CN101533985B - Method for producing contact device and the contact device - Google Patents

Method for producing contact device and the contact device Download PDF

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Publication number
CN101533985B
CN101533985B CN200910126982.8A CN200910126982A CN101533985B CN 101533985 B CN101533985 B CN 101533985B CN 200910126982 A CN200910126982 A CN 200910126982A CN 101533985 B CN101533985 B CN 101533985B
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CN
China
Prior art keywords
contact
dimple
damper element
potting compound
contact device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200910126982.8A
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Chinese (zh)
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CN101533985A (en
Inventor
克劳斯·G·汤奇
雷纳·菲佛
沃夫冈·索尔
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Schunk Kohlenstofftechnik GmbH
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Schunk Kohlenstofftechnik GmbH
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Publication of CN101533985A publication Critical patent/CN101533985A/en
Application granted granted Critical
Publication of CN101533985B publication Critical patent/CN101533985B/en
Expired - Fee Related legal-status Critical Current
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R39/00Rotary current collectors, distributors or interrupters
    • H01R39/02Details for dynamo electric machines
    • H01R39/36Connections of cable or wire to brush
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/12Manufacture of brushes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00Connectors or connections adapted for particular applications
    • H01R2201/10Connectors or connections adapted for particular applications for dynamoelectric machines

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Contacts (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Motor Or Generator Current Collectors (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)

Abstract

The present invention relates to a method for producing a contact device and the contact device (63), particularly a electric brush device provided with at least one contact tip (64), at least one connection line (67) and at least one damper element (68). In order to constitute the damper element, a drill is machininged in surface of the contact tip, and the drill is partially filled with an elastically hardened casting compound.

