2009100375637A CN200910037563A CN101583264B CN 101583264 B CN101583264 B CN 101583264B CN 2009100375637 A CN2009100375637 A CN 2009100375637A CN 200910037563 A CN200910037563 A CN 200910037563A CN 101583264 B CN101583264 B CN 101583264B
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China
Prior art keywords
substrate
spring element
lug
electromagnetic interference
link
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009100375637A
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Chinese (zh)
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CN101583264A (en
Inventor
洪志谦
陈家让
姜晓燕
张巧将
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lite On Electronics Guangzhou Co Ltd
Lite On Technology Changzhou Co Ltd
Lite On Technology Corp
Original Assignee
Silitek Electronic Guangzhou Co Ltd
Lite On Technology Corp
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Priority to CN2009100375637A priority Critical patent/CN101583264B/en
Publication of CN101583264A publication Critical patent/CN101583264A/en
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Publication of CN101583264B publication Critical patent/CN101583264B/en
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Abstract

The invention discloses a grounding structure for preventing electromagnetic interference and a monitor provided with the grounding structure for preventing electromagnetic interference. The structurecomprises a first substrate, a second substrate and a spring element, wherein the second substrate is connected with an electronic structure requiring to be grounded, the first substrate is connected with the second substrate through the spring element, the second substrate transmits electromagnetic wave generated by the electronic structure to the spring element, and the spring element transmits the electromagnetic wave to the first substrate. Taking the spring element as a medium, the grounding structure and the monitor ensure that the first substrate is well contacted with the second subst rate, the spring element replaces the conventional shrapnel, and the texture of the spring element is harder compared with that of the shrapnel. Meanwhile, the processing is convenient and is hard to cause poor effects. In addition, the installation of the spring element is also convenient, quick, greatly shortens the time of manufacturing the grounding structure for preventing the electromagneticinterference and lowers the labor cost.

