CN101539282B - 发光二极管模组 - Google Patents
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Abstract
一种发光二极管模组，其包括一导热板及若干安装于导热板上的发光二极管，每一发光二极管包括一发光二极管芯片及电性连接至该芯片的一第一引脚及一第二引脚，每一发光二极管还包括一承接芯片的基座，该基座与导热板热导性连接，第一引脚及第二引脚固定于基座上并与导热板隔开。本发明的发光二极管具有热电分离式的构造，其可使芯片发出相对恒定的光强，并相应地延长发光二极管的寿命。
Description
技术领域
本发明涉及一种发光二极管模组，特别是指一种具有热电分离式构造的发光二极管模组。
背景技术
随着发光效率的提升，发光二极管已被越来越多地应用在各个领域当中，如住宅照明、工业照明及交通指示等等。但是，在发光二极管发光效率增加的同时会导致其发热量增大，如若这些热量得不到及时地散发，将会使发光二极管的发光效率下降。因此，如何有效地散发发光二极管的热量变得至关重要。
美国专利第US 6,561,680B1号揭示了一种发光二极管模组，其包括一金属板及一固设于金属板上的发光二极管。发光二极管包括一正极引脚、一与正极引脚隔开的负极引脚、一粘接于负极引脚上的发光二极管芯片及一包封芯片的胶体。发光二极管的正极引脚及负极引脚直接贴设于金属板表面。当发光二极管工作时，芯片产生的热量通过正极引脚及负极引脚传导至金属板上，从而实现对发光二极管的散热。
但是，这种结构的发光二极管模组的电流亦是通过金属板表面、正极引脚及负极引脚传输至芯片，即是说，该发光二极管模组的导电路径与导热路径相互交迭。由于处于同一传输路径，电流在传输过程中易受到热量的影响而无法稳定输入至芯片。特别当金属板的温度达到一定程度之后，热量对于电流的影响将变得十分显著：电流无法保持相对稳定的数值而一直处于波动状态。这种波动的电流输入至芯片后将会导致芯片的发光强度不停的发生变化，使发光二极管无法维持正常照明。此外，这种波动的电流还容易损坏芯片，影响发光二极管的使用寿命。
发明内容
有鉴于此，实有必要提供一种具有热电分离式构造的发光二极管模组。
一种发光二极管模组，其包括一导热板及若干安装于导热板上的发光二极管，每一发光二极管包括一基座、一结合至基座上的发光二极管芯片及二分别固定于基座上并与芯片电性连接的第一引脚及第二引脚，所述基座与导热板热导性连接，所述第一引脚及第二引脚与导热板相互隔开，所述第一引脚及第二引脚的一部分暴露于基座内，第一引脚及第二引脚的另一部分延伸超出基座并悬置于导热板上方，每一发光二极管还包括若干自基座外侧面延伸而出的扣脚，这些发光二极管通过扣脚相互扣接成一整体，每一发光二极管还包括一插设于基座内的导热柱，芯片固设于该导热柱上，所述导热柱与扣脚相互连接并与导热板接触。
与现有技术相比，本发明的发光二极管模组的基座与导热板热导性连接，芯片产生的热量可通过基座传输至导热板内。此外，由于第一引脚及第二引脚与导热板相互隔开，通过第一引脚及第二引脚输入至芯片内的电流不会流经导热板。发光二极管模组的导热路径与导电路径至少部分相互错开，热量对电流不会造成太大影响。故此，电流的数值可维持在一个相对稳定的状态，发光二极管可发出相对恒定的光强，发光二极管的寿命亦相应地得到延长。
下面参照附图，结合具体实施例对本发明作进一步的描述。
附图说明
图1是本发明一实施例的发光二极管模组中的发光二极管组合的立体组装图。
图2是图1的俯视图。
图3是图1的仰视图。
图4是图1中的单个发光二极管的立体图，其中该发光二极管的透镜被移去以方便观察其内部结构。
图5是图4的俯视图。
图6是图4的仰视图。
图7是图4的侧视图。
图8是图1的侧视图，此时发光二极管模组中的导热板设置于发光二极管组合下方。
图9是本发明另一实施例的发光二极管模组中的发光二极管的俯视图。
图10是图9的仰视图。
具体实施方式
请参阅图1及图8，本发明的优选实施例的发光二极管模组包括一导热板10及一固设于导热板10上的发光二极管组合200。