Description

Manufacture method and the contact device of contact device
Technical field
The present invention relates to a kind of method for the manufacture of contact device and a kind of contact device, particularly brushgear, described contact device is with at least one contact, at least one connection wire and at least one damper element.
Background technology
Contact device or perhaps brushgear we be very familiar to, and for the commutator of motor or the contacting of bus ring.Contact is made primarily of with the various graphite of mixture being used as electrode material, and wherein connecting wire can be twisted wire, described connection wire to be fixed in contact or on contact for electric energy transmitting.Contact blade tip side is near the commutator of motor or bus ring in addition, and in the rotary course of commutator or bus ring, contact can because friction and wearing and tearing or mill to the greatest extent.Meanwhile, so-called spark also can cause conclusive impact to the wearing and tearing of contact.In addition, spark also can cause the gasification of contact electrode material, also can cause the coarse injustice of commutator sliding surface simultaneously, thus unstable wear.This disadvantageous spark is caused by the deviation in roundness of the vibrations of motor or commutator or bus ring.Therefore, in order to the vibrations suppressing contact possible, need the damper element regularly replacing contact, thus avoid spark.Damper element can be bonded to separately on the contact of contact device afterwards, and described contact device is produced in a kind of integrated manufacturing technology.
Contact device is made in the heart by contact blank or graphite molded piece work in-process, wherein, first will give the hole of contact blank processing for being fixedly connected with wire, and if desired for installing the hole of tripper and sensor element.Then in connection wire insertion hole, and a kind of packing material (i.e. so-called powder filler) is filled out in the gap connecting wire and hole wall, during filling, by a kind of around connect wire and can carry out Ramming operation small tubes reinforce powder filler.Then with a kind of cladding material sealing powder filler of liquid state, described liquid cladding material can cover the aperture connected between wire and contact.After coating cladding material by ductule with the form of drops, a liquid meniscus can be formed between connection wire and contact surface, and then solidify.After integrated processing, bond damper element or yielding rubber and supplement the bakelite plate coating covering damper element if desired in a special procedure of processing.The cost of damper element and installation thereof is higher than the cost of the contact device of manufacture one not with damper element.
Summary of the invention
Therefore the object of the invention is to: a kind of method for the manufacture of contact device and a kind of contact device are provided, utilize described method can manufacture a kind of contact device with damping performance, and with low cost.
By a kind of method for the manufacture of contact device according to claim 1 and a kind of have can realize foregoing invention object according to the contact device of feature described in claim 18.
In the method for the manufacture of contact device (particularly brushgear) according to invention, described contact device is with at least one contact, at least one connection wire and at least one damper element, in order to form described damper element, need to process a dimple in a surface of described contact, and then fill dimple at least partly with the hardenable potting compound of a kind of elasticity.After filling, potting compound will be set on dimple completely, and forms the damper element that has caoutchouc elasticity performance.
The formation of damper element can be merged in the classical production process of contact device according to the method for the invention, and need not carry out special extra process or preprocessing damper element to contact device, described damper element must be coated on contact device.Or rather, be that the colleague manufacturing contact device forms damper element, a kind of semi-finished product with inherent technique can be expressed as to a certain extent.
By cancelling other expensive production equipment and time of winning therefrom can cause directly reducing costs.
As a modification of the present invention, the favourable improvement project of the inventive method comprises following processing step:
Contact is processed at least two dimples;
Insert in first dimple and connect wire;
Packing material is inserted in first dimple;
Cladding material is coated onto on packing material; And
In second dimple, insert potting compound and form damper element by solidifying of potting compound.
The above processing step can form a damper element in of a contact device integrated processing technology, compared with the method used, greatly can reduce the manufacturing cost manufactured with the contact device of damper element by this method with prior art.Particularly in contact, be processed with at least two dimples, so the first dimple is used for installing and being fixedly connected with wire, this is the same with known manufacturing process.Fill another dimple supplemented with potting compound, wherein potting compound can solidify completely after inserting, and material is thus formed a kind of damper element with caoutchouc elasticity performance.Because while cladding material is coated onto packing material or afterwards, just potting compound is inserted the second dimple, so just damper element can be formed in a job step in an integrated machining center or a station at once.
Same proof particularly advantageously, process in a job step by dimple.At this moment, in a job step of the work in-process heart or a manufacturing procedure, the processing technology (such as: boring, milling, grinding etc.) of being cut by material simultaneously or can process dimple one by one.
Prove particularly advantageously, in contact, to be at least processed with another dimple.The processing of described dimple can be integrated in processing technology simply, and wherein said dimple is for installing sensor element, connection wire or other device and element that contact supplements.