Description

The display of the ground structure of anti-electromagnetic interference and anti-electromagnetic interference
Technical field
The present invention relates to a kind of ground structure, especially refer to a kind of ground structure that is applied to the anti-electromagnetic interference of electronic product, and the electronic product that adopts the anti-electromagnetic interference of this ground structure, as display.
Background technology
Because improving constantly of electronic component function, when renewal speed quickening, the performance of electronic product improve, also bring many electromagnetic compatibility problems, thereby produce electromagnetic interference (Electro MagneticInterference, EMI), influence the normal operation of computer.Therefore, for for example circuit board of computer internal configurations, CD drive (optical disc driver, ODD), the design of the anti-electromagnetic interference of DAA such as floppy disk also is the problem that electronic design engineering Shi Suoxu considers.
Prior art, in order to eliminate electromagnetic interference, circuit board can be provided with grounding elastic part as depicted in figs. 1 and 2 in close casing position, the bottom surface of DAAs such as circuit board.Referring to Fig. 1 and Fig. 2, described grounding elastic part 1 is located between the casing 12 and circuit board 9 of computer, described grounding elastic part 1 comprises with hot melting way and is incorporated into the body on the described casing 12 and extends and the conductive sheet 13 of for example arcuate structure of the bottom surface 91 of contact circuit plate 9 towards circuit board 9 direction one from described body 11, and described conductive sheet 13 has first contact site 130 that extends from described body 11, and extends and approach 91 middle parts, bottom surface of circuit board 9 and contact second contact site 131 of described casing 12 from described first contact site 130.So, the electromagnetic wave that produces when with first contact site 130 by described conductive sheet 13 described circuit board 9 being moved conducts to described body 11, and the heat fusion joint 111 that contacts with casing 12 by described body 11 conducts to described casing 12 again, to eliminate electromagnetic wave.
Along with reaching its maturity of electronic product, the competition in market is also more and more fierce thereupon, and the cost height not only of the shell fragment in the said structure, and adding man-hour, specification requirement adds and wants extreme care man-hour than higher, to avoid causing the metal clips distortion with the casing loose contact.Therefore, more multi-vendor trending towards sought the effect that can replace shell fragment, the structure that makes the cost reduction.Can reflect thus, the ground structure of anti-electromagnetic interference provided by the invention, it can make technical costs and production cost reduce the real necessity that belongs to effectively.
Summary of the invention
Technical problem to be solved by this invention aims to provide a kind of anti electromagnetic interference structure, and it is compared with existing anti-electromagnetic interference technology, can reduce cost, and makes product have more competitiveness, obtains bigger profit simultaneously.
Above-mentioned purpose is achieved in that
A kind of ground structure of anti-electromagnetic interference, it is applied to electronic product, and described anti-electromagnetic interference ground structure includes:
One first substrate, it is a metal material;
One second substrate, it is connected with a circuit board or other electronic structure that need be grounded, and is connected with described first substrate; And
One spring element, it is arranged on described second substrate, and makes this second substrate and this first substrate contacts good by described spring element.
Preferably, described second substrate is the connection side near a side of first substrate, and described spring element has one first link and one second link, and described connection side is provided with one first lug, and one second lug; First link of described spring element, second link are socketed on first lug, the second lug place of described second substrate respectively, with the fixing spring element on second substrate.
Preferably, the bending direction of described first lug, second lug is opposite.
Preferably, described second substrate has a plate, and described connecting plate is parallel with second substrate, and described first lug, second lug are located on the connecting plate.
The present invention also provides a kind of display of anti-electromagnetic interference, and it includes the structure of an anti-electromagnetic interference, and the structure of described anti-electromagnetic interference includes:
One first substrate, it is a metal material;
One second substrate, it is connected with the circuit board of this display, and is connected with described first substrate; And
One spring element, it is arranged on described second substrate, and makes second substrate and first substrate contacts good by described spring element.
Compared with prior art, the present invention has the following advantages:
The ground structure of anti-electromagnetic interference of the present invention, its with spring element as media, make win substrate and second substrate contacts good, spring element replaces traditional shell fragment, the quality of spring element is compared firmly with shell fragment, and adding man-hour conveniently, is difficult for causing bad, simultaneously, the manufacturing cost of spring element is much smaller than the manufacturing cost of shell fragment.First lug that is provided with near a side of described first substrate on the described connecting plate, and second lug, cooperate with first link, second link of spring element respectively, spring element can be installed on the connecting plate apace, mounting means quickly and easily, shorten the time of the ground structure of making described anti-electromagnetic interference significantly, thereby reduced human cost.
Description of drawings
The present invention is described in more detail below in conjunction with drawings and Examples:
Fig. 1 is the vertical view of prior art grounding elastic part;
