CN101567323B - 一种显示屏用三基色发光二极管的制造方法 - Google Patents
一种显示屏用三基色发光二极管的制造方法 Download PDFInfo
- Publication number
- CN101567323B CN101567323B CN2009101077368A CN200910107736A CN101567323B CN 101567323 B CN101567323 B CN 101567323B CN 2009101077368 A CN2009101077368 A CN 2009101077368A CN 200910107736 A CN200910107736 A CN 200910107736A CN 101567323 B CN101567323 B CN 101567323B
- Authority
- CN
- China
- Prior art keywords
- pit
- led luminescence
- luminescence chip
- emitting diode
- display screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101077368A CN101567323B (zh) | 2009-05-27 | 2009-05-27 | 一种显示屏用三基色发光二极管的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101077368A CN101567323B (zh) | 2009-05-27 | 2009-05-27 | 一种显示屏用三基色发光二极管的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101567323A CN101567323A (zh) | 2009-10-28 |
CN101567323B true CN101567323B (zh) | 2012-07-25 |
Family
ID=41283425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101077368A Active CN101567323B (zh) | 2009-05-27 | 2009-05-27 | 一种显示屏用三基色发光二极管的制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101567323B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102315376A (zh) * | 2010-06-30 | 2012-01-11 | 一诠精密电子工业(中国)有限公司 | 电热分离式发光二极管支架结构制成方法 |
CN104103748B (zh) * | 2013-04-10 | 2016-12-07 | 重庆市路迪机械厂 | 发光二极管封装结构及其制造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1755906A (zh) * | 2004-09-28 | 2006-04-05 | 相互股份有限公司 | 适用集成电路及发光二极管的封装方法 |
-
2009
- 2009-05-27 CN CN2009101077368A patent/CN101567323B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1755906A (zh) * | 2004-09-28 | 2006-04-05 | 相互股份有限公司 | 适用集成电路及发光二极管的封装方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101567323A (zh) | 2009-10-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201062757Y (zh) | 白光面光源发光装置 | |
CN101093068A (zh) | 白光器件及制造方法 | |
CN101769455A (zh) | 一种采用整体荧光转换技术的led灯泡 | |
CN204538080U (zh) | 一种内置rgbw晶片的led支架及其led产品 | |
CN203573986U (zh) | 一种集成ic封装的全彩led灯及所制成的灯串 | |
CN101764067A (zh) | 一种类太阳光谱led的封装方法 | |
CN109256458A (zh) | 一种led产品封装结构及其封装方法 | |
CN204005338U (zh) | 一种全周光条状led全玻璃球泡灯 | |
CN202302947U (zh) | 贴片led铜线灯串 | |
CN101567323B (zh) | 一种显示屏用三基色发光二极管的制造方法 | |
CN204179079U (zh) | 一种基于cob封装的多色led光源 | |
CN202487574U (zh) | 显示屏用三基色发光二极管 | |
CN2796104Y (zh) | 高亮度发光二极管的封装结构 | |
CN204045621U (zh) | 一种蓝宝石衬底芯片光源结构 | |
CN201133611Y (zh) | Led与oled相配合的三基色器件 | |
CN201887074U (zh) | 一种led均光芯片 | |
CN201057603Y (zh) | 发光二极体模组的结构改良 | |
CN201892097U (zh) | 一种由led光源构成的白光灯具 | |
CN101901864B (zh) | Led模组和led照明装置 | |
CN201117655Y (zh) | 发光二极管 | |
CN202662240U (zh) | 高亮度全彩显示屏led封装结构 | |
CN101867006A (zh) | 一种led均光芯片 | |
CN201521834U (zh) | 一种三合一全彩食人鱼led灯 | |
CN201126821Y (zh) | 发光二极管 | |
CN2854813Y (zh) | 发光二极管的封装结构改良 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220118 Address after: 332000 east side of floors 1 and 3, building 1, shuangchuang base, Jiujiang Economic and Technological Development Zone, Jiujiang City, Jiangxi Province Patentee after: Jiangxi Lanke Semiconductor Co.,Ltd. Address before: 518103 3 hi tech Industrial Zone, Fu Garden Road, Fuyong Town, Shenzhen, Guangdong, Baoan District Patentee before: SHENZHEN LANKE ELECTRONICS Co.,Ltd. |
|
DD01 | Delivery of document by public notice | ||
DD01 | Delivery of document by public notice |
Addressee: Patent of Shenzhen Lanke Electronics Co.,Ltd. The person in charge Document name: Notification of qualified procedures |