In the particularly advantageous execution mode of the one of this method, before inserting potting compound, a tripper can be inserted in a dimple.Before contact abrasion reaches critical point, tripper can separate contact from commutator or bus ring, damage commutator or bus ring to avoid contact device.If enough dark in contact for the dimple of tripper, potting compound can be inserted for forming damper element in so remaining on tripper pocket regions, and a special dimple need not be processed in order to form damper element.
If insert potting compound in the second dimple, so just can form two damper elements simultaneously.If contact device is installed relative to pressure elements, it is effective especially for doing so like this, and described pressure elements applies pressure, contact device is contacted with commutator or bus ring to contact on two contact positions of contact end.
In a kind of execution mode of this method, in contact device, be also processed with another one for installing the dimple of a sensor element.Such contact device just can equip other a sensor element simply in the framework of continuous production processes, such as, for identifying the sensor element of contact device wear condition.
In a kind of execution mode of this method, in contact device, be also processed with another one for inserting the dimple of an other connection wire.Such contact device has at least two and connects wire, and described two connection wires can ensure that contact especially reliably contacts.
Prove particularly advantageously, at least one dimple processing pore-forming.The diameter in a hole can adjust according to the diameter connecting wire, tripper or sensing element especially simply.In addition, hole machined gets up also special simple, and with low cost.
If a dimple is processed into annulus at least partly, so potting compound can be inserted to form one or more damper element in annulus or annulus section.One can be used as pressure elements with the helical spring of central circular diameter compatible and insert in the annular dimple of contact, and wherein helical spring can be fixing on the contact members in a kind of favourable form fit mode.
In a kind of execution mode of this method, at least one dimple is processed into square hole.A square hole can process in contact by saw blade, slotting cutter or a circular peripheral-mill especially simply.Utilize square hole can use the most surfaces of contact device contact jaw, thus form the relatively large damper element in surface.
Prove that particularly advantageously dimple is with a fan shaped cross section.Along the longitudinal axis processing dimple of contact end, or dimple can be processed on the direction of transverse axis, wherein, insert potting compound in a bottom surface upper part of dimple.Meanwhile, because potting compound has corresponding viscosity and cohesive force, so potting compound can be avoided to flow out dimple from the side, wherein potting compound can be frozen into a damper element with the form of drop-wise.The fan shaped cross section of dimple also may be used for special reliably fixation pressure element, such as: a pad.
If cladding material and potting compound in a job step application with insert, such as: by different application utensils, described application utensil is fixed relative to the position of contact, just saves time especially, and can reduce the surcharge of machining center when so producing contact device.
When making full use of viscosity and the cohesive force of potting compound, a certain amount of potting compound can be inserted in dimple, and potting compound to exceed a contact jaw of contact.Like this, the damper element by solidifying formation equally also can exceed contact jaw.Like this, just can form one especially simply between damper element with pressure elements and contact cooperation.
If potting compound was configured with a cladding element before it is frozen into a damper element, so contact device also will configure a cladding element, and need not implement other special job step, such as: bonding cladding element.Cladding element can cover contact completely, and smooth at least partly, wherein between cladding element and contact, also leaves certain gap, and this gap at least wants part potting compound or damper element to fill.
In a kind of execution mode of this method, potting compound can be used as cladding material.So just can cancel the job step of application cladding material, thus continue to reduce production cost.In this case, potting compound will meet the function of cladding material.
In another execution mode, use silica gel as potting compound.In required viscosity and quantitative range, use silica gel more to one's profit.In addition silica gel solidify can and automatically complete, wherein silica gel also has enough elasticity, thus can be used as damper element.
According to contact device of the present invention, particularly brushgear has at least one contact, described contact connects wire and at least one damper element with at least one, wherein in order to form damper element, need to process a dimple in a surface of contact, and dimple is filled with the potting compound that a kind of elasticity is solidified at least partly.The contact device of this structure manufactures simple especially, and with low cost, because damper element need not bond especially.
In a kind of favourable configurations form of contact device, contact has two dimples at least, wherein install in first dimple and connect wire, and fill the first dimple with packing material, packing material coats cladding material again.In the second dimple, insert potting compound and allow it solidify, to form damper element.So just can under of a contact device Integrated manufacture framework, by processing an other dimple and inserting a kind of potting compound and make it be set on contact in dimple, thus form a damper element with the particularly advantageous cost of one.
In the particularly advantageous execution mode of the one of contact device, the first dimple and the second dimple are distributed on a common central shaft.Two location of dimple on contact so just can process two dimples simply in a procedure, because can not be departed from substantially.