Fig. 2 shows schematic diagram for the partial cutaway of prior art grounding elastic part, casing and circuit board;
Fig. 3 is the cut-away view of the first embodiment ground structure of the anti-electromagnetic interference of the present invention;
Fig. 4 is the spring element of the first embodiment of the present invention and the exploded view of second substrate;
Fig. 5 is the spring element of the second embodiment of the present invention and the exploded view of second substrate;
Fig. 6 is the profile of the display of the anti-electromagnetic interference of the present invention.
Embodiment
Fig. 3 is the exploded view of the spring element of the present invention and second substrate for the cut-away view of the ground structure of the anti-electromagnetic interference of the present invention, Fig. 4, please be simultaneously referring to Fig. 3 and Fig. 4.The ground structure 100 of the anti-electromagnetic interference of the present invention, it includes: one first substrate, 101, one second substrates 102, and a spring element 103.Wherein, described first substrate 101 is a metal material, being applied to computer housing with this ground structure 100 is example, described first substrate 101 is a sheet metal that is connected with the shell of computer housing, perhaps being the hardware with the shell one of this computer housing, perhaps directly is the shell of this computer housing itself; Described second substrate 102 is connected with a circuit board or other electronic structure that need be grounded (figure does not show), and is connected with described first substrate 101; Described spring element 103 then is arranged on described second substrate 102, and makes described second substrate 102 contact well with described first substrate 101 by described spring element 103.Briefly, described spring element 103 is a media, and the electromagnetic wave that the electronic structure that is connected on second substrate 102 is produced conducts to first substrate 101 by spring element 103.
Described second substrate 102 is connection side 1021 near a side of first substrate 101, and described connection side 1021 is provided with one first lug 1023, and one second lug 1024, and the bending direction of described first lug 1023, second lug 1024 is opposite.Another embodiment (as shown in Figure 5), preferably has a plate 1022 at described second substrate 102, described connecting plate 1022 is positioned at the connection side 1021 of described second substrate 102, and it is outstanding to the direction of first substrate 101, and it is parallel with described second substrate 102, therefore also parallel with described first substrate 101.No matter be first embodiment or second embodiment, the bending direction of described first lug 1023, second lug 1024 is all opposite.
The two ends of described spring element 103 are respectively first link 1031, second link 1032, and described first link 1031, second link 1032 are socketed on first lug 1023, second lug, 1024 places respectively.No matter be that first first link 1031 with spring element 103 is socketed on first lug 1023, or second link 1032 of spring element 103 is socketed on second lug 1024, can both finish the installation of spring element 103.Apparently, also first link 1031 of spring element 103 can be socketed on second lug, 1024 places, second link 1032 of spring element 103 is socketed on second lug, 1023 places.
After installing spring element 103,103 of spring elements can closely contact with first substrate 101, when the electronic structure that is connected with first substrate 101 generates electromagnetic waves, 103 of spring elements serve as an instrumentality, with electromagnetic waveguide to the second substrate 102, second substrate 102 of metal material is with effective elimination electromagnetic wave.
The ground structure 100 of anti-electromagnetic interference of the present invention, it is applied to electronic products such as computer housing, display, floppy disk, causes those electronic products normally not move to prevent electromagnetic interference.Fig. 6 is for the profile of the display of the anti-electromagnetic interference of the present invention, referring to Fig. 6.The display 200 of anti-electromagnetic interference of the present invention, it includes an anti electromagnetic interference structure 201, this anti electromagnetic interference structure 201 comprises one first substrate 2011 and one second substrate 2012, this first substrate 2011, second substrate 2012 can be respectively in the present embodiment display housing 2011 and circuit board 2012, certainly its respectively with display housing 2011 also can with the element that circuit board 2012 is connected, Fig. 6 is an instantiation, is not limited to this sole mode.Described anti electromagnetic interference structure 201 also includes a spring element 2013, it is arranged on the described circuit board 2012, and the set-up mode of described spring element 2013 on circuit board 2012 is identical with the set-up mode of spring element 103 on second substrate 102 in the ground structure 100 of described anti-electromagnetic interference.The electromagnetic wave that described circuit board 2012 produces conducts to housing 2011 by spring element 2013, to eliminate the electromagnetic wave that circuit board 2012 produces.
The ground structure 100 of anti-electromagnetic interference of the present invention adopts the media of spring elements 103 as conduction electro-magnetic wave, substituted traditional with shell fragment as the conduction electro-magnetic wave media, make manufacturing cost reduce, thereby increase the competitive advantage of electronic product.
The above person of thought, only for the present invention's preferred embodiment, when the scope that can not limit the invention process with this, promptly the content of putting down in writing according to claim of the present invention and description of the invention has generally been done simple equivalent and is changed and modify, and all still belongs within the claim of the present invention institute covering scope.In addition, summary part and title only are the usefulness that is used for assisting the patent document search, are not the interest field that is used for limiting the present invention.