导热板10由热导性良好的金属材料制成，如铜、铝或二者的合金。导热板10的顶部形成一平坦的表面，供发光二极管组合200贴合。
请一并参阅图4，发光二极管组合200由若干发光二极管20彼此焊接而成。每一发光二极管20包括一正六边形的基座22、一粘接于基座22上的发光二极管芯片23、二分别插设于基座22相对两侧的第一引脚24及第二引脚26及一固定至基座22上且包封住芯片的封胶29(如图1)。
请一并参阅图5至图7，在本实施例中，基座22由陶瓷制成，可以理解地，基座22还可采用现有技术中其他导热且绝缘的材料制成，以在传输芯片23热量的同时对第一引脚24及第二引脚26绝缘。该基座22的顶面的中部区域向下凹陷出一正六边形的凹槽220，用于容置芯片23。该凹槽220的内径小于基座22的外径，由此，基座22环绕凹槽220的外侧部分形成一环形的台阶222，以供第一引脚24及第二引脚26插设。三扣脚28自基座22的外侧面一体向外辐射而出，每一扣脚28包括一矩形的横梁280及一形成于横梁280末端的梯形的扣合部282(如图6)，其中扣合部282用于嵌入相邻的发光二极管20的基座22内，横梁280则用于将相邻的发光二极管20隔开。该三扣脚28的底面均与基座22的底面共面，并与导热板10的顶面接触(如图8)，以将基座22所吸收的热量散布至导热板10上；这些扣脚28的顶面设置为低于第一引脚24及第二引脚26的底面，以与第一引脚24及第二引脚26隔开距离(如图7)。请一并参阅图3及图6，三缺口224相对于三扣脚28交替地环设于基座22的底面周缘，其中每一缺口224均呈梯形，且向外贯穿基座22的外侧面，以收容相邻发光二极管20的相应扣脚28的扣合部282，从而将这些发光二极管20扣接成一整体。
请再一并参阅图2，第一引脚24及第二引脚26均为完全平行于导热板10的金属片，其相对设置于靠近基座22的顶面，以与导热板10隔开距离。每一第一引脚24及第二引脚26均包括一穿设于台阶222内的固定部240、260及一自固定部240、260水平向外延伸的矩形的连接部242、262(如图5)，其中连接部242、262的尺寸远小于固定部240、260的尺寸。每一固定部240、260的内侧部分呈弧形，其暴露于凹槽220的底部，且通过金线(图未示)连接至芯片23的正负电极(图未示)，以实现每一发光二极管20内部的电气连接；每一固定部240、260的外侧部分呈矩形，其略微凸伸出基座22的外侧面，以增加第一引脚24及第二引脚26的机械稳定性。这些连接部242、262通过相应的固定部240、260悬设于导热板10的上方(如图8)，以避免与导热板10直接接触。第一引脚24的连接部242的末端开设一大致呈圆形的凹部244，第二引脚26的连接部262的末端则水平向外凸伸出一大致呈圆形的凸片264。如图2所示，该凹部244用于收容一相邻发光二极管20的第二引脚26的凸片264，而该凸片264则用于嵌入另一相邻发光二极管20的第一引脚24的凹部244内，从而实现这些发光二极管20间的外部电气连接。该凹部244的深度大于凸片264的厚度，当凸片264容置于凹部244内时，凹部244的内周面与凸片264的顶面将形成一较浅的凹坑248(如图1)。
如图1所示，所述封胶29呈半球形，其由透明的绝热性材料制成，如环氧树脂或硅胶。该封胶29用于将芯片23所发出的光线会聚至一预设的光束内，从而实现对外部的照明。
请一并参阅图1-4，组装该发光二极管模组时，首先将每一发光二极管20的三扣脚28的扣合部282卡入相邻三发光二极管20的基座22的三缺口224内，并使该每一发光二极管20的三缺口224收容另外三相邻发光二极管20的三扣合部282，由此完成发光二极管组合200的机械连接；与此同时，将该每一发光二极管20的第二引脚26的凸片264嵌入一相邻的发光二极管20的第一引脚24的凹部244内，并使该每一发光二极管20的第一引脚24的凹部244容置另一相邻的发光二极管20的第二引脚26的凸片264，由此完成发光二极管组合200的电气连接。最后，将已组装好的发光二极管组合200固定至导热板10上，以构成完整的发光二极管模组。