In a kind of improvement project of this execution mode, first and second dimple concentrically layout.So just can utilize the drill bit of a counterbit shape or milling cutter in contact, process two dimples in a unique acting campaign.The diameter of bottom dimple is smaller than top dimple diameter, and described bottom dimple, for installing connection wire, after being fixedly connected with wire, just can insert second top dimple potting compound.So just can form one especially simply and surround the damper element connecting wire.
In one embodiment, the first dimple is positioned at contact side, the contact jaw of the second dimple contact.So just can form a contact device coordinated from different installment state.Particularly connect the side that wire can be arranged on contact, wherein the second dimple of contact end is used for forming or installing damper element.So the contact jaw of contact can not be made a mess of because of coordinating with the contact of pressure elements, and described pressure elements may hinder wire.
Prove that particularly advantageously contact device has multiple contact.The contact that so just mutually can be bonded together by side forms contact device.The advantageous effect of prior art these contact devices known so just can be utilized to form composite type contact device.
Other Advantageous embodiments of contact device of the present invention can draw by the feature interpretation according to claim 1 to 14 dependent claims.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, describe the Advantageous Effects of the specific embodiment of the present invention and correspondence thereof in detail, wherein:
Fig. 1 is the sectional arrangement drawing of the first execution mode of the open contact device of prior art state.
Fig. 2 is the sectional arrangement drawing of the second execution mode of the open contact device of prior art state.
Fig. 3 is the three-dimensional view of a kind of contact device the 3rd execution mode.
Fig. 4 is the sectional arrangement drawing of contact device the 3rd execution mode.
Fig. 5 is the three-dimensional view of a kind of contact device the 4th execution mode.
Fig. 6 is the sectional arrangement drawing of contact device the 4th execution mode.
Fig. 7 is the three-dimensional view of a kind of contact device the 5th execution mode.
Fig. 8 is the sectional arrangement drawing of contact device the 5th execution mode.
Fig. 9 is the three-dimensional view of a kind of contact device the 6th execution mode.
Figure 10 is the sectional arrangement drawing of contact device the 6th execution mode.
Figure 11 is the three-dimensional view of a kind of contact device the 7th execution mode.
Figure 12 is the sectional arrangement drawing of contact device the 7th execution mode.
Figure 13 is the three-dimensional view of a kind of contact device the 8th execution mode.
Figure 14 is the sectional arrangement drawing of contact device the 8th execution mode.
Figure 15 is the three-dimensional view of a kind of contact device the 9th execution mode.
Figure 16 is the sectional arrangement drawing of contact device the 9th execution mode.
Figure 17 is the three-dimensional view of a kind of contact device the tenth execution mode.
Figure 18 is the sectional arrangement drawing of contact device the tenth execution mode.
Figure 19 is a kind of three-dimensional view of contact device the 11 execution mode.
Figure 20 is the sectional arrangement drawing of 11 execution modes of contact device.
Figure 21 is a kind of sectional arrangement drawing of contact device the 12 execution mode.
Figure 22 is a kind of sectional arrangement drawing of contact device the 13 execution mode.
Figure 23 is a kind of sectional arrangement drawing of contact device the 14 execution mode.
Embodiment
Fig. 1 illustrates contact device 10 disclosed in a kind of prior art, and described contact device connects wire 12 by a contact 11, one and a damper element 13 is formed.Connect the stranded end 14 of wire 12 to insert in contact 11 in a dimple formed with the form in hole 15, wherein utilize powder filler 18 to fill annular gap 16 between stranded end 14 and hole wall 17.During filling, ramming powder filler 18, thus stranded end 14 is tightly connected with contact 11.In the region, aperture 19 in hole 15, cladding material 20 is coated in the side 21 of contact 11, described cladding material covers powder filler 18 and aperture 19.Because cladding material 20 applies first in liquid form, so cladding material 20 can be formed a kind of with meniscal surface 22 between side 21 and stranded end 14.After coating cladding material 20, cladding material can solidify automatically.The contact jaw 23 of contact 11 fixes damper element 13 by tack coat 24.
A pressure elements not illustrating out in this figure, such as: the brush carrier pad of spring or elastic force action, the damper element 13 that can form the material by form of rubber acts on certain pressure.Contact 11 presses to the rolling surface of commutator and the bus ring not illustrating out here on the direction of view by contact jaw 25, so that electric energy transmitting.Deviation in roundness due to commutator can cause contact device 10 to unclamp from commutator, so substantially can prevent contact device 10 from shaking relative to commutator by damper element 13, so just can avoid producing disadvantageous spark.
Illustrate a kind of execution mode of the contact device 26 announced by prior art equally in fig. 2.Here, a contact 27 is with the dimple formed with the form in hole 28,29 and 30, a sensor element 31 with a transducer wire 32 is wherein installed in hole 28, in hole 29, is provided with one connects wire 33, a tripper 34 is installed in hole 30.A contact jaw 35 of contact 27 is coated with a damper element 36, and described damper element is fixed on contact jaw 35 by cementing layer 37, and described damper element surrounds sensor conductor 32 and is connected wire 33.Sensor element 31 for identifying the state of wear of contact 27, wherein with the overhang insulation device 38 of sensor element 31 with one turn commutator contact time, sensor element can send signal, represents and reaches corresponding state of wear.Tripper 34 has an open circuit pin 39, helical compression spring 40 and a dividing plate 41.When contact 27 wears up to the bottom 42 in hole 30, helical compression spring 40 can extrude open circuit pin 39 from hole 30, and from making contact 27 separate with commutator, corresponding device powers down will be caused like this, thus avoid due to the excessive abrasion of contact 27 and damage commutator.In addition, the region of hole 30 between dividing plate 41 and cementing layer 37 is filled with powder filler 43.Structure according to contact device also can cancel this powder filler.