Claims (8)

1. the ground structure of an anti-electromagnetic interference, it is applied to electronic product, and described anti-electromagnetic interference ground structure includes:
One first substrate, it is a metal material;
One second substrate, it is connected with a circuit board or other electronic structure that need be grounded, and is connected with described first substrate; And
One spring element, it is arranged on described second substrate, and between first substrate and this second substrate, so that this second substrate electrically contacts well with this first substrate;
Wherein, the electromagnetic wave that is connected in the electronic structure on second substrate conducts to first substrate by this spring element.
2. the ground structure of anti-electromagnetic interference as claimed in claim 1, it is characterized in that described second substrate is the connection side near a side of first substrate, described spring element has one first link and one second link, described connection side is provided with one first lug, and one second lug; First link of described spring element, second link are socketed on first lug, the second lug place of described second substrate respectively, with the fixing spring element on second substrate.
3. the ground structure of novel anti-electromagnetic interference as claimed in claim 2 is characterized in that, the bending direction of described first lug, second lug is opposite.
4. the ground structure of anti-electromagnetic interference as claimed in claim 2 is characterized in that, described second substrate has a plate, and described connecting plate is parallel with second substrate, and described first lug, second lug are located on the connecting plate.
5. the display of an anti-electromagnetic interference, it includes the structure of an anti-electromagnetic interference, and the structure of described anti-electromagnetic interference includes:
One first substrate, it is a metal material;
One second substrate, it is connected with the circuit board of this display, and is connected with described first substrate; And
One spring element, it is arranged on described second substrate, and between first substrate and this second substrate, so that second substrate electrically contacts well with first substrate;
Wherein, the electromagnetic wave that is connected in the electronic structure on second substrate conducts to first substrate by this spring element.
6. the display of anti-electromagnetic interference as claimed in claim 5, it is characterized in that described second substrate is the connection side near a side of first substrate, described spring element has one first link and one second link, described connection side is provided with one first lug, and one second lug; First link of described spring, second link are socketed on first lug, the second lug place of described second substrate respectively, with the fixing spring element on second substrate.
7. the display of anti-electromagnetic interference as claimed in claim 6 is characterized in that, the bending direction of described first lug, second lug is opposite.
8. the display of anti-electromagnetic interference as claimed in claim 6 is characterized in that, described second substrate has a plate, and described connecting plate is parallel with second substrate, and described first lug, second lug are located on the connecting plate.
CN2009100375637A 2009-02-26 2009-02-26 Grounding structure and monitor for preventing electromagnetic interference Expired - Fee Related CN101583264B (en)

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CN2009100375637A CN101583264B (en) 2009-02-26 2009-02-26 Grounding structure and monitor for preventing electromagnetic interference

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Application Number Priority Date Filing Date Title
CN2009100375637A CN101583264B (en) 2009-02-26 2009-02-26 Grounding structure and monitor for preventing electromagnetic interference

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CN101583264B true CN101583264B (en) 2011-06-29

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108738288B (en) * 2017-04-19 2021-02-09 阿尔派株式会社 Electronic device and assembling method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1474247A (en) * 2002-08-08 2004-02-11 广达电脑股份有限公司 Heat radiator of riveted radiation base plate and metal heat transfer block
CN1488236A (en) * 2000-03-21 2004-04-07 ���Ͽع����޹�˾ Conforming shielded form for electronic component assemblies and methods for making and using same
CN2666098Y (en) * 2003-11-07 2004-12-22 台捷电子股份有限公司 Circuit board assembly
CN2682776Y (en) * 2003-11-24 2005-03-02 神基科技股份有限公司 Electromagnetic wave suppressing and shielding structure for circuit substrate interference source

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1488236A (en) * 2000-03-21 2004-04-07 ���Ͽع����޹�˾ Conforming shielded form for electronic component assemblies and methods for making and using same
CN1474247A (en) * 2002-08-08 2004-02-11 广达电脑股份有限公司 Heat radiator of riveted radiation base plate and metal heat transfer block
CN2666098Y (en) * 2003-11-07 2004-12-22 台捷电子股份有限公司 Circuit board assembly
CN2682776Y (en) * 2003-11-24 2005-03-02 神基科技股份有限公司 Electromagnetic wave suppressing and shielding structure for circuit substrate interference source

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Address after: 213166 Wujin high tech Industrial Development Zone, Jiangsu Province, Yang Lake Road, No. 88

Patentee after: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD.

Patentee after: Lite-On Electronic (Guangzhou) Co., Ltd.

Patentee after: Lite-On Technology Corporation

Address before: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25

Patentee before: Xuli Electronics (Guangzhou) Co., Ltd.

Patentee before: Lite-On Technology Corporation

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110629

Termination date: 20170226