使用该发光二极管模组时，第一引脚24及第二引脚26构成的电流传输路径将电流输入至芯片23内，以驱动芯片23发出光线；而基座22及导热板10所构成的热量传输路径则将芯片23工作所产生的热量散发出去，确保发光二极管20的正常运作。由于第一引脚24及第二引脚26与导热板10隔开，电流不需流经导热板10即可输入至芯片23内，从而使电流的传输路径与热量的传输路径在第一引脚24及第二引脚26悬置于导热板10的位置处部分错开。因此，相比于现有技术，本发明的发光二极管模组中的芯片23所产生的热量对电流的影响较小，电流可保持在一个相对稳定的数值范围内，从而确保芯片23发出相对恒定的光强，进而使发光二极管20的寿命得到延长。
在上一实施例中，基座22及扣脚28完全与导热板10热导性接触，以充分地传输热量。但在该种情况下，发光二极管模组的电流传输路径只能部分与热量传输路径区隔。可以理解地，如果基座22只有部分与导热板10热导性接触，即改进为如图9-10中所示的构造，可使电流传输路径与热量传输路径完全错开。在本发明的另一实施例中，基座22f由绝热及绝缘的材料制成，如塑胶。基座22f的中部开设一圆形的通孔(图未标)，基座22f的底面向上凹陷出三均匀向外辐射的沟槽(图未标)。这些沟槽均与通孔连通，且向外贯穿基座22f的外侧面。一由热导性良好的材料(如金属)一体形成的导热结构(图未标)填充于通孔及沟槽内。该导热结构包括一圆形的导热柱27f及自该导热柱27f底部向外均匀辐射出的三扣脚28f。导热柱27f填充于基座22f的通孔内，其顶面通过导热胶(图未示)固定一发光二极管芯片23f，其底面与导热板10接触，以将芯片23f产生的热量传导至导热板10上。此外，该导热柱27f通过基座22f与第一引脚24f及第二引脚26f隔开，以避免将芯片23f产生的热量传输至第一引脚24f及第二引脚26f上。每一扣脚28f的内部嵌入相应的沟槽内，外部延伸超出基座22f以与相邻的发光二极管20f相扣接。这些扣脚28f的底面亦与导热板10的顶面接触，以将导热柱27f吸收的热量均匀地散布在导热板10上。
由于本实施例中的导热柱27f与第一引脚24f及第二引脚26f通过绝热的基座22f隔开，导热柱27f、扣脚28f及导热板10所构成的热量传输路径与第一引脚24f及第二引脚26f所构成的电流传输路径可完全错开，热量基本不会对电流造成任何影响。因此，电流可保持较为稳定的数值，使芯片23f所发出的光强较为恒定，发光二极管20f的寿命亦相应地大幅度得到延长。
还可以理解地，前述二实施例中的第一引脚24、24f及第二引脚26、26f与导热板10间还可夹设一绝热及绝缘层(图未示)。该绝热及绝缘层可对第一引脚24、24f及第二引脚26、26f起一支撑作用，防止第一引脚24、24f及第二引脚26、26f在安装及使用过程中发生弯折。
Claims (4)
1.一种发光二极管模组，其包括一导热板及若干安装于导热板上的发光二极管，每一发光二极管包括一发光二极管芯片及电性连接至该芯片的一第一引脚及一第二引脚，其特征在于：每一发光二极管还包括一承接芯片的基座，该基座与导热板热导性连接，第一引脚及第二引脚固定于基座上并与导热板隔开，所述第一引脚及第二引脚的一部分暴露于基座内，第一引脚及第二引脚的另一部分延伸超出基座并悬置于导热板上方，每一发光二极管还包括若干自基座外侧面延伸而出的扣脚，这些发光二极管通过扣脚相互扣接成一整体，每一发光二极管还包括一插设于基座内的导热柱，芯片固设于该导热柱上，所述导热柱与扣脚相互连接并与导热板接触。
2.如权利要求1所述的发光二极管模组，其特征在于：每一发光二极管的第二引脚直接与一相邻的发光二极管的第一引脚连接，每一发光二极管的第一引脚直接与另一相邻的发光二极管的第二引脚连接。
3.如权利要求1所述的发光二极管模组，其特征在于：所述第一引脚及第二引脚完全平行于导热板。
4.如权利要求1所述的发光二极管模组，其特征在于：所述导热柱及扣脚由导热材料一体形成，所述基座由绝热及绝缘的材料制成。
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