In the execution mode of a kind of contact device shown in Fig. 3 to Figure 23, the structure respectively connecting wire, sensor element and tripper is substantially identical with the structure described in Fig. 1 and Fig. 2.
Fig. 3 and Fig. 4 illustrates a kind of with connecting the contact device 44 of wire 45, and described connection wire is inserted in a dimple formed with the form in hole 46, and is fixed in dimple by powder filler 47 and cladding material 48.The potting compound being formed damper element 50 is filled with in second dimple formed with the form in hole 49.Wherein, damper element 50 surrounds and connects wire 45, can reach the auxiliary effect being fixedly connected with wire like this on contact 51.Here not shown compression spring can be used from damper element 50 1 and contact, and described compression spring is used for pressure to be applied to contact device 44, and described damper element surrounds and connects wire 45.
Can find out according to Fig. 5 and Fig. 6, contact device 52 has three holes 54,55 and 56 in contact 53, wherein in hole 55, inserts one and connects wire 57, rushes insert tripper 58 in hole 56.The part 59 of hole 54 and hole 56 remainder on tripper 58 is each with damper element 60 and 61, and described damper element utilizes the potting compound inserted in hole 54 and 56 to form.Due to the cohesive force of potting compound, damper element 60 and 61 can exceed the contact jaw 62 of contact 53.Damper element 60 and 61 and here not shown pressure elements contact.
Fig. 7 and Fig. 8 illustrates a kind of contact device 63, in described contact device, contact 64 has two holes 65 and 66.Be inserted with in hole 65 and connect wire 67, load damper element 68 by inserting of potting compound with being set in hole 66.Damper element 68 exceeds the contact jaw 69 of contact 64, and is substantially arranged on the centre of surface of contact jaw 69.
Fig. 9 and Figure 10 illustrates a kind of contact device 70 with contact 71, in contact 71, wherein have a fan-shaped dimple 72.One connects wire 73 and is fixed in a dimple formed with the form in hole 74.Dimple 72 about hole 74 Rotational Symmetry, and has a tenon 75 of contact 71.At fragment 76 and 77 place of dimple 72, be respectively furnished with damper element 78 and 79, described damper element is formed by solidifying of potting compound.A compression spring here not illustrating out inserts in dimple 72 with the form encasing tenon 75, and is fixed in dimple, wherein realizes damping by damper element 78 and 79.
Figure 11 and Figure 12 illustrates a kind of contact device 80 with contact 81, and in shown contact, other has the dimple 83 and 84 of fan shaped cross section to be configured with a dimple formed with the form in hole 82 and two.In dimple 83 and 84, the damper element 85 and 86 of drop-wise form is respectively installed, wherein form damper element 85 to 86 potting compound there is corresponding viscosity, potting compound can be avoided to flow out from dimple 83 and 84 before solidifying.The layout of damper element 85 and 86 is as shown in the figure specially adapted to use pad as pressure elements.
Figure 13 and 14 illustrates a kind of sketch of contact device 87, and described contact device is with contact 88 and a damper element 89.The possible position 90 of connection wire here not illustrating out with 91 according to be connected the dotted line that wire central shaft conforms to and implied.Structure for inserting the dimple connecting wire does not illustrate out equally.To illustrate in contact the square hole 92 that has fan shaped cross section here.Square hole 92 is filled up completely by damper element 89.
Figure 15 and Figure 16 illustrates a kind of contact device 93 with contact 94, in described contact, the longitudinal direction of contact jaw 95 has a dimple 96 with fan shaped cross section.It is a drop-wise damper element 97 be made up of the potting compound solidified in dimple 96.
Figure 17 and Figure 18 is illustrated is a kind of contact device 98 with contact 99, is wherein the dimple 101 of a square hole-shaped in a contact jaw 100 of contact 99, has the damper element 102 poured in described square dimple.Dimple 101 can process with a slotting cutter, on contact 99, wherein have an annular wall 103 to limit dimple 101, to insert potting compound.Damper element 102 can form the surface 104 that exceeds contact jaw 100.
Figure 19 and 20 illustrated be a contact device 105, described contact device has a contact 106, is arranged in the damper element 107 and 108 of dimple 109 and 110 and a cladding element 111 be arranged on dimple 109 and 110.Dimple 109 and 110 is perfused with a certain amount of potting compound, and described potting compound always exceeds the contact jaw 112 of contact 106.The potting compound also do not solidified completely is positioned with cladding element 101, when potting compound solidifies, between the contact jaw 112 and cladding element 111 of contact 106, leaves certain damping gap 113.In addition, cladding element 111 has a through hole 114, connects wire 115 through described through hole.
Figure 21 is illustrated is a kind of contact device 116, and in described contact device, on contact 117 porose 118,119 and 120, described hole is respectively used to sensor installation element 121, stranded end 122 and tripper 123.Dimple 125 is for forming damper element 126, and damper element surrounds connection wire 124.
Illustrate a kind of contact device 127 with contact 128 in fig. 22.Stranded end 131 and 132 is installed in hole 129 and 130, tripper 134 is installed in hole 133.A dimple 135 is had for installing vibration absorption unit 136 on hole 133.Damper element 136 seals hole 133 in the following manner, that is, tripper 134 is fixed in hole 133 tightly, and without the need to using powder filler.
Figure 23 illustrates a kind of contact device 137, in described contact device, contact 138 has hole 139,140 and 141, is separately installed with sensor element 142, tripper 143 and a stranded end 144 in these three holes.On hole 139,140 and 141, there is a fan-shaped dimple 145, wherein in dimple 145, be provided with damper element 146, described damper element surrounds the sensor conductor 147 of sensor element 142 and connects wire 148, and seals the hole 140 of tripper 143.

Claims (12)

1. the method for the manufacture of contact device, described contact device is with at least one contact, at least one connection wire and at least one damper element, it is characterized in that, in order to form damper element, second dimple is processed in a surface of contact, and then fill dimple at least partly with the coagulable potting compound of a kind of elasticity, wherein, described damper element is designed for the contact vibrations avoiding occurring; At least one first dimple is also processed in contact;
Connection wire is only inserted in the first dimple;
The first dimple is filled with packing material;
Cladding material is coated on packing material; And
Potting compound is inserted in the second dimple, and solidifies formation damper element by potting compound; And
Second dimple is formed with the form of square hole, and, most of region on the described surface of described contact device defines damper element.
2. method according to claim 1, is characterized in that, in a job step, process dimple.
3. method according to claim 2, is characterized in that, in first, second dimple described, be all filled with potting compound.
4. method according to claim 2, is characterized in that, described second dimple has a fan shaped cross section.
5. method according to claim 4, is characterized in that, cladding material and potting compound apply and insert in a job step.
6. method according to claim 5, is characterized in that, be filled with a certain amount of potting compound, and potting compound exceeds the contact jaw of contact in described second dimple.
7. method according to claim 6, is characterized in that, potting compound is provided with a cladding element before it solidifies.
8. method according to claim 7, is characterized in that, potting compound is used as cladding material.
9. method according to claim 8, is characterized in that, uses silica gel as potting compound.
10. utilize the contact device that method according to any one of claim 1 to 9 is made, there is at least one contact, at least one connection wire and at least one damper element, wherein, in order to form damper element, need to process second dimple in a surface of contact, and fill dimple at least partly with the coagulable potting compound of a kind of elasticity, wherein, described damper element is designed for the contact vibrations avoiding occurring; And, first dimple is had at least in contact, connecting wire is only arranged in first dimple, first dimple packing material is filled, packing material is coated with cladding material, wherein apply and be set in the potting compound formation damper element in the second dimple, and, most of region on the described surface of described contact device defines damper element.
11. contact devices according to claim 10, it is characterized in that, the first dimple is positioned at the side of contact, the second dimple is positioned on the contact jaw of contact.
12. contact devices according to claim 11, is characterized in that, contact device has multiple contact.
CN200910126982.8A 2008-03-06 2009-03-05 Method for producing contact device and the contact device Expired - Fee Related CN101533985B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008012963.1 2008-03-06
DE102008012963A DE102008012963A1 (en) 2008-03-06 2008-03-06 Method for producing a contact unit and contact unit

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Publication Number Publication Date
CN101533985A CN101533985A (en) 2009-09-16
CN101533985B true CN101533985B (en) 2015-03-25

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EP (1) EP2099102B1 (en)
CN (1) CN101533985B (en)
DE (1) DE102008012963A1 (en)
HU (1) HUE034201T2 (en)

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DE102008012963A1 (en) 2009-09-17
EP2099102B1 (en) 2017-06-14
EP2099102A1 (en) 2009-09-09
CN101533985A (en) 2009-09-16

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